Method for processing a transparent substrate, transparent substrate and household appliance

Abstract

The present application relates to the field of glass processing, and provides a transparent substrate processing method, a transparent substrate and a household appliance. The processing method comprises the following steps: etching a first side of a transparent substrate body to reduce the reflectivity of the first side; grinding the first side of the transparent substrate body; and forming a non-conductive plating film layer with a predetermined thickness on a second side of the transparent substrate body. The first side of the transparent substrate body becomes a matte non-reflective surface through etching, preventing light reflection and avoiding glare. The transparent substrate body achieves a softer and more delicate high-transparency AG effect through grinding the first side. The reflectivity is controlled by forming the non-conductive plating film layer with a predetermined thickness on the second side of the transparent substrate body, so that the transparent substrate exhibits optimal display performance and improves the overall appearance of the transparent substrate.

Description

Technical Field

[0001] This invention relates to the field of glass processing, and more particularly to a method for processing a transparent substrate, a transparent substrate, and a household appliance. Background Technology

[0002] While glass is one of the most widely used materials in home appliances, its processing technology has remained largely unchanged for a long time. However, with increasing consumer demand for furniture-like designs and concealed aesthetics, appearance and CMF (color / material / processing) have become increasingly simplified. Applying representative glass processing techniques such as printed patterns and mirror effects to products no longer aligns with these evolving design trends. Furthermore, the glass in these technologies reflects light, leading to glare. Summary of the Invention

[0003] This invention aims to at least solve one of the technical problems existing in related technologies. To this end, this invention proposes a processing method for a transparent substrate that effectively prevents light reflection and avoids glare.

[0004] The present invention also proposes a transparent substrate.

[0005] The present invention also proposes a household appliance.

[0006] A method for processing a transparent substrate according to a first aspect embodiment of the present invention includes the following steps:

[0007] The etching step involves etching the first side of the transparent substrate body to reduce the reflectivity of the first side.

[0008] The grinding step involves grinding the first side surface of the transparent substrate body.

[0009] In the coating step, a non-conductive coating layer of predetermined thickness is formed on the second side of the transparent substrate body.

[0010] According to the processing method of the transparent substrate of the present invention, by etching the first side of the transparent substrate body, the first side of the transparent substrate body can be made into a matte non-reflective surface to prevent light reflection and avoid glare; by grinding the first side of the transparent substrate body, the transparent substrate body can achieve a softer and more delicate high-transparency AG effect; by forming a non-conductive coating layer of predetermined thickness on the second side of the transparent substrate body, the reflectivity can be controlled; thus, the transparent substrate body exhibits the best display performance and improves the overall appearance of the transparent substrate body.

[0011] According to one embodiment of the present invention, prior to the etching step, the following step is further included:

[0012] The film application step involves attaching a protective film to the second side of the transparent substrate body.

[0013] According to one embodiment of the present invention, prior to the coating step, the following step is further included:

[0014] The film removal step involves removing the protective film adhered to the second side of the transparent substrate body.

[0015] According to one embodiment of the present invention, after the coating step, the following step is further included:

[0016] The step of printing a semi-transparent ink layer involves printing a semi-transparent ink layer of a first predetermined color on the side of the non-conductive coating layer opposite to the transparent substrate body.

[0017] According to one embodiment of the present invention, after the step of printing the translucent ink layer, the following step is further included:

[0018] The step of printing the base color ink layer involves printing a second predetermined color base color ink layer on the side of the translucent ink layer opposite to the non-conductive coating layer.

[0019] According to one embodiment of the present invention, after the step of printing the base color ink layer, the following step is further included:

[0020] A protective ink layer is printed on the side of the base ink layer that is opposite to the translucent ink layer.

[0021] According to one embodiment of the present invention, after the grinding step, the following step is further included:

[0022] An anti-fingerprint layer is formed on the first side of the transparent substrate body.

[0023] According to one embodiment of the present invention, prior to the coating step, the following step is further included:

[0024] In the optical performance verification step, if the reflectivity of the transparent substrate is determined to be less than a preset value, then the coating step is performed.

[0025] According to one embodiment of the present invention, prior to the optical performance verification step, the following step is further included:

[0026] Clean the first and / or second sides of the transparent substrate body.

[0027] According to one embodiment of the present invention, the grinding step includes:

[0028] The first side of the transparent substrate body is subjected to a first grinding process;

[0029] The first side of the transparent substrate body is subjected to a second grinding process;

[0030] The first side of the transparent substrate body is subjected to a third grinding process, wherein the grinding time and grinding pressure of the first grinding process, the second grinding process and the third grinding process are different.

[0031] According to one embodiment of the present invention, the transparent substrate body is glass, and the following steps are included before the film application step:

[0032] The transparent substrate body is subjected to tempering treatment.

[0033] According to a second aspect of the present invention, the transparent substrate is prepared by the processing method of any one of the above-described transparent substrates, comprising:

[0034] A transparent substrate body, wherein the first side of the transparent substrate body is etched and polished;

[0035] A non-conductive coating layer is formed on the second side of the transparent substrate body.

[0036] According to one embodiment of the present invention, it further includes:

[0037] A semi-transparent ink layer is formed on the side of the non-conductive coating layer that is opposite to the transparent substrate body;

[0038] A base color ink layer is formed on the side of the translucent ink layer opposite to the non-conductive coating layer.

[0039] According to one embodiment of the present invention, it further includes:

[0040] An ink protective layer is formed on the side of the base color ink layer opposite to the translucent ink layer.

[0041] According to one embodiment of the present invention, it further includes:

[0042] An anti-fingerprint layer is formed on a first side of the transparent substrate body. A household appliance according to a third aspect embodiment of the present invention includes a housing and the transparent substrate described in any one of the above claims, the transparent substrate being disposed on the housing.

[0043] The above-described one or more technical solutions in the embodiments of the present invention have at least one of the following technical effects:

[0044] According to the processing method of the transparent substrate of the present invention, by etching the first side of the transparent substrate body, the first side of the transparent substrate body can be made into a matte non-reflective surface to prevent light reflection and avoid glare; by grinding the first side of the transparent substrate body, the transparent substrate body can achieve a softer and more delicate high-transparency AG effect; by forming a non-conductive coating layer of predetermined thickness on the second side of the transparent substrate body, the reflectivity can be controlled; thus, the transparent substrate exhibits the best display performance and improves the overall appearance of the transparent substrate.

[0045] Furthermore, according to the embodiments of the present invention, by using the above-mentioned transparent substrate, the glare caused by the reflection of the transparent substrate in the home appliance is effectively avoided, thereby enhancing the display performance of the home appliance, improving the user experience, and enhancing the product competitiveness.

[0046] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0047] To more clearly illustrate the technical solutions in the embodiments of the present invention or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0048] Figure 1 This is one of the flowcharts of a method for processing a transparent substrate provided in an embodiment of the present invention;

[0049] Figure 2 This is a schematic diagram of the structure of the transparent substrate provided in an embodiment of the present invention;

[0050] Figure 3 This is the second flowchart of the processing method for a transparent substrate provided in the embodiments of the present invention.

[0051] Figure label:

[0052] 10. Transparent substrate body; 20. Non-conductive coating layer; 30. Semi-transparent ink layer; 40. Base color ink layer; 50. Ink protective layer; 60. Anti-fingerprint layer; 70. AG etched surface. Detailed Implementation

[0053] The embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of the invention.

[0054] In the description of the embodiments of the present invention, it should be noted that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of the present invention. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0055] In the description of the embodiments of the present invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of the present invention based on the specific circumstances.

[0056] In embodiments of the present invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0057] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0058] The following is combined with Figures 1-2 A method for processing a transparent substrate according to an embodiment of the present invention is described.

[0059] Figure 1 An example flowchart illustrates a method for processing a transparent substrate. Figure 2 A schematic diagram of the structure of the transparent substrate provided in an embodiment of the present invention is illustrated, such as... Figure 1 and Figure 2 As shown, the processing method for the transparent substrate includes the following steps:

[0060] Step 100: Etch the first side of the transparent substrate body 10 to reduce the reflectivity of the first side.

[0061] Step 200: Grind the first side surface of the transparent substrate body 10;

[0062] Step 300: A non-conductive coating layer 20 of predetermined thickness is formed on the second side of the transparent substrate body 10.

[0063] In this embodiment, step 100 is defined as the etching step, step 200 is defined as the grinding step, and step 300 is defined as the coating step.

[0064] According to the processing method of the transparent substrate of the present invention, by etching the first side of the transparent substrate body 10, the first side of the transparent substrate body 10 can be made into a matte non-reflective surface to prevent light reflection and avoid glare; by grinding the first side of the transparent substrate body 10, the transparent substrate body 10 can achieve a softer and more delicate high-transparency AG effect; by forming a non-conductive coating layer 20 of a predetermined thickness on the second side of the transparent substrate body 10, the reflectivity can be controlled; thus, the transparent substrate exhibits the best display performance and improves the overall appearance of the transparent substrate 10.

[0065] It should be noted that AG is short for Anti-glare. AG is a special chemical process that transforms the reflective surface of a transparent substrate into a matte, diffuse reflective surface, preventing glare and reducing reflectivity. It is understood that the transparent substrate 10 can be glass, acrylic, or other transparent synthetic materials such as transparent PC.

[0066] Understandably, the etching of the first side of the transparent substrate body 10 is performed using chemical etching. Chemical etching roughens and textures the glass surface with acidic chemicals, creating an uneven AG etched surface 70, which is a matte, non-reflective surface. By forming the AG etched surface 70, the first side of the transparent substrate body 10 has a lower reflectance compared to the surface of ordinary glass, significantly reducing light reflectivity. This reduces ambient light interference, improves image clarity, reduces screen glare, and makes the image clearer and more realistic, providing users with a better visual experience.

[0067] Since the main component of glass is silicon dioxide, and hydrofluoric acid is an acidic substance that can react with silicon dioxide and corrode glass, this embodiment uses an acidic chemical substance containing hydrofluoric acid for etching. During the etching process, the gloss and transmittance can be adjusted by regulating the concentration of the chemicals and the exposure time. When the etched transparent substrate is used as a display screen, it exhibits optimal display performance even in bright environments, improving the user experience and enhancing product competitiveness.

[0068] It should be noted that the composition of acidic chemicals is not limited to hydrofluoric acid, but can also be other types of acidic substances. The specific composition of acidic chemicals is determined according to the material of the transparent substrate body 10.

[0069] It is also understandable that the non-conductive coating layer 20 is formed on the second side of the transparent substrate body 10 by vacuum coating technology (i.e., vacuum evaporation technology). Vacuum coating technology is a technology that heats the evaporated coating material in a high vacuum environment, causing the atoms or molecules of the coating material to vaporize and escape from the surface to form a vapor flow. By injecting the vapor flow onto the second side of the transparent substrate body 10, a solid film is formed.

[0070] During the vacuum coating process, the reflectivity of the transparent substrate 10 can be precisely controlled by adjusting the thickness of the non-conductive coating layer 20. Since the thickness of the non-conductive coating layer 20 determines the reflectivity of the transparent substrate 10, this embodiment does not specifically limit the predetermined thickness; the thickness is determined based on the required reflectivity of the transparent substrate 10. The coating material can be Al, Ni, or Ti, etc. Of course, the specific type of coating material is not limited to these; it is determined based on the reflectivity of the transparent substrate 10.

[0071] In this embodiment, the non-conductive coating layer 20 is formed by the adhesion enhancement of multiple layers of chromium. By forming a non-conductive coating layer 20 of predetermined thickness on the second side of the transparent substrate body 10, a metallic reflection effect with a light transmittance of 15% and a color difference value L = 45 can be achieved. Of course, the specific values ​​of transmittance and color difference are not limited to these and can be determined according to actual needs.

[0072] When a transparent substrate is used as a display screen, a non-conductive coating layer 20 of predetermined thickness is formed on the second side of the transparent substrate body 10 using vacuum coating technology. This makes the display area and window area inconspicuous, improving the overall appearance. When the lighting is on, high-quality display can be achieved with high transmittance; when the lighting is off, external light is reflected, maintaining the overall aesthetic of the panel. When the transparent substrate is used as the panel of a household appliance, it effectively improves the appliance's appearance.

[0073] It is also understandable that Figure 3A second flowchart illustrating the processing method of the transparent substrate provided in this embodiment of the invention is shown below. Figure 3 As shown, prior to the etching step, the processing method of the transparent substrate further includes the following step: attaching a protective film (not shown) to the second side of the transparent substrate body 10, which is defined here as the film attaching step.

[0074] The protective film is suitable for protecting the second side of the transparent substrate body 10, preventing corrosion during the etching process. Since the etching process uses acidic chemicals, failure to protect the second side of the transparent substrate body 10 during etching will cause corrosion, resulting in an uneven surface that affects subsequent lamination processes and reduces product quality. In this embodiment, the protective film is bonded to the second side of the transparent substrate body 10 with adhesive. To facilitate removal of the protective film in subsequent processes, it can be adhered to the second side of the transparent substrate body 10 using self-adhesive.

[0075] It is also understandable that, such as Figure 3 As shown, before the coating step, the processing method of the transparent substrate further includes the following steps: removing the protective film pasted on the second side of the transparent substrate body 10, which is defined here as the film removal step.

[0076] Before forming a non-conductive coating layer 20 of a predetermined thickness on the second side of the transparent substrate body 10, the protective film on the second side of the transparent substrate body 10 needs to be removed so that the non-conductive coating layer 20 is firmly fixed to the second side of the transparent substrate body 10.

[0077] It is also understandable that, such as Figure 3 As shown, the grinding step in the processing method of the transparent substrate in this embodiment includes the following steps: performing a first grinding process on the first side of the transparent substrate body 10; performing a second grinding process on the first side of the transparent substrate body 10; and performing a third grinding process on the first side of the transparent substrate body 10. The grinding time and grinding pressure of the first grinding process, the second grinding process and the third grinding process are all different.

[0078] The transparent substrate body 10 is ground using a grinding tool and abrasive. Pressure is applied to the first side of the transparent substrate body 10, and the grinding is performed at low speed while continuously changing the grinding position to remove minor protrusions or uneven areas on the first side of the transparent substrate body 10. In this embodiment, a wet grinding method is used to grind the transparent substrate body 10. While the transparent substrate body 10 is being retracted in a flat position, abrasive liquid (strong acid) is sprayed onto the first side of the transparent substrate body 10. Simultaneously, an ultra-thinning process is performed as the transparent substrate body 10 is retracted.

[0079] In this embodiment, the grinding process includes three steps: a first grinding process, a second grinding process, and a third grinding process. Since the grinding time and pressure are different for each of the three grinding processes, the smoothness and reflectivity of the first side of the transparent substrate 10 are different after each grinding process. During the grinding process, the grinding time can be gradually increased (i.e., the grinding time for the first, second, and third grinding processes gradually increases), or the grinding time can be gradually decreased (i.e., the grinding time for the first, second, and third grinding processes gradually decreases).

[0080] Since grinding pressure is a crucial process parameter affecting the grinding process, it requires precise control. In this embodiment, the grinding pressure gradually increases during the three grinding processes; that is, the grinding pressure gradually increases in the first, second, and third grinding processes. However, the method of controlling the grinding pressure is not limited to this; the grinding pressure can also gradually decrease in the first, second, and third grinding processes, or the grinding pressure in the second grinding process can be greater than the grinding pressure in the first and third grinding processes, respectively. After the first, second, and third grinding processes, the first side of the transparent substrate body 10 achieves a softer and more refined high-transparency AG effect.

[0081] It should be noted that, in addition to the different grinding time and pressure, the movement trajectory of the grinding tool and the concentration of the grinding fluid can also be different in the three grinding processes, so that different effects are achieved after each grinding.

[0082] It is also understandable that, such as Figure 3 As shown, before the coating step, the processing method of the transparent substrate also includes the following steps: if the reflectivity of the transparent substrate body 10 is determined to be less than a preset value, then the coating step is performed. Here, this step is defined as the optical performance confirmation step.

[0083] After the transparent substrate 10 is ground, to ensure consistent optical performance for each transparent substrate 10, its optical performance needs to be confirmed. This is specifically determined by comparing the reflectivity of the transparent substrate 10 with a preset value. The reflectivity of the transparent substrate 10 is measured using optical equipment, and the results are then manually assessed based on the output values. If the reflectivity of the transparent substrate 10 is less than the preset value, the optical performance of the ground transparent substrate 10 is considered acceptable, and the coating step can proceed. If the reflectivity of the transparent substrate 10 is greater than or equal to the preset value, the optical performance of the ground transparent substrate 10 is considered unacceptable, and the grinding process can be repeated.

[0084] It should be noted that determining the optical properties is not limited to determining the reflectivity of the transparent substrate body 10, but can also include determining the light transmittance and surface smoothness of the transparent substrate body 10.

[0085] It is also understandable that, such as Figure 3 As shown, prior to the optical performance verification step, the processing method for the transparent substrate further includes the following steps: cleaning the first side and / or the second side of the transparent substrate body 10.

[0086] After removing the protective film, the surface of the transparent substrate body 10 may contain impurities, dust or liquid, which may affect the optical performance verification step of the transparent substrate body 10 and also affect the formation effect of the non-conductive coating layer 20. Therefore, before the optical performance verification step, the first and second sides of the transparent substrate body 10 need to be cleaned. Of course, only the second side of the transparent substrate body 10 can be cleaned.

[0087] It is also understandable that, such as Figure 3 As shown, after the coating step, the processing method of the transparent substrate further includes the following step: printing a semi-transparent ink layer 30 of a first predetermined color on the side of the non-conductive coating layer 20 away from the transparent substrate body 10. This step is defined here as the semi-transparent ink layer printing step.

[0088] The translucent ink layer 30 is printed on the side of the non-conductive coating layer 20 away from the transparent substrate body 10 using screen printing technology. The light transmittance of the translucent ink layer 30 is 34%. Of course, the light transmittance of the translucent ink layer 30 is not limited to this, and can be determined according to the actual desired effect. In this embodiment, the first predetermined color can be quantum black, blue collar, or other colors.

[0089] It's important to clarify here that "semi-transparency" refers to the optical effect of the ink layer; that is, a semi-transparent ink layer only allows a portion of light to pass through, resulting in low light transmittance. Semi-transparency is a superset of transparency; it allows light to pass through, but it doesn't necessarily conform to Snell's Law. It can also be understood as... Figure 3 As shown, after the step of printing the translucent ink layer 30, the processing method of the transparent substrate further includes the following step: printing a second predetermined color base ink layer 40 on the side of the translucent ink layer 30 opposite to the non-conductive coating layer 20. This step is defined here as the step of printing the base ink layer.

[0090] The base color ink layer 40, in combination with the semi-transparent ink layer 30, forms a near-black blue collar, further enhancing the display effect of the transparent substrate body 10 as a display screen and achieving the effect of hiding the window. By using a gray transparent substrate body 10, the gray transparent substrate body 10, in combination with the base color ink layer 40 and the semi-transparent ink layer 30, forms a dark or muted color, meeting the functional needs of the product and the aesthetic requirements of high-end products. By presenting a soft blue or other desired colors, the aesthetic appeal of the product can be enhanced.

[0091] It is also understandable that, such as Figure 3 As shown, after the step of printing the base color ink layer 40, the processing method of the transparent substrate further includes the following step: printing an ink protective layer 50 on the side of the base color ink layer 40 opposite to the translucent ink layer 30.

[0092] Because the base color ink layer 40 and the semi-transparent ink layer 30 are frequently scratched or worn during use, the aesthetics of the transparent substrate 10 are severely affected, impacting the user experience. Therefore, an ink protective layer 50 is printed on the side of the base color ink layer 40 opposite to the semi-transparent ink layer 30. This ink protective layer 50 protects both the base color ink layer 40 and the semi-transparent ink layer 30. Compared to the base color ink layer 40 and the semi-transparent ink layer 30, the ink protective layer 50 has higher hardness and is more wear-resistant, thus effectively maintaining the appearance of the transparent substrate, extending its service life, and improving the user experience. In this embodiment, the ink protective layer 50 is a low-temperature ink protective layer 50. Compared to a high-temperature ink protective layer 50, the low-temperature ink protective layer 50 requires a lower ambient temperature for printing and is easier to operate.

[0093] It is also understandable that, such as Figure 3 As shown, after the grinding step, the processing method of the transparent substrate further includes the following step: forming an anti-fingerprint layer 60 on the first side of the transparent substrate body 10.

[0094] Since the first side of the transparent substrate body 10 is usually in contact with the user's hands, after a period of use, a large number of fingerprints will accumulate on the first side of the transparent substrate body 10, seriously affecting its aesthetics and user experience. Forming an anti-fingerprint layer 60 on the first side of the transparent substrate body 10 can effectively reduce fingerprints. The anti-fingerprint layer 60 reduces fingerprints mainly through two methods: one is by dissolving and spreading oily stains to make fingerprints less noticeable; the other is by repelling stains to prevent fingerprints from adhering to the first side of the transparent substrate body 10.

[0095] When the anti-fingerprint layer 60 exists in the form of a thin film, the anti-fingerprint layer 60 can be bonded to the first side of the transparent substrate body 10 by adhesive. When the anti-fingerprint layer 60 exists in the form of an anti-fingerprint coating, the anti-fingerprint layer 60 is attached to the first side of the transparent substrate body 10, and the anti-fingerprint coating is an anti-fingerprint nano-coating or other coating.

[0096] It is also understood that in this embodiment, the transparent substrate body 10 is glass. Before the film application step, the processing method of the transparent substrate also includes the following steps: tempering the transparent substrate body 10.

[0097] Compared to ordinary glass, tempered glass is several times stronger, with a bending strength 3-5 times greater and an impact strength 5-10 times greater, thus improving safety. Furthermore, tempered glass exhibits 2-3 times better resistance to rapid temperature changes compared to ordinary glass, generally withstanding temperature differences exceeding 150°C, significantly preventing thermal breakage. Simultaneously, the increased load-bearing capacity of tempered glass mitigates its brittle nature; even if tempered glass breaks, it shatters into small, blunt fragments, greatly reducing the risk of injury. Therefore, using tempered glass as the panel for displays or household appliances effectively improves the safety of these devices. Since tempering is a common technique in the glass processing industry, it will not be discussed in detail here.

[0098] It should be noted that when the transparent substrate body 10 is a transparent material other than glass, tempering is not required.

[0099] It is also understandable that, such as Figure 3 As shown, before tempering the transparent substrate body 10, the processing method of the transparent substrate further includes the following steps: grinding the edges of the transparent substrate body 10.

[0100] After the transparent substrate body 10 is cut, burrs remain on its edges, affecting both its aesthetics and safety. Therefore, the edges of the transparent substrate body 10 need to be ground to make them smoother and more aesthetically pleasing. This grinding process can be performed using the grinding wheel groove of a CNC engraving machine, or other equipment with similar capabilities.

[0101] It should be noted here that, as Figure 3 As shown, before grinding the edges of the transparent substrate body 10, the following steps are required: cutting the raw material to obtain a blank of a predetermined size; then cleaning the blank to remove dust, impurities and other substances from the surface of the blank; and then CNC machining the blank to obtain a transparent substrate body 10 that meets the design requirements.

[0102] The following is combined with Figure 3 A method for processing a transparent substrate according to a specific embodiment of the present invention is described, such as... Figure 3 As shown, the processing method for the transparent substrate includes: step 410, cutting the raw material to obtain a blank of a predetermined size; step 420, performing preliminary cleaning on the blank; step 430, CNC machining the blank to obtain the transparent substrate body 10; step 440, grinding the edges of the transparent substrate body 10; step 450, tempering the transparent substrate body 10; step 460, attaching a protective film to the second side of the transparent substrate body 10; step 470, etching the first side of the transparent substrate body 10; step 480, performing a first grinding treatment on the first side of the transparent substrate body 10; step 490, performing a second grinding treatment on the first side of the transparent substrate body 10; step 500, performing a third grinding treatment on the first side of the transparent substrate body 10; step 510… Step 520: Remove the protective film adhered to the second side of the transparent substrate body 10; Step 530: Clean the first and / or second sides of the transparent substrate body 10; Step 540: If the reflectivity of the transparent substrate body 10 is determined to be less than a preset value, then perform the coating step; Step 550: Form a non-conductive coating layer 20 of a predetermined thickness on the second side of the transparent substrate body 10; Step 560: Print a semi-transparent ink layer 30 of a first predetermined color on the side of the non-conductive coating layer 20 opposite to the transparent substrate body 10; Step 570: Print an ink protective layer 50 on the side of the semi-transparent ink layer 30 opposite to the non-conductive coating layer 20; Step 580: Adhere an anti-fingerprint layer 60 to the first side of the transparent substrate body 10.

[0103] like Figure 2As shown, the present invention also provides a transparent substrate, which is prepared by the processing method of the transparent substrate described in any of the above embodiments. The transparent substrate includes a transparent substrate body 10 and a non-conductive coating layer 20. The first side of the transparent substrate body 10 is etched and polished, and the non-conductive coating layer 20 is formed on the second side of the transparent substrate body 10.

[0104] The first side of the transparent substrate body 10 is etched using chemical etching. Chemical etching roughens and roughens the glass surface with acidic chemicals, creating an uneven AG etched surface 70, which is a matte, non-reflective surface. By forming the AG etched surface 70, the first side of the transparent substrate body 10 has a lower reflectance compared to the surface of ordinary glass, significantly reducing light reflectivity. This reduces ambient light interference, improves image clarity, reduces screen glare, and makes images clearer and more realistic, providing users with a better visual experience.

[0105] In this embodiment, the grinding process includes three steps: a first grinding process, a second grinding process, and a third grinding process. Since the grinding time and pressure are different for each of the three grinding processes, the smoothness and reflectivity of the first side of the transparent substrate 10 are different after each grinding process. During the grinding process, the grinding time can be gradually increased (i.e., the grinding time for the first, second, and third grinding processes gradually increases), or the grinding time can be gradually decreased (i.e., the grinding time for the first, second, and third grinding processes gradually decreases).

[0106] It is also understood that the transparent substrate further includes a translucent ink layer 30 and a base color ink layer 40. The translucent ink layer 30 is formed on the side of the non-conductive coating layer 20 away from the transparent substrate body 10, and the base color ink layer 40 is formed on the side of the translucent ink layer 30 away from the non-conductive coating layer 20.

[0107] It is also understood that the transparent substrate further includes an ink protective layer 50, which is formed on the side of the base color ink layer 40 opposite to the translucent ink layer 30.

[0108] It is also understood that the transparent substrate further includes an anti-fingerprint layer 60, which is formed on a first side of the transparent substrate body 10. The present invention also provides a household appliance, which includes a housing and the transparent substrate described in the above embodiments, the transparent substrate being disposed on the housing.

[0109] It should be noted that the household appliances mentioned here can be refrigerators, televisions, water flossers, electric shavers, hair dryers, air ion generators, or other household appliances that require the use of transparent substrates.

[0110] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for processing a transparent substrate, characterized in that, Includes the following steps: The etching step involves etching the first side of the transparent substrate body to reduce the reflectivity of the first side. The grinding step involves grinding the first side surface of the transparent substrate body. The grinding step includes: The first side of the transparent substrate body is subjected to a first grinding process; The first side of the transparent substrate body is subjected to a second grinding process; The first side of the transparent substrate body is subjected to a third grinding process, wherein the grinding time and grinding pressure of the first grinding process, the second grinding process and the third grinding process are different; In the coating step, a non-conductive coating layer of predetermined thickness is formed on the second side of the transparent substrate body; Following the coating step, the following steps are also included: The step of printing a semi-transparent ink layer involves printing a semi-transparent ink layer of a first predetermined color on the side of the non-conductive coating layer opposite to the transparent substrate body.

2. The processing method for the transparent substrate according to claim 1, characterized in that, Prior to the etching step, the following steps are also included: The film application step involves attaching a protective film to the second side of the transparent substrate body.

3. The processing method for the transparent substrate according to claim 2, characterized in that, Prior to the coating step, the following steps are also included: The film removal step involves removing the protective film adhered to the second side of the transparent substrate body.

4. The processing method for the transparent substrate according to claim 3, characterized in that, Following the step of printing the translucent ink layer, the following steps are also included: The step of printing the base color ink layer involves printing a second predetermined color base color ink layer on the side of the translucent ink layer opposite to the non-conductive coating layer.

5. The processing method for the transparent substrate according to claim 4, characterized in that, Following the step of printing the base color ink layer, the following steps are also included: A protective ink layer is printed on the side of the base ink layer that is opposite to the translucent ink layer.

6. The method for processing a transparent substrate according to any one of claims 1 to 3, characterized in that, Following the grinding step, the following steps are also included: An anti-fingerprint layer is formed on the first side of the transparent substrate body.

7. The method for processing a transparent substrate according to any one of claims 1 to 3, characterized in that, Prior to the coating step, the following steps are also included: In the optical performance verification step, if the reflectivity of the transparent substrate is determined to be less than a preset value, then the coating step is performed.

8. The method for processing a transparent substrate according to claim 7, characterized in that, Prior to the optical performance verification step, the following steps are also included: Clean the first and / or second sides of the transparent substrate body.

9. The method for processing a transparent substrate according to claim 2 or 3, characterized in that, The transparent substrate is glass, and before the film application step, the following steps are also included: The transparent substrate body is subjected to tempering treatment.

10. A transparent substrate, characterized in that, The transparent substrate is prepared by the processing method of the transparent substrate according to any one of claims 1 to 9, comprising: A transparent substrate body, wherein the first side of the transparent substrate body is etched and polished; A non-conductive coating layer is formed on the second side of the transparent substrate body.

11. The transparent substrate according to claim 10, characterized in that, Also includes: A semi-transparent ink layer is formed on the side of the non-conductive coating layer that is opposite to the transparent substrate body; A base color ink layer is formed on the side of the translucent ink layer opposite to the non-conductive coating layer.

12. The transparent substrate according to claim 11, characterized in that, Also includes: An ink protective layer is formed on the side of the base color ink layer opposite to the translucent ink layer.

13. The transparent substrate according to any one of claims 10 to 12, characterized in that, Also includes: An anti-fingerprint layer is formed on the first side of the transparent substrate body.

14. A household appliance, characterized in that, It includes a housing and a transparent substrate as described in any one of claims 10 to 13, wherein the transparent substrate is disposed on the housing.

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