Semiconductor CVD vertical fin water-cooled plate structure and vacuum brazing process thereof

Abstract

The application discloses a kind of CVD longitudinal fin water-cooled plate structure for semiconductor and vacuum brazing process thereof, water-cooled plate structure includes oxygen-free copper square cavity part, and oxygen-free copper square cavity part has hollow cooling flow-through chamber inside, and multiple pieces of U-shaped copper sheet are fixed in cooling flow-through chamber, oxygen-free copper square cavity part bottom and top each have a cover plate connection containing groove, and sealing lower cover plate and sealing upper cover plate are respectively fixed in oxygen-free copper square cavity part bottom and top cover plate connection containing groove;Oxygen-free copper square cavity part side has cooling water inlet hole and cooling water outlet hole being communicated with cooling flow-through chamber;Water-cooled plate structure is clamped and positioned by positioning tool during welding process;Oxygen-free copper cover plate part, oxygen-free copper square cavity part and U-shaped copper sheet are assembled once, and vacuum brazing is carried out in vacuum furnace, reduce the instability factor when forming and welding of traditional U-shaped waterway, improve the uniform consistency of product, provide reliable heat dissipation capacity for cooling system.

Description

Technical Field

[0001] This invention relates to the field of vacuum brazing technology, specifically to a CVD longitudinal fin water-cooled plate structure for semiconductors and its vacuum brazing process. Background Technology

[0002] Semiconductor chemical vapor deposition (CVD) is a commonly used technique for preparing thin films. During CVD, it is necessary to control the temperature within the reaction chamber and cool the material. Water cooling plates are typically used to cool the film reaction chamber.

[0003] A water-cooled plate is a heat transfer device that uses water as the cooling medium. It is typically made of metal (such as copper or aluminum) and has internal channels and passages to guide the flow of cold water. This cold water absorbs excess heat by contacting the reaction chamber walls and is then dissipated through an external water-cooling system. Water-cooled plates allow for temperature control within the reaction chamber, ensuring stable reaction conditions and improving the uniformity and quality of thin film deposition. Furthermore, water-cooled plates can increase the reaction rate and enhance deposition efficiency.

[0004] The uniformity and stability of the water-cooled plate structure directly affect its heat dissipation effect. Currently, in the process of preparing the water-cooled plate structure, it is easily affected by some unstable factors, resulting in uneven heat conduction during the use of the overall structure. Summary of the Invention

[0005] The purpose of this invention is to provide a CVD longitudinal fin water-cooled plate structure for semiconductors and its vacuum brazing process, which can improve the production efficiency and product quality stability of the water-cooled plate structure.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] A CVD longitudinal fin water-cooled plate structure for semiconductors includes an oxygen-free copper square cavity component. The oxygen-free copper square cavity component has a hollow cooling flow chamber. Multiple U-shaped copper sheets are fixed in the cooling flow chamber. The bottom and top of the oxygen-free copper square cavity component each have a cover plate connecting and receiving groove that communicates with the cooling flow chamber. A sealing lower cover plate and a sealing upper cover plate are respectively fixed in the cover plate connecting and receiving grooves at the bottom and top of the oxygen-free copper square cavity component.

[0008] The oxygen-free copper square cavity part has cooling water inlet holes and cooling water outlet holes on its side that are connected to the cooling flow chamber.

[0009] The present invention also provides a vacuum brazing process for the above-mentioned CVD longitudinal fin water-cooled plate structure for semiconductors, comprising the following steps:

[0010] S1. Parts cleaning:

[0011] Clean the lower sealing cover plate, the upper sealing cover plate, the oxygen-free copper square cavity parts and multiple U-shaped copper sheets to remove oil and oxides from the surface of each part.

[0012] S2. Install the U-shaped copper sheet:

[0013] The oxygen-free copper square cavity part is clamped on the positioning fixture. Then, multiple U-shaped copper sheets are placed at equal intervals inside the cooling flow chamber. A 2-5 mm thick layer of nickel-based solder paste is applied to the part where the U-shaped copper sheets contact the cooling flow chamber, and the nickel-based solder paste is allowed to solidify.

[0014] S3. Install oxygen-free copper cover plate parts:

[0015] Apply a 2-5 mm thick layer of nickel-based solder paste to the areas where the lower and upper sealing cover plates contact the U-shaped copper sheet. Fix the lower and upper sealing cover plates in the cover plate connection and receiving grooves on the lower and upper sides of the oxygen-free copper square cavity part, respectively, and clamp and fix the lower and upper sealing cover plates while waiting for the nickel-based solder paste to solidify.

[0016] S4. Apply additional solder paste:

[0017] Apply 2-5mm thick solder paste to the gap between the lower and upper sealing cover plates and the contact area between the cover plate and the receiving groove, and wait for the solder paste to solidify.

[0018] Then, the lower sealing cover plate on the underside of the oxygen-free copper square cavity part is supported and stabilized, and the upper sealing cover plate on the top of the oxygen-free copper square cavity part is stabilized by weight.

[0019] S5. Weld the entire water-cooled plate structure:

[0020] The assembled water-cooled plate structure, together with the positioning fixture, is placed in a vacuum brazing furnace for welding.

[0021] S6. Cool and remove from the oven:

[0022] Turn off the brazing furnace and allow the welded water-cooled plate structure to cool to room temperature along with the furnace before removing it.

[0023] S7. Leak detection process:

[0024] Leakage rate testing was performed on the welded water-cooled plate structure; the leakage rate was <1×10⁻⁶. -9 mbar.L / s indicates a qualified product.

[0025] Preferably, the specific welding process in step S5 is as follows: turn on the brazing furnace, and after the temperature inside the brazing furnace reaches 350°C, keep it at that temperature for 35 minutes;

[0026] Then, the assembled water-cooled plate structure, together with the positioning fixture, is placed into a vacuum brazing furnace and held at a furnace temperature of 350℃ for 20-30 minutes.

[0027] Then, the brazing furnace is heated to 650°C uniformly over 40–60 minutes and held at that temperature for 30–40 minutes.

[0028] Then, the brazing furnace is heated to 970°C uniformly over 40–60 minutes and held at that temperature for 30–40 minutes.

[0029] Then, the brazing furnace is heated to 1040℃ uniformly over 20-30 minutes and held for 5-8 minutes.

[0030] Preferably, the specific cooling process in step S6 is as follows: the brazing furnace is turned off, and the water-cooled plate structure after welding is cooled together with the furnace. After the temperature inside the brazing furnace drops to 600°C, argon or nitrogen is introduced into the brazing furnace.

[0031] After the temperature inside the brazing furnace continues to drop to 50°C, remove the welded water-cooled plate structure along with the positioning fixture from the brazing furnace and let it cool to room temperature.

[0032] Preferably, in the vacuum brazing process of a CVD longitudinal fin water-cooled plate structure for semiconductors as described above, the positioning fixture used includes two positioning support cylinders. The sidewalls of the positioning support cylinders have multiple fastening slider receiving holes that extend radially through them, and fastening constraint sliders are slidably connected in the fastening slider receiving holes.

[0033] An end face limiting ring is fixed to the outside of the positioning support cylinder;

[0034] The positioning support cylinder is rotatably connected to a slider synchronous drive ring coaxial with it. The slider synchronous drive ring has multiple synchronous drive constraint grooves on its side. The side of the slider is fixed with drive mating posts, and the drive mating posts slide and engage in the synchronous drive constraint grooves one by one.

[0035] A slider synchronous drive shaft is rotatably connected inside the positioning support cylinder. A synchronous drive bevel gear is fixed to one end of the slider synchronous drive shaft, and a synchronous driven bevel gear is fixed to the end face of the slider synchronous drive ring. A manual driven bevel gear is fixed to the other end of the slider synchronous drive shaft. The manual driven bevel gear is meshed with a manual drive bevel gear. The side wall of the positioning support cylinder has a manual gear shaft through hole that runs along the rotation axis of the manual drive bevel gear. The rotation axis of the manual drive bevel gear is rotatably connected in the manual gear shaft through hole.

[0036] Two positioning support cylinders are connected to the base support structure, which includes a base support plate. The base support plate is fixed with a positioning support side plate by a base support rod, and the two positioning support cylinders are fixedly connected to the side of the positioning support side plate.

[0037] Description: This positioning fixture provides good support and stability constraint for the water-cooled plate structure during the welding process, positions and constrains each part of the water-cooled plate structure, ensures the overall welding accuracy of the water-cooled plate structure, and greatly improves the pass rate of the final product.

[0038] Preferably, the positioning support cylinder is provided with a gap retaining mechanism, which includes a gap retaining receiving shell fixed on the inner side wall of the positioning support cylinder. The gap retaining receiving shell has multiple slider mating grooves that communicate with each other on the side, and a gap retaining slider is slidably connected in the slider mating groove.

[0039] The top of the gap-holding housing is slidably connected to a slider telescopic drive plate. The sliding direction of the slider telescopic drive plate is perpendicular to the sliding direction of the gap-holding slider. The slider telescopic drive plate has multiple slider telescopic constraint grooves. The part of the gap-holding slider inside the gap-holding housing is fixed with a slider telescopic constraint post. The slider telescopic constraint posts are slidably fitted in the slider telescopic constraint grooves one by one.

[0040] A slider drive housing is fixed on the side of the clearance retaining housing away from the slider mating groove. A slider drive shaft is rotatably connected inside the slider drive housing. One end of the slider drive shaft extends into the interior of the clearance retaining housing. A telescopic drive gear is fixed at the end of the slider drive shaft that extends into the clearance retaining housing. A telescopic driven rack is fixed on the lower side of the slider telescopic drive plate. The telescopic drive gear and the telescopic driven rack are meshed and connected.

[0041] The other end of the slider drive shaft is fixed with a telescopic driven bevel gear, which meshes with a telescopic drive bevel gear. The top of the slider drive housing has a telescopic gear shaft mating hole that is open to both the inside and outside. The rotating shaft of the telescopic drive bevel gear is rotatably connected in the telescopic gear shaft mating hole. The upper side of the positioning support cylinder has a telescopic adjustment through hole that is coaxial with the telescopic gear shaft mating hole.

[0042] Explanation: In the gap holding mechanism, multiple gap holding sliders are inserted one-to-one into the gaps between multiple U-shaped copper sheets, so that the multiple U-shaped copper sheets are arranged at equal intervals and remain stable, avoiding misalignment or displacement between the U-shaped copper sheets during the welding process.

[0043] Preferably, the positioning support cylinder is connected to an upper cover plate counterweight mechanism, which includes a counterweight mechanism support plate fixedly connected to the upper side of the positioning support cylinder, and a counterweight mechanism rotating plate rotatably connected to the top of the counterweight mechanism support plate.

[0044] The top of the counterweight mechanism's rotating disk is connected to a counterweight deflection support arm via a first counterweight fixing hinge. The other end of the counterweight deflection support arm is connected to a counterweight plate via a second counterweight fixing hinge. The top of the counterweight plate has multiple counterweight receiving slots.

[0045] Note: The upper cover plate pressure mechanism applies pre-pressure to the sealing upper cover plate, which helps to maintain the stability of the sealing upper cover plate during the welding process and prevents the sealing upper cover plate from being misaligned or shifted.

[0046] Preferably, the base support plate is provided with a lower cover plate support mechanism, which includes a support mechanism receiving cylinder fixed to the top of the base support plate and extending vertically. The top of the support mechanism receiving cylinder has a vertically penetrating support column mating hole. A cover plate support column is slidably connected in the support column mating hole. The top of the cover plate support column is connected to a support column top plate through a ball hinge.

[0047] The support mechanism is rotatably connected to a lifting support ring coaxial with it inside the housing cylinder. The lifting support ring is fixedly connected to a lifting drive worm gear coaxial with it. The lifting drive worm gear has a vertically penetrating lifting drive threaded hole. The lower part of the cover plate support column has external threads, and the lower part of the cover plate support column is threadedly connected to the lifting drive threaded hole.

[0048] The inner wall of the support mechanism housing cylinder is fixed with a worm support seat, and a lifting drive worm is rotatably connected to the worm support seat. The lifting drive worm is meshed with the lifting drive worm wheel. The side wall of the support mechanism housing cylinder has a lifting adjustment through hole that runs through the rotation axis of the lifting drive worm wheel.

[0049] Note: In the lower cover plate support mechanism, the lifting and lowering of the cover plate support column is manually adjusted. The cover plate support column drives the top plate of the support column to press against the bottom of the sealed lower cover plate, which is used to maintain the stability of the sealed lower cover plate.

[0050] Preferably, a gap isolation mechanism is used in conjunction with the gap maintaining mechanism. The gap isolation mechanism includes two gap isolation receiving shells with openings facing away from each other. A plurality of C-shaped spring plates are fixedly connected between the two gap isolation receiving shells. A sliding connecting ring and a sliding connecting post are fixedly fixed on the side of the two gap isolation receiving shells that are close to each other. The sliding connecting post is slidably engaged in the sliding connecting ring.

[0051] The gap isolation housing contains a gap isolation magnet, and the sides of the gap isolation magnets that are close to each other have the same polarity.

[0052] Instructions: The two gap isolation housings, together with the gap isolation magnets, press against the sidewalls between two adjacent U-shaped copper sheets to maintain the stable and equidistant arrangement of multiple U-shaped copper sheets. When in use, a thin steel wire is tied to the sliding connecting ring to facilitate the removal of the gap isolation mechanism after welding.

[0053] Compared with the prior art, the beneficial effects of the present invention are reflected in the following aspects:

[0054] 1. This invention involves assembling the oxygen-free copper cover plate, the oxygen-free copper square cavity, and the U-shaped copper sheet in a single process, followed by vacuum brazing in a vacuum furnace. This reduces the instability factors during the forming and welding of traditional U-shaped water channels, improves the uniformity of the product, and provides reliable heat dissipation for the cooling system.

[0055] 2. This invention utilizes the positioning fixture to provide good support and stability constraint for the water-cooled plate structure during the welding process, and to position and constrain each part of the water-cooled plate structure, ensuring the overall welding accuracy of the water-cooled plate structure, resulting in better welding strength and higher reliability of the finished water-cooled plate structure, and significantly improving the qualification rate of the final product.

[0056] 3. In the gap holding mechanism of the present invention, multiple gap holding sliders are inserted one-to-one into the gaps between multiple U-shaped copper sheets, so that the multiple U-shaped copper sheets are arranged at equal intervals and remain stable, avoiding misalignment and displacement between the U-shaped copper sheets during the welding process.

[0057] 4. In this invention, the upper cover plate pressure mechanism applies pre-pressure to the sealing upper cover plate, and the lower cover plate support mechanism provides top pressure support to the sealing lower cover plate, maintaining the stability of the sealing upper and lower cover plates during the welding process and preventing misalignment or displacement during welding. Attached Figure Description

[0058] Figure 1 This is a front view of the water-cooled plate structure of the present invention;

[0059] Figure 2 yes Figure 1 The right view;

[0060] Figure 3 yes Figure 1 Top view;

[0061] Figure 4 This is a schematic diagram of the positioning tooling of the present invention;

[0062] Figure 5 This is a schematic diagram of the positioning support cylinder of the present invention;

[0063] Figure 6 yes Figure 5 The left view;

[0064] Figure 7 yes Figure 5 The right view;

[0065] Figure 8 This is a schematic diagram of the gap maintaining mechanism of the present invention;

[0066] Figure 9 yes Figure 8 Top view;

[0067] Figure 10 This is a schematic diagram of the gap isolation mechanism of the present invention;

[0068] Figure 11 This is a top view of the counterweight plate of the present invention;

[0069] Figure 12 This is a schematic diagram of the structure of the lower cover plate support mechanism of the present invention;

[0070] Figure 13 yes Figure 12 A bottom view.

[0071] In the diagram, 10-Oxygen-free copper square cavity part, 101-Cooling flow chamber, 102-Cover plate connecting receiving groove, 11-U-shaped copper sheet, 121-Sealing lower cover plate, 122-Sealing upper cover plate, 131-Cooling water inlet, 132-Cooling water outlet, 20-Positioning fixture, 21-Positioning support cylinder, 210-End face limiting ring, 211-Fastening slider receiving hole, 22-Fastening constraint slider, 221-Drive mating column, 23-Slider synchronous drive ring, 231-Synchronous drive constraint groove, 232-Slider synchronization Drive shaft, 233-Synchronous drive bevel gear, 234-Synchronous driven bevel gear, 235-Manual driven bevel gear, 236-Manual drive bevel gear, 237-Manual gear shaft through hole, 24-Base support structure, 241-Base support plate, 242-Base support rod, 243-Positioning support side plate, 30-Clearance holding mechanism, 31-Clearance holding receiving shell, 311-Slider mating groove, 32-Clearance holding slider, 33-Slider telescopic drive plate, 331-Slider telescopic constraint groove, 332-Slider Telescopic constraint column, 34-slider drive housing, 341-slider drive shaft, 342-telescopic drive gear, 343-telescopic driven rack, 344-telescopic driven bevel gear, 345-telescopic drive bevel gear, 346-telescopic gear shaft mating hole, 39-gap isolation mechanism, 390-gap isolation magnet, 391-gap isolation housing, 392-C-shaped spring sheet, 393-sliding connecting ring, 394-sliding connecting column, 40-upper cover plate counterweight mechanism, 41-counterweight mechanism support plate, 42-pressure 421-First counterweight fixing hinge, 43-Counterweight deflection support arm, 431-Second counterweight fixing hinge, 44-Counterweight plate, 441-Counterweight block receiving groove, 50-Lower cover plate support mechanism, 51-Support mechanism receiving cylinder, 511-Support column mating hole, 510-Lifting adjustment through hole, 52-Cover plate support column, 521-Support column top plate, 53-Lifting support ring, 54-Lifting drive worm gear, 541-Lifting drive threaded hole, 55-Lifting drive worm, 551-Worm support seat. Detailed Implementation

[0072] The following is combined Figures 1-13The present invention will be described in detail. For ease of description, the orientations mentioned below are defined as follows: The directions of up, down, left, right, front, and back mentioned below are consistent with the directions of up, down, left, right, front, and back in the projection relationship of the respective main view or structural schematic diagram.

[0073] Example 1:

[0074] A CVD longitudinal finned water-cooled plate structure for semiconductors, such as Figure 1 , Figure 2 and Figure 3 As shown, the water-cooled plate structure includes an oxygen-free copper square cavity component 10, which has a hollow cooling flow chamber 101. Multiple U-shaped copper sheets 11 are fixed inside the cooling flow chamber 101. The bottom and top of the oxygen-free copper square cavity component 10 each have a cover plate connecting receiving groove 102 that communicates with the cooling flow chamber 101. A sealing lower cover plate 121 and a sealing upper cover plate 122 are respectively fixed in the cover plate connecting receiving groove 102 at the bottom and top of the oxygen-free copper square cavity component 10.

[0075] The oxygen-free copper square cavity part 10 has a cooling water inlet hole 131 and a cooling water outlet hole 132 on its side, which are connected to the cooling flow chamber 101.

[0076] Example 2:

[0077] This embodiment describes a vacuum brazing process for a semiconductor CVD longitudinal fin water-cooled plate structure according to Embodiment 1 above, including the following steps:

[0078] S1. Parts cleaning:

[0079] Clean the lower sealing cover plate 121, the upper sealing cover plate 122, the oxygen-free copper square cavity part 10 and the multiple U-shaped copper sheets 11 to remove oil and oxides from the surface of each part.

[0080] S2. Install the U-shaped copper sheet:

[0081] The oxygen-free copper square cavity part 10 is clamped on the positioning fixture 20. Then, multiple U-shaped copper sheets 11 are arranged at equal intervals inside the cooling flow chamber 101. A 5mm thick nickel-based solder paste is applied to the part where the U-shaped copper sheets 11 contact the cooling flow chamber 101, and the nickel-based solder paste is allowed to solidify.

[0082] S3. Install oxygen-free copper cover plate parts:

[0083] Apply a 5mm thick layer of nickel-based solder paste to the areas where the lower sealing cover plate 121 and the upper sealing cover plate 122 contact the U-shaped copper sheet 11. Fix the lower sealing cover plate 121 and the upper sealing cover plate 122 in the cover plate connecting receiving grooves 102 on the lower and upper sides of the oxygen-free copper square cavity part 10, respectively, and clamp and fix the lower sealing cover plate 121 and the upper sealing cover plate 122, and wait for the nickel-based solder paste to solidify.

[0084] S4. Apply additional solder paste:

[0085] Apply 5mm thick solder paste to the gap between the lower sealing cover plate 121 and the upper sealing cover plate 122 and the cover plate connecting receiving groove 102, and wait for the solder paste to solidify.

[0086] Then, the lower sealing cover plate 121 on the lower side of the oxygen-free copper square cavity part 10 is supported and stabilized, and the upper sealing cover plate 122 on the top of the oxygen-free copper square cavity part 10 is stabilized by weight.

[0087] S5. Weld the entire water-cooled plate structure:

[0088] The assembled water-cooled plate structure, together with the positioning fixture 20, is placed into a vacuum brazing furnace for welding.

[0089] The specific welding process is as follows: turn on the brazing furnace, and after the temperature inside the brazing furnace reaches 350℃, keep it at that temperature for 35 minutes.

[0090] Then, the assembled water-cooled plate structure, together with the positioning fixture, is placed into a vacuum brazing furnace and held at a furnace temperature of 350℃ for 30 minutes.

[0091] Then, the brazing furnace is heated to 650°C uniformly over 60 minutes and held at that temperature for 40 minutes.

[0092] Then, the brazing furnace is heated to 970°C uniformly over 60 minutes and held at that temperature for 40 minutes.

[0093] Then, within 30 minutes, the brazing furnace is heated to 1040℃ evenly and held for 8 minutes.

[0094] S6. Cool and remove from the oven:

[0095] Turn off the brazing furnace and allow the welded water-cooled plate structure to cool down along with the furnace. After the temperature inside the brazing furnace drops to 600°C, fill the brazing furnace with nitrogen.

[0096] After the temperature inside the brazing furnace continues to drop to 50°C, remove the welded water-cooled plate structure along with the positioning fixture from the brazing furnace and let it cool to room temperature.

[0097] S7. Leak detection process:

[0098] Leakage rate testing was performed on the welded water-cooled plate structure; the leakage rate was <1×10⁻⁶. -9 mbar.L / s indicates a qualified product.

[0099] Example 3:

[0100] The difference from Example 2 is that in step S2, a 2mm thick layer of nickel-based solder paste is applied to the part where the U-shaped copper sheet 11 contacts the cooling flow chamber 101;

[0101] In step S3, a 2mm thick layer of nickel-based solder paste is applied to the areas where the lower sealing cover plate 121 and the upper sealing cover plate 122 contact the U-shaped copper sheet 11.

[0102] In step S4, a 2mm thick layer of solder paste is applied to the gap between the lower sealing cover plate 121 and the upper sealing cover plate 122 and the cover plate connecting receiving groove 102.

[0103] The specific welding process in step S5 is as follows: turn on the brazing furnace, and after the temperature inside the brazing furnace reaches 350℃, keep it at that temperature for 35 minutes.

[0104] Then, the assembled water-cooled plate structure, together with the positioning fixture, is placed into a vacuum brazing furnace and held at a furnace temperature of 350℃ for 20 minutes.

[0105] Then, the brazing furnace is heated to 650°C uniformly over 40 minutes and held at that temperature for 30 minutes.

[0106] Then, the brazing furnace is heated to 970°C uniformly over 40 minutes and held at that temperature for 30 minutes.

[0107] Then, within 20 minutes, the brazing furnace is heated to 1040℃ evenly and held for 5 minutes.

[0108] The cooling process in step S5 is as follows: the brazing furnace is turned off, and the water-cooled plate structure that has been welded is cooled together with the furnace. After the temperature inside the brazing furnace drops to 600°C, argon gas is introduced into the brazing furnace.

[0109] After the temperature inside the brazing furnace continues to drop to 50°C, remove the welded water-cooled plate structure along with the positioning fixture 20 from the brazing furnace and let it cool to room temperature.

[0110] Example 4:

[0111] The difference from Example 2 is that in step S2, a 3mm thick layer of nickel-based solder paste is applied to the part where the U-shaped copper sheet 11 contacts the cooling flow chamber 101.

[0112] In step S3, a 3mm thick layer of nickel-based solder paste is applied to the areas where the lower sealing cover plate 121 and the upper sealing cover plate 122 contact the U-shaped copper sheet 11.

[0113] In step S4, a 3mm thick layer of solder paste is applied to the gap between the lower sealing cover plate 121 and the upper sealing cover plate 122 and the cover plate connecting receiving groove 102.

[0114] The specific welding process in step S5 is as follows: turn on the brazing furnace, and after the temperature inside the brazing furnace reaches 350℃, keep it at that temperature for 35 minutes.

[0115] Then, the assembled water-cooled plate structure, together with the positioning fixture, is placed into a vacuum brazing furnace and held at a furnace temperature of 350℃ for 25 minutes.

[0116] Then, within 50 minutes, the brazing furnace is heated to 650°C and held at that temperature for 35 minutes.

[0117] Then, the brazing furnace is heated to 970°C uniformly over 50 minutes and held at that temperature for 35 minutes.

[0118] Then, the brazing furnace is heated to 1040℃ uniformly over 25 minutes and held at that temperature for 6 minutes.

[0119] The cooling process in step S5 is as follows: the brazing furnace is turned off, and the water-cooled plate structure that has been welded is cooled together with the furnace. After the temperature inside the brazing furnace drops to 600°C, argon gas is introduced into the brazing furnace.

[0120] After the temperature inside the brazing furnace continues to drop to 50°C, remove the welded water-cooled plate structure along with the positioning fixture 20 from the brazing furnace and let it cool to room temperature.

[0121] Example 5:

[0122] This embodiment provides the structure of the positioning fixture 20 used in embodiments 2 to 4 above, such as Figure 4 As shown, the positioning fixture 20 includes two positioning support cylinders 21, as follows: Figure 5 As shown, the side wall of the positioning support cylinder 21 has multiple fastening slider receiving holes 211 that extend radially through it, and fastening constraint sliders 22 are slidably connected in the fastening slider receiving holes 211.

[0123] An end face limiting ring 210 is fixed on the outside of the positioning support cylinder 21;

[0124] The positioning support cylinder 21 is rotatably connected to a slider synchronous drive ring 23 coaxial with it. The slider synchronous drive ring 23 has multiple synchronous drive constraint grooves 231 on its side. The side of the fastening constraint slider 22 is fixed with a drive engagement post 221. The drive engagement post 221 slides in the synchronous drive constraint groove 231 one by one.

[0125] A slider synchronous drive shaft 232 is rotatably connected inside the positioning support cylinder 21. A synchronous drive bevel gear 233 is fixed at one end of the slider synchronous drive shaft 232, a synchronous driven bevel gear 234 is fixed at the end face of the slider synchronous drive ring 23, and a manual driven bevel gear 235 is fixed at the other end of the slider synchronous drive shaft 232. The manual driven bevel gear 235 is meshed with a manual drive bevel gear 236. The side wall of the positioning support cylinder 21 has a manual gear shaft through hole 237 that passes through the rotation axis of the manual drive bevel gear 236. The rotation axis of the manual drive bevel gear 236 is rotatably connected in the manual gear shaft through hole 237.

[0126] Two positioning support cylinders 21 are connected to the base support structure 24. The base support structure 24 includes a base support plate 241. The base support plate 241 is fixed with a positioning support side plate 243 by a base support rod 242. The two positioning support cylinders 21 are fixedly connected to the side of the positioning support side plate 243.

[0127] like Figure 4 As shown, the positioning support cylinder 21 is equipped with a gap maintaining mechanism 30, such as... Figure 8 As shown, the gap holding mechanism 30 includes a gap holding receiving shell 31 fixed on the inner wall of the positioning support cylinder 21. The gap holding receiving shell 31 has a plurality of slider mating grooves 311 that communicate with each other on the side. A gap holding slider 32 is slidably connected in the slider mating grooves 311.

[0128] A slider telescopic drive plate 33 is slidably connected to the top of the gap retaining housing 31. The sliding direction of the slider telescopic drive plate 33 is perpendicular to the sliding direction of the gap retaining slider 32. The slider telescopic drive plate 33 has multiple slider telescopic constraint grooves 331. The part of the gap retaining slider 32 inside the gap retaining housing 31 is fixed with a slider telescopic constraint post 332. The slider telescopic constraint post 332 is slidably fitted in the slider telescopic constraint groove 331.

[0129] A slider drive housing 34 is fixed on the side of the clearance retaining housing 31 away from the slider mating groove 311. A slider drive shaft 341 is rotatably connected inside the slider drive housing 34. One end of the slider drive shaft 341 extends into the interior of the clearance retaining housing 31. A telescopic drive gear 342 is fixed at the end of the slider drive shaft 341 that extends into the clearance retaining housing 31. A telescopic driven rack 343 is fixed on the lower side of the slider telescopic drive plate 33. The telescopic drive gear 342 is meshed with the telescopic driven rack 343.

[0130] The other end of the slider drive shaft 341 is fixed with a telescopic driven bevel gear 344, which meshes with a telescopic drive bevel gear 345. The top of the slider drive housing 34 has a telescopic gear shaft mating hole 346 that is internally and externally connected. The rotating shaft of the telescopic drive bevel gear 345 is rotatably connected in the telescopic gear shaft mating hole 346. The upper side of the positioning support cylinder 21 has a telescopic adjustment through hole 347 that is coaxially connected with the telescopic gear shaft mating hole 346.

[0131] like Figure 4 As shown, an upper cover plate counterweight mechanism 40 is connected to the positioning support cylinder 21. The upper cover plate counterweight mechanism 40 includes a counterweight mechanism support plate 41 fixedly connected to the upper side of the positioning support cylinder 21. A counterweight mechanism rotating plate 42 is rotatably connected to the top of the counterweight mechanism support plate 41.

[0132] The top of the counterweight mechanism rotary disk 42 is connected to a counterweight deflection support arm 43 via a first counterweight fixing hinge 421. The other end of the counterweight deflection support arm 43 is connected to a counterweight plate 44 via a second counterweight fixing hinge 431. The top of the counterweight plate 44 has multiple counterweight receiving slots 441.

[0133] like Figure 4 As shown, a lower cover plate support mechanism 50 is provided on the base support plate 241, such as... Figure 12 As shown, the lower cover plate support mechanism 50 includes a support mechanism receiving cylinder 51 that is fixed to the top of the base support plate 241 and extends vertically. The top of the support mechanism receiving cylinder 51 has a vertically penetrating support column mating hole 511. A cover plate support column 52 is slidably connected in the support column mating hole 511. The top of the cover plate support column 52 is connected to the support column top plate 521 through a ball hinge.

[0134] The support mechanism housing cylinder 51 is rotatably connected to a lifting support ring 53 coaxial with it. The lifting support ring 53 is fixedly connected to a lifting drive worm gear 54 coaxial with it. The lifting drive worm gear 54 has a vertically penetrating lifting drive threaded hole 541. The lower part of the cover plate support column 52 has an external thread, and the lower part of the cover plate support column 52 is threadedly connected to the lifting drive threaded hole 541.

[0135] A worm support seat 551 is fixed to the inner wall of the support mechanism receiving cylinder 51. A lifting drive worm 55 is rotatably connected to the worm support seat 551. The lifting drive worm 55 is meshed with the lifting drive worm wheel 54. The side wall of the support mechanism receiving cylinder 51 has a lifting adjustment through hole 510 that runs through the rotation axis of the lifting drive worm wheel 54.

[0136] like Figure 10As shown, a gap isolation mechanism 39 is used in conjunction with the gap holding mechanism 30. The gap isolation mechanism 39 includes two gap isolation receiving shells 391 with openings facing away from each other. A plurality of C-shaped spring plates 392 are fixedly connected between the two gap isolation receiving shells 391. A sliding connecting ring 393 and a sliding connecting post 394 are fixedly fixed on the side of the two gap isolation receiving shells 391 that are close to each other. The sliding connecting post 394 is slidably engaged in the sliding connecting ring 393.

[0137] A gap isolation magnet 390 is fixed inside the gap isolation housing 391, and the gap isolation magnets 390 on the side that are close to each other have the same polarity.

[0138] In practical application, the positioning fixture 20 of the present invention first fixes the oxygen-free copper square cavity part 10 on the positioning support cylinder 21, and inserts the cooling water inlet hole 131 and the cooling water outlet hole 132 into the two positioning support cylinders 21 respectively. The end of the rotating shaft of the manual drive bevel gear 236 has an internal hexagonal hole. By rotating the rotating shaft of the manual drive bevel gear 236 with a hexagonal screwdriver, the manual drive bevel gear 236 is driven to rotate. The manual drive bevel gear 236 drives the manual driven bevel gear 235 together with the slider synchronous drive shaft 232 and The synchronous drive bevel gear 233 rotates together, and the synchronous drive bevel gear 233 drives the synchronous driven bevel gear 234 to rotate together with the slider synchronous drive ring 23. Under the constraint of the synchronous drive constraint groove 231, the drive mating column 221 drives the fastening constraint slider 22 to move away from each other along the radial direction of the positioning support cylinder 21. The outer sides of the multiple fastening constraint sliders 22 press against the inner sidewalls of the cooling water inlet hole 131 and the cooling water outlet hole 132, so that the oxygen-free copper square cavity part 10 can be fixedly installed on the positioning support cylinder 21.

[0139] Then, multiple U-shaped copper sheets 11 are arranged at equal intervals and placed into the cooling flow chamber 101. The end of the rotating shaft of the telescopic drive bevel gear 345 has an internal hexagonal hole. Using a hexagonal screwdriver to rotate the rotating shaft of the telescopic drive bevel gear 345, the telescopic drive bevel gear 345 is rotated. The telescopic drive bevel gear 345 drives the telescopic driven bevel gear 344 to rotate together with the slider drive shaft 341 and the telescopic drive gear 342. The telescopic drive gear 342 drives the telescopic driven rack 343 to move together with the slider telescopic drive plate 33. Under the constraint of the slider telescopic constraint groove 331, the slider telescopic constraint column 332 drives the gap holding slider 32 to extend out of the slider mating groove 311. Multiple gap holding sliders 32 are inserted one-to-one into the gaps between the multiple U-shaped copper sheets 11, so that the multiple U-shaped copper sheets 11 are arranged at equal intervals and remain stable. Nickel-based solder paste is applied to the part of the U-shaped copper sheet 11 that contacts the cooling flow chamber 101, and the nickel-based solder paste is allowed to solidify.

[0140] A gap isolation mechanism 39 is placed in each gap between multiple U-shaped copper sheets 11. Two gap isolation housings 391, together with gap isolation magnets 390, press against the side wall between two adjacent U-shaped copper sheets 11 to maintain the stable arrangement of multiple U-shaped copper sheets 11 with equal spacing. When in use, a thin steel wire is tied to the sliding connecting ring 393, and the other end of the steel wire extends out from the cooling water inlet hole 131 or the cooling water outlet hole 132, so that the gap isolation mechanism 39 can be removed after welding is completed.

[0141] The high temperature during the welding process will demagnetize the gap isolation magnet 390, reducing the maximum static friction between the gap isolation mechanism 39 and the sidewalls of the two adjacent U-shaped copper sheets 11. After welding, the gap isolation mechanism 39 can be pulled out along the steel wire.

[0142] Next, install the lower sealing cover plate 121 and the upper sealing cover plate 122. Apply nickel-based solder paste to the parts of the lower sealing cover plate 121 and the upper sealing cover plate 122 that contact the U-shaped copper sheet 11. Fix the lower sealing cover plate 121 and the upper sealing cover plate 122 in the cover plate connecting receiving grooves 102 on the lower and upper sides of the oxygen-free copper square cavity part 10, respectively. The end of the rotating shaft of the lifting drive worm gear 55 has an internal hexagonal hole. Use a hexagonal screwdriver to drive the rotating shaft of the lifting drive worm gear 55 to rotate together with the lifting drive worm gear 55 through the lifting adjustment through hole 510. The lifting drive worm gear 55 drives the lifting drive worm wheel 54 to rotate. Under the thread transmission constraint between the lifting drive threaded hole 541 and the cover plate support column 52, the cover plate support column 52 is driven to move vertically upward along the axis of the support column mating hole 511. The cover plate support column 52 drives the support column top plate 521 to move upward together, so that the support column top plate 521 presses against the bottom of the lower sealing cover plate 121.

[0143] Manually drive the counterweight deflection support arm 43 to deflect around the axis of the counterweight mechanism rotating disk 42, so that the counterweight plate 44 is above the sealing upper cover plate 122. Manually drive the counterweight deflection support arm 43 to move down and deflect around the rotation axis of the first counterweight fixing hinge 421, so that the counterweight plate 44 presses on the top of the sealing upper cover plate 122, and puts the counterweight block into the counterweight block receiving groove 441. Wait for the nickel-based solder paste at the contact part between the sealing lower cover plate 121 and the sealing upper cover plate 122 and the U-shaped copper sheet 11 to solidify.

[0144] Finally, apply solder paste to the gaps where the lower sealing cover plate 121 and the upper sealing cover plate 122 contact with the cover plate connecting receiving groove 102, and wait for the solder paste to solidify.

[0145] Once the brazing furnace is ready, the assembled water-cooled plate structure, along with the positioning fixture 20, can be placed into the vacuum brazing furnace for welding.

Claims

1. A vacuum brazing process for a CVD longitudinal fin water-cooled plate structure for semiconductors, characterized in that, The water-cooled plate structure includes an oxygen-free copper square cavity component (10), which has a hollow cooling flow chamber (101) inside. Multiple U-shaped copper sheets (11) are fixed inside the cooling flow chamber (101). The oxygen-free copper square cavity component (10) has a cover plate connecting receiving groove (102) at the bottom and top of the oxygen-free copper square cavity component (10) that communicates with the cooling flow chamber (101). A sealing lower cover plate (121) and a sealing upper cover plate (122) are respectively fixed in the cover plate connecting receiving groove (102) at the bottom and top of the oxygen-free copper square cavity component (10). The oxygen-free copper square cavity part (10) has a cooling water inlet hole (131) and a cooling water outlet hole (132) on its side that are connected to the cooling flow chamber (101). The vacuum brazing process includes the following steps: S1. Parts cleaning: Clean the lower sealing cover plate (121), the upper sealing cover plate (122), the oxygen-free copper square cavity part (10) and the multiple U-shaped copper sheets (11) to remove oil and oxides from the surface of each part. S2. Install the U-shaped copper sheet: The oxygen-free copper square cavity part (10) is clamped on the positioning fixture (20), and then multiple U-shaped copper sheets (11) are arranged at equal intervals inside the cooling flow chamber (101). A 2-5 mm thick nickel-based solder paste is applied to the part where the U-shaped copper sheets (11) contact the cooling flow chamber (101), and the nickel-based solder paste is allowed to solidify. S3. Install oxygen-free copper cover plate parts: Apply 2-5 mm thick nickel-based solder paste to the parts where the lower sealing cover plate (121) and the upper sealing cover plate (122) contact the U-shaped copper sheet (11). Fix the lower sealing cover plate (121) and the upper sealing cover plate (122) in the cover plate connection receiving groove (102) on the lower and upper sides of the oxygen-free copper square cavity part (10), respectively, and clamp and fix the lower sealing cover plate (121) and the upper sealing cover plate (122) and wait for the nickel-based solder paste to solidify. S4. Apply additional solder paste: Apply 2-5 mm thick solder paste to the gap between the lower sealing cover plate (121) and the upper sealing cover plate (122) and the cover plate connecting receiving groove (102), and wait for the solder paste to solidify. Then, the lower sealing cover plate (121) on the lower side of the oxygen-free copper square cavity part (10) is supported and stabilized, and the upper sealing cover plate (122) on the top of the oxygen-free copper square cavity part (10) is stabilized by weight. S5. Welding of the entire water-cooled plate structure: The assembled water-cooled plate structure, together with the positioning fixture (20), is placed into a vacuum brazing furnace for welding. S6. Cool and remove from the oven: Turn off the brazing furnace and allow the welded water-cooled plate structure to cool to room temperature along with the furnace before removing it. S7. Leak detection process: Leakage rate testing was performed on the welded water-cooled plate structure; the leakage rate was <1×10⁻⁶. -9 mbar.L / s indicates a qualified product.

2. The vacuum brazing process for a CVD longitudinal fin water-cooled plate structure for semiconductors according to claim 1, characterized in that, The specific welding process in step S5 is as follows: turn on the brazing furnace, and after the temperature inside the brazing furnace reaches 350℃, keep it at that temperature for 35 minutes. Then, the assembled water-cooled plate structure, together with the positioning fixture, is placed into a vacuum brazing furnace and held at a furnace temperature of 350℃ for 20-30 minutes. Then, the brazing furnace is heated to 650°C uniformly over 40-60 minutes and held at that temperature for 30-40 minutes. Then, the brazing furnace is heated to 970℃ uniformly over 40-60 minutes and held for 30-40 minutes. Then, within 20-30 minutes, the brazing furnace is heated to 1040℃ evenly and held for 5-8 minutes.

3. The vacuum brazing process for a CVD longitudinal finned water-cooled plate structure for semiconductors according to claim 1, characterized in that, The specific cooling process in step S6 is as follows: turn off the brazing furnace and let the welded water-cooled plate structure cool down with the furnace. After the temperature inside the brazing furnace drops to 600°C, argon or nitrogen is introduced into the brazing furnace. After the temperature inside the brazing furnace continues to drop to 50°C, the welded water-cooled plate structure, together with the positioning fixture (20), is taken out of the brazing furnace and cooled to room temperature.

4. The vacuum brazing process for a CVD longitudinal fin water-cooled plate structure for semiconductors according to claim 1, characterized in that, The positioning fixture (20) includes two positioning support cylinders (21). The side wall of the positioning support cylinder (21) has a plurality of fastening slider receiving holes (211) that run radially through it. A fastening constraint slider (22) is slidably connected in the fastening slider receiving hole (211). An end face limiting ring (210) is fixed on the outside of the positioning support cylinder (21); The positioning support cylinder (21) is rotatably connected to a slider synchronous drive ring (23) coaxial with it. The slider synchronous drive ring (23) has multiple synchronous drive constraint grooves (231) on its side. The fastening constraint slider (22) has a drive mating column (221) fixed on its side. The drive mating column (221) slides in the synchronous drive constraint groove (231) one by one. The positioning support cylinder (21) is rotatably connected to a slider synchronous drive shaft (232). One end of the slider synchronous drive shaft (232) is fixed with a synchronous drive bevel gear (233). The end face of the slider synchronous drive ring (23) is fixed with a synchronous driven bevel gear (234). The other end of the slider synchronous drive shaft (232) is fixed with a manual driven bevel gear (235). The manual driven bevel gear (235) is meshed with a manual drive bevel gear (236). The side wall of the positioning support cylinder (21) has a manual gear shaft through hole (237) that runs through the rotation axis of the manual drive bevel gear (236). The rotation axis of the manual drive bevel gear (236) is rotatably connected in the manual gear shaft through hole (237). The two positioning support cylinders (21) are connected to the base support structure (24). The base support structure (24) includes a base support plate (241). The base support plate (241) is fixed with a positioning support side plate (243) by a base support rod (242). The two positioning support cylinders (21) are fixedly connected to the side of the positioning support side plate (243).

5. The vacuum brazing process for a CVD longitudinal finned water-cooled plate structure for semiconductors according to claim 4, characterized in that, The positioning support cylinder (21) is provided with a gap holding mechanism (30). The gap holding mechanism (30) includes a gap holding receiving shell (31) fixed on the inner side wall of the positioning support cylinder (21). The gap holding receiving shell (31) has a plurality of slider mating grooves (311) that communicate with each other on the side. A gap holding slider (32) is slidably connected in the slider mating groove (311). The top of the gap retaining housing (31) is slidably connected to a slider telescopic drive plate (33). The sliding direction of the slider telescopic drive plate (33) is perpendicular to the sliding direction of the gap retaining slider (32). The slider telescopic drive plate (33) has multiple slider telescopic constraint grooves (331). The part of the gap retaining slider (32) inside the gap retaining housing (31) is fixed with a slider telescopic constraint post (332). The slider telescopic constraint post (332) is slidably fitted in the slider telescopic constraint groove (331) one by one. A slider drive housing (34) is fixed on the side of the gap retaining housing (31) away from the slider mating groove (311). A slider drive shaft (341) is rotatably connected inside the slider drive housing (34). One end of the slider drive shaft (341) extends into the gap retaining housing (31). A telescopic drive gear (342) is fixed at the end of the slider drive shaft (341) that extends into the gap retaining housing (31). A telescopic driven rack (343) is fixed on the lower side of the slider telescopic drive plate (33). The telescopic drive gear (342) meshes with the telescopic driven rack (343). The other end of the slider drive shaft (341) is fixed with a telescopic driven bevel gear (344), which is meshed with a telescopic drive bevel gear (345). The top of the slider drive housing (34) has a telescopic gear shaft mating hole (346) that is open to both the inside and outside. The rotating shaft of the telescopic drive bevel gear (345) is rotatably connected in the telescopic gear shaft mating hole (346). The upper side of the positioning support cylinder (21) has a telescopic adjustment through hole (347) that is coaxially connected with the telescopic gear shaft mating hole (346).

6. The vacuum brazing process for a CVD longitudinal finned water-cooled plate structure for semiconductors according to claim 4, characterized in that, The positioning support cylinder (21) is connected to an upper cover plate pressure mechanism (40). The upper cover plate pressure mechanism (40) includes a pressure mechanism support plate (41) fixedly connected to the upper side of the positioning support cylinder (21). The top of the pressure mechanism support plate (41) is rotatably connected to a pressure mechanism rotating plate (42). The top of the rotating disk (42) of the counterweight mechanism is connected to a counterweight deflection support arm (43) via a first counterweight fixing hinge (421). The other end of the counterweight deflection support arm (43) is connected to a counterweight plate (44) via a second counterweight fixing hinge (431). The top of the counterweight plate (44) has multiple counterweight receiving slots (441).

7. The vacuum brazing process for a CVD longitudinal finned water-cooled plate structure for semiconductors according to claim 4, characterized in that, The base support plate (241) is provided with a lower cover plate support mechanism (50). The lower cover plate support mechanism (50) includes a support mechanism receiving cylinder (51) fixed to the top of the base support plate (241) and extending vertically. The top of the support mechanism receiving cylinder (51) has a vertically penetrating support column mating hole (511). A cover plate support column (52) is slidably connected in the support column mating hole (511). The top of the cover plate support column (52) is connected to a support column top plate (521) through a ball hinge. The support mechanism housing cylinder (51) is rotatably connected to a lifting support ring (53) coaxial with it. The lifting support ring (53) is fixedly connected to a lifting drive worm gear (54) coaxial with it. The lifting drive worm gear (54) has a vertically penetrating lifting drive threaded hole (541). The lower part of the cover plate support column (52) has an external thread. The lower part of the cover plate support column (52) is threadedly connected to the lifting drive threaded hole (541). The inner wall of the support mechanism receiving cylinder (51) is fixed with a worm support seat (551), and a lifting drive worm (55) is rotatably connected to the worm support seat (551). The lifting drive worm (55) is meshed with the lifting drive worm wheel (54). The side wall of the support mechanism receiving cylinder (51) has a lifting adjustment through hole (510) that runs through the rotation axis of the lifting drive worm wheel (54).

8. The vacuum brazing process for a CVD longitudinal fin water-cooled plate structure for semiconductors according to claim 5, characterized in that, A gap isolation mechanism (39) is used in conjunction with the gap holding mechanism (30). The gap isolation mechanism (39) includes two gap isolation receiving shells (391) with openings facing away from each other. A plurality of C-shaped spring plates (392) are fixedly connected between the two gap isolation receiving shells (391). A sliding connecting ring (393) and a sliding connecting post (394) are fixedly fixed on the side of the two gap isolation receiving shells (391) that are close to each other. The sliding connecting post (394) is slidably engaged in the sliding connecting ring (393). A gap isolation magnet (390) is fixed inside the gap isolation housing (391), and the gap isolation magnets (390) on the side that are close to each other have the same polarity.

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