Light source device and projector

CN118011720BActive Publication Date: 2026-09-18SEIKO EPSON CORP
View PDF 3 Cites 0 Cited by

Patent Information

Application Number
CN202311485956.0
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2022-11-10
Filing Date
2023-11-09
Publication Date
2026-09-18
Estimated Expiration
2043-11-09

AI Technical Summary

Technical Problem

但是,在制造荧光体或肋时产生尺寸误差的情况下,可能产生如下的不良情况:肋按压荧光体的力过强或过弱,根据情况的不同,肋不与荧光体抵接

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN118011720B_ABST
    Figure CN118011720B_ABST
Patent Text Reader

Abstract

A light source device and projector. It achieves desired fluorescence and exhibits excellent reliability. The light source device includes: a light-emitting element emitting a first light having a first wavelength; a substrate having a first surface on which the light-emitting element is disposed and a second surface located opposite to the first surface; a wavelength conversion member containing a phosphor and converting the first light emitted from the light-emitting element into a second light having a second wavelength; a support member having a third surface abutting against the first surface of the substrate and a fourth surface located opposite to the third surface and supporting the wavelength conversion member; and a spacer member abutting against the substrate and the wavelength conversion member respectively, holding the light-emitting element and the wavelength conversion member in a separated position. The fixing member is configured to include an elastic member that fixes the support member to the substrate when the third surface is pressed towards the first surface.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This invention relates to a light source device and a projector. Background Technology

[0002] As a light source device for a projector, a light source device that utilizes the fluorescence emitted from the phosphor when excitation light emitted from the light-emitting element is irradiated by the phosphor is proposed.

[0003] Patent Document 1 discloses a light source device comprising: a light-emitting diode (LED) emitting excitation light; a rod-shaped phosphor converting the excitation light into fluorescence; and a support for the phosphor. The phosphor is fixed to the support by a linear component. Furthermore, the LED's support substrate and the support are directly fixed by screws.

[0004] Patent Document 1: International Publication No. 2020 / 254455

[0005] In the light source device of Patent Document 1, the support functions as a heat dissipation component that expels heat generated by the phosphor to the outside and suppresses the temperature rise of the phosphor. Therefore, the phosphor is preferably attached to the support with a moderate force. However, if the contact force of the phosphor is less than a specified value, the heat of the phosphor cannot be sufficiently transferred to the support, and therefore, the temperature of the phosphor rises, and fluorescence with the desired intensity may not be obtained. Conversely, if the contact force of the phosphor is greater than the specified value, excessive load is applied to the phosphor, and depending on the situation, the phosphor may break. In addition, in order to efficiently transfer the heat of the phosphor to the support, a structure in which the phosphor is fixed to the support without the use of adhesive materials is desirable.

[0006] In the light source device of Patent Document 1, the ribs of the LED support substrate abut against the phosphor, and the support substrate and the bracket are threaded together to fix the phosphor to the bracket. However, if dimensional errors occur during the manufacturing of the phosphor or the ribs, the following undesirable situation may occur: the force of the ribs pressing against the phosphor may be too strong or too weak, and depending on the situation, the ribs may not abut against the phosphor. Therefore, it is desirable to provide a light source device that can stably obtain fluorescence with the desired intensity regardless of the dimensional errors of various components and has excellent reliability. Summary of the Invention

[0007] To address the aforementioned issues, one aspect of the present invention provides a light source device comprising: a light-emitting element that emits first light having a first wavelength band; a substrate having a first surface on which the light-emitting element is disposed and a second surface located opposite to the first surface; a wavelength conversion member comprising a phosphor that converts the first light emitted from the light-emitting element into second light having a second wavelength band different from the first wavelength band; a support member having a third surface abutting against the first surface of the substrate and a fourth surface located opposite to the third surface, supporting the wavelength conversion member; a fixing member that fixes the support member to the substrate; and a spacer member that abuts against both the substrate and the wavelength conversion member, respectively, holding the light-emitting element and the wavelength conversion member in a position separated from each other, wherein the fixing member is configured to include an elastic member that fixes the support member to the substrate when the third surface is pressed toward the first surface.

[0008] A projector according to one aspect of the present invention comprises: a light source device according to one aspect of the present invention; a light modulation device that modulates light emitted from the light source device according to image information; and a projection optics device that projects light modulated by the light modulation device. Attached Figure Description

[0009] Figure 1 This is a schematic structural diagram of the projector according to the first embodiment.

[0010] Figure 2 This is a schematic structural diagram of the first lighting device according to the first embodiment.

[0011] Figure 3 It is a three-dimensional diagram of the light source device.

[0012] Figure 4 This is the front view of the light source device.

[0013] Figure 5 This is a side view of the light source device.

[0014] Figure 6 yes Figure 5 An enlarged view of the part marked A.

[0015] Figure 7 It is along Figure 3 A cross-sectional view of the light source device along line VII-VII.

[0016] Figure 8A This is a diagram showing the state of the fixing components before the fastening screw components.

[0017] Figure 8B This is a diagram showing the state of the retaining components after the fastening screw components.

[0018] Figure 9 This is a front view of the light source device according to the second embodiment.

[0019] Figure 10A This is a diagram showing the state of the fixing components before the fastening screw components.

[0020] Figure 10B This is a diagram showing the state of the retaining components after the fastening screw components.

[0021] Figure 11 This is the front view of the light source device in the first variation.

[0022] Figure 12 This is a perspective view of the light source device according to the third embodiment.

[0023] Figure 13 This is the front view of the light source device.

[0024] Label Explanation

[0025] 1 Projector; 4B, 4G, 4R optical modulation device; 6 Projection optical device; 50 Wavelength conversion component; 54, 44, 34, 94 Support component; 54c, 44c, 34c, 94c third surface; 54d, 44d, 94d fourth surface; 54f Recess; 54j Bottom surface; 54m First wall surface; 54n Second wall surface; 54p Groove; 55 Substrate; 55a First surface; 55b Second surface; 56 Light-emitting element; 65 45, 95 Fixing components; 67 Spacing components; 97 First heat sink (first heat dissipation component); 68 Second heat sink (second heat dissipation component); 71 h hole; 55 h First through hole; 65h, 44h, 34h Second through holes; 78, 48 Screw components; 46 Main body; 47 Mounting part; 49 Elastic component; 100, 120, 130, 140 Light source device; E excitation light (first light); Y fluorescence (second light). Detailed Implementation

[0026] [First Implementation]

[0027] Hereinafter, the first embodiment of the present invention will be described using the accompanying drawings.

[0028] The projector in this embodiment is an example of a projector that uses a liquid crystal panel as a light modulation device.

[0029] In the following figures, the scale of the dimensions is sometimes different depending on the constituent elements to facilitate observation of each element.

[0030] Figure 1 This is a diagram showing a schematic structure of the projector 1 according to this embodiment.

[0031] like Figure 1As shown, the projector 1 of this embodiment is a projection-type image display device that displays color images on a screen (projected surface) SCR. The projector 1 includes three light modulation devices corresponding to each color light: red light LR, green light LG, and blue light LB.

[0032] The projector 1 includes a first illumination device 20, a second illumination device 21, a color separation optical system 3, a light modulation device 4R, a light modulation device 4G, a light modulation device 4B, a light combining element 5, and a projection optical device 6.

[0033] The first illumination device 20 emits yellow fluorescence Y towards the color separation optical system 3. The second illumination device 21 emits blue light LB towards the light modulation device 4B. The detailed structure of the first illumination device 20 and the second illumination device 21 will be described later.

[0034] The following description, in the accompanying drawings, will use an orthogonal XYZ coordinate system as needed. The Z-axis is the axis along the vertical direction of the projector 1. The X-axis is the axis parallel to the optical axis AX1 of the first illumination device 20 and the optical axis AX2 of the second illumination device 21. The Y-axis is the axis orthogonal to both the X-axis and the Z-axis. The optical axis AX1 of the first illumination device 20 is the central axis of the fluorescence Y emitted from the first illumination device 20. The optical axis AX2 of the second illumination device 21 is the central axis of the blue light LB emitted from the second illumination device 21.

[0035] The color separation optical system 3 separates the yellow fluorescence Y emitted from the first illumination device 20 into red light LR and green light LG. The color separation optical system 3 includes a dichroic mirror 7, a first reflecting mirror 8a, and a second reflecting mirror 8b.

[0036] Dichroic mirror 7 separates the fluorescent Y light into red light LR and green light LG. Specifically, dichroic mirror 7 transmits red light LR and reflects green light LG. A second reflector 8b is positioned in the optical path of the green light LG. The second reflector 8b reflects the green light LG reflected by dichroic mirror 7 toward the optical modulation device 4G. A first reflector 8a is positioned in the optical path of the red light LR. The first reflector 8a reflects the red light LR transmitted through dichroic mirror 7 toward the optical modulation device 4R.

[0037] The blue light LB emitted from the second lighting device 21 is reflected by the reflector 9 toward the light modulation device 4B.

[0038] The structure of the second lighting device 21 will be described below.

[0039] The second lighting device 21 includes a light source 81, a converging lens 82, a diffuser plate 83, a rod lens 84, and a relay lens 85. The light source 81 is composed of at least one semiconductor laser. The light source 81 emits blue light LB composed of laser light. Alternatively, the light source 81 is not limited to a semiconductor laser, but may also be composed of an LED that emits blue light.

[0040] The converging lens 82 is a convex lens. The converging lens 82 causes the blue light LB emitted from the light source 81 to be incident on the diffuser plate 83 in a substantially convergent state. The diffuser plate 83 diffuses the blue light LB emitted from the converging lens 82 with a predetermined diffusion degree, generating blue light LB having a substantially uniform light distribution distribution similar to the fluorescence Y emitted from the first illumination device 20. For example, frosted glass made of optical glass can be used as the diffuser plate 83.

[0041] Blue light LB, diffused by diffuser plate 83, is incident on rod lens 84. Rod lens 84 has a prismatic shape extending along the optical axis AX2 of the second illumination device 21. Rod lens 84 has a light incident end face 84a at one end and a light emitting end face 84b at the other end. Diffuser plate 83 is fixed to light incident end face 84a of rod lens 84 by optical adhesive (not shown). Preferably, the refractive index of diffuser plate 83 and refractive index of rod lens 84 are as similar as possible.

[0042] Blue light LB undergoes total internal reflection and propagates inside the bar lens 84, thus exiting from the light exiting end face 84b in a state with improved uniformity of illuminance distribution. The blue light LB exiting from the bar lens 84 is incident on the relay lens 85. The relay lens 85 causes the blue light LB, with improved uniformity of illuminance distribution after passing through the bar lens 84, to be incident on the reflecting mirror 9.

[0043] The shape of the light-emitting end face 84b of the rod lens 84 is rectangular, which is approximately similar to the shape of the image-forming area of ​​the light modulation device 4B. As a result, the blue light LB emitted from the rod lens 84 is efficiently incident on the image-forming area of ​​the light modulation device 4B.

[0044] Optical modulation device 4R modulates red light LR according to image information to form image light corresponding to red light LR. Optical modulation device 4G modulates green light LG according to image information to form image light corresponding to green light LG. Optical modulation device 4B modulates blue light LB according to image information to form image light corresponding to blue light LB.

[0045] The optical modulation devices 4R, 4G, and 4B each use, for example, a transmissive liquid crystal panel. Furthermore, polarizers (not shown) are disposed on the incident and emission sides of the liquid crystal panel. The polarizers allow only linearly polarized light in a specific direction to pass through.

[0046] A field lens 10R is disposed on the incident side of the optical modulation device 4R. A field lens 10G is disposed on the incident side of the optical modulation device 4G. A field lens 10B is disposed on the incident side of the optical modulation device 4B. The field lens 10R parallelizes the principal ray of the red light LR incident on the optical modulation device 4R. The field lens 10G parallelizes the principal ray of the green light LG incident on the optical modulation device 4G. The field lens 10B parallelizes the principal ray of the blue light LB incident on the optical modulation device 4B.

[0047] The light combining element 5 synthesizes image light corresponding to red light LR, green light LG, and blue light LB by incident image light emitted from light modulation devices 4R, 4G, and 4B, and then projects the synthesized image light toward the projection optical device 6. The light combining element 5 may be, for example, a cross-shaped dichroic prism.

[0048] The projection optics 6 consists of multiple projection lenses. The projection optics 6 magnifies and projects the image light synthesized by the light combining element 5 onto the SCR screen. Thus, an image is displayed on the SCR screen.

[0049] The structure of the first lighting device 20 will be described below.

[0050] Figure 2 This is a schematic structural diagram of the first lighting device 20.

[0051] like Figure 2 As shown, the first illumination device 20 includes a light source device 100, a parallel optical system 63, an integrator optical system 70, a polarization conversion element 102, and an overlapping optical system 103.

[0052] Figure 3 This is a three-dimensional view of the light source device 100. Figure 4 This is the front view of the light source device 100. Figure 5 This is a side view of the light source device 100. Figure 6 yes Figure 5 An enlarged view of the part marked A. Figure 7 It is along Figure 3 A cross-sectional view of the light source device 100 along lines VII-VII. Additionally, in Figures 3-7 In order to make it easier to observe the attached drawings, the illustration of the angle conversion component 52 is omitted.

[0053] like Figures 2-7 As shown, the light source device 100 includes a wavelength conversion component 50, a light source unit 51, an angle conversion component 52, a reflector 53, a support component 54, a fixing component 65, a spacing component 67, and a second heat sink 68. The light source unit 51 includes a substrate 55 and a light-emitting element 56.

[0054] The wavelength conversion component 50 has a quadrangular prism shape extending along the X-axis and has six faces. The side of the wavelength conversion component 50 extending along the X-axis is longer than the sides extending along the Y-axis and Z-axis. Therefore, the X-axis corresponds to the major axis direction of the wavelength conversion component 50. The length of the side extending along the Y-axis is equal to the length of the side extending along the Z-axis. That is, the cross-sectional shape of the wavelength conversion component 50 cut by the plane perpendicular to the X-axis (YZ plane) is a square. The length of the wavelength conversion component 50 in the X-axis direction is, for example, about 40 mm to 70 mm. The length of one side of the square, which is the cross-sectional shape of the wavelength conversion component 50, is, for example, about 1.0 mm to 1.5 mm. The cross-sectional shape of the wavelength conversion component 50 cut by the plane perpendicular to the X-axis can also be rectangular.

[0055] like Figure 2 As shown, the wavelength conversion component 50 has a first end face 50a and a second end face 50b, a first side face 50c and a second side face 50d, a third side face 50e and a fourth side face 50f. The first end face 50a and the second end face 50b intersect the long axis direction (X-axis direction) of the wavelength conversion component 50 and are located on opposite sides of each other. The first side face 50c and the second side face 50d intersect the first end face 50a and the second end face 50b and are located on opposite sides of each other in the Y-axis direction. The third side face 50e and the fourth side face 50f intersect the first side face 50c and the second side face 50d and are located on opposite sides of each other in the Z-axis direction. In the following description, the first side face 50c, the second side face 50d, the third side face 50e and the fourth side face 50f are sometimes collectively referred to as side faces.

[0056] The wavelength conversion component 50 includes a phosphor that converts excitation light E having a first wavelength band into fluorescence Y having a second wavelength band different from the first wavelength band. The excitation light E is incident on the wavelength conversion component 50 from the first side surface 50c. The fluorescence Y is guided inside the wavelength conversion component 50 and then emitted from the first end surface 50a. In this embodiment, the excitation light E corresponds to the first light. In this embodiment, the fluorescence Y corresponds to the second light.

[0057] The wavelength conversion component 50 includes a ceramic phosphor composed of a polycrystalline phosphor that converts the wavelength of the excitation light E into fluorescence Y. The fluorescence Y has a second band, for example, a yellow band of 490–750 nm. That is, the fluorescence Y is a yellow fluorescence containing both red and green light components.

[0058] The wavelength conversion component 50 may also comprise a single-crystal phosphor instead of a polycrystalline phosphor. Alternatively, the wavelength conversion component 50 may be made of fluorescent glass. Alternatively, the wavelength conversion component 50 may be made of a material in which multiple phosphor particles are dispersed in a binder made of glass or resin. The wavelength conversion component 50 made of such a material converts the excitation light E into fluorescence Y.

[0059] Specifically, the material of the wavelength conversion component 50 includes, for example, yttrium aluminum garnet (YAG) phosphors. Taking YAG:Ce containing cerium (Ce) as an activator as an example, the material of the wavelength conversion component 50 can be materials obtained by mixing raw material powders containing constituent elements such as Y2O3, Al2O3, and CeO3 and carrying out solid-phase reaction; Y-Al-O amorphous particles obtained by wet methods such as co-precipitation and sol-gel methods; and YAG particles obtained by gas-phase methods such as spray drying, flame thermal decomposition, and thermal plasma methods.

[0060] The light source unit 51 includes a light-emitting element 56, which has a light-emitting surface 56a that emits excitation light E in a first wavelength band. The light-emitting element 56 is, for example, an LED. The light-emitting surface 56a of the light-emitting element 56 faces the first side surface 50c of the wavelength conversion member 50, and emits the excitation light E toward the first side surface 50c. The first wavelength band is, for example, a violet to blue band from 400nm to 480nm, with a peak wavelength of, for example, 445nm. Thus, the light source unit 51 is arranged opposite to one of the four sides along the length of the wavelength conversion member 50.

[0061] The substrate 55 supports the light-emitting element 56. The substrate 55 has a first surface 55a on which the light-emitting element 56 is disposed and a second surface 55b located opposite the first surface. A driving circuit for driving the light-emitting element can be directly formed on the substrate 55 by printing or the like, or a circuit board with the driving circuit can be connected to it. In this embodiment, the light source unit 51 is composed of the light-emitting element 56 and the substrate 55, but in addition, it may also include other optical components such as a light guide plate, a diffuser plate, and a lens. In this embodiment, the light source unit 51 has multiple light-emitting elements 56, but the number of light-emitting elements 56 may be only one; there is no particular limitation.

[0062] The support member 54 is arranged to surround the wavelength conversion member 50. The support member 54 supports the wavelength conversion member 50. Furthermore, the support member 54 receives heat generated by the wavelength conversion member 50 and transfers it to the substrate 55. Therefore, the support member 54 is preferably made of a material having a specified strength and high thermal conductivity. As the material for the support member 54, metals such as aluminum and stainless steel are used, and aluminum alloys such as 6061 series are particularly preferred. The specific structure of the support member 54 will be described later.

[0063] The fixing member 65 fixes the support member 54 to the substrate 55. In other words, the fixing member 65 restricts the movement of the support member 54 relative to the substrate 55. The fixing member 65 is provided at multiple locations along the long axis of the wavelength conversion member 50. In this embodiment, the fixing member 65 is provided at two locations: one near the first end face 50a of the wavelength conversion member 50 and the other near the second end face 50b. However, it is not limited to these locations; for example, it may be provided at the center of the long axis of the wavelength conversion member 50. The number of fixing members 65 is not particularly limited. The specific structure of the fixing member 65 will be described later.

[0064] like Figure 2 As shown, a reflector 53 is disposed on the second end face 50b of the wavelength conversion component 50. The reflector 53 guides light into the interior of the wavelength conversion component 50, causing the fluorescent Y-rays reaching the second end face 50b to be reflected and guided to the first end face 50a. The reflector 53 is composed of a metal film or a dielectric multilayer film formed on the second end face 50b of the wavelength conversion component 50. Alternatively, the reflector 53 may be a component separate from the wavelength conversion component 50, but joined to the second end face 50b.

[0065] In the first illumination device 20, when the excitation light E emitted from the light source 51 is incident on the wavelength conversion member 50, the phosphor contained inside the wavelength conversion member 50 is excited and emits fluorescence Y from any light-emitting point. The fluorescence Y travels in all directions from any light-emitting point, but the fluorescence Y directed towards the four sides 50c, 50d, 50e, and 50f undergoes repeated total internal reflection at multiple locations on the sides 50c, 50d, 50e, and 50f, and travels towards either the first end face 50a or the second end face 50b. The fluorescence Y traveling towards the first end face 50a is incident on the angle conversion member 52. The fluorescence Y traveling towards the second end face 50b is reflected by the reflector 53 and travels towards the first end face 50a.

[0066] A portion of the excitation light E incident on the wavelength conversion member 50 that was not used in the excitation of the phosphor is reflected by components surrounding the wavelength conversion member 50, including the light-emitting element 56 of the light source section 51, or by a reflector 53 disposed on the second end face 50b. Therefore, a portion of the excitation light E is enclosed inside the wavelength conversion member 50 and reused.

[0067] An angle conversion component 52 is disposed on the light emission side of the first end face 50a of the wavelength conversion component 50. The angle conversion component 52 is, for example, a tapered rod. The angle conversion component 52 has a light incident surface 52a on which the fluorescence Y emitted from the wavelength conversion component 50 is incident, a light emission surface 52b on which the fluorescence Y is emitted, and a side surface 52c on which the incident fluorescence Y is reflected toward the light emission surface 52b.

[0068] The angle conversion component 52 has a frustum-shaped quadrangular pyramid, and its cross-sectional area perpendicular to the optical axis J increases along the direction of light propagation. Therefore, the area of ​​the light emitting surface 52b is larger than the area of ​​the light incident surface 52a. The optical axis J of the angle conversion component 52 is defined as the axis passing through the center of both the light emitting surface 52b and the light incident surface 52a and parallel to the X-axis. Furthermore, the optical axis J of the angle conversion component 52 coincides with the optical axis AX1 of the first illumination device 20.

[0069] During its journey inside the angle conversion member 52, the fluorescence Y incident on the angle conversion member 52 changes direction in a manner approaching parallel to the optical axis J each time it is totally reflected by the side surface 52c. In this way, the angle conversion member 52 converts the emission angle distribution of the fluorescence Y emitted from the first end face 50a of the wavelength conversion member 50. Specifically, the angle conversion member 52 makes the maximum emission angle of the fluorescence Y in the light emission surface 52b smaller than the maximum incident angle of the fluorescence Y in the light incident surface 52a.

[0070] Generally, the optical expansion of light, defined by the product of the area of ​​the light emitting region and the solid angle of the light (maximum emission angle), is preserved. Therefore, the optical expansion of fluorescence Y is also preserved before and after transmission through angle conversion member 52. As described above, angle conversion member 52 has a structure in which the area of ​​light emitting surface 52b is larger than the area of ​​light incident surface 52a. Therefore, from the viewpoint of preserving optical expansion, angle conversion member 52 can make the maximum emission angle of fluorescence Y in light emitting surface 52b smaller than the maximum incident angle of fluorescence Y incident on light incident surface 52a. In this way, angle conversion member 52 functions as a concentrator.

[0071] Angle conversion component 52 is fixed to wavelength conversion component 50 with optical adhesive (not shown) so that light incident surface 52a faces the first end face 50a of wavelength conversion component 50. That is, angle conversion component 52 and wavelength conversion component 50 are in contact through optical adhesive, and no gap (air layer) is provided between them. If a gap exists between angle conversion component 52 and wavelength conversion component 50, fluorescence Y reaching the light incident surface 52a at an angle greater than the critical angle will be totally internally reflected at the light incident surface 52a and will not be able to enter angle conversion component 52. In contrast, as in this embodiment, without a gap between angle conversion component 52 and wavelength conversion component 50, the amount of fluorescence Y that cannot enter angle conversion component 52 can be reduced. From this viewpoint, it is preferable to make the refractive index of angle conversion component 52 and wavelength conversion component 50 as similar as possible.

[0072] As the angle conversion component 52, a compound parabolic concentrator (CPC) can be used instead of a conical rod. Even when using a CPC as the angle conversion component 52, the same effect as when using a conical rod can be obtained. Alternatively, the light source device 100 may not necessarily include the angle conversion component 52.

[0073] like Figure 7 As shown, the spacer member 67 is provided on the portion of the first surface 55a of the substrate 55 where the light-emitting element 56 is not disposed. Figure 7 In this example, three spacer members 67 are provided, but the number of spacer members 67 is not particularly limited. The spacer members 67 abut against the first surface 55a of the substrate 55 and the first side surface 50c of the wavelength conversion member 50, respectively, keeping the light-emitting element 56 and the wavelength conversion member 50 in a separated position. The height of the spacer members 67 (the distance between the substrate 55 and the wavelength conversion member 50) is, for example, about 0.2 mm to 2 mm. The spacer members 67 are preferably made of materials with excellent light resistance, such as metal or glass. Alternatively, the spacer members 67 can be directly formed on the first surface 55a of the substrate 55 by methods such as screen printing. Furthermore, the abutment between the spacer members 67 and the wavelength conversion member 50 can be either direct abutment or the members can be sandwiched between them. When members are arranged between them, non-adhesive members are more preferred.

[0074] The spacer 67 may also be provided at the portion of the substrate 55 where the light-emitting element 56 is disposed. However, in this embodiment, the spacer 67 is disposed at the portion of the substrate 55 where the light-emitting element 56 is not disposed, so the excitation light E emitted from the light-emitting element 56 will not be blocked by the spacer 67, thereby improving the utilization efficiency of the excitation light E.

[0075] like Figure 5 As shown, the second heat sink 68 is disposed in contact with the second surface 55b of the substrate 55. The second heat sink 68 has a flat plate portion 71 and a plurality of fins 72. The substantially entire surface of the flat plate portion 71 abuts against the second surface 55b of the substrate 55. The plurality of fins 72 are disposed on the flat plate portion 71 at intervals from each other in the long axis direction (X-axis direction) of the wavelength conversion member 50. The number of fins 72 is not particularly limited. The second heat sink 68 is made of a metal such as stainless steel or aluminum.

[0076] The second heat sink 68 transfers heat from the substrate 55 to the external space by contacting the substrate 55, thus dissipating heat from the fins 72. Therefore, as... Figure 3As shown, preferably, the plurality of fins 72 are arranged parallel to the airflow direction B from the fan, so that the airflow from the fan of the projector 1 is efficiently blown onto the plurality of fins 72. This improves the cooling efficiency of the second heat sink 68. Furthermore, the arrangement direction of the plurality of fins 72 is aligned with the long axis direction of the wavelength conversion component 50, so the wavelength conversion component 50 can be cooled uniformly along the long axis direction.

[0077] like Figure 4 As shown, the flat plate portion 71 of the second heat sink 68 is provided with a hole 71h for fixing to the substrate 55. The fixing structure of the second heat sink 68 and the substrate 55 will be described later. In this embodiment, the second heat sink 68 corresponds to the second heat dissipation component.

[0078] The support component 54 and the fixing component 65 will be described in detail below.

[0079] like Figure 4 As shown, the support member 54 has a third surface 54c that abuts against the first surface 55a of the substrate 55 and a fourth surface 54d located on the opposite side of the third surface 54c. Additionally, the support member 54 has a recess 54f that is recessed from the third surface 54c toward the fourth surface 54d. The recess 54f is formed in a groove shape and extends along the long axis (X-axis direction) of the wavelength conversion member 50. The wavelength conversion member 50 is disposed inside the recess 54f. In a cross-sectional view intersecting the long axis of the wavelength conversion member 50, the width W1 of the support member 54 in the Z-axis direction is smaller than the width W2 of the substrate 55 in the Z-axis direction. The first surface 55a and the third surface 54c of the substrate 55 can abut directly or be abutted therebetween via a clamping member. Examples of clamping members include, for instance, lubricating grease, in addition to adhesive materials.

[0080] The recess 54f has a bottom surface 54j that abuts against the wavelength conversion member 50, a first wall surface 54m that extends in a direction intersecting the bottom surface 54j and faces the third side surface 50e of the wavelength conversion member 50, and a second wall surface 54n that faces the fourth side surface 50f. The first wall surface 54m and the second wall surface 54n are each formed by an inclined surface, which is separated from the wavelength conversion member 50 and slopes in a direction in which the distance between them and the wavelength conversion member 50 increases as it moves from the bottom surface 54j toward the third surface 54c. That is, the recess 54f has a groove-like shape whose width increases as it moves from the bottom surface 54j toward the third surface 54c. Furthermore, the first wall surface 54m and the second wall surface 54n may not necessarily be entirely composed of inclined surfaces; they may only have inclined surfaces in certain portions. Additionally, the first wall surface 54m and the second wall surface 54n may also be formed by curved surfaces. Furthermore, at least one of the first wall surface 54m and the second wall surface 54n may abut against the wavelength conversion component 50.

[0081] The first wall surface 54m and the second wall surface 54n are each formed from the surface of a metal such as aluminum or stainless steel, which is the constituent material of the support member 54. More specifically, the first wall surface 54m and the second wall surface 54n are each formed from a mirror-finished surface of the metal. Therefore, the first wall surface 54m and the second wall surface 54n are both light-reflective, reflecting the incident excitation light E. Alternatively, the first wall surface 54m and the second wall surface 54n may also be formed from other metal films or dielectric multilayer films formed on the surface of metals such as aluminum or stainless steel.

[0082] In a cross-sectional view intersecting the major axis of the wavelength conversion component 50, the width W3 of the light-emitting element 56 in the Z-axis direction is larger than the width W4 of the wavelength conversion component 50 in the Z-axis direction. Consequently, in the Z-axis direction, both ends of the light-emitting element 56 protrude outwards from the wavelength conversion component 50. Specifically, both ends of the light-emitting element 56 protrude to positions overlapping with the gaps between the third side surface 50e and the first wall surface 54m, and the gaps between the fourth side surface 50f and the second wall surface 54n.

[0083] According to this structure, a portion of the excitation light E emitted from the light-emitting element 56 passes through the gap between the third side surface 50e and the first wall surface 54m, or the gap between the fourth side surface 50f and the second wall surface 54n, and then enters the inclined first wall surface 54m or second wall surface 54n. At this time, the excitation light E is reflected by the first wall surface 54m or the second wall surface 54n and enters the third side surface 50e or the fourth side surface 50f of the wavelength conversion member 50. Thus, the first wall surface 54m and the second wall surface 54n are inclined, thereby making it easier for the excitation light E passing through the gap between the wavelength conversion member 50 and the support member 54 to enter the third side surface 50e or the fourth side surface 50f. Therefore, the amount of excitation light E reflected back to the light source section 51 by the bottom surface 54j can be reduced. As a result, the utilization efficiency of the excitation light E can be improved. At this time, a portion of the excitation light E enters the support member 54, and a portion is absorbed by the support member 54, thereby causing the temperature of the support member 54 itself to rise. In this sense, heat dissipation of the support component 54 is also important.

[0084] At a position on the substrate 55 corresponding to the hole 71h of the second heat sink 68, a first through hole 55h is provided, which penetrates the substrate 55 in a direction intersecting the first surface 55a and the second surface 55b.

[0085] The fixing member 65 is a plate-shaped member that abuts against the outer surface of the supporting member 54, excluding the third surface 54c. The fixing member 65 is made of an elastic member with high elastic restoring force, such as hard steel or stainless steel, and has a shape that bends approximately at right angles at four points. Therefore, the fixing member 65 can elastically deform and elastically recover when subjected to external force. Furthermore, the fixing member 65 can be made of any material capable of elastic deformation and elastic recovery; it can also be a metal such as copper, a resin, a glass plate, or a similar material.

[0086] The fixing member 65 has a pressing portion 74 and a mounting portion 75. The pressing portion 74 surrounds the outer surface of the support member 54 except for the third surface 54c and abuts against the outer surface. A spring-operated portion 76 that bends outward is provided in the portion of the pressing portion 74 opposite to the two sides of the support member 54. By providing the spring-operated portion 76 in this location, the pressing portion 74 can extend and retract in the height direction (Y-axis direction) of the support member 54. The mounting portion 75 extends from both ends of the pressing portion 74 along the first surface 55a of the substrate 55 and abuts against the first surface 55a. A second through hole 65h that penetrates the mounting portion 75 in the thickness direction is provided in the mounting portion 75 at a position corresponding to the hole 71h of the second heat sink 68.

[0087] like Figure 6 As shown, a groove 54p is provided in the fourth surface 54d of the support member 54 at the position abutting against the fixing member 65. In the long axis direction (X-axis direction) of the wavelength conversion member 50, the width L2 of the groove 54p is larger than the width L1 of the fixing member 65. Therefore, the fixing member 65 is disposed inside the groove 54p. Furthermore, the depth D1 of the groove 54p is larger than the thickness T1 of the fixing member 65. The width L1 of the fixing member 65 is preferably, for example, about 2 mm to 10 mm. The thickness T1 of the fixing member 65 is preferably, for example, about 0.1 mm to 2 mm. With this structure, the fixing member 65 is easily aligned with the support member 54, and the possibility of the fixing member 65 shifting in the X-axis direction is small. Furthermore, since the fixing member 65 does not protrude downwards from the fourth surface 54d of the support member 54, interference between other components and the light source device 100 is less likely, making the light source device 100 easier to handle.

[0088] like Figure 4As shown, the fixing member 65, the substrate 55, and the second heat sink 68 are fixed to each other by screw members 78 inserted into the second through hole 65h of the fixing member 65, the first through hole 55h of the substrate 55, and the hole 71h of the second heat sink 68. According to this structure, the fixing member 65, the substrate 55, and the second heat sink 68 can be fixed together using a single screw member 78, thus simplifying the fixing structure of the components. Furthermore, to fix the substrate 55 and the second heat sink 68, for example, by providing a through hole in the second heat sink 68, it is difficult to insert a screw member facing the substrate 55 from the side where the heat sink 72 is located. However, with the above structure, the screw member 78 can be easily inserted. Therefore, the assembly of the light source device 100 can be easily performed, and the area of ​​the fins 72 of the second heat sink 68 and the degree of freedom in the arrangement of the fins 72 can be ensured.

[0089] Alternatively, if the above-mentioned effect is not required, the mounting component 65 and the substrate 55 can be fixed with one screw component, and the substrate 55 and the second heat sink 68 can be fixed with other screw components. In this case, the mounting component 65 and the substrate 55, as well as the substrate 55 and the second heat sink 68, can be fixed by methods other than threaded fastening.

[0090] The following describes the action of the support member 54 being pressed relative to the substrate 55.

[0091] Figure 8A This is a diagram showing the state of the retaining member 65 before the screw component 78 is tightened. Figure 8B This is a diagram showing the state of the retaining member 65 after the screw component 78 has been tightened.

[0092] Tightening Figure 8A Before the screw component 78 is shown, the third surface 54c of the support component 54 abuts against the first surface 55a of the substrate 55, but the mounting portion 75 of the fixing component 65 does not abut against the first surface 55a of the substrate 55. This state does not apply external force to the fixing component 65 and is the initial state of the fixing component 65. At this time, the spring action portion 76 of the fixing component 65 is in a strongly bent state.

[0093] Next, as Figure 8B As shown, the fastening screw component 78 extends until the mounting portion 75 of the fixing component 65 abuts against the first surface 55a of the substrate 55. Consequently, the spring-operated portion 76 of the fixing component 65 is stretched from a strongly bent state towards the thickness direction (Y-axis direction) of the support component 54, changing to an elongated state. At this time, the fixing component 65 is elastic, and therefore, an elastic restoring force is applied to return it to its initial state. The pressing portion 74 of the fixing component 65 presses the support component 54 towards the first surface 55a of the substrate 55.

[0094] Through the aforementioned action, the fixing member 65 presses the support member 54 toward the substrate 55 and fixes it to the substrate 55 while the spring actuation part 76 is stretched. The fixing member 65 is composed of a plate-shaped member with a predetermined width, so the support member 54 can be stably fixed in the long axis direction (X-axis direction) of the wavelength conversion member 50. Furthermore, the spacer member 67 is located between the substrate 55 and the wavelength conversion member 50, so when the support member 54 is pressed against the substrate 55, the spacer member 67 generates a force that presses the wavelength conversion member 50 against the bottom surface 54j of the recess 54f of the support member 54. Thus, the wavelength conversion member 50 is fixed in a state of tight engagement with the support member 54 without the use of adhesive material.

[0095] like Figure 2 As shown, a parallelizing optical system 63, composed of a collimating lens or the like, is provided between the light source device 100 and the integrator optical system 70. The parallelizing optical system 63 further reduces the angular distribution of the fluorescence Y emitted from the angle conversion member 52, ensuring that the highly parallel fluorescence Y is incident on the integrator optical system 70. Alternatively, if the parallelism of the fluorescence Y emitted from the angle conversion member 52 is sufficiently high, the parallelizing optical system 63 may not be necessary.

[0096] The integrator optical system 70 includes a first lens array 61 and a second lens array 101. Together with the overlapping optical system 103, the integrator optical system 70 functions as a uniform illumination optical system that homogenizes the intensity distribution of fluorescence Y emitted from the light source device 100 within the respective light modulation devices 4R and 4G, which are the illuminated areas. Fluorescence Y emitted from the parallelization optical system 63 is incident on the first lens array 61. The first lens array 61 and the second lens array 101 together constitute the integrator optical system 70.

[0097] The first lens array 61 has a plurality of first microlenses 61a. The plurality of first microlenses 61a are arranged in a matrix in a plane parallel to the YZ plane orthogonal to the optical axis AX1 of the first illumination device 20. The plurality of first microlenses 61a divide the fluorescence Y emitted from the angle conversion member 52 into multiple partial beams. Each of the first microlenses 61a has a rectangular shape that is approximately similar to the shape of the image forming area of ​​the light modulation devices 4R and 4G. Thus, the partial beams emitted from the first lens array 61 are efficiently incident on the image forming areas of the light modulation devices 4R and 4G, respectively.

[0098] The fluorescence Y emitted from the first lens array 61 propagates toward the second lens array 101. The second lens array 101 is arranged opposite to the first lens array 61. The second lens array 101 has a plurality of second small lenses 101a corresponding to the plurality of first small lenses 61a of the first lens array 61. Together with the overlapping optical system 103, the second lens array 101 arranges the images of the plurality of first small lenses 61a of the first lens array 61 in the vicinity of the image forming areas of the light modulation devices 4R and 4G. The plurality of second small lenses 101a are arranged in a matrix in a plane parallel to the YZ plane orthogonal to the optical axis AX1 of the first illumination device 20.

[0099] In this embodiment, each of the first small lenses 61a of the first lens array 61 and each of the second small lenses 101a of the second lens array 101 have the same size as each other, but they may also have different sizes. Furthermore, in this embodiment, the first small lenses 61a of the first lens array 61 and the second small lenses 101a of the second lens array 101 are arranged at a position that is aligned with each other's optical axes, but they may also be arranged in a state that is off-center from each other.

[0100] The polarization conversion element 102 converts the polarization direction of the fluorescence Y emitted from the second lens array 101. Specifically, the polarization conversion element 102 converts the portions of the fluorescence Y beam that are divided by the first lens array 61 and emitted from the second lens array 101 into linearly polarized light.

[0101] The polarization conversion element 102 includes: a polarization separation layer (not shown), which allows one linearly polarized component of the polarization component contained in the fluorescence Y emitted from the light source device 100 to pass directly through, and reflects the other linearly polarized component in a direction perpendicular to the optical axis AX1; a reflection layer (not shown), which reflects the other linearly polarized component reflected by the polarization separation layer in a direction parallel to the optical axis AX1; and a phase difference plate (not shown), which converts another linearly polarized light component reflected by the reflection layer into a single linearly polarized component.

[0102] [Effects of the first embodiment]

[0103] The light source device 100 of this embodiment includes: a light-emitting element 56 that emits excitation light E; a substrate 55 having a first surface 55a on which the light-emitting element 56 is disposed and a second surface 55b located opposite to the first surface 55a; a wavelength conversion member 50 that includes a phosphor and converts the excitation light E emitted from the light-emitting element 56 into fluorescence Y; a support member 54 having a third surface 54c abutting against the first surface 55a of the substrate 55 and a fourth surface 54d located opposite to the third surface 54c, supporting the wavelength conversion member 50; a fixing member 65 that fixes the support member 54 to the substrate 55; and a spacer member 67 that abuts against the substrate 55 and the wavelength conversion member 50 respectively, holding the light-emitting element 56 and the wavelength conversion member 50 in a position separated from each other. The fixing member 65 fixes the support member 54 to the substrate 55 with the third surface 54c pressed towards the first surface 55a.

[0104] According to the structure of this embodiment, by appropriately selecting parameters such as the constituent material and thickness of the fixing member 65, and the shape and size of the spring actuation part 76, the force with which the fixing member 65 presses the support member 54 against the substrate 55 can be appropriately adjusted. At this time, as described above, the force with which the wavelength conversion member 50 presses against the support member 54 through the action of the spacer member 67 is also appropriately adjusted, improving the tightness of the contact between the wavelength conversion member 50 and the support member 54. As a result, the heat generated by the wavelength conversion member 50 is sufficiently transferred to the support member 54, and then transferred to the second heat sink 68 via the substrate 55 that abuts against the support member 54, and dissipated from the second heat sink 68 to the external space. Consequently, the decrease in wavelength conversion efficiency accompanying the temperature rise of the wavelength conversion member 50 can be suppressed, and fluorescence Y with the desired intensity can be obtained.

[0105] Furthermore, even if dimensional errors exist during the manufacturing of the wavelength conversion component 50 or the spacing component 67, these errors are absorbed by the deformation of the spring action portion 76 of the fixing component 65, so the pressing pressure is always properly adjusted. As a result, the aforementioned effects can be stably achieved, and damage to the wavelength conversion component 50 can be suppressed. Thus, according to this embodiment, a light source device 100 with high reliability and desired fluorescence intensity can be obtained.

[0106] In this embodiment, the heat from the support member 54 is dissipated to the external space via the substrate 55 from the second heat sink 68. Therefore, it is not necessary to provide a heat sink on the fourth surface 54d of the support member 54. This allows for miniaturization of the light source device 100. However, if it is desired to dissipate more heat, a heat sink can also be provided on the fourth surface 54d of the support member 54.

[0107] The projector 1 of this embodiment is equipped with the light source device 100 of this embodiment, so it is possible to realize a highly efficient and compact projector.

[0108] [Second Implementation]

[0109] Hereinafter, the second embodiment of the present invention will be described using the accompanying drawings.

[0110] The basic structure of the projector and light source device in the second embodiment is largely the same as that in the first embodiment, except that the structures of the support and fixing components differ from those in the first embodiment. Therefore, the description of the basic structure of the projector and light source device is omitted.

[0111] Figure 9 This is a front view of the light source device 120 according to the second embodiment.

[0112] exist Figure 9 In this document, the same reference numerals are used for the same constituent elements as those used in the first embodiment, and descriptions are omitted.

[0113] like Figure 9 As shown, the light source device 120 of this embodiment includes a wavelength conversion member 50, a light source unit 51, an angle conversion member (not shown), a mirror (not shown), a support member 44, a fixing member 45, a spacing member 67, and a second heat sink 68.

[0114] The support member 44 has a third surface 44c that abuts against the first surface 55a of the substrate 55 and a fourth surface 44d located on the opposite side of the third surface 44c. Furthermore, the support member 44 has a main body portion 46 on which a recess 44f supporting the wavelength conversion member 50 is provided; and a mounting portion 47. The main body portion 46 and the mounting portion 47 are integrally formed. The mounting portion 47 extends along the third surface 44c of the support member 44 and has a thickness thinner than that of the main body portion 46. The recess 44f has a bottom surface 44j supporting the wavelength conversion member 50; and a first wall surface 44m and a second wall surface 44n inclined relative to the bottom surface 44j.

[0115] A first through hole 55h is provided on the substrate 55, extending in a direction intersecting the first surface 55a and the second surface 55b. A second through hole 44h is provided in the mounting portion 47 of the support member 44, at a position corresponding to the first through hole 55h on the substrate 55, extending in a direction intersecting the third surface 44c. A hole 71h is provided in the second heat sink 68 at a position corresponding to the first through hole 55h and the second through hole 44h. In this embodiment, the second through hole 44h is provided in the mounting portion 47, which has a thickness thinner than that of the main body portion 46; therefore, the processing of the second through hole 44h is easy.

[0116] The fixing member 45 includes a screw member 48 and a resilient member 49. The screw member 48 has a head 48a that is inserted into a second through hole 44h, a first through hole 55h, and a hole 71h. The resilient member 49 is an annular member through which the screw member 48 passes, and is located between the head 48a of the screw member 48 and the mounting portion 47 of the support member 44. For example, a spring washer, a coil spring, or an annular rubber ring can be used as the resilient member 49.

[0117] The support member 44, the substrate 55, and the second heat sink 68 are fixed to each other by screw members 48 inserted into the second through hole 44h, the first through hole 55h, and the hole 71h. According to this structure, the support member 44, the substrate 55, and the second heat sink 68 can be fixed together using a single screw member 48, thus simplifying the fixing structure of the components. Furthermore, similar to the first embodiment, it is not necessary to insert a fixing screw member from the side of the second heat sink 68 where the fins 72 are provided. This simplifies the assembly of the light source device 120 and ensures the heat dissipation capacity of the second heat sink 68. The other structures of the light source device 120 are the same as those of the light source device 100 of the first embodiment.

[0118] The following explains the function of pressing the support member 44 onto the substrate 55.

[0119] Figure 10A This is a diagram showing the state of the retaining member 45 before the screw member 48 is tightened. Figure 10B This is a diagram showing the state of the retaining member 45 after the screw member 48 has been tightened.

[0120] exist Figure 10A In the stage before tightening the screw component 48, the head 48a of the screw component 48 does not abut against the elastic component 49. This state does not apply external force to the elastic component 49 and is its initial state. Then, as shown... Figure 10B As shown, when the screw component 48 is tightened, the elastic component 49 changes to a state where it is compressed in the thickness direction (Y-axis direction) of the elastic component 49. At this time, the elastic component 49 presses the support component 44 against the first surface 55a of the substrate 55 by means of an elastic restoring force that wants to return to the initial state.

[0121] Through the aforementioned action, the fixing member 45 presses the supporting member 44 toward the substrate 55 and fixes it to the substrate 55 while the elastic member 49 is compressed. Furthermore, a spacer member 67 is sandwiched between the substrate 55 and the wavelength conversion member 50. Therefore, when the supporting member 44 is pressed toward the substrate 55, the spacer member 67 generates a force that presses the wavelength conversion member 50 toward the bottom surface 44j of the recess 44f of the supporting member 44. Thus, the wavelength conversion member 50 is fixed to the supporting member 44 in a tightly bonded state without the use of adhesive material.

[0122] [Effects of the second implementation method]

[0123] In this embodiment, even if there are dimensional errors in the wavelength conversion component 50 or the spacer component 67, the wavelength conversion component 50 is pressed against the support component 44 with appropriate force, and the support component 44 is pressed against the substrate 55 with appropriate force. Therefore, the same effect as in the first embodiment can be obtained: the reduction in wavelength conversion efficiency caused by the temperature rise of the wavelength conversion component 50 is suppressed, fluorescence Y with the desired intensity can be obtained, and damage to the wavelength conversion component 50 can be suppressed. Thus, a light source device 120 with excellent reliability and fluorescence Y with the desired intensity can be realized.

[0124] [First Variation]

[0125] Hereinafter, variations of this embodiment will be described.

[0126] Figure 11 This is a front view of the light source device 130 in the first modified example. Figure 11 In this document, the same reference numerals are used for components that are identical to those in the light source device 120 of the second embodiment described above, and descriptions are omitted.

[0127] like Figure 11 As shown, the support member 34 in the first modification differs from the support member 44 in the second embodiment in that it does not have a mounting portion extending from the main body along the third surface of the support member. A second through hole 34h is provided in the main body of the support member 34, penetrating the support member 34 in a direction intersecting the third surface 34c. The other structures of the light source device 130 are the same as those of the light source device 120 in the second embodiment.

[0128] In this modified example, the same effect as in the second embodiment described above can also be achieved: a light source device 130 with high reliability and fluorescence Y with desired intensity can be obtained.

[0129] In this modified example, the support member 34 does not have a mounting portion, therefore, compared with the second embodiment, the width of the support member 34 in the Z-axis direction can be reduced. In addition, the support member 34, which has sufficient thickness, is provided with a second through hole 34h, so the support member 34 can stably withstand the pressing force from the elastic member 49.

[0130] [Third Implementation]

[0131] Hereinafter, the third embodiment of the present invention will be described using the accompanying drawings.

[0132] The basic structure of the projector and light source device in the third embodiment is largely the same as that in the first embodiment, so the description of the basic structure of the projector and light source device is omitted.

[0133] Figure 12 This is a perspective view of the light source device 140 according to the third embodiment. Figure 13 This is a front view of the light source device 140 according to the third embodiment.

[0134] exist Figure 12 and Figure 13 In this document, the same reference numerals are used for the same components as those used in the first embodiment, and descriptions are omitted.

[0135] like Figure 12 and Figure 13 As shown, the light source device 140 of this embodiment includes a wavelength conversion member 50, a light source unit 51, an angle conversion member (not shown), a mirror (not shown), a support member 94, a fixing member 95, a spacing member 67, a first heat sink 97, and a second heat sink 68.

[0136] The first heat sink 97 is disposed opposite to the fourth surface 94d of the support member 94. Although not shown in the figure, in this embodiment, it is also as in the first embodiment. Figure 6 As shown, a groove is provided on the fourth surface 94d of the support member 94, and the fixing member 95 is disposed inside the groove. Therefore, even though the fixing member 95 is disposed on the fourth surface 94d of the support member 94, the fixing member 95 will not protrude from the fourth surface 94d, and the first heat sink 97 abuts against the fourth surface 94d of the support member 94 without gap. In this embodiment, the first heat sink 97 corresponds to the first heat dissipation member.

[0137] The first radiator 97, like the second radiator 68, has a flat plate portion 98 and multiple fins 99. The fixing structure of the first radiator 97 and the support member 94 is not particularly limited. For example, it can be a structure in which a mounting portion is provided on the support member 94 and the first radiator 97 is threadedly fixed at the mounting portion, or it can be a structure in which a mounting portion is provided on the first radiator 97 and the support member 94 is threadedly fixed at the mounting portion.

[0138] The fixing member 95 is substantially the same as the fixing member 65 in the first embodiment, but differs from the fixing member 65 in that the spring actuation part 93 is provided at a position opposite to the fourth surface 94d of the support member 94. In this embodiment, as in the first embodiment, the fixing member 95 presses the support member 94 against the substrate 55 and fixes it by the elastic restoring force of the spring actuation part 93 in a stretched state.

[0139] like Figure 13As shown, in a cross-sectional view intersecting the long axis (X-axis direction) of the wavelength conversion member 50, the width W1 of the support member 94 in the Z-axis direction is smaller than the width W2 of the substrate 55 in the Z-axis direction. Furthermore, the width W5 of the first heat sink 97 in the Z-axis direction is smaller than the width W2 of the substrate 55 in the Z-axis direction. The width W2 of the substrate 55 is, for example, approximately 50 mm to 70 mm. The width W1 of the support member 94 is, for example, approximately 5 mm to 20 mm. The width W1 of the support member 94 is preferably less than 1 / 3 of the width W2 of the substrate 5, more preferably less than 1 / 5 of the width W2 of the substrate 55, and even more preferably less than 1 / 10 of the width W2 of the substrate 55.

[0140] The other structures of the light source device 140 are the same as those in the first embodiment.

[0141] [Effects of the third embodiment]

[0142] In this embodiment, even if there are dimensional errors in the wavelength conversion component 50 or the spacer component 67, the wavelength conversion component 50 is pressed against the support component 94 with appropriate force, and the support component 94 is pressed against the substrate 55 with appropriate force. Therefore, the same effect as in the first embodiment can be obtained: the reduction in wavelength conversion efficiency caused by the temperature rise of the wavelength conversion component 50 is suppressed, fluorescence Y with the desired intensity can be obtained, and damage to the wavelength conversion component 50 can be suppressed. Thus, a light source device 140 with excellent reliability and fluorescence Y with the desired intensity can be realized.

[0143] In this embodiment, the light source device 140 includes a first heat sink 97 in addition to the second heat sink 68, thus enabling efficient dissipation of heat from the support member 94 to the external space. Furthermore, while the width W1 of the support member 94 can be the same as the width W2 of the substrate 55, the heat from the wavelength conversion member 50 is hardly transferred to the end of the support member 94, which is far from the wavelength conversion member 50. Therefore, from a heat transfer perspective, the area at the end of the support member 94 becomes useless space. Thus, as in this embodiment, it is reasonable to have a structure where the width W1 of the support member 94 is smaller than the width W2 of the substrate 55.

[0144] Furthermore, the heat from the support member 94 is dissipated from both the second heat sink 68 and the first heat sink 97. Therefore, the width W5 of the first heat sink 97 provided on the fourth surface 94d of the support member 94 is the same as the width W1 of the support member 94, and it will not be unnecessarily large. A structure smaller than the width W2 of the substrate 55 is reasonable. In this way, according to this embodiment, the temperature rise of the wavelength conversion member 50 can be suppressed more reliably, and the portion of the light source device 140 on the support member 94 side can be miniaturized.

[0145] Furthermore, the scope of the present invention is not limited to the embodiments described above, and various modifications can be made without departing from the spirit of the invention. Additionally, one aspect of the present invention can employ a structure that appropriately combines the characteristic portions of the above embodiments and variations.

[0146] In the light source devices of the first and third embodiments, the entire fixing member is composed of an elastic member. However, for example, the spring action portion of the fixing member may also be composed of an elastic member, while the portion other than the spring action portion may not be elastic. Furthermore, the fixing member is not necessarily composed of a plate-shaped member; for example, it may be a linear member such as piano wire.

[0147] In the above embodiments, a radiator is cited as an example of a heat dissipation component. However, other cooling devices such as Peltier elements, heat-conducting components such as heat pipes, and any liquid cooling device that contains a liquid refrigerant in a container can also be used. Alternatively, fins can be formed directly on the outer surface of the support member. According to this structure, it is not necessary to fix the radiator to the support member. Furthermore, in the above embodiments, an example of providing a heat dissipation component on the fourth surface of the support member is shown, but heat dissipation components can also be further provided on the side of the support member that intersects with the fourth surface.

[0148] In the above embodiments, an example is shown in which the width of the support member is smaller than the width of the substrate in a cross-sectional view intersecting the long axis direction (X-axis direction) of the wavelength conversion member. However, the second embodiment does not require a mounting part of the plate-shaped member as a fixing member, so the width of the support member may not necessarily be smaller than the width of the substrate.

[0149] Furthermore, the specific descriptions regarding the shape, quantity, arrangement, and materials of the various components of the light source device and projector are not limited to the above embodiments and can be appropriately modified. Additionally, the above embodiments show an example of mounting the light source device of the present invention on a projector using a liquid crystal panel, but this is not a limitation. The light source device of the present invention can also be applied to a projector using a digital micromirror device as a light modulation device. Furthermore, the projector may not have multiple light modulation devices, or it may have only one light modulation device.

[0150] The above embodiments illustrate an example of applying the light source device of the present invention to a projector, but are not limited thereto. The light source device of the present invention can also be applied to lighting fixtures or automotive headlights, etc.

[0151] [Summary of this disclosure]

[0152] The following is a summary published in this note.

[0153] (Postscript 1)

[0154] A light source device comprising: a light-emitting element that emits first light having a first wavelength band; a substrate having a first surface on which the light-emitting element is disposed and a second surface located on the opposite side of the first surface; a wavelength conversion member comprising a phosphor that converts the first light emitted from the light-emitting element into second light having a second wavelength band different from the first wavelength band; a support member having a third surface abutting against the first surface of the substrate and a fourth surface located on the opposite side of the third surface, supporting the wavelength conversion member; a fixing member that fixes the support member to the substrate; and a spacer member that abuts against the substrate and the wavelength conversion member respectively, holding the light-emitting element and the wavelength conversion member in a position separated from each other, wherein the fixing member is configured to include an elastic member that fixes the support member to the substrate when the third surface is pressed toward the first surface.

[0155] According to the structure in Appendix 1, even with dimensional errors in the wavelength conversion component or the spacing component, the wavelength conversion component can be pressed against the support component with appropriate force, and the support component can be pressed against the substrate with appropriate force. As a result, the reduction in wavelength conversion efficiency caused by the temperature rise of the wavelength conversion component can be suppressed, and damage to the wavelength conversion component can be prevented. Thus, a light source device with desired fluorescence intensity and excellent reliability can be obtained.

[0156] (Postscript 2)

[0157] According to the light source device described in Appendix 1, the fixing member is composed of a plate-shaped member that abuts against at least a portion of the outer surface of the support member other than the third surface, and the support member is fixed to the substrate in a stretched state of the elastic member.

[0158] According to the structure in Appendix 2, the fixing member can press the support member against the substrate using the elastic restoring force of the elastic member in a stretched state. Furthermore, since the fixing member is composed of a plate-like member, it can stably press the support member against the substrate.

[0159] (Note 3)

[0160] According to the light source device described in Appendix 2, a groove is provided on the fourth surface of the support member at the position abutting the plate-shaped member, the plate-shaped member is disposed inside the groove, and the depth of the groove is greater than the thickness of the plate-shaped member.

[0161] According to the structure in Appendix 3, the plate-shaped member does not protrude from the fourth surface of the support member, thus simplifying the handling of the light source device. Furthermore, when a heat dissipation member is provided on the fourth surface of the support member, the heat dissipation member is in close contact with the fourth surface of the support member, thereby improving thermal conductivity from the support member to the heat dissipation member.

[0162] (Note 4)

[0163] According to Appendix 3, the light source device further includes a first heat dissipation component that abuts against the fourth surface and is subjected to heat transfer from the support component.

[0164] According to the structure in Appendix 4, the heat from the support member is transferred from the fourth surface to the first heat dissipation member, suppressing the temperature rise of the wavelength conversion member. Therefore, it is possible to suppress the decrease in wavelength conversion efficiency.

[0165] (Note 5)

[0166] The light source device according to any one of Appendix 2 to Appendix 4 further comprises a second heat dissipation component that abuts against the second surface of the substrate and is subjected to heat transfer from the substrate.

[0167] According to the structure in Appendix 5, the heat from the support member is transferred from the second surface of the substrate to the second heat dissipation member, suppressing the temperature rise of the wavelength conversion member. This, in turn, suppresses the reduction in wavelength conversion efficiency.

[0168] (Note 6)

[0169] According to the light source device described in Appendix 5, a hole is provided on the second heat dissipation component, and a first through hole is provided on the substrate at a position corresponding to the hole of the second heat dissipation component. The first through hole penetrates the substrate in a direction intersecting the first surface and the second surface. A second through hole is provided on the plate-shaped component at a position corresponding to the hole of the second heat dissipation component. The second through hole penetrates the plate-shaped component along the thickness direction. The plate-shaped component, the substrate, and the second heat dissipation component are fixed to each other by inserting screw components into the second through hole, the first through hole, and the hole.

[0170] According to the structure in Appendix 6, the plate-shaped component, the base plate, and the second heat dissipation component are fixed together by screw components, thus simplifying the fixing structure of these components.

[0171] (Note 7)

[0172] According to the light source device described in Appendix 1, a hole is provided on the first surface of the substrate, and a through hole is provided on the support member at a position corresponding to the hole on the substrate, which passes through the support member in a direction intersecting the third surface. The fixing member includes a screw member for inserting into the through hole and the hole, and an elastic member between the head of the screw member and the support member. The fixing member fixes the support member to the substrate when the elastic member is compressed.

[0173] According to the structure in Appendix 7, the fixing member can press the supporting member against the substrate using the elastic restoring force of the elastic member in a compressed state.

[0174] (Note 8)

[0175] According to the light source device described in Appendix 7, the support member has a main body portion that supports the wavelength conversion member and a mounting portion that extends along the third surface and has a thickness thinner than that of the main body portion, and the through hole is provided in the mounting portion.

[0176] According to the structure in Appendix 8, a through hole is provided in the mounting part, which is thinner than the main body, so the through hole can be easily machined.

[0177] (Postscript 9)

[0178] According to Appendix 7 or Appendix 8, the light source device further includes a first heat dissipation component that abuts against the fourth surface of the support component and is subjected to heat transfer from the support component.

[0179] According to the structure in Appendix 9, the heat from the support component is transferred from the fourth surface to the first heat dissipation component, suppressing the temperature rise of the wavelength conversion component. This, in turn, suppresses the reduction in wavelength conversion efficiency.

[0180] (Postscript 10)

[0181] The light source device according to any one of Annexes 7 to 9 further comprises a second heat dissipation component, the second heat dissipation component abutting against the second surface of the substrate and being transferred heat from the substrate.

[0182] According to the structure in Appendix 10, the heat from the support member is transferred from the second surface of the substrate to the second heat dissipation member, suppressing the temperature rise of the wavelength conversion member. This, in turn, suppresses the reduction in wavelength conversion efficiency.

[0183] (Postscript 11)

[0184] According to the light source device described in Appendix 10, the hole in the substrate is a first through hole that penetrates the substrate in a direction intersecting the first surface and the second surface, the through hole in the support member is a second through hole, and the second heat dissipation member has a hole at a position corresponding to the first through hole and the second through hole. The support member, the substrate, and the second heat dissipation member are fixed to each other by inserting the screw member into the second through hole, the first through hole, and the hole.

[0185] According to the structure in Appendix 11, the support component, the base plate, and the second heat dissipation component are fixed together by screw components, thus simplifying the fixing structure of these components.

[0186] (Postscript 12)

[0187] According to Appendix 4 or Appendix 9, in a cross-sectional view intersecting the long axis of the wavelength conversion component, the width of the support component is smaller than the width of the substrate, and the width of the first heat dissipation component is smaller than the width of the substrate.

[0188] According to the structure in Appendix 12, it is possible to miniaturize the portion on the support component side of the light source device.

[0189] (Postscript 13)

[0190] According to any one of Appendix 1 to Appendix 12, the support member has a recess recessed from the third surface to the fourth surface, the wavelength conversion member is disposed inside the recess, the recess having: a bottom surface abutting against the wavelength conversion member; and a first wall surface and a second wall surface extending in a direction intersecting the bottom surface and opposite to the wavelength conversion member, at least one of the first wall surface and the second wall surface having an inclined surface separated from the wavelength conversion member and inclined in a direction in which the distance between the inclined surface and the wavelength conversion member increases as it moves from the bottom surface toward the third surface, the inclined surface reflecting at least a portion of the first light emitted from the light-emitting element.

[0191] According to the structure in Appendix 13, the first light emitted from the light-emitting element and incident on the gap between the first or second wall surface and the wavelength conversion component is reflected by the inclined surface and easily incident on the wavelength conversion component. As a result, the utilization efficiency of the first light can be improved.

[0192] (Postscript 14)

[0193] A projector comprising: a light source device as described in any one of Annexes 1 to 13; a light modulation device for modulating light emitted from the light source device according to image information; and a projection optics device for projecting light modulated by the light modulation device.

[0194] According to the structure in Appendix 14, a highly efficient and compact projector can be realized.

Claims

1. A light source device, comprising: A light-emitting element that emits first light with a first wavelength; A substrate having a first surface on which the light-emitting element is disposed and a second surface located on the opposite side of the first surface; A wavelength conversion component, comprising a phosphor, converts the first light emitted from the light-emitting element into a second light having a second wavelength band different from the first wavelength band; A support member having a third surface that abuts against the first surface of the substrate and a fourth surface located on the opposite side of the third surface, supports the wavelength conversion member; A fixing component that secures the support component to the substrate; and The spacer members abut against both the substrate and the wavelength conversion component, respectively, keeping the light-emitting element and the wavelength conversion component in a separated position. The fixing member is configured to include an elastic member, which fixes the support member to the substrate when the third surface is pressed toward the first surface.

2. The light source device according to claim 1, wherein, The fixing member is composed of a plate-shaped member that abuts against at least a portion of the outer surface of the support member other than the third surface, and fixes the support member to the substrate in the state where the elastic member is stretched.

3. The light source device according to claim 2, wherein, A groove is provided on the fourth surface of the support member at the position where it abuts against the plate-shaped member. The plate-shaped component is disposed inside the groove. The depth of the groove is greater than the thickness of the plate-shaped component.

4. The light source device according to claim 3, wherein, The light source device also has a first heat dissipation component, which abuts against the fourth surface and is subjected to heat transfer from the supporting component.

5. The light source device according to any one of claims 2 to 4, wherein, The light source device also has a second heat dissipation component, which abuts against the second surface of the substrate and is subjected to heat transfer from the substrate.

6. The light source device according to claim 5, wherein, A hole is provided on the second heat dissipation component. A first through hole is provided on the substrate at a position corresponding to the hole of the second heat dissipation component. The first through hole penetrates the substrate in a direction intersecting the first surface and the second surface. A second through hole is provided on the plate-shaped component at a position corresponding to the hole of the second heat dissipation component, and the second through hole penetrates the plate-shaped component along the thickness direction. The plate-shaped component, the substrate, and the second heat dissipation component are fixed together by inserting screw components into the second through hole, the first through hole, and the holes.

7. The light source device according to claim 1, wherein, A hole is provided on the first surface of the substrate. A through hole is provided in the support member at a position corresponding to the hole in the substrate, and the through hole extends through the support member in a direction intersecting the third surface. The fixing component includes a screw component that is inserted into the through hole and the hole, and an elastic component located between the head of the screw component and the support component. The fixing component secures the support component to the substrate while the elastic component is compressed.

8. The light source device according to claim 7, wherein, The support member has a main body portion that supports the wavelength conversion member and a mounting portion that extends along the third surface and has a thickness thinner than that of the main body portion. The through hole is provided in the mounting part.

9. The light source device according to claim 7 or 8, wherein, The light source device also has a first heat dissipation component, which abuts against the fourth surface of the support component and is subjected to heat transfer from the support component.

10. The light source device according to claim 7 or 8, wherein, The light source device also has a second heat dissipation component, which abuts against the second surface of the substrate and is subjected to heat transfer from the substrate.

11. The light source device according to claim 10, wherein, The hole in the substrate is a first through hole that penetrates the substrate in a direction intersecting the first surface and the second surface. The through hole in the support component is the second through hole. The second heat dissipation component has holes at positions corresponding to the first through hole and the second through hole. The support component, the substrate, and the second heat dissipation component are fixed together by inserting screws into the second through hole, the first through hole, and the holes.

12. The light source device according to claim 4, wherein, In a cross-sectional view intersecting the major axis of the wavelength conversion component, The width of the support member is smaller than the width of the substrate. The width of the first heat dissipation component is smaller than the width of the substrate.

13. The light source device according to claim 1 or 7, wherein, The support member has a recess that is recessed from the third surface to the fourth surface. The wavelength conversion component is disposed inside the recess. The recess has: a bottom surface that abuts against the wavelength conversion component; and a first wall surface and a second wall surface that extend in a direction intersecting the bottom surface and are opposite to the wavelength conversion component. At least one of the first wall surface and the second wall surface has an inclined surface that is separated from the wavelength conversion component and slopes in a direction in which the distance between the inclined surface and the wavelength conversion component increases as it moves from the bottom surface toward the third surface. The inclined surface reflects at least a portion of the first light emitted from the light-emitting element.

14. A projector comprising: The light source device according to claim 1 or 7; A light modulation device that modulates light emitted from the light source device according to image information; and A projection optical device that projects light modulated by the light modulation device.

Citation Information

Patent Citations

  • HLD module with improved cooling of a luminescent body

    WO2020254455A1

  • Wavelength conversion element, illuminator, and projector

    US20200241406A1

  • HLD module with improved cooling of a luminescent body

    US20220342137A1