Spacecraft buffer and damping system and method based on shape memory effect

Abstract

The application provides a spacecraft buffer damping system and method based on shape memory effect, which comprises a shape memory device, a response device, a cooling device, a recovery device and a controller; the shape memory device comprises a plurality of buffer sheets which can be deformed in one direction, and the buffer sheets are symmetrically distributed on both sides of a memory cavity; the response device is used for providing excitation to the buffer sheets under the action of the controller, so that the buffer sheets are deformed; the cooling device is used for inputting cooling medium into the memory cavity under the action of the controller, so as to fix the state of the buffer sheets; and the recovery device is used for extracting gas in the memory cavity, so that the memory cavity recovers to the initial state under the action of the difference between the internal pressure and the external pressure; the damping system provided by the application has the advantages of simple structure, good buffer performance, strong controllability, high reliability and reusability.

Description

Technical Field

[0001] This invention relates to the field of buffer and vibration reduction systems, and more particularly to a spacecraft buffer and vibration reduction system and method based on the shape memory effect. Background Technology

[0002] With the continuous development of aerospace technology, humanity has gradually increased its exploration of space. As an essential tool for human space exploration, spacecraft have been widely developed and used. With the ongoing exploration of space, geological surveys of other planets and the return of manned spacecraft are particularly important tasks, which place high demands on the vibration damping performance of spacecraft landing buffer systems.

[0003] Spacecraft are heavy objects. When they perform missions to explore other planets or return to Earth as manned spacecraft, they will have enormous kinetic energy as they descend from high altitudes. When a spacecraft comes into contact with or collides with the surface of Earth or other planets, it will generate huge reaction forces, causing it to bounce or tumble. After multiple bounces and collisions, it will finally stop on the surface of the planet. At that time, the spacecraft will inevitably suffer huge damage, reducing the reliability of its precision components.

[0004] Landing buffers for general spacecraft primarily utilize metal-rubber to create shock-absorbing units. Existing technology offers a landing buffer for asteroid surfaces based on the energy absorption principle of metal-rubber. This device absorbs residual energy during vertical landing using the energy-absorbing properties of the metal-rubber. However, due to the use of a buffer support, the deformation of the metal-rubber is relatively small, resulting in poor shock absorption. Other spacecraft landers employ honeycomb panels. Existing technology provides a spacecraft solar panel pyrotechnic impact buffer device. This device uses the impact of the honeycomb panel with pyrotechnic materials to achieve a cushioning function. However, due to unstable damping and difficulty in recovering from deformation of the honeycomb material, the shock absorption effect is inconsistent. Landers for recoverable satellites or manned spacecraft return capsules mainly use airbags. Existing technology also provides a spacecraft airbag system. This device uses pressure strips and screws to fix the airbag to the bottom of the spacecraft. However, when the air pressure in the airbag is too high, the spacecraft is prone to rebound and tumbling after landing, potentially damaging delicate components inside the spacecraft. Furthermore, since the airbags require manual collection and handling after deployment, the collection process is cumbersome and dangerous. They cannot be actively retrieved and deployed, and are generally not reusable. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides a spacecraft cushioning and vibration reduction system and method based on the shape memory effect. It utilizes the controllable deformation characteristics of shape memory materials to solve these problems. The main deformable component in the cushioning and vibration reduction system is a buffer sheet, whose matrix material is a shape memory polymer. Upon excitation, the buffer sheet changes its stiffness and deformation, thereby achieving the cushioning and vibration reduction function. Furthermore, by adjusting the stiffness and deformation of the buffer sheet, the cushioning and vibration reduction system can achieve different vibration energy absorption effects, thus realizing different cushioning and vibration reduction effects. Liquid cooling and pneumatics are used to fix and retrieve the shape memory device's state. A controller regulates its operating state and enables the reuse of the cushioning and vibration reduction system.

[0006] The present invention achieves the above-mentioned technical objectives through the following technical means.

[0007] A spacecraft cushioning and vibration reduction system based on shape memory effect includes a shape memory device, a response device, a cooling device, a recovery device, and a controller;

[0008] The shape memory device includes several buffer sheets that can deform in one direction, and the buffer sheets are symmetrically distributed on both sides of the memory cavity.

[0009] The response device is used to excite the buffer sheet, causing the buffer sheet to deform;

[0010] The cooling device is used to input cooling medium into the memory cavity to solidify the buffer sheet;

[0011] The recovery device is used to extract the gas in the memory cavity, so that the memory cavity can be restored to its initial state under the action of the pressure difference with the outside air.

[0012] The controller is used to control the operation of the response device, cooling device, and recovery device.

[0013] Furthermore, several buffer sheets are connected in a serrated pattern, and adjacent buffer sheets are connected by a light-curing adhesive.

[0014] Furthermore, the response device is an electrical response device.

[0015] Furthermore, the electrical response device includes a flexible electrothermal layer attached to the surface of the buffer sheet, and the flexible electrothermal layer is controlled by a controller to heat the buffer sheet, causing the buffer sheet to deform.

[0016] Furthermore, the controller controls each of the flexible electrothermal layers to make the deformation of each buffer sheet the same or different.

[0017] Furthermore, the temperature gradient of each flexible electrothermal layer is controlled by a controller, so that the deformation of the buffer sheet increases or decreases gradually along the deformation direction.

[0018] Furthermore, the cooling device includes an infusion pump; the infusion pump is connected to the memory cavity and is used to input the cooling medium into the memory cavity.

[0019] Furthermore, a recycling device is provided, which includes an air pump; the air pump is connected to the memory cavity and is used to extract the gas inside the memory cavity.

[0020] A vibration reduction method for a spacecraft buffer vibration reduction system based on shape memory effect includes the following steps:

[0021] The memory cavity is initially in an initial compressed state. The controller controls the response device to provide excitation to the buffer sheet in the initial compressed state, causing the buffer sheet to deform due to heat. The memory cavity has a buffering capacity.

[0022] An impact force is applied to the memory cavity, and the memory cavity is compressed to form a first compressed state. The controller controls the cooling device to cool the buffer plate and solidify the first compressed state.

[0023] The impact force is removed, the cooling medium in the memory cavity is discharged, the controller controls the response device to provide excitation to the buffer plate in the first compression state, the controller controls the recovery device to make the memory cavity return to the initial compression state; the controller controls the cooling device to cool the buffer plate and solidify the initial compression state.

[0024] The beneficial effects of this invention are as follows:

[0025] 1. The spacecraft buffering and vibration reduction system and method based on shape memory effect described in this invention provides excitation to the buffer sheet through a response device, causing the buffer sheet to deform, thereby enabling the buffering vibration system to absorb vibrations and thus achieving a buffering and vibration reduction effect.

[0026] 2. The spacecraft buffering and vibration reduction system and method based on shape memory effect described in this invention, by inputting different parameters into the controller, enables the response device to provide different excitations to the buffer plate, causing the buffer plate to deform to different degrees, thereby achieving different buffering and vibration reduction effects.

[0027] 3. The spacecraft buffer and vibration reduction system and method based on shape memory effect described in this invention uses a cooling device to input and discharge cooling medium into the memory cavity and a recovery device to extract gas from the memory cavity, so that the shape memory device can be transformed from a compressed to an extended state, thereby realizing the rapid release and recovery function of the buffer and vibration reduction system.

[0028] 4. The spacecraft buffering and vibration reduction system and method based on shape memory effect described in this invention provides excitation to the buffer sheet through a controller-controlled response device, causing the buffer sheet to deform under heat, thus providing buffering capacity; controls the cooling device to fix the state of the buffer sheet; controls the recovery device to evacuate air to restore the buffer sheet to its initial state; it has strong controllability, high reliability, and can be reused. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. The drawings described below are some embodiments of the present invention. For those skilled in the art, it is obvious that other drawings can be obtained from these drawings without creative effort.

[0030] Figure 1 This is a schematic diagram of the spacecraft buffer and vibration reduction system based on shape memory effect as described in this invention;

[0031] Figure 2 This is a schematic diagram of the structural relationship of the response device described in this invention;

[0032] Figure 3 This is a schematic diagram illustrating the structural relationship between the buffer sheet and the flexible electrothermal layer structure described in this invention;

[0033] Figure 4 This is a flowchart illustrating the working state of the spacecraft buffer and vibration reduction system based on shape memory effect as described in this invention.

[0034] In the picture:

[0035] 1-Buffer sheet; 2-Top cover; 3-Base; 4-Elastic film; 4-1 Front film; 4-2 Rear film; 5-Cooling device; 5-1 Infusion pump; 5-2 Infusion pipe; 5-3 Water outlet pipe; 6-Recovery device; 6-1 Air pump; 6-2 Air guide pipe; 7-Controller; 8-Flexible heating layer. Detailed Implementation

[0036] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0037] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "axial," "radial," "vertical," "horizontal," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0038] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0039] like Figure 1 As shown, the spacecraft buffering and vibration reduction system based on shape memory effect of the present invention includes a shape memory device, a response device, a cooling device 5, a recovery device 6, and a controller 7. The shape memory device includes a buffer sheet 1, a top cover 2, a base 3, and an elastic film 4. There are several buffer sheets 1. Each buffer sheet 1 can deform in one direction. In the present invention, the buffer sheet 1 deforms in the vertical direction. By changing the installation direction of the buffer sheet 1, the buffer sheet 1 can also deform in the horizontal or inclined direction. Adjacent buffer sheets 1 are connected by photocurable adhesive, and several buffer sheets 1 form two sawtooth-shaped connecting structures. The two sawtooth-shaped connecting structures are symmetrically distributed on both sides of the memory cavity. The memory cavity is a cavity composed of several buffer sheets 1, a top cover 2, a base 3, and an elastic film 4. A front film 4-1 and a rear film 4-2 are respectively provided on the front and rear sides of the memory cavity.

[0040] The memory cavity has several through holes; in this invention, there are three through holes. Two through holes are located at the upper part of the memory cavity, one of which is connected to a cooling device 5 for introducing cooling medium into the memory cavity, and the other through hole is connected to a recovery device 6 for extracting gas from the memory cavity. A third through hole is located at the lower end of the memory cavity; after the memory cavity is shaped, the cooling medium inside the memory cavity is discharged through a water outlet pipe 5-3. The response device is an electrical response device, such as... Figure 3 As shown, the electrical response device includes a flexible electrothermal layer 8 attached to the outside of the buffer sheet 1. By electrically stimulating the flexible electrothermal layer 8, the flexible electrothermal layer 8 generates heat and transfers the heat to the buffer sheet 1. The buffer sheet 1 softens and deforms when heated. By inputting different parameters through the controller 7, different current, voltage magnitudes, and energizing time can be controlled, which can change the deformation and hardness of the buffer sheet 1. That is, the controller 7 controls each layer of the flexible electrothermal layer 8 so that the deformation of each layer of the buffer sheet 1 is the same or different.

[0041] The cooling device 5, the recovery device 6, and the controller 7 are all fixed on the same side of the top cover 2. The cooling device 5 includes an infusion pump 5-1, an infusion pipe 5-2, and a water outlet pipe 5-3. The infusion pump 5-1 is fixed to the front side of the top cover 2 by bolts. The infusion pipe 5-2 is connected to the upper left through hole of the memory cavity. The infusion pump 5-1 is used to input cooling medium into the memory cavity. The water outlet pipe 5-3 is located at the lower through hole of the memory cavity. After the memory cavity is fixed, the water outlet pipe 5-3 is used to discharge the memory medium. The cooling medium inside the cavity; the recovery device 6 includes an air pump 6-1 and an air guide pipe 6-2; the air pump 6-1 is fixedly connected to the top cover 2 by bolts, and the air guide pipe 6-2 is connected to the through hole on the upper right side of the memory cavity; the recovery device 6 is used to extract the gas inside the memory cavity, so that the memory cavity and the outside world are generated by a pressure difference, thereby changing the memory cavity from an extended state to a compressed state; the response device, cooling device 5 and recovery device 6 are all connected to the controller 7, and the controller 7 is used to control the operation of each device.

[0042] like Figure 4As shown, the controller 7 controls the operation of the response device, cooling device 5, and recovery device 6, causing the memory cavity to transition between compressed and extended states, achieving rapid release and recovery of the buffer and vibration damping system. The controller 7 controls the response device to provide excitation to the buffer plate 1, causing corresponding changes in the material properties and shape of the buffer plate 1, thereby changing the state of the memory cavity, realizing the release of the buffer and vibration damping system and achieving the buffer and vibration damping function. The buffer plate 1 can be heated and deformed by external heat conduction. The flexible electrothermal layer 8 attached to the outside of the buffer plate 1 is electrically stimulated to generate heat and conducts the heat to the buffer plate 1, causing the buffer plate 1 to heat up and change its deformation and hardness. The controller 7 controls the infusion pump 5-1 of the cooling device 5 to input cooling medium into the memory cavity. The cooling medium contacts the buffer plate 1, causing the buffer plate 1 to change from a deformable elastic body to a rigid body, fixing the state of the memory cavity. The controller 7 controls the recovery device 6 to control the air pump 6-1 to extract the gas in the memory cavity, creating a pressure difference between the memory cavity and the outside, causing the memory cavity to change from an extended state to a compressed state.

[0043] Example 1

[0044] The matrix material of the buffer sheet 1 is a shape memory polymer, including polyurethane acrylate (PUA), isobornyl acrylate (IBOA), and ethyl 2,4,6-trimethylbenzoylphenylphosphonate (TPO-L), with mass fractions of 55 wt%, 42 wt%, and 3 wt%, respectively. The buffer sheet 1 is synthesized and then printed into a strip sample with a length of 125 mm, a width of 25 mm, and a thickness of 2 mm by stereolithography. The initial shape of the buffer sheet 1 can be compressed in water at 50-70°C, and then its shape is fixed in cold water to facilitate subsequent assembly. Two buffer sheets 1 are bonded together with light-curing adhesive. After bonding, they are irradiated with UV light for 3-5 minutes to form two symmetrically distributed sawtooth-shaped connecting structures. The uppermost buffer sheet 1 of the two sawtooth-shaped connecting structures is bonded to the top cover 2 with adhesive, and the lowermost buffer sheet 1 is fixedly connected to the base 3. The base 3 is a composite board with a length of 150mm, a width of 25mm, and a thickness of 4mm. The top cover 2 is a composite board with a thickness of 8mm, and its length and width are the same as those of the base 3.

[0045] The memory cavity is initially in an initial compressed state. Buffer 1, stimulated by the response device, softens and deforms upon heating, changing from a rigid body to an elastic body. When the deformation of buffer 1 is complete, the memory cavity transitions from the initial compressed state to an extended state. Applying pressure to the memory cavity causes it to transition from the extended state to the first compressed state. When the memory cavity is stably in a compressed state, the controller 7 controls the infusion pump 5-1 of the cooling device 5 to input cooling medium into the memory cavity. The cooling medium contacts the heated and deformed buffer 1, causing it to cool and change from an elastic body to a rigid body, thus fixing the memory cavity in its first compressed state. The valve of the outlet pipe 5-3 is opened to discharge the cooling medium from the memory cavity. After discharging the cooling medium, the valve is closed, and the response device provides stimulation to soften the buffer 1 upon heating, changing it back to an elastic body. The controller 7 then controls the recovery device... The control air pump 6-1 extracts the gas from the memory cavity, creating a pressure difference between the memory cavity and the outside. Under the action of the pressure difference, the memory cavity changes from an extended state to an initial compressed state. The control cooling device 5's infusion pump 5-1 inputs cooling medium into the memory cavity. The cooling medium comes into contact with the buffer plate 1, cooling the heated and deformed buffer plate 1. After cooling, the buffer plate 1 changes from an elastic body to a rigid body, fixing the memory cavity in its initial compressed state. The valve of the outlet pipe 5-3 is opened to discharge the cooling medium from the memory cavity, and then the valve is closed, completing the recovery of the buffer and vibration damping system. Thus, the shape memory device completes one working cycle, and the state of the buffer plate 1 undergoes the change from compression to extension to compression. Repeating the above operation can realize the rapid transition of the shape memory device between compressed and extended states, achieving the buffer and vibration damping effect, and enabling the rapid release and recovery of the buffer and vibration damping device.

[0046] Example 2:

[0047] In this embodiment, the initial state of the memory cavity is the initial compressed state, with a height of 85mm. The thickness of the buffer sheet 1 is set to 2mm. The base 3 is a composite plate with a length of 150mm, a width of 25mm, and a thickness of 4mm. The thickness of the top cover 2 is 8mm. The elastic film is made of TPU film with a thickness of 0.5mm. The overall deformation process of the memory cavity is achieved by controlling the operation of the response device, cooling device 5, and recycling device 6 through the controller 7. Figure 4 As shown, the specific steps are as follows:

[0048] S01: The controller 7 inputs a command, and the response device excites the buffer sheet 1 to deform due to heat. For example, a current of 3A and a voltage of 38V are input to the flexible heating layer 8, with an energizing time of 20s. The energizing time, current, and voltage of the flexible heating layer 8 can be set according to actual working needs. Different control parameters can cause the buffer sheet 1 to undergo different deformations. The flexible heating layer 8 attached to the outside of the buffer sheet 1 generates heat through the thermal resistance effect and conducts it to the buffer sheet 1. When the temperature of the buffer sheet 1 rises above the glass transition temperature of the material, it changes from a rigid body to an elastic body, thereby activating the shape recovery function of the material. The shape of the buffer sheet 1 is stretched. When its shape is fully stretched, the height of the memory cavity becomes 204mm, completing the release of the buffer and vibration damping system.

[0049] S02: Apply a 20N impact force to the memory cavity. After being impacted, the memory cavity changes from an extended state to a first compressed state. When the memory cavity is in a stable compressed state, the height of the memory cavity is 115mm, thus achieving the buffering and vibration reduction function.

[0050] S03: Controller 7 controls the infusion pump 5-1 of cooling device 5 to input cooling medium into memory cavity. The cooling medium comes into contact with buffer plate 1, which cools buffer plate 1 and changes buffer plate 1 from an elastic body to a rigid body, thus solidifying the first compressed state of memory cavity.

[0051] S04: Remove the impact force and open the valve of the water outlet pipe 5-3 to discharge the cooling medium in the memory cavity. Then close the valve and control the response device to excite the buffer plate 1 again, so that it is heated and softened to fully extend. The buffer plate 1 changes from a rigid body to an elastic body. Control the recovery device 6 to control the air pump 6-1 to extract the gas in the memory cavity, so that the memory cavity and the outside are generated by the air pressure difference. Under the action of the air pressure difference, the memory cavity changes from the extended state to the initial compressed state.

[0052] S05: Control the infusion pump 5-1 of the cooling device 5 to input the cooling medium into the memory cavity. The cooling medium comes into contact with the buffer plate 1, causing the buffer plate 1 to change from an elastic body to a rigid body, thus solidifying the initial compression state of the memory cavity. Open the valve of the outlet pipe 5-3 to discharge the cooling medium in the memory cavity, and then close the valve to complete the recovery of the buffer and vibration reduction system.

[0053] Repeating steps S01 to S05 allows for the reuse of the damping and shock absorption system, as well as its rapid release and recovery.

[0054] Example 3:

[0055] In this embodiment, the initial state of the memory cavity is the initial compressed state, with a height of 85mm. The thickness of the buffer sheet 1 is set to 2mm. The base 3 is a composite material with a length of 150mm, a width of 25mm, and a thickness of 4mm. The thickness of the top cover 2 is 8mm. The elastic film is made of TPU film with a thickness of 0.5mm. By changing the output current and voltage of the flexible heating layer 8, the softness and deformation of the buffer sheet 1 will vary within the same time period, thereby achieving different vibration reduction effects. Other basic values ​​remain unchanged. The controller 7 controls the operation of each device to realize the local deformation process of the memory cavity, such as... Figure 4 As shown, the specific steps are as follows:

[0056] S01: The controller 7 inputs a command to control the response device to excite the buffer sheet 1 to deform due to heat. In this embodiment, the top and bottom flexible heating layers 8 are simultaneously supplied with a current of 0.8A and a voltage of 20V, while the two middle flexible heating layers 8 are supplied with a current of 3A and a voltage of 38V. The energizing time is 20s for each layer. The flexible heating layer 8 attached to the outside of the buffer sheet 1 generates heat through the thermal resistance effect and conducts it to the buffer sheet 1. The top and bottom buffer sheets 1 have the same degree of softness and deformation, and the two middle buffer sheets 1 have the same degree of softness and deformation. The buffer sheet 1, which deforms due to heat, changes from a rigid body to an elastic body. When its shape is fully extended, the height of the memory cavity becomes 170mm, completing the release of the buffer and vibration damping system.

[0057] S02: Apply a 20N impact force to the memory cavity. After being impacted, the memory cavity changes from an extended state to a first compressed state. When the memory cavity is in a stable compressed state, the height of the memory cavity is 103mm, thus achieving the buffering and vibration reduction function.

[0058] S03: The controller 7 controls the infusion pump 5-1 of the cooling device 5 to input the cooling medium into the memory cavity. The cooling medium comes into contact with the buffer plate 1, which cools the buffer plate 1. After cooling, the buffer plate 1 changes from an elastic body to a rigid body, thus solidifying the first compressed state of the memory cavity.

[0059] S04: Remove the impact force and open the valve of the water outlet pipe 5-3 to discharge the cooling medium in the memory cavity. Then close the valve and control the response device to excite the buffer plate 1 again, so that it is heated and softened to fully extend. The buffer plate 1 changes from a rigid body to an elastic body. Control the recovery device 6 to control the air pump 6-1 to extract the gas in the memory cavity, so that the memory cavity and the outside are generated by the air pressure difference. Under the action of the air pressure difference, the memory cavity changes from the extended state to the initial compressed state.

[0060] S05: Control the infusion pump 5-1 of the cooling device 5 to input the cooling medium into the memory cavity. The cooling medium comes into contact with the buffer plate 1, causing the buffer plate 1 to cool down. After cooling, the buffer plate 1 changes from an elastic body to a rigid body, solidifying the initial compression state of the memory cavity. Open the valve of the water outlet pipe 5-3 to discharge the cooling medium in the memory cavity, and then close the valve to complete the recovery of the buffer and vibration reduction system.

[0061] Repeating steps S01 to S05 allows for the reuse of the damping and shock absorption system, as well as its rapid release and recovery.

[0062] Example 4:

[0063] Based on Embodiment 3, this embodiment changes the current, voltage, and energizing time of each flexible heating layer 8, so that each flexible heating layer 8 heats its corresponding buffer sheet 1 to different temperatures, causing the temperature of each buffer sheet 1 to change in a gradient along the compression direction of the buffer sheet 1. This gradient can be either increasing or decreasing. Ultimately, the temperature gradient changes the amount of deformation of the buffer sheet 1. For example, the controller 7 controls the input current parameters of the flexible electrothermal layer 8 attached to the surface of each buffer sheet 1, so that the temperature of the first buffer sheet 1 is x℃, the temperature of the second buffer sheet 1 is 1.1x℃, the temperature of the third buffer sheet 1 is 1.2x℃, and the temperature of the fourth buffer sheet 1 is 1.3x℃, or the temperature of the first buffer sheet 1 is 1.3x℃, the temperature of the second buffer sheet 1 is 1.2x℃, the temperature of the third buffer sheet 1 is 1.1x℃, and the temperature of the fourth buffer sheet 1 is x℃, where 1.3x℃ will not damage the buffer sheet 1; the remaining steps are the same as in Embodiment 3, which can also realize the reuse of the buffer vibration reduction system, and at the same time realize the rapid release and recycling of the buffer vibration reduction system.

[0064] It should be understood that although this specification is described according to various embodiments, not every embodiment contains only one independent technical solution. This way of describing the specification is only for clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

[0065] The detailed descriptions listed above are merely specific illustrations of feasible embodiments of the present invention, and are not intended to limit the scope of protection of the present invention. All equivalent embodiments or modifications made without departing from the spirit of the present invention should be included within the scope of protection of the present invention.

Claims

1. A spacecraft damping and vibration reduction system based on shape memory effect, characterized in that, It includes a shape memory device, a response device, a cooling device (5), a recycling device (6), and a controller (7); The shape memory device includes several buffer sheets (1) that can deform in one direction. The buffer sheets (1) are symmetrically distributed on both sides of the memory cavity. The buffer sheets (1) are connected in a sawtooth shape, and adjacent buffer sheets (1) are connected by light-curing adhesive. The response device is an electrical response device used to excite the buffer sheet (1) to cause the buffer sheet (1) to deform; the electrical response device includes a flexible electrothermal layer (8) attached to the surface of the buffer sheet (1), and the temperature gradient of each flexible electrothermal layer (8) is controlled by the controller (7) so that the deformation of the buffer sheet (1) increases or decreases along the deformation direction. The cooling device (5) is used to input cooling medium into the memory cavity to solidify the buffer sheet (1); The recovery device (6) is used to extract the gas in the memory cavity, so that the memory cavity can be restored to its initial state under the action of the pressure difference with the outside air. The controller (7) is used to control the operation of the response device, the cooling device (5) and the recycling device (6); the controller (7) controls each layer of the flexible electrothermal layer (8) so that the deformation of each layer of buffer sheet (1) is the same or different.

2. The spacecraft buffer and vibration reduction system based on shape memory effect according to claim 1, characterized in that, The cooling device (5) includes an infusion pump (5-1); the infusion pump (5-1) is connected to the memory cavity and is used to input the cooling medium into the memory cavity.

3. The spacecraft buffer and vibration reduction system based on shape memory effect according to claim 1, characterized in that, It is also provided with a recycling device (6), which includes an air pump (6-1); the air pump (6-1) is connected to the memory cavity and is used to extract the gas in the memory cavity.

4. A vibration reduction method for a spacecraft buffer vibration reduction system based on shape memory effect according to any one of claims 1-3, characterized in that, Includes the following steps: The memory cavity is initially compressed. The controller (7) controls the response device to provide excitation to the buffer sheet (1) in the initial compressed state, so that the buffer sheet (1) is heated and deformed, and the memory cavity has buffering capacity. An impact force is applied to the memory cavity, and the memory cavity is compressed to form a first compressed state. The controller (7) controls the cooling device (5) to cool the buffer sheet (1) and solidify the first compressed state. The impact force is removed, the cooling medium in the memory cavity is discharged, the controller (7) controls the response device to provide excitation to the buffer plate (1) in the first compression state, the controller (7) controls the recovery device (6) to make the memory cavity return to the initial compression state; the controller (7) controls the cooling device (5) to cool the buffer plate (1) and solidify the initial compression state.

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