An evaporation apparatus and a method of using the same

Abstract

The application relates to an evaporation equipment and a use method thereof. A plating pot fixing mechanism is arranged on the top wall of an evaporation cavity. The plating pot fixing mechanism comprises a second buckle. A first buckle matched with the second buckle is arranged on the plating pot. The cooperation between the second buckle and the first buckle can quickly fix the plating pot to be evaporated on the top wall of the evaporation cavity, and realizes efficient loading of the plating pot. When the evaporation of a plating pot is completed, the second buckle of the plating pot fixing mechanism can efficiently release the evaporated plating pot, and realizes quick unloading of the plating pot. The buckle cooperation between the first buckle and the second buckle makes the loading and unloading of the plating pot simple, convenient and easy to realize, and the time consumption is short. The buckle cooperation is favorable for improving the plating pot loading and unloading speed and improving the operation rate of the evaporation equipment.

Description

Technical Field

[0001] This application relates to the field of vapor deposition technology, and in particular to a vapor deposition apparatus and its usage method. Background Technology

[0002] Vacuum evaporation technology is commonly used in LED (Light-Emitting Diode) fabrication processes, such as ITO (Indium Tin Oxide) film evaporation, chip electrode evaporation, and DBR (Distributed Bragg Reflection) evaporation. Vacuum evaporation technology involves placing a crucible containing the evaporation target in the lower part of a vacuum chamber, and a deposition pan holding the wafer to be evaporated in the upper part of the vacuum chamber. An evaporation target in the crucible is heated by a heat source to deposit organic or metallic materials onto the wafer, and a crystal oscillator is used to control the film thickness. After evaporation on the wafer in the deposition pan is complete, the deposition pan needs to be removed from the top wall of the vacuum chamber, and the evaporated wafer removed. When new wafers are ready to be evaporated, they need to be placed on the deposition pan, and the deposition pan is then loaded into the vacuum chamber. Undoubtedly, the time and difficulty of loading and unloading the plating pot will affect the utilization rate of the vapor deposition equipment. Therefore, how to improve the loading and unloading efficiency of the plating pot in the vacuum chamber and reduce the loading and unloading difficulty is an urgent problem to be solved. Summary of the Invention

[0003] In view of the shortcomings of the above-mentioned related technologies, the purpose of this application is to provide a vapor deposition equipment and its usage method, which aims to save the time spent loading and unloading the deposition pot, reduce the difficulty of loading and unloading, and improve the utilization rate of the vapor deposition equipment.

[0004] This application first provides a vapor deposition apparatus, comprising:

[0005] A vapor deposition chamber with an internal vapor deposition cavity;

[0006] An exhaust system configured to draw gas from the vapor deposition chamber to the outside of the chamber;

[0007] An evaporation system located at the bottom of the vapor deposition chamber;

[0008] The plating pot includes the first snap-fit; and

[0009] A plating pot fixing mechanism is provided on the top wall of the evaporation chamber and configured to hold the plating pot in the upper part of the evaporation chamber. The plating pot fixing mechanism includes a second buckle.

[0010] The plating pot fixing mechanism uses a second buckle to engage with the first buckle to fix the plating pot onto the plating pot fixing mechanism.

[0011] In the aforementioned vapor deposition equipment, a pot fixing mechanism is installed on the top wall of the vapor deposition chamber. This mechanism includes a second latch, and the pot has a first latch that engages with the second latch. The engagement of the second and first latches allows the pot to be vapor-deposited to be quickly fixed to the top wall of the vapor deposition chamber, achieving efficient pot loading. Once the vapor deposition of a pot is complete, the second latch of the pot fixing mechanism can efficiently release the vapor-deposited pot, enabling rapid unloading. Based on the latching action of the first and second latches, the loading and unloading of the pot is simple, convenient, and quick, improving the loading and unloading speed and increasing the uptime of the vapor deposition equipment.

[0012] Optionally, the first buckle has a buckle head and a connecting rod, with the two ends of the connecting rod fixedly connected to the buckle head and the main body of the plating pot, respectively; the second buckle has an assembly cavity into which the buckle head can extend, and the assembly cavity has a bottom opening and a side opening on the bottom and side surfaces of the second buckle, respectively, and the bottom opening and the side opening are connected: the buckle head slides into the assembly cavity from the side opening, and the two ends of the connecting rod are located on both sides of the bottom opening, and the size of the bottom opening in the direction perpendicular to the sliding of the buckle head is smaller than the size of the buckle head in the same direction; the second buckle also has a limiting block configured to move along the height direction of the plating pot under the drive of the motion mechanism, and when the limiting block moves down, it can prevent the buckle head from sliding out of the side opening with the connecting rod, and when the limiting block moves up, it can allow the buckle head to slide out of the opening with the connecting rod.

[0013] In the aforementioned vapor deposition equipment, the second latch in the plating pot fixing mechanism is equipped with an assembly cavity having a side opening and a bottom opening. In the first latch on the plating pot, a latch head and the plating pot body are connected at both ends via a connecting rod. The latch head can slide into the assembly cavity through the side opening, while the connecting rod can move through the bottom opening. However, the size of the bottom opening perpendicular to the sliding direction of the latch head is the same as the size of the latch head in the same direction. Therefore, after sliding into the assembly cavity, the latch head cannot pass through the bottom opening. The latch head is used to fix the connecting rod and the plating pot body, which is fixedly connected to the connecting rod, onto the second latch. Simultaneously, the second latch has a limiting block driven by a motion mechanism. The motion mechanism can drive the limiting block to move up and down. When the limiting block moves down, it can block the latch head, preventing it from sliding out of the side opening of the assembly cavity, thus achieving a locking mechanism for the plating pot. When the limiting block moves up, the path for the latch head to slide out from the side outlet is unobstructed, allowing the first latch to disengage from the second latch, thus unloading the plating pot. The loading process of the plating pot in this vapor deposition equipment only requires sliding the buckle head into the assembly cavity and moving the limit block down. The unloading process only requires moving the limit block up and sliding the buckle head out. The whole process is simple and easy to implement, and takes little time. It helps to improve the loading and unloading speed of the plating pot and increase the utilization rate of the vapor deposition equipment.

[0014] Optionally, the motion mechanism includes a cylinder, with the piston rod of the cylinder fixedly connected to the limiting block.

[0015] Optionally, the assembly cavity has a unique side opening.

[0016] In the aforementioned vapor deposition equipment, the assembly cavity has only one side opening. After the snap-fit ​​head slides into the assembly cavity through this side opening, it can only slide out through this side opening. Therefore, the second snap-fit ​​only needs to set a limiting block for one side opening, which helps to simplify the structure of the second snap-fit.

[0017] Optionally, the vapor deposition equipment also includes:

[0018] The transfer cavity has a transfer chamber inside, which is attached to the upper part of the outer wall of the vapor deposition chamber. The exhaust system is also configured to draw the gas in the transfer cavity to the outside of the cavity, and the transfer cavity is smaller than the vapor deposition chamber.

[0019] A first isolation door is disposed between the transfer cavity and the evaporation cavity. When closed, the first isolation door isolates the airflow exchange between the transfer cavity and the evaporation cavity; when open, it connects the transfer cavity and the evaporation cavity.

[0020] The transfer mechanism, located within the transfer chamber, is configured to, when the first isolation door is open, carry the plating pot to be plated through the first isolation door into the plating chamber to transfer the plating pot to the plating pot fixing mechanism; the transfer mechanism is also configured to, when the first isolation door is open, carry the plated plating pot released by the plating pot fixing mechanism back through the first isolation door to the transfer chamber.

[0021] In the aforementioned vapor deposition equipment, a transfer chamber with a smaller volume than the vapor deposition chamber is also provided. A first isolation door is installed between the transfer chamber and the vapor deposition chamber. When the first isolation door is open, the transfer chamber and the vapor deposition chamber are connected; when the first isolation door is closed, the transfer chamber and the vapor deposition chamber are independent chambers. This coordination between the transfer mechanism and the first isolation door allows the wafer loading and unloading processes in the deposition pot to be completed within the independent transfer chamber, eliminating the need to break the vacuum in the vapor deposition chamber. This improves the uptime of the vapor deposition equipment. Furthermore, it avoids the problem of water and oxygen adsorbing onto the inner wall of the vapor deposition chamber after breaking the vacuum, which would negatively impact the vapor deposition environment and thus improve the vapor deposition quality.

[0022] Optionally, the transmission structure includes:

[0023] The transport slide rail is installed inside the transmission cavity; and

[0024] A support platform set on a transport slide rail and configured to support a plating pot;

[0025] The drive mechanism is configured to move the platform along the transport slide rail.

[0026] Optionally, the plating pot fixing mechanism also includes:

[0027] The rotating mechanism, which is fixedly connected to the second buckle, is configured to drive the second buckle to rotate in a plane perpendicular to the height direction; and when there is a need to transfer the plating pot between the transfer chamber and the evaporation chamber, the rotating mechanism will drive the second buckle to rotate until the side opening faces the transfer chamber and then stop rotating.

[0028] In the aforementioned vapor deposition equipment, where there is a need to transfer the plating pot between the transfer chamber and the vapor deposition chamber, the rotating mechanism always ensures that the side opening of the assembly chamber faces the transfer chamber. This allows the clamping head of the plating pot, which is transferred from the transfer chamber through the transfer mechanism, to slide directly into the assembly chamber from the side opening. It also allows the clamping head of the plating pot on the plating pot fixing mechanism to be directly transported back to the transfer chamber by the transfer mechanism after sliding out of the side opening, further improving the ease of loading and unloading the plating pot.

[0029] Optionally, the vapor deposition equipment also includes:

[0030] The target cavity has a target cavity inside, and the target cavity is attached to the lower part of the outer wall of the vapor deposition cavity. The exhaust system is also configured to draw the gas in the target cavity to the outside of the cavity, and the target cavity is smaller than the vapor deposition cavity.

[0031] A second isolation door is disposed between the target cavity and the evaporation cavity. When closed, the second isolation door isolates the airflow exchange between the target cavity and the evaporation cavity; when open, it connects the target cavity and the evaporation cavity.

[0032] The target transfer robotic arm located in the target cavity is configured to carry the vapor deposition target stored in the target cavity through the second isolation door into the vapor deposition cavity when the second isolation door is open, and supply the vapor deposition target to the vapor deposition system.

[0033] The aforementioned vapor deposition equipment also includes a target cavity with a smaller volume than the vapor deposition chamber. A second isolation door separates the target cavity from the vapor deposition chamber. When the second isolation door is open, the target cavity and the vapor deposition chamber are connected; when the second isolation door is closed, the target cavity and the vapor deposition chamber are independent chambers. Because the exhaust system also evacuates the gas from the target cavity, the target cavity can be maintained in a vacuum state for storing the vapor-deposited target material, preventing the target material from becoming damp or oxidized, and maintaining the reliability of the vapor-deposited target material. Simultaneously, the cooperation between the target material transfer robotic arm and the second isolation door ensures that the supply process of the vapor-deposited target material does not affect the vacuum state of the vapor deposition chamber, thereby improving the uptime of the vapor deposition equipment.

[0034] Based on the same inventive concept, this application also provides a method of using a vapor deposition equipment, applicable to any of the aforementioned vapor deposition equipment, the method of using the vapor deposition equipment comprising:

[0035] The plating pot to be plated is fixed to the plating pot fixing mechanism by the cooperation of the first and second buckles.

[0036] Control the evaporation system to perform vapor deposition operations;

[0037] Control the plating pot fixing mechanism to release the plating pot that has been vaporized.

[0038] In the above-described method of using the vapor deposition equipment, a pot fixing mechanism is provided on the top wall of the vapor deposition chamber. This mechanism includes a second latch, and the pot has a first latch that engages with the second latch. The engagement of the second and first latches allows the pot to be vapor-deposited to be quickly fixed to the top wall of the vapor deposition chamber, achieving efficient pot loading. Once the vapor deposition of a pot is complete, the second latch of the pot fixing mechanism can efficiently release the vapor-deposited pot, achieving rapid unloading. Based on the latching action of the first and second latches, the loading and unloading of the pot is simple, convenient, and easy to implement, with short loading times, which helps to increase the loading and unloading speed of the pot and improve the utilization rate of the vapor deposition equipment.

[0039] The first buckle has a buckle head and a connecting rod, with the two ends of the connecting rod fixedly connected to the buckle head and the main body of the plating pot, respectively. The second buckle has an assembly cavity into which the buckle head can extend. The assembly cavity has a bottom opening and a side opening on the bottom and side surfaces of the second buckle, respectively, and the bottom opening and the side opening are connected. The buckle head slides into the assembly cavity from the side opening. The two ends of the connecting rod are located on both sides of the bottom opening, and the size of the bottom opening in the direction perpendicular to the sliding of the buckle head is smaller than the size of the buckle head in the same direction. The second buckle also has a limiting block configured to move along the height direction of the plating pot under the drive of the motion mechanism. When the limiting block moves down, it can prevent the buckle head from sliding the connecting rod out of the side opening. When the limiting block moves up, it can allow the buckle head to slide the connecting rod out of the opening.

[0040] The plating pot to be plated is fixed to the plating pot fixing mechanism by the cooperation of the first buckle and the second buckle, including:

[0041] After the control motion mechanism drives the limit block to move upward, the first buckle of the plating pot to be vaporized is assembled into the assembly cavity from the side opening;

[0042] The motion mechanism drives the limit block to move downward, thereby locking the buckle head of the first buckle in the assembly cavity;

[0043] After the target material is vapor-deposited by the control evaporation system, the limit block is moved upward by the motion mechanism, so that the plating pot fixing mechanism releases the plate that has been vapor-deposited.

[0044] The above-described method for using the vapor deposition equipment involves loading the deposition pot into the vapor deposition chamber. The motion mechanism moves the limiting block upwards, allowing the locking head of the first latch on the deposition pot to slide from the side outlet into the assembly cavity of the second latch. Then, the motion mechanism moves the limiting block downwards to lock the locking head in the assembly cavity, completing the loading of the deposition pot. After loading, the target material can be vapor-deposited. When unloading the deposited deposition pot, the motion mechanism moves the limiting block upwards, ensuring unobstructed sliding of the locking head of the first latch, allowing the first latch to disengage from the second latch, thus unloading the deposition pot. This method simplifies loading the deposition pot process by simply sliding the locking head into the assembly cavity and lowering the limiting block, and unloading by simply moving the limiting block upwards and sliding the locking head out. The entire process is simple, quick, and efficient, improving the loading and unloading speed of the deposition pot and increasing the utilization rate of the vapor deposition equipment.

[0045] Optionally, the vapor deposition equipment may further include: a transfer cavity having a transfer chamber inside, a first isolation door disposed between the transfer cavity and the vapor deposition cavity, and a transfer mechanism disposed within the transfer cavity;

[0046] The process of fixing the plating pot to be plated to the plating pot fixing mechanism by the cooperation of the first and second buckles also includes: placing the wafer to be plated onto the plating pot located in the transfer cavity when the first isolation door is closed; controlling the exhaust system to draw gas from the transfer cavity to make the transfer cavity enter a vacuum state; controlling the first isolation door to open; and carrying the plating pot to be plated through the first isolation door into the plating cavity by the transfer mechanism.

[0047] After the first and second latches are used to fix the plating pot to be plated to the plating pot fixing mechanism, the method also includes: controlling the transmission mechanism to pass through the first isolation door and return to the transmission chamber; and closing the first isolation door.

[0048] After the evaporation system performs the vapor deposition operation, and before the pot fixing mechanism releases the vapor-deposited pot, the process also includes: controlling the opening of the first isolation door while the transfer chamber is in a vacuum state; and controlling the transfer mechanism to pass through the first isolation door into the vapor deposition chamber and hold the vapor-deposited pot.

[0049] After the control pot fixing mechanism releases the plated pot, the process also includes: controlling the transfer mechanism to carry the plated pot out of the first isolation door and back into the transfer chamber; closing the first isolation door; breaking the vacuum in the transfer chamber and removing the plated wafers from the plated pot.

[0050] In the above-mentioned method of using the vapor deposition equipment, a transfer chamber with a smaller volume than the vapor deposition chamber is also provided. A first isolation door is provided between the transfer chamber and the vapor deposition chamber. When the first isolation door is open, the transfer chamber and the vapor deposition chamber are connected; when the first isolation door is closed, the transfer chamber and the vapor deposition chamber are independent chambers. This coordination between the transfer mechanism and the first isolation door allows the wafer loading and unloading processes in the deposition pot to be completed within the independent transfer chamber, eliminating the need to break the vacuum in the vapor deposition chamber. This improves the uptime of the vapor deposition equipment. Simultaneously, it avoids the problem of water and oxygen adsorbing onto the inner wall of the vapor deposition chamber after breaking the vacuum, which would affect the vapor deposition environment and thus improve the vapor deposition quality.

[0051] Optionally, the vapor deposition equipment may further include: a target cavity with a target cavity formed inside, a second isolation door disposed between the target cavity and the vapor deposition chamber, and a target transfer robotic arm disposed inside the target cavity;

[0052] Before controlling the evaporation system to perform target deposition, the following steps are also included:

[0053] When the target cavity is in a vacuum state, control the second isolation door to open; control the target transfer robot arm to carry the vaporized target stored in the target cavity through the second isolation door into the vaporization cavity, and supply the vaporized target to the vaporization system; control the target transfer robot arm to return to the target cavity through the second isolation door; control the second isolation door to close.

[0054] In the above-described method of using the vapor deposition equipment, the equipment includes a target cavity with a smaller volume than the vapor deposition chamber. A second isolation door is installed between the target cavity and the vapor deposition chamber. When the second isolation door is open, the target cavity and the vapor deposition chamber are connected; when the second isolation door is closed, the target cavity and the vapor deposition chamber are independent chambers. Because the exhaust system also evacuates the gas from the target cavity, the target cavity can also be maintained in a vacuum state for storing the vapor-deposited target material, preventing the target material from becoming damp or oxidized, and maintaining the reliability of the target material. Simultaneously, the cooperation between the target material transfer robotic arm and the second isolation door ensures that the supply process of the vapor-deposited target material does not affect the vacuum state of the vapor deposition chamber, thereby improving the uptime of the vapor deposition equipment. Attached Figure Description

[0055] Figure 1 This is a schematic diagram of the structure of an optional embodiment of the vapor deposition equipment provided in this application;

[0056] Figure 2 This is a schematic diagram of the structure of a first buckle provided in an optional embodiment of this application;

[0057] Figure 3 This is a schematic diagram of a second buckle provided in an optional embodiment of this application;

[0058] Figure 4aA cross-sectional view on a first plane when the first buckle and the second buckle are engaged, according to an optional embodiment of this application;

[0059] Figure 4b A cross-sectional view on a second plane when the first and second buckles are engaged, according to an optional embodiment of this application;

[0060] Figure 5a A schematic diagram showing the limiting block in an upward-moving state when the first and second latches are engaged, according to an optional embodiment of this application;

[0061] Figure 5b A schematic diagram showing the limiting block in a downward-moving state when the first and second latches are engaged, according to an optional embodiment of this application;

[0062] Figure 6 A schematic flowchart illustrating a method of using the vapor deposition equipment provided in an optional embodiment of this application;

[0063] Figure 7 This is a schematic diagram of the structure of an optional embodiment of the vapor deposition equipment provided in this application;

[0064] Figure 8 A schematic diagram of a vapor deposition apparatus provided in another optional embodiment of this application;

[0065] Figure 9 This is a schematic diagram of a vapor deposition apparatus provided in another optional embodiment of this application.

[0066] Explanation of reference numerals in the attached figures:

[0067] 10-Evaporation equipment; 11-Evaporation chamber; 110-Evaporation chamber; 12-Exhaust system; 13-Evaporation system; 14-Potting pot; 140-First buckle; 141-Buckling head; 142-Connecting rod; 15-Potting pot fixing mechanism; 150-Second buckle; 151-Assembly cavity; 152-Limiting block; 153-Motion mechanism; 16-Heating belt system; 17-Transfer cavity; 170-Transfer cavity; 171-Transfer mechanism; 1711-Transport slide rail; 1712-Bearing platform; 18-First isolation door; 19-Target cavity; 190-Target cavity; 191-Target transfer robotic arm; 20-Second isolation door. Detailed Implementation

[0068] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this application.

[0069] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application.

[0070] In evaporation deposition equipment, the wafer to be deposited is placed on a deposition pan (also called a "deposition umbrella"), a process known as "wafer loading." The entire deposition pan is then loaded into the deposition chamber, positioned at the top to receive the deposition target material from the crucible below. After the wafer deposition in the deposition pan is complete, the pan is unloaded from the deposition chamber, facilitating the "wafer removal." Therefore, in vacuum evaporation deposition technology, the loading and unloading of deposition pans is frequent. The efficiency of this process affects the uptime of the evaporation deposition equipment, and the ease or difficulty of loading and unloading also impacts the application cost of the evaporation deposition technology.

[0071] Therefore, this application aims to provide a solution that can solve the above-mentioned technical problems, the details of which will be described in subsequent embodiments.

[0072] An optional embodiment of this application:

[0073] This embodiment first provides a vapor deposition apparatus; please refer to [link to relevant documentation]. Figure 1 The diagram shown is a structural schematic of the vapor deposition equipment:

[0074] The vapor deposition equipment 10 includes a vapor deposition chamber 11, an exhaust system 12, an evaporation system 13, a deposition pot 14, and a deposition pot fixing mechanism 15.

[0075] The vapor deposition chamber 11 contains a vapor deposition cavity 110, which ensures the airtightness of the vapor deposition cavity 110. The exhaust system 12 draws gas from the vapor deposition cavity 110 to the outside, thus lowering the gas pressure inside the cavity compared to the outside. In some examples of this embodiment, the exhaust system 12 can maintain the vapor deposition cavity 110 in a vacuum state or even a high vacuum state by drawing gas out. A high vacuum state refers to a gas pressure of 1.333 × 10⁻⁶. -1 ~1.333×10 -6 The vacuum state between Pa. It is understood that although the specific structure of the exhaust system 12 is not shown in the accompanying drawings of this embodiment, the exhaust system 12 should include one or more vacuum pumps (for example, in one example, the exhaust system 12 has a forepump and a main pump) and a gas pipeline connecting the vapor deposition chamber 110 and the vacuum pumps.

[0076] Both the evaporation system 13 and the plating pot 14 are located within the evaporation chamber 110. It is understood that after assembly, the evaporation equipment 10 is generally positioned with the evaporation system 13 below and the plating pot 14 above. Therefore, in this embodiment, the side of the evaporation chamber 110 containing the plating pot 14 is designated as the "upper side," and the side containing the evaporation system 13 is designated as the "lower side." The plating pot 14 is fixed to the top wall of the evaporation chamber 11 by a plating pot fixing mechanism 15, located at the upper part of the evaporation chamber 110. Several wafers to be evaporated are supported on the plating pot 14. The evaporation system 13, located at the lower part of the evaporation chamber 110, includes one or at least two crucibles containing evaporation targets, including organic materials, metallic materials, etc. The evaporation system 13 also includes a heating source, which heats the evaporation targets in the crucibles, causing the evaporation targets to vaporize and rise towards the upper part of the evaporation chamber 110, ultimately depositing onto the wafers. The heating and evaporation methods of the heating source on the vapor-deposited target material in the crucible include, but are not limited to, at least one of the following methods: electric current heating, electron beam evaporation, and laser evaporation.

[0077] In this embodiment, the plating pot fixing mechanism 15 is itself fixed to the vapor deposition chamber 11. Therefore, fixing the plating pot 14 to the plating pot fixing mechanism 15 effectively achieves the fixing of the plating pot 14 to the vapor deposition chamber 11. The plating pot fixing mechanism 15 and the plating pot 14 are fixedly engaged by a snap fastener. In this embodiment, the plating pot 14 is provided with a first snap fastener 140, and the plating pot fixing mechanism 15 is provided with a second snap fastener 150 that engages with the first snap fastener 140. Considering that the first snap fastener 140 is located below the second snap fastener 150, in some examples of this embodiment, the first snap fastener 140 is referred to as the "lower snap fastener," and the second snap fastener 150 is referred to as the "upper snap fastener." The structure of the first snap fastener 140 and the second snap fastener 150 and their engagement are described below. Please refer to [link to relevant documentation]. Figure 2 , Figure 3 as well as Figure 4a , Figure 4b :

[0078] The first buckle 140 has a buckle head 141 and a connecting rod 142, such as Figure 2 As shown, the two ends of the connecting rod 142 are respectively fixedly connected to the buckle head 141 and the plating pot body ( Figure 2(Not shown in the image), typically, the connecting rod 142, the snap-fit ​​head 141, and the plating pot body do not need to be separated. Furthermore, the reliability of the connection between the connecting rod 142 and the other two is crucial. Therefore, in some examples of this embodiment, the snap-fit ​​head 141, the connecting rod 142, and the plating pot body can be integrally formed. Assuming the plane perpendicular to the axis of the connecting rod 142 is considered a "cross-section plane," and the vertical projections (projection lines perpendicular to this cross-section plane) of the snap-fit ​​head 141 and the connecting rod 142 on this cross-section plane are the first projection and the second projection, respectively, then in at least one direction, the size of the first projection is larger than the size of the second projection in the same direction. In some examples of this embodiment, the size of the first projection in any direction is larger than the size of the second projection in the same direction.

[0079] The second buckle 150 is provided with an assembly cavity 151, into which the buckle head 141 can extend, such as Figure 3 As shown. In this embodiment, the side of the second buckle 150 facing the bottom wall of the vapor deposition chamber 11 is designated as its "bottom surface," and the side opposite to the bottom surface is designated as its "top surface." Connecting the top surface and the bottom surface is the "side surface" of the second buckle 150. In this embodiment, the assembly cavity 151 is provided with a bottom opening and a side opening on the bottom surface and the side surface of the second buckle 150, respectively, and the bottom opening and the side opening are connected. The snap-fit ​​head 141 can enter the assembly cavity 151 through the side opening, while the connecting rod 142 connected to the snap-fit ​​head 141 can slide in the bottom opening along the extension direction of the bottom opening (i.e., the sliding direction of the snap-fit ​​head 141). Simultaneously, because the dimension of the bottom opening perpendicular to the sliding direction of the snap-fit ​​head 141 is smaller than the dimension of the snap-fit ​​head 141 in the same direction, the snap-fit ​​head 141, sliding into the assembly cavity 151, will not pass from the upper side to the lower side of the bottom opening. The two ends of the connecting rod 142 are located on the upper and lower sides of the bottom opening, respectively: the side connecting to the snap-fit ​​head 141 is located on the upper side of the bottom opening, and the side connecting to the plating pot body is located on the lower side of the bottom opening. Therefore, the plating pot 14 can be hung on the second snap-fit ​​150 through the snap-fit ​​head 141 and the bottom surface of the second snap-fit. Please refer to [link to relevant documentation]. Figure 4a and Figure 4b ,in Figure 4a This is a cross-sectional view of the first latch 140 and the second latch 150 in action on a first plane, where the first plane is parallel to the side opening and passes through both the latch head 141 and the connecting rod 142 (assuming...). Figure 4a The corresponding first plane does not pass through the motion mechanism 153 and the limiting block 152; Figure 4b This is a cross-sectional view on the second plane when the first buckle 140 and the second buckle 150 are engaged. The second plane is parallel to the bottom opening and passes through the buckle head 141 but not through the connecting rod 142.

[0080] However, it should be understood that the second snap fastener 150 necessarily has a solid bottom surface, a top surface, and a side surface. The bottom opening and the side opening are located on the bottom surface and the side surface of the solid, respectively. The second snap fastener 150 may have only one solid side surface, or it may have two or more. In some examples of this embodiment, the main body of the second snap fastener 150 is close to a cuboid, having four solid side surfaces. In this case, the assembly cavity 151 of the second snap fastener 150 is formed by six solid side surfaces. In other examples, the main body of the second snap fastener 150 is also a cuboid, but it may only have three solid side surfaces, with one side lacking solidity. In still other examples, the second snap fastener 150 may have only one or two solid side surfaces. Furthermore, the main body of the second snap fastener 150 may be cubic, disc-shaped, frustum-shaped, or pyramidal, etc.

[0081] To prevent the locking head 141 from sliding out of the assembly cavity 151 after the plating pot 14 is loaded onto the plating pot fixing mechanism 15, thus preventing the plating pot 14 from undesirably falling off the plating pot fixing mechanism 15, in this embodiment, the second locking head 150 also has a limiting block 152. The limiting block 152 is driven by the motion mechanism 153 to move along the height direction of the plating cavity 110, that is, to move up and down. In this embodiment, when the limiting block 152 moves upward, the process of the locking head 141 sliding into the assembly cavity 151 from the side opening of the second locking head 150 and sliding out of the assembly cavity 151 is unobstructed. Figure 5a As shown, however, when the limiting block 152 moves down, the sliding in and sliding out processes of the latch head 141 are obstructed, preventing the latch head 141 from sliding into the assembly cavity 151 from outside the second latch 150 or from sliding out of the assembly cavity 151, as... Figure 5b As shown. Therefore, when it is necessary to load or unload the plating pot 14, the motion mechanism 153 can drive the limiting block 152 to move upward. However, after the plating pot 14 has been hung on the second buckle 150 by the buckle head 141, the motion mechanism 153 can be controlled to drive the limiting block 152 to move downward, preventing the buckle head 141 from sliding out of the assembly cavity 151 from the side opening of the second buckle 150 during the vapor deposition operation.

[0082] It is understandable that the object directly blocked after the limit block 152 moves down can be the latch head 141, such as... Figure 5b In some cases, when the sliding motion of the latch head 141 is obstructed, the latch head 141 will contact the limiting block 152. In other examples, the direct object blocked by the limiting block 152 after it moves down can be the connecting rod 142. In this case, when the sliding motion of the latch head 141 is obstructed, the connecting rod 142 will contact the limiting block 152. In still other examples, the direct object blocked by the limiting block 152 can include both the latch head 141 and the connecting rod 142.

[0083] In some examples of this embodiment, the assembly cavity 151 has only one side opening. In this case, the snap-fit ​​head 141 can only enter and exit the assembly cavity 151 through this one side opening. Therefore, when setting the limiting block 152, it is only necessary to set the limiting block 152 for this single side opening. In other examples, the assembly cavity 151 has more than one side opening. In this case, it is necessary to set the limiting block 152 for each side opening. For example, in one example, the side opening is divided into a left side opening and a right side opening (here, "left" and "right" are not absolute left and right, but only reflect the relative position of the two side openings), and both the left side opening and the right side opening are connected to the bottom opening. In this case, the buckle head 141 can slide into the assembly cavity 151 from one side opening and slide out from the same side opening, for example, it can slide in from the left side opening and then slide out from the left side opening; or it can slide in from one side opening and then slide out from the opposite side opening, for example, it can slide in from the right side opening and then slide out from the left side opening. Therefore, in this case, in order to limit the buckle head 141 within the assembly cavity 151, it is necessary to set a left side limiting block and a right side limiting block.

[0084] In some examples of this embodiment, the motion mechanism 153 that drives the limit block 152 to move can be a cylinder, for example, the limit block 152 can be fixedly connected to the piston rod of the cylinder; in other examples, the motion mechanism 153 can be a motor, etc.

[0085] This embodiment also provides a method for using vapor deposition equipment, which will be described below in conjunction with... Figure 6 The flowchart illustrating the operation of the vapor deposition equipment 10 describes part of its operation:

[0086] S602: After the control motion mechanism drives the limit block to move upward, the first buckle of the plating pot to be vaporized is assembled into the assembly cavity from the side opening.

[0087] First, assuming the plating pan 14 has just undergone the wafer loading process and is carrying the wafer to be plated, it needs to be loaded onto the plating pan fixing mechanism 15. Therefore, it is first ensured that the limiting block 152 does not obstruct the sliding path of the latch head 141 in the first latch 140. If the limiting block 152 obstructs the sliding path of the latch head 141, the motion mechanism 153 in the second latch 150 is controlled to move the limiting block 152 upward. Subsequently, the first latch 140 of the plating pan 14 to be plated is assembled into the assembly cavity 151 from the side opening, that is, the latch head 141 slides into the assembly cavity 151 from the side opening. The connecting rod 142 of the first latch 140 will slide along the bottom opening of the assembly cavity 151, with one end in the assembly cavity 151 and the other end on the other side of the bottom opening.

[0088] S604: The motion mechanism drives the limit block to move downward, so as to lock the buckle head of the first buckle in the assembly cavity.

[0089] Subsequently, the motion mechanism is controlled, for example, the cylinder drives the limit block 152 to move down, so that the limit block 152 blocks the passage of the buckle head 141 to slide out of the assembly cavity 151, so that the buckle head 141 is limited in the assembly cavity 151, preventing the plating pot 14 from falling off the plating pot fixing mechanism 15 during the evaporation process.

[0090] S606: After the target material is vapor-deposited by the control evaporation system, the limit block is moved upward by the motion mechanism, so that the plating pot fixing mechanism releases the plated plating pot.

[0091] After the plating pot 14 to be plated is locked onto the plating pot fixing mechanism 15, the plating operation can begin. After the plating operation is completed, the plated wafers on the plating pot 14 need to be removed. Before this, the plating pot fixing mechanism 15 needs to release the plating pot 14. Therefore, the motion mechanism 153 can be controlled to move the limiting block 152 upward, so that the passage for the snap head 141 to slide out from the side opening of the assembly cavity 151 is not blocked, and the plating pot fixing mechanism 15 can release the plated pot 14.

[0092] In some examples of the vapor deposition equipment 10 provided in this embodiment, the pot fixing mechanism 15 further includes a rotating mechanism (not shown in the figure). The rotating mechanism is fixedly connected to the second buckle 150 on one hand and to the top wall of the vapor deposition chamber 11 on the other hand. The rotating mechanism can drive the second buckle 150 to rotate in a plane perpendicular to the height direction of the vapor deposition chamber 110. Therefore, after the pot 14 is fixed to the second buckle 150 by the first buckle 140, the pot 14 will rotate together with the second buckle 150 in a plane perpendicular to the height direction of the vapor deposition chamber 110. The rotating mechanism is mainly set to ensure the uniformity of the wafer vapor deposition film thickness in the pot 14 during the vapor deposition operation of the vapor deposition equipment 10.

[0093] In some examples of this embodiment, the vapor deposition apparatus 10 also includes a heating belt system 16, see [link to relevant documentation]. Figure 7 As shown, the heating belt system 16 is typically located in the upper part of the vapor deposition chamber 110, for example, along the upper part of the side wall of the vapor deposition chamber 11, or along the top wall of the vapor deposition chamber 11, or both along the upper part of the side wall and the top wall of the vapor deposition chamber 11. Figure 7 As shown. The main function of the heating belt system 16 is to remove water vapor from the vapor deposition chamber 110 and ensure that the temperature of the vapor deposition chamber 110 meets the corresponding process temperature requirements.

[0094] In the vapor deposition equipment and its usage method provided in this embodiment, the loading and unloading process of the vapor deposition pot is simplified by the cooperation between the second buckle in the pot fixing mechanism and the first buckle on the pot: the loading process of the pot only requires sliding the buckle head into the assembly cavity and moving the limiting block down, and the unloading process only requires moving the limiting block up and sliding the buckle head out. The whole process is simple and easy to implement, and takes little time, which helps to improve the loading and unloading speed of the pot and improve the utilization rate of the vapor deposition equipment.

[0095] Another optional embodiment of this application:

[0096] This embodiment will further describe the vapor deposition equipment 10 and its usage method based on the foregoing embodiments and with reference to examples:

[0097] Please see Figure 8 In addition to the vapor deposition chamber 11, the vapor deposition equipment 10 also includes an exhaust system (because the exhaust system is usually located on the back of the vapor deposition chamber 11, therefore...). Figure 8 In addition to the basic structures such as the exhaust system (not shown), evaporation system 13, plating pot 14, and plating pot fixing mechanism 15, the system also includes a transfer cavity 17. A transfer chamber 170 is formed within the transfer cavity 17. The transfer cavity 17 is fitted to the evaporation cavity 11. In some examples of this embodiment, the position of the transfer cavity 170 corresponds to the position of the plating pot 14 in the evaporation cavity 110. Therefore, the transfer cavity 17 is located on the upper part of the outer wall of the evaporation cavity 11. In this embodiment, the exhaust system is used not only to extract and discharge gas from the evaporation cavity 110 but also to extract gas from the transfer cavity 170. Therefore, the exhaust system can ensure that both the evaporation cavity 110 and the transfer cavity 170 are in a vacuum state. In some examples of this embodiment, the transfer cavity 170 and the evaporation cavity 110 may share certain components of the exhaust system, such as a portion of the suction pump and a portion of the airflow piping. In some other examples, the exhaust system has at least two independent subsystems, with the transfer chamber 170 and the vapor deposition chamber 110 each having their own independent subsystems. In this case, the transfer chamber 170 and the vapor deposition chamber 110 do not share the airflow pipeline and the vacuum pump.

[0098] A first isolation door 18 is provided between the transfer cavity 170 and the vapor deposition cavity 110. When the first isolation door 18 is in the open state, the transfer cavity 170 and the vapor deposition cavity 110 are connected. When the first isolation door 18 is in the closed state, the airflow exchange between the transfer cavity 170 and the vapor deposition cavity 110 is isolated, and the two are independent.

[0099] The transfer cavity 170 is also equipped with a transfer mechanism 171. The transfer mechanism 171 is used to carry the plating pot 14 to be plated through the first isolation door 18 into the plating cavity 110 when the first isolation door 18 is open, so as to transfer the plating pot 14 onto the plating pot fixing mechanism 15. On the other hand, the transfer mechanism 171 is also used to carry the plated plating pot 14 released by the plating pot fixing mechanism 15 back to the transfer cavity 170 through the first isolation door 18 when the first isolation door 18 is open.

[0100] In some examples of this embodiment, the transmission mechanism 171 can be a robotic arm; in other examples, the transmission mechanism 171 includes a transport slide rail 1711, a support platform 1712, and a drive mechanism. Figure 8 (Not shown in the image), wherein the support platform 1712 is used to support the plating pot 14 to be plated or the plating pot 14 that has already been plated. The support platform 1712 is set on the transport slide rail 1711 and can slide along the transport slide rail 1711 under the drive of the drive mechanism.

[0101] It is understandable that the transmission cavity 17 should also be provided with a window for loading and unloading wafers; this part of the structure will not be described in detail here.

[0102] In this embodiment, both the loading and unloading processes of the plating pan 14 are implemented in the transfer cavity 170:

[0103] During wafer loading, the first isolation door 18 is kept closed. The wafer to be deposited is placed onto the plating pot 14 located within the transfer cavity 170 only when the vacuum in the transfer cavity 170 is broken. Then, the exhaust system is controlled to evaporate the gas from the transfer cavity 170, creating a vacuum. Next, the first isolation door 18 is opened, and the plating pot 14 is carried through the first isolation door 18 into the evaporation cavity 110 via the transfer mechanism 171. The plating pot 14 is then loaded onto the plating pot fixing mechanism 15 via the engagement of the first and second latches. It is understood that to prevent the evaporation target from depositing into the transfer cavity 170 and adhering to the transfer mechanism 171 during the evaporation operation, in this embodiment, after loading the plating pot 14 onto the plating pot fixing mechanism 15, the transfer mechanism 171 is controlled to pass through the first isolation door 18 back into the transfer cavity 170, and the first isolation door 18 is closed, thus isolating and independent the evaporation cavity 110 and the transfer cavity 170.

[0104] After the evaporation system 13 performs target material evaporation, the first isolation door 18 can be opened while the transfer chamber 170 is in a vacuum state. Then, the transfer mechanism 171 can be controlled to pass through the first isolation door 18 into the evaporation chamber 110 and hold the evaporation pot 14 to be released by the evaporation pot fixing mechanism 15. For example, if the transfer mechanism 171 is a robotic arm, the robotic arm can extend from the transfer chamber 170 into the evaporation chamber 110 and hold the evaporation pot 14 by clamping or other means. If the transfer mechanism 171 includes the aforementioned transport slide rail 1711 and the support platform 1712, the support platform 1712 can slide along the transport slide rail 1711 through the first isolation door 18 under the drive of the drive mechanism after the first isolation door 18 is opened, enter the evaporation chamber 110, and support the evaporation pot 14 to be released on it. After the transfer mechanism 171 reliably holds the plating pan 14 to be released, the plating pan fixing mechanism 15 can release the plated plating pan 14: the control motion mechanism moves the limiting block upward, allowing the locking head to slide out from the side opening of the assembly cavity. Undoubtedly, the transfer mechanism 171 must hold the plating pan 14 before the plating pan fixing mechanism 15 releases it. This is because if the transfer mechanism 171 has not yet held the plating pan 14 when the plating pan fixing mechanism 15 releases it, the plating pan 14 will fall. After the plating pan 14 is released onto the transfer mechanism 171, the transfer mechanism 171 can carry the plating pan 14 through the first isolation door 18 back to the transfer cavity 170 for subsequent wafer unloading operations. It is understood that before unloading the plating pan 14 in the transfer cavity 170, the first isolation door 18 needs to be closed so that the vacuum breaking in the transfer cavity 170 does not affect the vacuum state of the plating cavity 110. When breaking the vacuum in the transmission cavity 170, the vacuum can be broken directly using the atmosphere, or nitrogen or inert gas can be introduced into the transmission cavity 170 to break the vacuum. Nitrogen and inert gas are relatively stable, which helps to ensure the safety of the production environment.

[0105] It is understood that, in this embodiment, because a transfer cavity 170 is provided in the vapor deposition equipment 10, the plating pot 14 is always transferred between the transfer cavity 170 and the vapor deposition cavity 110. Therefore, when there is a need to load the plating pot 14 onto the plating pot fixing mechanism 15, or to unload the plating pot 14 from the plating pot fixing mechanism 15, the rotation system in the plating pot fixing mechanism 15 can be controlled to drive the second buckle to rotate so that the side opening faces the transfer cavity 170. This facilitates the transfer mechanism 171 to transfer the plating pot 14 from the transfer cavity 170 to the plating pot fixing mechanism 15, or facilitates the transfer mechanism 171 to receive the vapor-deposited plating pot 14 from the plating pot fixing mechanism 15.

[0106] As described above, the inclusion of the transfer cavity 170, transfer mechanism 171, and first isolation door 18 allows for the loading and unloading of wafers in the plating pan 14 without disrupting the vacuum state of the evaporation chamber 110. Only the transfer cavity 170 is subjected to vacuum breaking. Furthermore, since the transfer cavity 170 is smaller than the evaporation chamber 110, the time required for vacuum breaking or evacuation in the transfer cavity 170 is significantly shorter than that in the evaporation chamber 110. This avoids breaking the vacuum in the evaporation chamber 110 with each wafer loading and unloading, preventing the evaporation equipment 10 from spending excessive time on vacuuming and breaking. The design of the transfer cavity 170 and other structures improves the uptime and productivity of the evaporation equipment 10. Simultaneously, the elimination of frequent vacuum breaking in the evaporation chamber 110 prevents external moisture from entering the evaporation chamber and affecting the evaporation quality.

[0107] Another optional embodiment of this application:

[0108] This embodiment provides a method with Figure 8 For different types of vapor deposition equipment 10, please refer to [link / reference]. Figure 9 The schematic diagram of the vapor deposition equipment 10 shown is as follows:

[0109] exist Figure 8 Based on the vapor deposition equipment 10 shown, Figure 9 The vapor deposition apparatus 10 further includes a target cavity 19, within which a target cavity 190 is formed. The target cavity 19 is fitted to the vapor deposition cavity 11. The target cavity 190 is used to store vapor deposition targets for use in the vapor deposition cavity 110 under vacuum. Therefore, in some examples of this embodiment, the position of the target cavity 190 corresponds to the position of the evaporation system 13 in the vapor deposition cavity 110. For example, the target cavity 19 is located at the lower part of the outer wall of the vapor deposition cavity 11. In this embodiment, the exhaust system (because the exhaust system is usually located on the back of the vapor deposition cavity 11, so...) Figure 9 The exhaust system (not shown) is used not only to pump and discharge gas from the vapor deposition chamber 110, but also to pump gas from the transfer chamber 170 and the target chamber 190. Therefore, the exhaust system can ensure that the vapor deposition chamber 110 is in a vacuum state, as well as that of the transfer chamber 170 and the target chamber 190. In some examples of this embodiment, the target chamber 190, the transfer chamber 170, and the vapor deposition chamber 110 may share certain components of the exhaust system, such as sharing part of the pump and part of the airflow pipeline. In other examples, the exhaust system has multiple independent subsystems, with each of the target chamber 190, the transfer chamber 170, and the vapor deposition chamber 110 having its own independent subsystem. In this case, the target chamber 190, the transfer chamber 170, and the vapor deposition chamber 110 will not share airflow pipelines and pumps.

[0110] Understandably, although Figure 9The vapor deposition apparatus 10 shown has both a transfer cavity 170 and a target cavity 190. However, in some other examples of this embodiment, the vapor deposition apparatus 10 may only have a vapor deposition cavity 110 and a target cavity 190, without a transfer cavity 170. That is, the target cavity 190 does not exist dependent on the transfer cavity 170.

[0111] A second isolation door 20 is provided between the target cavity 190 and the vapor deposition cavity 110. When the second isolation door 20 is in the open state, the target cavity 190 and the vapor deposition cavity 110 are connected. When the second isolation door 20 is in the closed state, the airflow exchange between the target cavity 190 and the vapor deposition cavity 110 is isolated, and the two are independent.

[0112] A target transfer robotic arm 191 is also provided inside the target cavity 190. The target transfer robotic arm 191 is used to pick up the vapor deposition targets stored in the target cavity 190 and, when the second isolation door 20 is open, carry the vapor deposition targets through the second isolation door 20 into the vapor deposition chamber 110 to supply the vapor deposition targets to the evaporation system 13. In some examples of this embodiment, several vapor deposition targets are stored in the target cavity 190 in categories. When the crucible in the evaporation system 13 lacks the corresponding vapor deposition targets, the second isolation door 20 can be opened while the target cavity 190 is in a vacuum state. Then, the target transfer robotic arm 191 carries the corresponding vapor deposition targets through the second isolation door 20 and places the vapor deposition targets into the corresponding crucibles. Subsequently, the target transfer robotic arm 191 can retract into the target cavity 190 and then close the second isolation door 20, thereby preventing vapor deposition targets from depositing in the target cavity 190 during the vapor deposition operation in the vapor deposition chamber 110.

[0113] Normally, the target cavity 190 is under vacuum. This vacuum prevents the stored vapor deposition target from deteriorating, such as becoming damp or oxidized. This reduces the formation of microparticles on the wafer during vapor deposition, improving the deposition quality of the vapor deposition equipment 10. In addition to the second isolation door 20, the target cavity 19 typically has an operating door or window for externally replenishing the vapor deposition target. When replenishing the target cavity 190, the vacuum can be broken while the second isolation door 20 is closed. After replenishment, the target cavity 190 is evacuated using the exhaust system. This allows the second isolation door 20 to be opened directly when the target transfer robot arm supplies the vapor deposition target to the vapor deposition chamber 110.

[0114] The vapor deposition target process in the vapor deposition chamber 110 is achieved by the target cavity 190 combined with the target transfer robotic arm 191 and the second isolation door 20. This eliminates the need for repeated vacuuming and devastating operations in both the vapor deposition chamber 110 and the target cavity 190, significantly saving production time and improving efficiency. Furthermore, the target cavity 190 can hold a sufficient quantity of vapor deposition target at once, satisfying multiple process steps, thus also eliminating the need for frequent vacuuming and devastating operations. Additionally, storing the vapor deposition target within the high-vacuum target cavity 190 isolates it from the atmospheric environment, helping to reduce the impact of water and oxygen on the target. This extends the storage time of the vapor deposition target and also contributes to the formation of a higher quality, more stable, and controllable film during the vapor deposition process.

[0115] Evaporation For example, for an Al (aluminum) film of a certain thickness, the evaporation rate is... Because the vapor deposition chamber 110 is too large, traditional vapor deposition equipment consumes approximately 40 minutes for vacuuming and breaking the vacuum during vapor deposition, with a total time of 74 minutes. However, if the vapor deposition equipment 10 provided in this embodiment is used, the transfer chamber 170 is smaller than the vapor deposition chamber 110, and the time consumed for vacuuming and breaking the vacuum can be controlled within 10 minutes. Compared with traditional vapor deposition equipment, the vapor deposition time per furnace of the vapor deposition equipment 10 can be controlled within 44 minutes, saving 30 minutes of time, and the number of furnaces produced per day can be increased from 17 to 30.

[0116] Al targets are easily oxidized after the molten source is placed in the crucible. In normal production, they need to be replaced every 7 days; otherwise, the resulting alumina will affect the film quality during vapor deposition. The vapor deposition equipment 10 stores Al ingots in the target chamber 190, which is under a constant vacuum. The vapor deposition chamber 110 is also under a vacuum, isolating the target from the atmospheric environment during vapor deposition. This extends the lifespan of the Al target from 7 days to 2 months. With the current price of Al at 0.65 / g and each Al ingot replacement using 60g, using the vapor deposition equipment 10 can save approximately 1700 yuan per machine per year. Furthermore, the continuous vacuum in the vapor deposition chamber 110 of the equipment 10 maximizes the stability of the chamber environment, reduces abnormalities during vapor deposition, improves vapor deposition yield, and saves rework time and costs.

[0117] It should be understood that the application of this application is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A vapor deposition apparatus, characterized in that, include: A vapor deposition chamber with an internal vapor deposition cavity; An exhaust system configured to draw gas from the vapor deposition chamber to the outside of the chamber; An evaporation system located at the lower part of the vapor deposition chamber; The plating pot includes the first snap-fit; and A plating pot fixing mechanism is provided on the top wall of the vapor deposition chamber and configured to hold the plating pot in the upper part of the vapor deposition chamber, the plating pot fixing mechanism including a second buckle; The plating pot fixing mechanism is configured to fix the plating pot onto the plating pot fixing mechanism by cooperating with the first buckle via the second buckle. The vapor deposition equipment also includes: A transfer cavity having a transfer chamber inside is fitted to the upper part of the outer side wall of the vapor deposition cavity; The first buckle has a buckle head and a connecting rod, and the two ends of the connecting rod are respectively fixedly connected to the buckle head and the body of the plating pot; The second buckle has an assembly cavity into which the buckle head can extend. The assembly cavity has a bottom opening and a side opening on the bottom and side surfaces of the second buckle, respectively, and the bottom opening and the side opening are connected. The buckle head slides into the assembly cavity through the side opening. The two ends of the connecting rod are located on both sides of the bottom opening, and the size of the bottom opening in the direction perpendicular to the sliding of the buckle head is smaller than the size of the buckle head in the same direction. The second buckle also has a limiting block configured to move along the height direction of the vapor deposition chamber under the drive of the motion mechanism. When the limiting block moves downward, it can prevent the buckle head from sliding the connecting rod out of the side opening. When the limiting block moves upward, it can allow the buckle head to slide the connecting rod out of the opening. The motion mechanism includes a cylinder, and the piston rod of the cylinder is fixedly connected to the limiting block; The fixing mechanism of the plating pot also includes: The rotating mechanism, which is fixedly connected to the second buckle, is configured to drive the second buckle to rotate in a plane perpendicular to the height direction. When there is a need to transfer the plating pot between the transfer chamber and the evaporation chamber, the rotating mechanism will drive the second buckle to rotate until the side opening faces the transfer chamber and then stop rotating.

2. The vapor deposition equipment as described in claim 1, characterized in that, The assembly cavity has a unique side opening.

3. The vapor deposition equipment as described in any one of claims 1 to 2, characterized in that, The vapor deposition equipment also includes: The exhaust system is also configured to draw gas from the transmission chamber to the outside of the chamber, and the transmission chamber is smaller than the vapor deposition chamber; A first isolation door is disposed between the transfer cavity and the evaporation cavity. When closed, the first isolation door isolates the airflow exchange between the transfer cavity and the evaporation cavity; when open, it connects the transfer cavity and the evaporation cavity. The transfer mechanism disposed in the transfer cavity is configured to carry the plating pot to be vaporized through the first isolation door into the vaporization cavity when the first isolation door is in the open state, so as to transfer the plating pot to the plating pot fixing mechanism. The transmission mechanism is also configured to carry the vaporized plating pot released by the plating pot fixing mechanism through the first isolation door back to the transmission cavity when the first isolation door is in the open state.

4. The vapor deposition equipment as described in claim 3, characterized in that, The transmission mechanism includes: The transport slide rail disposed within the transmission cavity; and A support platform is set on the transport slide rail and configured to support the plating pot; A drive mechanism configured to move the support platform along the transport slide rail.

5. The vapor deposition equipment as described in any one of claims 1 to 2, characterized in that, The vapor deposition equipment also includes: The target cavity has a target cavity inside, and the target cavity is attached to the lower part of the outer side wall of the vapor deposition cavity. The exhaust system is also configured to draw the gas in the target cavity to the outside of the cavity, and the target cavity is smaller than the vapor deposition cavity. A second isolation door is disposed between the target cavity and the evaporation cavity. When closed, the second isolation door isolates the airflow exchange between the target cavity and the evaporation cavity; when open, it connects the target cavity and the evaporation cavity. A target transfer robotic arm located within the target cavity is configured to carry the vapor deposition targets stored in the target cavity through the second isolation door into the vapor deposition cavity when the second isolation door is open, and to supply the vapor deposition targets to the vapor deposition system.

6. A method of using a vapor deposition equipment, characterized in that, Applied to the vapor deposition equipment as described in any one of claims 1-5, the method of using the vapor deposition equipment includes: The plating pot to be plated is fixed to the plating pot fixing mechanism by the cooperation of the first buckle and the second buckle; Control the evaporation system to perform the vapor deposition operation; Control the plating pot fixing mechanism to release the plating pot that has been vapor-deposited.

7. The method of using the vapor deposition equipment as described in claim 6, characterized in that, The first buckle has a buckle head and a connecting rod, and the two ends of the connecting rod are respectively fixedly connected to the buckle head and the body of the plating pot; The second buckle has an assembly cavity into which the buckle head can extend. The assembly cavity has a bottom opening and a side opening on the bottom and side surfaces of the second buckle, respectively, and the bottom opening and the side opening are connected. The buckle head slides into the assembly cavity through the side opening. The two ends of the connecting rod are located on both sides of the bottom opening, and the size of the bottom opening in the direction perpendicular to the sliding of the buckle head is smaller than the size of the buckle head in the same direction. The second buckle also has a limiting block configured to move along the height direction of the vapor deposition chamber under the drive of the motion mechanism. When the limiting block moves downward, it can prevent the buckle head from sliding the connecting rod out of the side opening. When the limiting block moves upward, it can allow the buckle head to slide the connecting rod out of the opening. The step of fixing the plating pot to be plated to the plating pot fixing mechanism by the cooperation of the first buckle and the second buckle includes: After the motion mechanism is controlled to move the limiting block upward, the first buckle of the plating pot to be vaporized is assembled into the assembly cavity from the side opening; The motion mechanism drives the limiting block to move downward, thereby locking the buckle head of the first buckle inside the assembly cavity; After the evaporation system performs target material vapor deposition, the motion mechanism drives the limiting block to move upward, causing the plating pot fixing mechanism to release the plated plating pot.

8. The method of using the vapor deposition equipment as described in claim 6 or 7, characterized in that, If the vapor deposition equipment further includes: The system includes a transfer cavity with an internal transfer chamber, a first isolation door disposed between the transfer cavity and the vapor deposition cavity, and a transfer mechanism disposed within the transfer cavity. The step of fixing the plating pot to be plated to the plating pot fixing mechanism by the cooperation of the first buckle and the second buckle further includes: With the first isolation door closed, the wafer to be vapor-deposited is placed on the plating pan located in the transfer cavity; The exhaust system is controlled to draw gas from the transmission chamber, causing the transmission chamber to enter a vacuum state; Control the opening of the first isolation door; The plating pot to be plated is carried through the first isolation door and enters the plating chamber by the transfer mechanism. After fixing the plating pot to be plated to the plating pot fixing mechanism by the cooperation of the first buckle and the second buckle, the method further includes: Control the transmission mechanism to pass through the first isolation door and return to the transmission cavity; Close the first isolation door; After controlling the evaporation system to perform the vapor deposition operation, and before controlling the pot fixing mechanism to release the vapor-deposited pot, the method further includes: When the transfer chamber is in a vacuum state, the first isolation door is opened; the transfer mechanism is controlled to pass through the first isolation door into the vapor deposition chamber and hold the vapor-deposited pot. After the control mechanism for fixing the plating pot releases the already plated plating pot, the method further includes: The transmission mechanism is controlled to carry the plating pot through the first isolation door back into the transmission cavity; Close the first isolation door; The vacuum in the transmission cavity is broken, and the wafer that has been deposited on the plating pan is removed.

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