Metal plate and wiring device

Abstract

A metal plate (10) has a rectangular base plate (11) and a plurality of side walls (12) erected from a peripheral portion (11b) of the base plate (11). Furthermore, a plate thickness of a corner portion (13) formed by two adjacent side walls (12) among the plurality of side walls (12) or formed by one side wall (12) and the base plate (11) is 40% or more with respect to a reference thickness of the base plate (11).

Description

Technical Field

[0001] This invention relates to metal plates and wiring devices. Background Technology

[0002] Patent Document 1 discloses a forged thin-walled body made of magnesium alloy, which is formed by forging a thin sheet of magnesium alloy, such that the wall thickness of the main part formed by the bottom and peripheral wall is 1.5 mm or less, the chamfer or radius of the vertical inner corner and / or outer corner of the wall is 1 mm or less, the height of the wall is 30 mm or less, and the hub part is 10 times or less than the wall thickness of the main part.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2001-170734 Summary of the Invention

[0006] The problem the invention aims to solve

[0007] However, although Patent Document 1 discloses forgings specifically for magnesium alloys, there is a requirement to ensure the strength of the corners in other common metal plates.

[0008] Furthermore, on the other hand, when changing the thickness of such a typical metal sheet, it is possible to consider machining the formed product. In this case, it is more time-consuming and the manufacturing cost will also increase.

[0009] Therefore, the object of the present invention is to provide a metal plate and wiring device that can ensure the strength of the corners and suppress the increase in manufacturing costs, and can be applied to ordinary metal plates, rather than specifically magnesium alloys.

[0010] Solution for solving the problem

[0011] One technical solution of the present invention provides a metal plate having a rectangular base plate and a plurality of sidewalls erected from the periphery of the base plate; the thickness of the corner formed by two adjacent sidewalls or by one sidewall and the base plate is 40% or more relative to the reference thickness of the base plate.

[0012] Furthermore, one embodiment of the present invention provides a wiring device with a metal plate as the covering body, which can be applied to a common metal plate rather than a magnesium alloy.

[0013] The effects of the invention

[0014] The metal plate and wiring device according to the present invention can ensure the strength of the metal plate and suppress the increase in manufacturing costs, and can be applied to ordinary metal plates, rather than specifically magnesium alloys. Attached Figure Description

[0015] Figure 1 This is a perspective view showing the appearance of the wiring device according to the embodiment.

[0016] Figure 2A It is a perspective view showing the appearance of the surface of the metal plate when observing the embodiment.

[0017] Figure 2B This is a perspective view showing the appearance of the back side of the metal plate when observing the embodiment.

[0018] Figure 3 It means Figure 2A A cross-sectional view of the corner of the metal plate of line III-III.

[0019] Figure 4A This diagram shows the state of a metal sheet before it is clamped in the mold during manufacturing.

[0020] Figure 4B This is a diagram showing the state of a metal sheet after the mold has been clamped during manufacturing.

[0021] Figure 5 This diagram shows the thickness of the metal sheet immediately following forging and the metal sheet undergoing secondary processing.

[0022] Figure 6 This is a diagram showing the thickness of the metal plates in the comparative examples.

[0023] Figure 7 It is a graph showing the hardness of the metal sheet immediately after forging, the metal sheet after secondary processing, and the metal sheet of the comparative example. Detailed Implementation

[0024] Furthermore, the embodiments described below are all general or specific examples. The values, shapes, materials, constituent elements, the arrangement and connection of constituent elements, steps, and the order of steps shown in the following embodiments are all merely examples and are not intended to limit the present invention. In addition, constituent elements not described in the independent claims of the constituent elements in the following embodiments are described as optional constituent elements.

[0025] Furthermore, the figures are schematic diagrams and not precise illustrations. Also, in each figure, the same reference numerals are used for the same constituent components. Furthermore, in the following embodiments, terms such as "generally parallel" and "cubic parallel" are used. For example, "generally parallel" and "cubic parallel" do not only refer to being completely parallel or entirely cuboid, but also to being substantially parallel and substantially cuboid, i.e., including, for example, a margin of error of about a few percent. Furthermore, "generally parallel" and "cubic parallel" mean being parallel and straight within the range where the effects of the present invention can be obtained. The same applies to other uses of "generally" and "shaped".

[0026] Furthermore, in the following embodiments, the short side direction of the metal plate is defined as the X-axis direction, the long side direction of the metal plate is defined as the Y-axis direction, and the direction orthogonal to both the X-axis and Y-axis directions is defined as the Z-axis direction. Additionally, in the X-axis direction... Figure 1 The left side is defined as the positive direction side, and in the Y-axis direction, Figure 1 The upper side is defined as the positive direction side, and the pressure will be applied in the Z-axis direction. Figure 1 The direction side of the switch is defined as the positive direction side.

[0027] The following description, with reference to the figures, details the specific implementation methods.

[0028] (Implementation Method)

[0029] <Components: Wiring Equipment 1>

[0030] First, the composition of wiring device 1 will be explained.

[0031] Figure 1 This is a perspective view showing the appearance of the wiring device 1 according to the embodiment.

[0032] like Figure 1 As shown, the wiring device 1 is, for example, a connection device that supplies power to or disconnects the power supply to equipment systems such as lighting fixtures and ventilation devices installed in the facility. The wiring device 1 is embedded in a structure such as a ceiling or wall. The wiring device 1 is, for example, a socket or a switch. The wiring device 1 is formed into a long rectangular parallelepiped along the Y-axis.

[0033] When the wiring device 1 is installed in the embedded structure, the switch body 2 of the wiring device 1 is inserted into the through hole 20a of the metal plate 10. That is, the wiring device 1 directly or indirectly connects the metal plate 10 and the switch body 2 with a part of the switch body 2 of the wiring device 1 exposed from the through hole 20a of the metal plate 10.

[0034] Wiring device 1 includes switch body 2 and metal plate 10.

[0035] Switch body 2 is a switching device that electrically connects or disconnects electrical wires. Switch body 2 is an example of a main body.

[0036] For example, the switch body 2 consists of a housing, a pair of terminals, a locking spring, an operating part, and a handle 4. The housing is a long rectangular parallelepiped along the X-axis and houses the pair of terminals, the locking spring, etc. Each of the terminals is a quick-connect terminal made of a highly conductive metal material. The locking spring, by pressing the wire against the terminal, establishes an electrical connection between the terminal and the wire; releasing the pressure on the terminal removes the wire from the terminal. The operating part is mounted on the Z-axis negative side of the switch body 2. Furthermore, the handle 4 is rotatably positioned on the Z-axis negative side of the operating part. Pressing the operating part with the handle 4 causes the switch body 2 to, for example, make contact between the movable contact of one terminal and the fixed contact of the other terminal, thereby establishing an electrical connection. Furthermore, pressing the operating part again with the handle 4 causes the switch body 2 to separate the movable contact of one terminal from the fixed contact of the other terminal, thereby disengaging the connection. That is, by pressing the handle 4, the contact built into the switch body 2 can be switched between an ON state and an OFF state, thereby switching between the on and off states of equipment such as lighting devices and power supplies such as commercial AC power supplies. In other words, the switch body 2 is an opening and closing device that switches between the ON and OFF states of the contacts according to the switching operation of the handle 4.

[0037] Figure 2A This is a perspective view showing the appearance of the surface 11a of the metal plate 10 in the embodiment. Figure 2B This is a perspective view showing the appearance of the back side 11c of the metal plate 10 in the embodiment.

[0038] like Figure 1 , Figure 2A and Figure 2B As shown, the metal plate 10 is a rectangular frame mounted on the structure. A through hole 20a for mounting the switch body 2 is formed in the center of the metal plate 10. However, although this embodiment illustrates the case where the through hole 20a is formed in the center of the metal plate 10, it is also possible that the through hole 20a is not formed in the center of the metal plate 10. In this case, the metal plate 10 may also be a sheet material covering the switch body 2.

[0039] Furthermore, the metal plate 10 is made of metallic materials. For example, the metallic materials are mainly composed of metals such as iron, aluminum, and copper.

[0040] Furthermore, the surface roughness of the metal plate 10, measured by the new JIS (Japanese Industrial Standards) method, is in the range of 1.0 to 3.0 (μm). That is, multiple straight grooves extending in a predetermined direction or multiple circular grooves are formed on the surface 11a of the metal plate 10. This surface finishing of the metal plate 10 is performed by machining. Specifically, the straight grooves extending in the predetermined direction can be formed by performing a brushed finish on the surface 11a of the metal plate 10. Furthermore, the circular grooves can be formed by performing a vibration finish on the surface 11a of the metal plate 10. Here, the surface 11a of the metal plate 10 is the surface on the negative Z-axis side of the metal plate 10. In this embodiment, the surface roughness of the surface 11a of the metal plate 10 after vibration finishing is 2.275 (μm).

[0041] Furthermore, an aluminum oxide film is formed on the surface 11a of the metal plate 10. This surface processing of the metal plate 10 is performed by chemical liquid processing. Specifically, the aluminum oxide film can be formed by performing an acid-resistant aluminum processing on the surface 11a of the metal plate 10.

[0042] In addition, the metal plate 10 has a base plate 11 and multiple sidewalls 12.

[0043] The base plate 11 is rectangular. In this embodiment, the base plate 11 is a long rectangular plate along the Y-axis. Furthermore, the base plate 11 is a flat plate that is approximately parallel to the XY plane.

[0044] Multiple sidewalls 12 are erected from the periphery 11b of the base plate 11. Here, the periphery 11b of the base plate 11 is the outer peripheral edge of the base plate 11. That is, the multiple sidewalls 12 are formed along the periphery 11b of the base plate 11 and are formed to stand upright along the positive Z-axis direction. Therefore, the multiple sidewalls 12 are arranged to surround the back surface 11c of the base plate 11. Here, the back surface 11c of the base plate 11 is the surface of the base plate 11 facing the positive Z-axis direction, which is the surface of the metal plate 10 opposite to the surface 11a of the base plate 11.

[0045] In this embodiment, the base plate 11 is rectangular, and therefore four sidewalls 12 are formed on the base plate 11. Thus, the four sidewalls 12 disposed on the periphery 11b of the base plate 11 are arranged to surround the back surface 11c of the metal plate 10.

[0046] Such a metal plate 10 has corner portions 13a formed by two adjacent sidewalls 12 or by one sidewall 12 and a base plate 11. The corner portions 13a include corner portions 13 formed by two adjacent sidewalls 12 and the base plate 11. In the metal plate 10 of this embodiment, four corner portions 13 are formed by one base plate 11 and four sidewalls 12.

[0047] Further utilization Figure 3 Explanation of corner 13. Figure 3 It means Figure 2A A cross-sectional view of the corner 13 of the metal plate 10 in line III-III.

[0048] like Figure 2A , Figure 2B and Figure 3 As shown, in this embodiment, the corner portion 13 is formed by two adjacent sidewalls 12 from a plurality of sidewalls 12 and a base plate 11. The lower limit of the thickness of the corner portion 13 is 40% or more relative to the reference thickness of the base plate 11 of the metal plate 10. For example, the thickness W1 of the corner portion 13 is set to 40% or more relative to the reference thickness. Alternatively, the lower limit can also be set to a thickness of 40% to 50% relative to the reference thickness. Furthermore, the upper limit of the thickness of the corner portion 13 is less than 85% relative to the reference thickness of the base plate 11 of the metal plate 10.

[0049] In this embodiment, the thickness of the sidewall 12 of the metal plate 10 is 1.108 mm, the thickness of the bottom plate 11 is 0.988 mm, the thickness of the peripheral portion 11b is 1.137 mm, and the thickness of the corner portion 13 is 0.625 mm. The thicknesses of the sidewall 12, bottom plate 11, peripheral portion 11b, and corner portion 13 of the metal plate 10 are merely one example and are not limited to this embodiment.

[0050] Here, the reference thickness is the thickness of the base plate 11. Specifically, when the base plate 11 has a through hole 20a, the reference thickness is the thickness of the midpoint between the through hole 20a and the periphery 11b of the base plate 11. Furthermore, when the base plate 11 does not have a through hole 20a, the reference thickness is the thickness of the central portion of the base plate 11. In this embodiment, for example, the reference thickness is 1 mm. Alternatively, the reference thickness may be the average thickness of the base plate 11 excluding the periphery 11b, the corner 13, and the through hole 20a.

[0051] Furthermore, the multiple sidewalls 12 are forgings. That is, the multiple sidewalls 12 are forgings formed into a predetermined shape by pressing. Therefore, the thickness of the multiple sidewalls 12 is greater than the thickness of the base plate 11. In addition, the corners 13 are formed by chamfering when forging the multiple sidewalls 12. The base plate 11 can be either a casting or a forging.

[0052] Furthermore, the metal plate 10 can be directly connected to the switch body 2 via a fastening member or fastening mechanism such as a threaded member. Alternatively, the metal plate 10 can also be indirectly connected to the switch body 2 via a switch connector (not shown). This switch connector connects the switch body 2 to the metal plate 10.

[0053] <Manufacturing Method>

[0054] Next, using Figure 4A and Figure 4B The manufacturing method of the metal plate 10 is explained.

[0055] Figure 4A This is a diagram showing the state of the metal sheet 10 before the mold is clamped during manufacturing. Figure 4B This is a diagram showing the state of the metal sheet 10 after the mold is clamped during manufacturing.

[0056] First, such as Figure 4A As shown, a base plate consisting of a rectangular base plate 111 and multiple base sidewalls 112 is prepared. This base plate is a metal plate made before the metal plate 10 of this embodiment is formed. For example, the base plate can also be formed by die casting or stamping.

[0057] Specifically, the base plate allows molten metal to flow into a mold cavity formed by combining multiple molds, where it solidifies and is thus shaped. Alternatively, the base plate can be shaped by stamping a flat metal sheet using a square punch or other mold.

[0058] Next, the base plate is positioned within the openings formed by molds A, B, C, and D. Mold A is positioned on the underside of the base plate, mold B is positioned on the outer periphery of the multiple base sidewalls 112 of the base plate, and mold C is positioned on the inner periphery of the multiple base sidewalls 112 of the base plate. At this time, a gap is formed between mold C and mold B, exposing the ends of the base sidewalls 112.

[0059] like Figure 4B As shown, the mold D is placed into the gap, thereby pressurizing the base sidewall 112. The base sidewall 112 is forged by pressurizing with the mold D. By forging the base sidewall 112 with the mold D, a sidewall 12 with a thickness greater than that of the base plate 111 and the base sidewall 112 is formed.

[0060] Furthermore, since the mold B has an arc-shaped bend B1 at the boundary between the base sidewall 112 and the base plate 111, the shape of the bend B1 is transferred to the boundary between the base sidewall 112 and the base plate 111 when the base sidewall 112 is pressed by the mold D. Therefore, when the base sidewall 112 is pressed by the mold D, forging begins, and the mold D presses the base sidewall 112 into the... Figure 4B The position of the lower stop point, together with the forged multiple sidewalls 12, forms the corner 13.

[0061] Furthermore, the surface 11a side of the metal plate 10 of the peripheral portion 11b has a chamfer of C0.5. That is, the peripheral portion 11b is given a C0.5 shape by forging multiple sidewalls 12.

[0062] <Measurement Results>

[0063] Next, using Figure 5 , Figure 6 , Figure 7 The measurement results for metal plates A, B, and C immediately after forging, metal plates A1, B1, and C1 after secondary processing, and metal plates A2, B2, and C2 of the comparative example are explained. Metal plates A, B, and C, and metal plates A1, B1, and C1 after secondary processing, correspond to metal plate 10 of this embodiment. Furthermore, metal plates A1, B1, and C1 after secondary processing are metal plates that have undergone brushed finish, vibration processing, and acid-resistant aluminum processing.

[0064] Figure 5 This diagram shows the thicknesses of the metal plates A, B, and C immediately after forging, the metal plates A1, B1, and C1 after secondary processing, and the metal plates A2, B2, and C2 of the comparative examples. Figure 6 This is a diagram showing the thickness of the metal plates A2, B2, and C2 in the comparative examples. Figure 7 It is a graph showing the hardness of the metal sheet immediately after forging, the metal sheet after secondary processing, and the metal sheet of the comparative example.

[0065] exist Figure 5The plate thicknesses at the following locations are illustrated: the central portion NO1 of the base plate, the peripheral portion NO2 near a corner, the peripheral portion NO3, the peripheral portion NO4 near another corner, the peripheral portion NO5 near another corner, another peripheral portion NO6, the peripheral portion NO7 near yet another corner, the boundary portion of two adjacent sidewalls NO8, the boundary portion of two adjacent sidewalls NO9, another peripheral portion NO10, and the central portion of the base plate NO11. Immediately after forging, the thicknesses of NO1 to NO11 of the metal plate A become 74.7, 90.4, 90.3, 92.8, 86.6, 90.1, 85.1, 84.8, 97.8, 89.5, and 80.5 (mm). Furthermore, the NO1 to NO11 of the metal plate B immediately following forging becomes 80.0, 91.6, 93.3, 98.0, 93.8, 83.6, 83.2, 88.9, 91.4, 92.2, and 85.4 (mm). Similarly, the NO1 to NO11 of the metal plate C immediately following forging becomes 75.5, 90.6, 92.8, 94.1, 89.2, 88.9, 87.5, 92.9, 92.2, 94.3, and 82.5 (mm). The NO1 to NO11 of the secondary processed metal plate A1 becomes 79.8, 99.4, 92.4, 102.7, 100.5, 93.6, 93.9, 101.3, 96.0, 92.1, and 81.7 (mm). The aforementioned NO1 to NO11 of the secondary processed metal plate B1 become 75.8, 98.3, 93.0, 93.6, 108.3, 92.5, 92.4, 112.6, 115.1, 95.6, and 78.8 (mm). The aforementioned NO1 to NO11 of the secondary processed metal plate C1 become 82.1, 109.3, 92.1, 100.8, 101.9, 94.8, 92.3, 94.4, 107.1, 95.1, and 81.4 (mm).

[0066] exist Figure 6 Examples of plate thicknesses at the following locations: central portion of the base plate NO1, peripheral portion NO2, peripheral portion near the corner NO3, peripheral portion near another corner NO4, another peripheral portion NO5, yet another peripheral portion NO6, corner NO7, surface NO8, and corner NO9.

[0067] The NO1 to NO9 of the comparative example metal plate A2 are 35.3, 32.6, 25.1, 33.4, 35.1, 36.3, 230.1, 215.8, and 254.9 (mm). The NO1 to NO9 of the comparative example metal plate B2 are 41.1, 36.5, 26.8, 29.1, 29.6, 40.7, 229.5, 204.6, and 251.6 (mm). The NO1 to NO9 of the comparative example metal plate C2 are 38.0, 39.5, 28.7, 33.1, 31.4, 43.9, 233.2, 206.2, and 250.1 (mm).

[0068] In addition, the results of this measurement include errors that would arise in the usual measurement of plate thickness.

[0069] Thus, the following results can be obtained: the difference in thickness between the metal plates A, B, and C immediately after forging, and the metal plates A1, B1, and C1 after secondary processing, is smaller than that between the metal plates A2, B2, and C2 of the comparative example.

[0070] exist Figure 7 In the figure, the base material hardness, base material surface hardness, base material back hardness, forging surface hardness, base material hardness ratio, and maximum-minimum ratio are represented by the base material hardness of the metal sheet immediately following forging, the secondary processed metal sheet, and the comparative example metal sheet.

[0071] Here, in the metal sheet immediately following forging and in the metal sheet undergoing secondary processing, the base material hardness represents the average of the surface hardness and the back hardness of the base material. Similarly, the base material surface hardness represents... Figure 5 The average value of NO1. Similarly, the hardness of the back side of the base material indicates... Figure 5 The average value of NO11. Similarly, the hardness of the forged surface indicates... Figure 5 The average value of NO2 to NO10. Similarly, the base material hardness ratio is calculated based on (forging surface hardness - base material hardness) / base material hardness. Similarly, the maximum and minimum value ratio is based on [( Figure 5 (the maximum value among NO1 to NO11) - ( Figure 5 (Minimum value among NO1 to NO11) / ( Figure 5 It is calculated by taking the minimum value among NO1 to NO11.

[0072] In the comparative example metal sheet, the base material hardness represents the average of the surface hardness and the back hardness of the base material. Similarly, the surface hardness of the base material represents... Figure 6 The average value of NO8. Similarly, the hardness of the back side of the base material indicates... Figure 6 The average value of NO7. Similarly, the hardness of the forged surface indicates... Figure 6The average value of NO9. Similarly, the base material hardness ratio is calculated based on (forging surface hardness - base material hardness) / base material hardness. Similarly, the maximum-minimum ratio is based on [( Figure 6 (the maximum value among NO7 to NO9) - ( Figure 6 (Minimum value among NO7 to NO9)] / ( Figure 6 It is calculated by taking the minimum value among NO7 to NO9.

[0073] The base material hardness of the metal plate immediately after forging is 79.8, the surface hardness of the base material immediately after forging is 76.7, the back surface hardness of the base material immediately after forging is 82.8, the forging surface hardness of the metal plate immediately after forging is 90.6, the base material hardness ratio of the metal plate immediately after forging is 0.1356, and the maximum-to-minimum ratio of the metal plate immediately after forging is 0.3119.

[0074] The hardness of the base material of the secondary processed metal plate is 79.9, the surface hardness of the base material of the secondary processed metal plate is 79.2, the back hardness of the base material of the secondary processed metal plate is 80.6, the hardness of the forged surface of the secondary processed metal plate is 98.6, the hardness ratio of the base material of the secondary processed metal plate is 0.2330, and the ratio of the maximum to the minimum value of the secondary processed metal plate is 0.5185.

[0075] The hardness of the base material of the comparative example metal plate is 219.9, the surface hardness of the base material of the comparative example metal plate is 208.9, the back hardness of the base material of the comparative example metal plate is 230.9, the hardness of the forged surface of the comparative example metal plate is 252.2, the hardness ratio of the base material of the comparative example metal plate is 0.1469, and the ratio of the maximum to the minimum value of the comparative example metal plate is 0.2458.

[0076] In addition, the results of this measurement include errors that arise in general measurements such as Vickers hardness.

[0077] Thus, the following result can be obtained: in the metal plate immediately following forging and the metal plate after secondary processing, the hardness of the forged sidewalls 12 and corners 13 is higher than that of the unforged base plate 11 compared to the metal plate of the comparative example.

[0078] <Effects>

[0079] Next, the effects of the metal plate 10 and the wiring device 1 in this embodiment will be explained.

[0080] As described above, the metal plate 10 of this embodiment includes a rectangular base plate 11 and multiple sidewalls 12 erected from the periphery 11b of the base plate 11. Furthermore, the thickness of the corner portion 13 formed by two adjacent sidewalls 12 or by one sidewall 12 and the base plate 11 is 40% or more relative to the reference thickness of the base plate 11 of the metal plate 10.

[0081] Based on this, since the thickness of the corner portion 13 is at least 40% greater than the reference thickness of the base plate 11 of the metal plate 10, the strength of the metal plate 10 can be ensured.

[0082] Furthermore, since a base plate 11 and multiple sidewalls 12 can be formed, the formed product does not need to be machined as in the prior art, thus avoiding situations where manufacturing costs increase due to the time spent manufacturing the metal plate 10.

[0083] Therefore, the metal plate 10 can ensure the strength of the metal plate 10 and suppress the increase in manufacturing costs, and it can be applied to ordinary metal plates, rather than specifically magnesium alloys.

[0084] Furthermore, the wiring device 1 of this embodiment includes a metal plate 10, which serves as the material covering the main body.

[0085] The same effect as described above is achieved in this wiring device 1.

[0086] Furthermore, in the metal plate 10 of this embodiment, the thickness of the corner portion 13 is less than 85% of the reference thickness of the base plate 11 of the metal plate 10.

[0087] Based on this, the strength of the corner 13 of the metal plate 10 can be ensured.

[0088] Furthermore, in the metal plate 10 of this embodiment, the multiple sidewalls 12 are forgings.

[0089] Based on this, the strength of the multiple sidewalls 12 can be ensured. Therefore, for example, when workers install the metal plate 10 onto the structure, even if the metal plate 10 is accidentally dropped, the metal plate 10 will not easily deform.

[0090] Furthermore, since multiple sidewalls 12 can be formed by forging, there is no need to machine the formed product as in the prior art, thus reducing the likelihood of increased manufacturing costs due to the time spent manufacturing the metal plate 10. In other words, this metal plate 10 can suppress the increase in manufacturing costs.

[0091] Furthermore, in the metal plate 10 of this embodiment, the surface roughness of the metal plate 10, as measured by the new JIS (Japanese Industrial Standards) method, is in the range of 1.0 to 3.0 (μm).

[0092] Based on this, a desired pattern can be formed on the surface 11a of the metal plate 10.

[0093] Furthermore, in the metal plate 10 of this embodiment, a plurality of straight grooves extending in a predetermined direction or a plurality of circular grooves are formed on the surface 11a of the metal plate 10.

[0094] Based on this, multiple straight lines, multiple circular patterns, etc., can be formed on the surface 11a of the metal plate 10, thus enabling the metal plate 10 to have a good appearance.

[0095] Furthermore, in the metal plate 10 of this embodiment, an aluminum oxide film is formed on the surface 11a of the metal plate 10.

[0096] Based on this, the alumina film formed on the surface 11a of the metal plate 10 can provide a metal plate 10 with good corrosion resistance and wear resistance.

[0097] (Other variations)

[0098] The metal plate and wiring device of the present invention have been described above based on the various embodiments described, but the present invention is not limited to these embodiments. Various modifications to the embodiments that may be conceived by those skilled in the art without departing from the spirit of the present invention are all included within the scope of the present invention.

[0099] Furthermore, any modifications conceived by those skilled in the art to the above embodiments, or any combination of the constituent elements and functions of the embodiments without departing from the spirit of the invention, are included in the present invention.

[0100] Explanation of reference numerals in the attached figures

[0101] 1: Wiring equipment

[0102] 2: Switch body (main body)

[0103] 10: Metal plate

[0104] 11: Base Plate

[0105] 11a: Surface

[0106] 11b: Peripheral part

[0107] 12: Sidewall

[0108] 13, 13a: Corner

Claims

1. A metal plate comprising: A rectangular base plate; and Multiple sidewalls are erected from the periphery of the base plate and configured to surround the back of the base plate. The multiple sidewalls and the base plate are forgings. The thickness of the forged sidewalls is greater than the thickness of the unforged sidewalls and the thickness of the unforged base plate. The thickness of the forged corner formed by the forged two adjacent sidewalls and the forged base plate is more than 40% and less than 85% of the reference thickness of the base plate.

2. The metal plate according to claim 1, characterized in that, The surface roughness of the metal plate, as determined by the new JIS method, is in the range of 1.0 μm to 3.0 μm.

3. The metal plate according to claim 1 or 2, characterized in that, On the surface of the metal plate, multiple straight grooves extending in a specified direction or multiple circular grooves are formed.

4. The metal plate according to claim 1 or 2, characterized in that, An aluminum oxide film is formed on the surface of the metal plate.

5. A wiring device, characterized in that, The metal plate as described in any one of claims 1 to 4 is used as a sheet material covering the main body.

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