一种适配微波等离子体焊接的导流保温装置

By designing a heat-conducting and heat-insulating device, the problems of low heat utilization and excessive temperature difference during microwave plasma welding of optical fiber preforms were solved, enabling highly reliable welding of large-diameter preforms, improving welding strength and efficiency, and reducing costs.

CN118026516BActive Publication Date: 2026-07-17WUHAN FEILING OPTOELECTRONICS TECH CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
WUHAN FEILING OPTOELECTRONICS TECH CO LTD
Filing Date
2024-01-31
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

When microwave plasma welding optical fiber preforms, the plasma hot jet velocity is too fast, and the welding cannot effectively absorb heat through heat conduction, resulting in the core of the preform not reaching a molten state. In addition, the thermal conductivity of large-diameter preforms is low, and the heat absorbed is insufficient. The temperature difference during welding is too large, making it difficult to guarantee the welding quality.

Method used

Design a flow guiding and heat preservation device adapted to microwave plasma welding, including a flow guiding and heat preservation section and a diameter reduction section. The flow guiding and heat preservation section surrounds and covers the welding end face of the preform rod. Through the guide gap of the microwave plasma torch, combined with multiple layers of quartz, graphite, aluminum silicate and stainless steel, a uniform hot flame flow is formed. The diameter reduction section and the flaring section are designed to improve heat utilization and welding efficiency.

Benefits of technology

This technology enables highly reliable welding of large-diameter preforms, reduces axial and radial temperature differences, improves welding strength, avoids contamination of fiber optic preforms and burn risks to operators, and lowers the cost of using plasma torches.

✦ Generated by Eureka AI based on patent content.

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Abstract

本发明公开了一种适配微波等离子体焊接的导流保温装置,包括:导流保温部和缩径部;导流保温部至少环绕包覆待焊接的两段预制棒的焊接端面区域,将从焊接端面间通过的微波等离子体焰炬导向其与预制棒棒体面间的间隙;缩径部包括第一和第二缩径部,分别连接导流保温部的两端,分别环绕包覆待焊接的两段预制棒的缩径部包覆区域;缩径部与预制棒棒体面间的间隙的平均间隙距离小于导流保温部与预制棒棒体面间的间隙的平均间隙距离。本发明通过导流保温部配合缩径部的结构设计,可将微波等离子体焰炬产生的大部分热量“锁定”,能够将焰炬导流并均匀地包覆在需要焊接的预制棒端面上,从而提升了焊接过程中的热量传递效果,提高了焊接质量和效率。
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