Cutting apparatus and method of manufacturing cut products

Abstract

The cutting apparatus has a worktable, a cutting mechanism, a holding mechanism, and a water separation and discharge mechanism. The worktable or the holding mechanism is connected to a dry vacuum pump through a suction path. The water separation and discharge mechanism is located on the suction path and discharges water through a water discharge path. The water separation and discharge mechanism includes a first tank, a second tank, and a valve mechanism. The first tank includes a partition that separates an area where a connection port to the vacuum pump is located and an area where a connection port to the worktable or the holding mechanism is located. In the first tank, a gap is formed above the partition. The valve mechanism changes a first state in which water flowing from the first tank into the second tank is stored in the second tank and a second state in which water is stored in the first tank and water stored in the second tank is discharged.

Description

Technical Field

[0001] This invention relates to a cutting device and a method for manufacturing a cut-up product. Background Technology

[0002] Japanese Patent Application Publication No. 2019-202353 (Patent Document 1) discloses a cutting apparatus for cutting a workpiece. This cutting apparatus includes an adsorption unit that attracts and holds the workpiece. The adsorption unit has a chuck table, and the workpiece is attracted and held by the chuck table. A suction pump is connected to the adsorption unit. In this cutting apparatus, a water-sealed vacuum pump is used as the suction pump, which does not decrease the suction force even when attracting water (see Patent Document 1).

[0003] Patent documents

[0004] Patent Document 1: Japanese Patent Application Publication No. 2019-202353

[0005] When a water-sealed vacuum pump is used to adsorb and cut an object (e.g., a substrate), fresh water is continuously supplied to the vacuum pump to suppress the temperature rise of the sealing water. That is, if a water-sealed vacuum pump is used, a large amount of water is consumed. To solve this problem, a dry vacuum pump is considered instead of a water-sealed vacuum pump. In this case, for example, in the process of spraying water onto the object to be cut, it is necessary to prevent water from seeping into the vacuum pump. Furthermore, continuous adsorption of the object to be cut is required. However, Patent Document 1 does not disclose a means to solve this problem. Summary of the Invention

[0006] The present invention was made to solve this problem, and its purpose is to: in the cutting device and the method for manufacturing the cut-off item using a dry vacuum pump, to suppress water from entering the vacuum pump while maintaining the adsorption of the object to be cut.

[0007] A cutting device according to one aspect of the present invention includes a worktable, a cutting mechanism, a holding mechanism, and a water separation and discharge mechanism. The worktable holds the object to be cut by adsorbing it. The cutting mechanism cuts the object on the worktable into a single piece. The holding mechanism holds the single-piece object by adsorbing it. The worktable or holding mechanism is connected to a dry vacuum pump via a suction path. The water separation and discharge mechanism is located on the suction path and discharges water via a drainage path. The water separation and discharge mechanism includes a first tank and a second tank. The second tank is located downstream of the first tank in the drainage path. The first tank includes a partition separating the area where the connection port to the vacuum pump is located from the area where the connection port to the worktable or holding mechanism is located. A gap is formed above the partition in the first tank. The water separation and discharge mechanism also includes a valve mechanism. The valve mechanism changes a first state where water flowing from the first tank into the second tank is stored in the second tank, and a second state where water is stored in the first tank and the water stored in the second tank is discharged.

[0008] The above-described cutting apparatus is used in a method for manufacturing a cut article according to another aspect of the present invention. This method includes the step of cutting the object to be cut onto a worktable by a cutting mechanism to create a single piece.

[0009] Invention Effects

[0010] According to the present invention, in the method for manufacturing a cutting device and a cutting article using a dry vacuum pump, it is possible to suppress water immersion into the vacuum pump while maintaining the adsorption of the object to be cut. Attached Figure Description

[0011] Figure 1 It is a schematic top view of the cutting device.

[0012] Figure 2 This is a schematic diagram illustrating the first water separation and discharge mechanism in the first state.

[0013] Figure 3 This is a schematic diagram illustrating the first water separation and discharge mechanism in the second state.

[0014] Figure 4 It is a schematic diagram showing the plan of the first storage tank.

[0015] Figure 5 It is a schematic representation Figure 4 A diagram of the VV cross-section.

[0016] Figure 6 It is a schematic representation Figure 4 A diagram of section VI-VI.

[0017] Figure 7 It is a diagram that schematically represents the hardware structure of a computer.

[0018] Figure 8 This is a flowchart illustrating an example of the drainage process in the first water separation and discharge mechanism.

[0019] Figure 9 This is a flowchart illustrating an example of the drainage process in the second water separation and discharge mechanism.

[0020] Figure 10 This is a flowchart illustrating an example of the operation of the first water separation and discharge mechanism when drainage is inadequate.

[0021] Figure 11 This is a diagram schematically illustrating other examples of the first water separation and discharge mechanism in the first state.

[0022] Figure 12 This is a diagram schematically illustrating another example of the first water separation and discharge mechanism in the second state. Detailed Implementation

[0023] Hereinafter, an embodiment of one aspect of the present invention (hereinafter also referred to as "this embodiment") will be described in detail using the accompanying drawings. Furthermore, the same or equivalent parts in the drawings will be labeled with the same symbols, and their descriptions will not be repeated. Additionally, for ease of understanding, objects in the drawings will be appropriately omitted or exaggerated for schematic depiction.

[0024] [1. Structure]

[0025] <1-1. Overall Structure of the Cutting Device>

[0026] Figure 1 This is a schematic top view of the cutting device 1 according to this embodiment. The cutting device 1 is configured to monolithize the object to be cut (in this embodiment, a packaging substrate) into multiple cut pieces (electronic components (packaging components) in the case of the packaging substrate). In the packaging substrate, a substrate or lead frame on which a semiconductor chip is mounted is sealed with resin.

[0027] As an example of an object to be cut, a substrate can be cited, including substrates that are not sealed with resin (including wafers) and substrates that are sealed with resin (package substrates). Examples of package substrates include BGA (Ball Grid Array) package substrates, LGA (Land Grid Array) package substrates, CSP (Chip Size Package) package substrates, LED (Light Emitting Diode) package substrates, and QFN (Quad Flat No-leaded) package substrates.

[0028] In this example, a packaging substrate P1 is used as the object to be cut, and the cutting device 1 monolithizes the packaging substrate P1 into multiple electronic components S1 (not shown). Hereinafter, the surface of the packaging substrate P1 that is sealed with resin is called the molding surface, and the surface opposite to the molding surface is called the ball / lead surface. In addition, when the object to be cut is a substrate that is not sealed with resin, the ball / lead surface in this embodiment corresponds to the surface facing upwards during cutting (the cutting surface), and the molding surface in this embodiment corresponds to the surface opposite to the cutting surface.

[0029] like Figure 1 As shown, the cutting device 1 includes a cutting module A1 and an inspection / storage module B1 as its constituent elements. The cutting module A1 is configured to manufacture multiple electronic components S1 (cut items) by cutting the packaging substrate P1. The inspection / storage module B1 is configured to inspect each of the manufactured electronic components S1 and then store the electronic components S1 in a tray. In the cutting device 1, each constituent element is detachable and replaceable relative to the other constituent elements.

[0030] The cutting module A1 mainly includes a substrate supply unit 3, a positioning unit 4, a cutting worktable 5, a spindle unit 6, and a conveying unit 7. In addition, the cutting module A1 includes a second water separation and discharge mechanism 42, a third water separation and discharge mechanism 43, a part of a first water separation and discharge mechanism 41, vacuum pumps D2 and D3, and a part of vacuum pump D1.

[0031] The substrate supply unit 3 supplies the packaging substrates P1 one by one to the positioning unit 4 by ejecting the packaging substrates P1 one by one from the cassette M1 that contains a plurality of packaging substrates P1. At this time, the packaging substrates P1 are configured with the ball / lead surface facing upward.

[0032] The positioning unit 4 positions the packaging substrate P1, which is pushed out from the substrate supply unit 3, on the track unit 4a. Afterward, the positioning unit 4 transports the positioned packaging substrate P1 to the cutting table 5.

[0033] The cutting stage 5 holds the packaged substrate P to be cut. In this example, a cutting device 1 with a dual-cutting stage structure having two cutting stages 5 is shown. Vacuum pump D2 is connected to one cutting stage 5 via suction path VR2, and vacuum pump D3 is connected to the other cutting stage 5 via suction path VR3. Both vacuum pumps D2 and D3 are dry vacuum pumps. Each cutting stage 5 adsorbs the packaged substrate P1 by the suction of vacuum pump D2 or vacuum pump D3. A second water separation and discharge mechanism 42 is provided in suction path VR2, and a third water separation and discharge mechanism 43 is provided in suction path VR3. The second water separation and discharge mechanism 42 and the third water separation and discharge mechanism 43 will be described in detail below.

[0034] Each cutting worktable 5 includes a holding member 5a, a rotating mechanism 5b, and a moving mechanism 5c. The holding member 5a holds the packaging substrate P1 by adsorbing it from below and feeding it from the positioning part 4. The rotating mechanism 5b enables the holding member 5a to rotate about the θ1 direction shown in the figure. The moving mechanism 5c enables the holding member 5a to move along the Y-axis shown in the figure.

[0035] The spindle section 6 cuts the package substrate P1 to monolithize the package substrate P1 into multiple electronic components S1. In this example, a cutting device 1 with a dual-spindle structure having two spindle sections 6 is shown. The spindle sections 6 are movable along the X-axis and Z-axis shown in the figure. Alternatively, the cutting device 1 can also be a single-spindle structure having one spindle section 6.

[0036] The spindle portion 6 includes a blade 6a and a rotating shaft 6c. The blade 6a, through high-speed rotation, cuts the packaging substrate P1, monolithically dividing the packaging substrate P1 into multiple electronic components S1. The blade 6a is mounted on the rotating shaft 6c in a state where it is held by a first flange and a second flange (not shown). The first flange and the second flange are fixed to the rotating shaft 6c by fastening components (not shown), such as nuts. The first flange is also referred to as the inner flange, and the second flange is also referred to as the outer flange.

[0037] The spindle section 6 is equipped with nozzles for cutting water, cooling water, and cleaning water (none shown). The cutting water nozzles spray cutting water onto the high-speed rotating cutting tool 6a. The cooling water nozzles spray cooling water. The cleaning water nozzles spray cleaning water to remove chips and other debris.

[0038] Refer again Figure 1 When the packaged substrate P1 is placed on the cutting stage 5, the cutting stage 5 holds the packaged substrate P1 in place. Then, the packaged substrate P1 is photographed by a first position confirmation camera 5d to confirm its position. The confirmation performed using the first position confirmation camera 5d is also called alignment. For example, the position of a mark set on the packaged substrate P1 is confirmed during the confirmation performed using the first position confirmation camera 5d. This mark, for example, indicates the cutting position of the packaged substrate P1.

[0039] Next, the cutting stage 5 moves along the Y-axis of the mandrel portion 6 as shown in the figure. After the cutting stage 5 moves below the mandrel portion 6, the package substrate P1 is cut by moving the cutting stage 5 and the mandrel portion 6 relative to each other. In this case, since the ball / lead surface of the package substrate P1 faces upward, the ball / lead surface becomes the cutting surface. Then, the package substrate P1 is photographed by the second position confirmation camera 6b as needed to confirm the position of the package substrate P1, etc. In the confirmation performed using the second position confirmation camera 6b, for example, the cutting position and cutting width of the package substrate P1 are confirmed.

[0040] After the packaging substrate P1 is cut, the cutting stage 5 moves away from the mandrel 6 along the Y-axis in the figure, while holding multiple monolithized electronic components S1. During this movement, the upper surface (ball / lead surface) of the electronic components S1 is cleaned and dried by the first cleaner 5e. Cleaning water is used for cleaning the electronic components S1.

[0041] The conveying unit 7 adsorbs the electronic component S1 held on the cutting table 5 from above. A vacuum pump D1 is connected to the conveying unit 7 via a suction path VR1. The vacuum pump D1 is a dry vacuum pump. The conveying unit 7 adsorbs the electronic component S1 by the suction of the vacuum pump D1. A first water separation and discharge mechanism 41 is provided in the suction path VR1. The first water separation and discharge mechanism 41 will be described in detail later. The conveying unit 7 adsorbs the electronic component S1 and conveys it to the inspection table 11 of the inspection / storage module B1. During this conveying process, the lower surface (molded surface) of the electronic component S1 is cleaned and dried using a second cleaner 7a. The conveying unit 7, with the electronic component S1 adsorbed, descends in the Z-axis direction in the figure, and the electronic component S1 is cleaned and dried while it is close to the second cleaner 7a. When the cleaning and drying of the electronic component S1 is finished, the conveying unit 7, with the electronic component S1 adsorbed, rises in the Z-axis direction in the figure. Additionally, cleaning water is used in the cleaning of the electronic component S1.

[0042] The inspection / collection module B1 mainly includes an inspection workbench 11, a first optical inspection camera 12, a second optical inspection camera 13, a placement unit 14, and an extraction unit 15. Alternatively, the first optical inspection camera 12 may also be installed in the cutting module A1. Furthermore, the inspection / collection module B1 includes a portion of a first water separation and discharge mechanism 41 and a portion of a vacuum pump D1. The first water separation and discharge mechanism 41 and the vacuum pump D1 exist across both the cutting module A1 and the inspection / collection module B1.

[0043] The inspection stage 11 holds the electronic component S1 for optical inspection. The inspection stage 11 is movable along the X-axis shown in the figure. Furthermore, the inspection stage 11 can be tilted up and down. The inspection stage 11 is equipped with a holding member that holds the electronic component S1 by adsorbing it. A vacuum pump D1 is connected to the inspection stage 11 via a suction path VR1. The inspection stage 11 uses the suction of the vacuum pump D1 to adsorb the electronic component S1 onto the holding member.

[0044] The first optical inspection camera 12 and the second optical inspection camera 13 photograph both sides (ball / pin side and molded side) of the electronic component S1. Various inspections of the electronic component S1 are performed based on the image data generated by the first optical inspection camera 12 and the second optical inspection camera 13. The first optical inspection camera 12 and the second optical inspection camera 13 are respectively positioned near the inspection worktable 11 to photograph from above.

[0045] The first optical inspection camera 12 captures the molded surface of the electronic component S1, which is conveyed from the transport unit 7 to the inspection table 11. Then, the transport unit 7 places the electronic component S1 onto the holding member of the inspection table 11. After the holding member holds the electronic component S1, the inspection table 11 flips up and down. After the inspection table 11 moves above the second optical inspection camera 13, the second optical inspection camera 13 captures the ball / pin surface of the electronic component S1.

[0046] The inspected electronic component S1 is placed in the placement unit 14. A vacuum pump D1 is connected to the placement unit 14 via a suction path VR1. The placement unit 14 uses the suction of the vacuum pump D1 to attract the inspected electronic component S1. The placement unit 14 is movable along the Y-axis shown in the figure. The inspection worktable 11 places the inspected electronic component S1 in the placement unit 14.

[0047] The extraction unit 15 transfers the electronic components S1 disposed in the placement unit 14 to the tray. The electronic components S1 are classified as "good" or "defective" based on the inspection results using the first optical inspection camera 12 and the second optical inspection camera 13. Based on the classification results, the extraction unit 15 transfers each electronic component S1 to either a good product tray 15a or a defective product tray 15b. That is, good products are stored in the good product tray 15a, and defective products are stored in the defective product tray 15b. Each good product tray 15a and defective product tray 15b is replaced with a new tray when it is full of electronic components S1.

[0048] The cutting device 1 also includes a computer 50, a monitor 20, and a sound output unit 25. The monitor 20 is configured to display images. The monitor 20 is, for example, a display device such as a liquid crystal monitor or an organic EL (Electro Luminescence) monitor. The sound output unit 25 is configured to output sound. The sound output unit 25 is, for example, a sound output device such as a speaker, a buzzer, or a bell.

[0049] The computer 50 controls, for example, the various parts of the cutting module A1 and the inspection / storage module B1. The computer 50 controls, for example, the board supply unit 3, the positioning unit 4, the cutting worktable 5, the spindle unit 6, the conveying unit 7, the inspection worktable 11, the first optical inspection camera 12, the second optical inspection camera 13, the placement unit 14, the extraction unit 15, the first water separation and discharge mechanism 41, the second water separation and discharge mechanism 42, the third water separation and discharge mechanism 43, vacuum pumps D1, D2, and D3, a monitor 20, and a sound output unit 25.

[0050] <1-2. Structure of each water separation and discharge mechanism>

[0051] As described above, each cutting worktable 5 is connected to a vacuum pump D2 or a vacuum pump D3, and the conveying unit 7, the inspection worktable 11, and the placement unit 14 are each connected to a vacuum pump D1. Each cutting worktable 5 is exposed to, for example, cutting water, cooling water, and cleaning water sprayed when cutting the packaged substrate P1, as well as cleaning water used when cleaning the electronic component S1 using the first cleaner 5e. Through the suction of vacuum pumps D2 and D3, these waters are drawn into suction paths VR2 and VR3, respectively. Additionally, the conveying unit 7 is exposed to, for example, the cleaning water used when cleaning the electronic component S1 using the second cleaner 7a. Through the suction of vacuum pump D1, this water is drawn into suction path VR1, for example.

[0052] Assuming that vacuum pumps D1, D2, and D3 are all water-sealed vacuum pumps, there will be no problem even if water is immersed in each vacuum pump. However, when using water-sealed vacuum pumps, in order to suppress the temperature rise of the sealing water, it is necessary to continuously supply fresh water into the vacuum pumps. That is, if water-sealed vacuum pumps are used, a large amount of water is consumed. To solve this problem, in the shut-off device 1 of this embodiment, vacuum pumps D1, D2, and D3 are all dry vacuum pumps.

[0053] To prevent water from entering the dry vacuum pumps D1, D2, and D3 respectively, a first water separation and discharge mechanism 41, a second water separation and discharge mechanism 42, and a third water separation and discharge mechanism 43 are respectively installed on the suction paths VR1, VR2, and VR3. Each of these mechanisms is configured to separate water entering the suction path and discharge the separated water to the outside of the cut-off device 1 through a drainage path. By draining water through these mechanisms, water can be prevented from entering the vacuum pumps D1, D2, and D3 respectively.

[0054] As described above, the first water separation and discharge mechanism 41 is located on the suction path VR1 between each of the conveying units 7, the inspection workbench 11, and the configuration unit 14 and the vacuum pump D1. The second water separation and discharge mechanism 42 is located on the suction path VR2 between a cutting workbench 5 and the vacuum pump D2. The third water separation and discharge mechanism 43 is located on the suction path VR3 between another cutting workbench 5 and the vacuum pump D3. The locations of the first water separation and discharge mechanism 41, the second water separation and discharge mechanism 42, and the third water separation and discharge mechanism 43 are different from each other, but they have substantially the same structure. The first water separation and discharge mechanism 41, the second water separation and discharge mechanism 42, and the third water separation and discharge mechanism 43 can be changed between a first state and a second state, respectively. The first state and the second state will be described later. Hereinafter, the first water separation and discharge mechanism 41 will be described representatively.

[0055] Figure 2 This is a schematic diagram showing the first water separation and discharge mechanism 41 in the first state. Figure 3 This is a schematic diagram illustrating the first water separation and discharge mechanism 41 in the second state. (See diagram for example.) Figure 2 and Figure 3 As shown, the first water separation and discharge mechanism 41 includes a first storage tank 410, a second storage tank 420, a liquid level sensor 430, and valves V1, V2, and V3.

[0056] The first storage tank 410 is located on the suction path VR1. The first storage tank 410 is connected via piping to the upstream conveying unit 7, inspection workbench 11, and placement unit 14 in the suction path VR1. The first storage tank 410 is configured to store water flowing in through the suction path VR1. Additionally, the first storage tank 410 is connected via piping to the downstream vacuum pump D1 in the suction path VR1. Furthermore, the first storage tank 410 is connected via piping to the downstream second storage tank 420 in the drainage path DR1. The first storage tank 410 is configured to discharge the stored water to the second storage tank 420.

[0057] A liquid level sensor 430 is installed in the first tank 410. The liquid level sensor 430 is configured to detect the height of the liquid level (water level) in the first tank 410. Various known sensors, such as water level gauges, can be used as the liquid level sensor 430.

[0058] Figure 4 It is a schematic diagram showing the plan of the first storage tank 410. Figure 5 It is a schematic representation Figure 4 A diagram of the VV cross-section. Figure 6 It is a schematic representation Figure 4 A diagram of the VI-VI section. (See diagram.) Figure 4 , Figure 5 and Figure 6As shown, the first storage tank 410 includes a first storage tank body 411, connection ports 412, 413, 414 and a partition 415.

[0059] The first tank body 411 is, for example, made of metal and has a cylindrical shape. A connection port 412 extends through the top of the first tank body 411. Pipes connected to the connection port 412 are respectively connected to the conveying unit 7, the inspection workbench 11, and the placement unit 14. These pipes form part of the suction path VR1. Furthermore, the connection port 412 does not necessarily have to be located on the top of the first tank body 411; for example, it can be located on the side of the first tank body 411. Additionally, in each of the second water separation discharge mechanisms 42 and the third water separation discharge mechanism 43, the pipes connected to the cutting workbench 5 are connected to the connection port 412.

[0060] Connection port 413 extends through the side of the first storage tank body 411. Connection port 413 is connected to a pipe connected to vacuum pump D1. This pipe forms part of the suction path VR1. Furthermore, connection port 413 does not necessarily have to be located on the side of the first storage tank body 411; for example, it can also be located on the top of the first storage tank body 411. Additionally, in the second water separation and discharge mechanism 42 and the third water separation and discharge mechanism 43, the pipes connected to vacuum pump D2 and vacuum pump D3, respectively, are connected to connection port 413.

[0061] Connection port 414 extends through the bottom surface of the first storage tank body 411. A pipe connected to the second storage tank 420 is connected to connection port 414. This pipe forms part of the drainage path DR1. The first storage tank 410 drains water to the second storage tank 420 through connection port 414.

[0062] The partition 415 is, for example, made of metal and has a rectangular shape. Viewed from above, the partition 415 stands at the center of the first tank body 411, extending upwards from the bottom surface of the first tank body 411. The partition 415 is joined to the inner side surface and inner bottom surface of the first tank body 411 via multiple welded portions W1. The partition 415 separates the area containing the connection port 413 from the area containing the connection port 412 within the first tank 410. That is, the connection port 413 is located in one area separated by the partition 415, and the connection port 412 is located in another area separated by the partition 415. Furthermore, since a gap is formed between two adjacent welded portions W1, water that seeps into the connection port 412 and falls downwards is stored in the two areas separated by the partition 415.

[0063] In the first storage tank 410, a gap is formed above the partition 415. In this example, the length of the gap is X1. By forming a gap above the partition 415, the path of the airflow generated by the suction of the vacuum pump D1 is ensured. Furthermore, the lower end of the connection port 412 is located lower than the upper end of the partition 415. In this example, the lower end of the connection port 412 (or the upper part of the front end of the connection port 412 when the connection port 412 is provided on the side) is located at a position that is X2 lengths lower than the upper end of the partition 415. Therefore, water that has entered through the connection port 412 is less likely to be drawn in by the connection port 413.

[0064] Refer again Figure 2 and Figure 3 The second storage tank 420 is located downstream of the first storage tank 410 in the drainage path DR1. The second storage tank 420 is located in the height direction (Z-axis direction)... Figure 1 The second tank 420 is positioned lower than the first tank 410. Therefore, water flowing into the suction path VR1 flows from the first tank 410 into the second tank 420 by gravity. The second tank 420 is configured to store the water flowing into the first tank 410.

[0065] In the drainage path DR1, a valve V1 is provided between the first storage tank 410 and the second storage tank 420. The valve V1 can be opened and closed. When the valve V1 is in the open state, water stored in the first storage tank 410 flows into the second storage tank 420. When the valve V1 is in the closed state, water is stored in the first storage tank 410, and the flow of water from the first storage tank 410 to the second storage tank 420 stops.

[0066] Between valve V1 and the second storage tank 420, the drainage path DR1 branches. The branch destination is connected to the atmosphere via valve V2. Valve V2 can be opened and closed. When valve V2 is open, the pressure in the drainage path DR1 becomes atmospheric pressure. In the drainage path DR1, downstream of the second storage tank 420, valve V3 is provided. Valve V3 is a drainage valve and is composed of a check valve.

[0067] For example, when valve V1 is open and valve V2 is closed, valve V3 automatically closes because the area Z1 containing the drainage path DR1, the second storage tank 420, and valve V3 becomes a vacuum. In this case, water flowing into the suction path VR1 is stored in the second storage tank 420 through the first storage tank 410. The first state mentioned above refers to the state where valve V1 is open and valves V2 and V3 are closed (see reference). Figure 2 ).

[0068] On the other hand, when valve V1 is closed and valve V2 is open, valve V3 automatically becomes open because the area Z2, which does not include the drainage path DR1, the second storage tank 420, and valve V3, becomes a vacuum. In this case, the water flowing into the suction path VR1 is stored in the first storage tank 410, and the water stored in the second storage tank 420 is discharged to the outside of the shut-off device 1 through the water outlet. The second state mentioned above refers to the state where valve V1 is closed and valves V2 and V3 are open (see reference). Figure 3 ).

[0069] As described above, the first water separation and discharge mechanism 41 can switch between a first state and a second state. By switching between the first state and the second state at appropriate timing through the control of each valve, drainage can be properly performed while maintaining the vacuum pump D1's suction of the electronic component S1. The timing of the switch between the first state and the second state will be described later.

[0070] <1-3. Computer Hardware Structure>

[0071] Figure 7 This is a schematic diagram representing the hardware structure of computer 50. For example... Figure 7 As shown, the computer 50 includes a control unit 70, an input / output (I / F) interface 90, a receiving unit 95, and a storage unit 80, all of which are electrically connected via a bus.

[0072] The control unit 70 includes a CPU (Central Processing Unit) 72, RAM (Random Access Memory) 74, and ROM (Read Only Memory) 76, etc. The control unit 70 is configured to include the components within the response information processing and control computer 50 and the components within the cut-off device 1.

[0073] The input / output (I / F) 90 is configured to communicate with each component included in the cutting device 1 via signal lines. The I / F 90 is used to send data from the computer 50 to each component within the cutting device 1 and to receive data sent from each component within the cutting device 1 to the computer 50. The receiving unit 95 is configured to receive instructions from the user. The receiving unit 95 may consist of, for example, part or all of a touch panel, keyboard, mouse, and microphone.

[0074] The storage unit 80 is, for example, an auxiliary storage device such as a hard disk drive or a solid-state drive. The storage unit 80 is configured, for example, as a storage control program 81. The control program 81 is executed by the control unit 70, thereby implementing various operations in the disconnection device 1. When the control unit 70 executes the control program 81, the control program 81 is expanded in the RAM 74. Then, the control unit 70 controls each component by having the CPU 72 interpret and execute the control program 81 expanded in the RAM 74.

[0075] [2. Action]

[0076] <2-1. Drainage Action in the First Water Separation and Discharge Mechanism>

[0077] Figure 8 This is a flowchart illustrating an example of the drainage process in the first water separation and discharge mechanism 41. The process shown in this flowchart is in the second state of the first water separation and discharge mechanism 41. Figure 3 In the case of [the situation described in the flowchart], the control unit 70 of the computer 50 performs the operation. Furthermore, the process shown in this flowchart is performed after each package substrate P1 has been processed.

[0078] Reference Figure 8 The control unit 70 determines whether the cleaning (washing) of the ball / pin surface of the electronic component S1 adsorbed on the cutting worktable 5 by the first cleaner 5e is completed (step S100). When it is determined that the cleaning of the ball / pin surface is not completed ("No" in step S100), the control unit 70 stands by until the cleaning of the ball / pin surface is completed.

[0079] On the other hand, when it is determined that the cleaning of the ball / pin surface is complete ("Yes" in step S100), the control unit 70 controls valves V1 and V2 respectively to change the first water separation and discharge mechanism 41 from the second state to the first state (step S110). That is, the control unit 70 controls valve V1 to switch from the closed state to the open state, and controls valve V2 to switch from the open state to the closed state. As a result, valve V3 becomes closed, and before water is immersed from the delivery unit 7 into the suction path VR1 by cleaning by the second cleaner 7a, the amount of water that can be stored in the first water separation and discharge mechanism 41 can be increased while maintaining the state of suction of the electronic component S1 by the vacuum pump D1. In addition, the state switching in valve V1 and the state switching in valve V2 are performed simultaneously.

[0080] Then, the control unit 70 determines whether the cleaning performed by the second cleaner 7a on the molded surface (the surface opposite to the cut surface) of the electronic component S1 adsorbed on the conveying unit 7 is complete, and the conveying unit 7 moves along the Z-axis ( Figure 1The control unit 70 checks whether the upward movement in the direction of the second cleaner 7a is complete (step S120). When it is determined that the cleaning performed by the second cleaner 7a and the upward movement of the conveying unit 7 are not complete ("No" in step S120), the control unit 70 stands still until the cleaning performed by the second cleaner 7a and the upward movement of the conveying unit 7 are completed. The timing for the completion of the cleaning performed by the second cleaner 7a and the upward movement of the conveying unit 7 is when the second storage tank 420 in the first water separation and discharge mechanism 41 has the most water accumulated and the first storage tank 410 is difficult to accumulate water.

[0081] On the other hand, when it is determined that the cleaning performed by the second cleaner 7a and the rise of the conveying unit 7 are completed ("Yes" in step S120), the control unit 70 controls valves V1 and V2 respectively to change the first water separation and discharge mechanism 41 from the first state to the second state (step S130). That is, the control unit 70 controls valve V1 to switch from the open state to the closed state, and controls valve V2 to switch from the closed state to the open state. As a result, valve V3 becomes open, and after the final treatment with water is performed on the electronic component S1 while it is being adsorbed in the conveying unit 7, the water stored in the second storage tank 420 can be discharged to the outside of the cut-off device 1 while the electronic component S1 is being drawn in by the vacuum pump D1. In addition, the state switching in valve V1 and the state switching in valve V2 are performed simultaneously.

[0082] <2-2. Drainage Action in the Second and Third Water Separation and Discharge Mechanisms>

[0083] The drainage processes of the second water separation and discharge mechanism 42 and the third water separation and discharge mechanism 43 are essentially the same. The drainage process in the second water separation and discharge mechanism 42 will be described below as representative.

[0084] Figure 9 This is a flowchart illustrating an example of the drainage process in the second water separation and discharge mechanism 42. The process shown in this flowchart is executed by the control unit 70 of the computer 50 when the second water separation and discharge mechanism 42 is in its second state. Furthermore, the process shown in this flowchart is performed after each package substrate P1 has been processed.

[0085] Reference Figure 9 The control unit 70 determines whether the packaging substrate P1 has been placed on the cutting stage 5 (step S200). If it is determined that the packaging substrate P1 is not placed on the cutting stage 5 ("No" in step S200), the control unit 70 stands by until the packaging substrate P1 is placed on the cutting stage 5.

[0086] On the other hand, when it is determined that the packaging substrate P1 has been placed on the cutting table 5 ("Yes" in step S200), the control unit 70 controls valves V1 and V2 respectively to change the second water separation and discharge mechanism 42 from the second state to the first state (step S210). That is, the control unit 70 controls valve V1 to switch from the closed state to the open state, and controls valve V2 to switch from the open state to the closed state. As a result, valve V3 becomes closed, and before the cutting water, cooling water and cleaning water are immersed into the suction path VR2 from the cutting table 5, the amount of water that can be stored in the second water separation and discharge mechanism 42 can be increased while maintaining the state of the electronic component S1 being attracted by the vacuum pump D2. In addition, the state switching in valve V1 and the state switching in valve V2 are performed simultaneously.

[0087] Then, the control unit 70 determines whether the cleaning (washing) of the ball / pin surface of the electronic component S1 adsorbed on the cutting worktable 5 by the first cleaner 5e is complete (step S220). When it is determined that the cleaning of the ball / pin surface is not complete ("No" in step S220), the control unit 70 stands still until the cleaning of the ball / pin surface is completed. The timing for the completion of the cleaning of the ball / pin surface of the electronic component S1 by the first cleaner 5e is when the second water separation and discharge mechanism 42 has the most water accumulated in the second storage tank 420 and the first storage tank 410 is difficult to accumulate water.

[0088] On the other hand, when it is determined that the cleaning of the ball / pin surface is complete ("Yes" in step S220), the control unit 70 controls valves V1 and V2 respectively to change the second water separation and discharge mechanism 42 from the first state to the second state (step S230). That is, the control unit 70 controls valve V1 to switch from the open state to the closed state, and controls valve V2 to switch from the closed state to the open state. As a result, valve V3 becomes open, and after the final treatment using water is performed on the electronic component S1 while it is being attracted to the cutting workbench 5, the water stored in the second tank 420 can be discharged to the outside of the cutting device 1 while maintaining the state of the electronic component S1 being attracted by the vacuum pump D2. In addition, the state switching in valve V1 and the state switching in valve V2 are performed simultaneously.

[0089] <2-3. Actions when drainage is poor>

[0090] The first water separation and discharge mechanism 41, the second water separation and discharge mechanism 42, and the third water separation and discharge mechanism 43 all operate together when poor drainage occurs. The operation of the first water separation and discharge mechanism 41 when poor drainage is described below as a representative example.

[0091] Figure 10This is a flowchart illustrating an example of the operation of the first water separation and discharge mechanism 41 when drainage is inadequate. The process shown in this flowchart is executed by the control unit 70 of the computer 50 when the cutting device 1 is activated.

[0092] Reference Figure 10 The control unit 70 determines, by referring to the output of the liquid level sensor 430, whether the height of the liquid level (water level) in the first storage tank 410 is above a predetermined height (step S300). When it is determined that the liquid level in the first storage tank 410 is less than the predetermined height ("No" in step S300), the control unit 70 continues the determination in step S300.

[0093] On the other hand, when it is determined that the liquid level in the first tank 410 is above a specified height ("Yes" in step S300), the control unit 70 controls the sound output unit 25 to output a warning sound (step S310). By hearing the warning sound, the operator can recognize that poor drainage has occurred in the first water separation and discharge mechanism 41.

[0094] [3. Characteristics]

[0095] As described above, in the cutting device 1 according to this embodiment, the first water separation and discharge mechanism 41, the second water separation and discharge mechanism 42, and the third water separation and discharge mechanism 43 can each change between a first state in which water flowing from the first storage tank 410 into the second storage tank 420 is stored in the second storage tank 420, and a second state in which water is stored in the first storage tank 410 and the water stored in the second storage tank 420 is discharged to the outside of the cutting device 1. Therefore, according to this cutting device 1, by appropriately changing the state of each water separation and discharge mechanism, it is possible to maintain the adsorption of electronic components S1, etc., onto the substrate while suppressing water immersion into each vacuum pump.

[0096] Furthermore, in the first storage tank 410, the area where the connection port 413, which communicates with the vacuum pumps D1, D2, or D3, is located, and the area where the connection port 412, which communicates with the path of the adsorption electronic component S1 or the packaging substrate P1, is located, are separated by a partition 415, allowing water to be stored in both areas of the partition 415. Moreover, a gap is formed above the partition 415. According to the cutting device 1 of this embodiment, with this simple structure, water can be separated based on air intake. Furthermore, by performing drainage treatments by the first water separation and discharge mechanism 41, the second water separation and discharge mechanism 42, and the third water separation and discharge mechanism 43 each time a packaging substrate P1 is processed, the capacity of the first storage tank 410 and the second storage tank 420 can be minimized.

[0097] Furthermore, the packaging substrate P1 and electronic component S1 are examples of "cutting objects" in this invention. The cutting worktable 5 is an example of a "worktable" in this invention. The spindle part 6 is an example of a "cutting mechanism" in this invention. The conveying part 7 is an example of a "holding mechanism" in this invention. The suction paths VR1, VR2, and VR3 are examples of "suction paths" in this invention. The vacuum pumps D1, D2, and D3 are examples of "vacuum pumps" in this invention. The drainage path DR1 is an example of a "drainage path" in this invention. The first water separation and discharge mechanism 41, the second water separation and discharge mechanism 42, and the third water separation and discharge mechanism 43 are examples of "water separation and discharge mechanisms" in this invention. The first storage tank 410 is an example of a "first storage tank" in this invention, and the second storage tank 420 is an example of a "second storage tank" in this invention. The partition 415 is an example of a "partition" in this invention. The structure including valves V1, V2, and V3 is an example of a "valve mechanism" in this invention. The control unit 70 of the computer 50 is an example of a "control unit" in this invention. Valve V3 is an example of the "drainage valve" of the present invention.

[0098] [4. Other Implementation Methods]

[0099] The ideas behind the above embodiments are not limited to those described above. Hereinafter, an example of another embodiment to which the ideas of the above embodiments can be applied will be described.

[0100] <4-1>

[0101] In the cutting-off device 1 according to the above embodiment, the first water separation and discharge mechanism 41, the second water separation and discharge mechanism 42, and the third water separation and discharge mechanism 43 each include valves V1 and V2. However, each of the first water separation and discharge mechanism 41, the second water separation and discharge mechanism 42, and the third water separation and discharge mechanism 43 may not necessarily include valves V1 and V2. Each of the first water separation and discharge mechanism 41, the second water separation and discharge mechanism 42, and the third water separation and discharge mechanism 43 may, for example, include a valve mechanism that changes the first state in which water flowing from the first storage tank 410 into the second storage tank 420 is stored in the second storage tank 420, and the second state in which water is stored in the first storage tank 410 and the water stored in the second storage tank 420 is discharged. As such a valve mechanism, a three-way valve can be cited as an example. Hereinafter, other examples of the first water separation and discharge mechanism 41 will be described.

[0102] Figure 11 This is a schematic diagram showing the first water separation and discharge mechanism 41A in the first state. Figure 12 This is a schematic diagram illustrating the first water separation and discharge mechanism 41A in the second state. (See diagram for reference.) Figure 11 and Figure 12As shown, in the first water separation and discharge mechanism 41A, a three-way valve VA is provided between the first storage tank 410 and the second storage tank 420. The three-way valve VA can change the state in which the first storage tank 410 and the second storage tank 420 are connected. Figure 11 ) and the state of the second storage tank 420 being in contact with the atmosphere ( Figure 12 That is, the three-way valve VA can change the first state of discharging water from the first storage tank 410 to the second storage tank 420 and storing water in the second storage tank 420. Figure 11 The second state involves storing water in the first tank 410 and discharging water from the second tank 420. Figure 12 In the cutting-off device 1 according to the above embodiment, a three-way valve VA may be used instead of valves V1 and V2. Furthermore, in the first state, range Z3 is a vacuum state, and in the second state, range Z4 is a vacuum state.

[0103] <4-2>

[0104] Furthermore, in the cutting device 1 according to the above embodiment, a first water separation and discharge mechanism 41, a second water separation and discharge mechanism 42, and a third water separation and discharge mechanism 43 are respectively provided on the suction paths VR1, VR2, and VR3. However, it is not necessary to provide water separation and discharge mechanisms on each suction path. For example, water-sealed vacuum pumps can be used as vacuum pumps D2 and D3, and water separation and discharge mechanisms are not provided on the suction paths VR2 and VR3. Alternatively, for example, a water-sealed vacuum pump can be used as vacuum pump D1, and water separation and discharge mechanisms may not be provided in the suction path VR1.

[0105] <4-3>

[0106] Furthermore, in the shut-off device 1 according to the above embodiment, the valves V3 included as the first water separation and discharge mechanism 41, the second water separation and discharge mechanism 42, and the third water separation and discharge mechanism 43 are check valves. However, valve V3 does not necessarily have to be a check valve. Valve V3 can also be configured as an on / off valve (a so-called shut-off valve). In this case, for example, when water is stored in the second storage tank 420, valve V3 is controlled to be in a closed state, and when water is discharged from the second storage tank 420, valve V3 is controlled to be in an open state.

[0107] <4-4>

[0108] Additionally, valve V2, which is open to the atmosphere, is positioned on the path between valve V1 and the second storage tank 420, branching the drainage path DR1. However, valve V2 only needs to be positioned in the drainage path DR1 at a point where the downstream of valve V1 (more specifically, within the second storage tank 420) reaches atmospheric pressure; it is not necessary for the drainage path DR1 to branch. For example, a piping connection could be made above the second storage tank 420, with valve V2 mounted on that piping.

[0109] <4-5>

[0110] Furthermore, in the shut-off device 1 according to the above embodiment, a warning sound is emitted when the water level in the first tank 410 is above a predetermined height. However, it is not always necessary to emit a warning sound when the water level in the first tank 410 is above the predetermined height. For example, the shut-off device 1 can be forcibly stopped when the water level in the first tank 410 is above the predetermined height. As a result, it is possible to suppress the situation where water overflows from the first tank 410.

[0111] <4-6>

[0112] Furthermore, in the above embodiments, in Figure 8 In step S100, it is determined whether the cleaning (washing) performed by the first cleaner 5e is complete. However, in Figure 8 In step S100, it can also be determined whether the drying performed by the first cleaner 5e is complete. Furthermore, if it is determined that drying is complete, the first water separation and discharge mechanism 41 can also change from the second state to the first state. Additionally, Figure 8 In step S120, it can also be determined whether the drying performed by the second cleaner 7a is complete. Furthermore, if it is determined that drying is complete, the first water separation and discharge mechanism 41 can also change from the first state to the second state. Additionally, Figure 9 In step S220, it is determined whether the cleaning (washing) of the ball / pin surface of the electronic component S1 performed by the first cleaner 5e is complete. However, in Figure 9 In step S220, it can also be determined whether the drying performed by the first cleaner 5e is complete. Furthermore, if it is determined that the drying is complete, the first water separation and discharge mechanism 41 can also change from the first state to the second state.

[0113] <4-7>

[0114] Furthermore, in the shut-off device 1 according to the above embodiment, when switching the states of valves V1 and V2 included in each water separation and discharge mechanism, the states of valves V1 and V2 are switched simultaneously. However, the states of valves V1 and V2 do not necessarily need to be switched simultaneously. For example, when switching the state of each water separation and discharge mechanism from a first state to a second state, valve V1 can be switched from the open state to the closed state, and then valve V2 can be switched from the closed state to the open state. Alternatively, for example, when switching the state of each water separation and discharge mechanism from the second state to the first state, valve V2 can be switched from the open state to the closed state, and then valve V1 can be switched from the closed state to the open state.

[0115] The embodiments of the present invention have been described above by way of example. That is, the detailed description and drawings have been disclosed for illustrative purposes. Therefore, the constituent elements described in the detailed description and drawings may include those that are not essential for solving the problem. Therefore, these non-essential constituent elements should not be assumed to be essential simply because they are described in the detailed description and drawings.

[0116] Furthermore, the above-described embodiments are merely examples of the present invention in all respects. Various modifications and alterations can be made to the above-described embodiments within the scope of the present invention. That is, when implementing the present invention, specific structures can be appropriately adopted according to the embodiments.

[0117] Explanation of reference numerals in the attached figures

[0118] 1. Cutting device; 3. Substrate supply unit; 4. Positioning unit; 4a. Track unit; 5. Cutting worktable; 5a. Holding component; 5b. Rotating mechanism; 5c. Moving mechanism; 5d. First position confirmation camera; 5e. First cleaner; 6. Spindle unit; 6a. Blade; 6b. Second position confirmation camera; 6c. Rotating shaft; 7. Conveying unit; 7a. Second cleaner; 11. Inspection worktable; 12. First optical inspection camera; 13. Second optical inspection camera; 14. Placement unit; 15. Extraction unit; 15a. Good product tray; 15b. Defective product tray; 20. Monitor; 25. Sound output unit; 41, 41A. First water separation and discharge mechanism; 42. Second water separation and discharge mechanism; 43. Third water... Separation and discharge mechanism, 50 computer, 70 control unit, 72 CPU, 74 RAM, 76 ROM, 80 storage unit, 81 control program, 90 input / output (I / F), 410 first storage tank, 411 first storage tank body, 412, 413, 414 connection port, 415 partition, 420 second storage tank, 430 liquid level sensor, A1 cut-off module, B1 inspection / storage module, D1, D2, D3 vacuum pumps, DR1 drainage path, M1 material box, P1 packaging substrate, S1 electronic components, V1, V2, V3 valves, VA three-way valve, VR1, VR2, VR3 suction path, W1 welding unit, Z1, Z2, Z3, Z4 range.

Claims

1. A cutting device, comprising: The workbench holds the object to be cut by adsorption; The cutting mechanism cuts the object to be cut into single pieces by cutting it off from the worktable; and The holding mechanism holds the cut object by adsorbing the monolithized cut object. The worktable or the holding mechanism is connected to the dry vacuum pump via a suction path. The cutting device also includes a water separation and discharge mechanism, which is located on the suction path and discharges water through the drainage path. The water separation and discharge mechanism includes: First storage tank; and The second storage tank is located further downstream than the first storage tank in the drainage path. The first storage tank includes a partition that separates the area where the connection port to the vacuum pump is located from the area where the connection port to the worktable or the holding mechanism is located. The partition is partially joined to the bottom surface of the first storage tank, but not to the top surface of the first storage tank. A gap is partially formed between the lower end of the partition and the bottom surface of the first storage tank. The connection port to the vacuum pump and the connection port to the worktable or the holding mechanism respectively penetrate through the top or side of the first storage tank. In the first storage tank, a gap is formed above the partition. The water separation and discharge mechanism further includes a valve mechanism that changes the state of water flowing from the first storage tank into the second storage tank and being stored in the second storage tank to a second state of water being stored in the first storage tank and water stored in the second storage tank being discharged.

2. The cutting device according to claim 1, wherein, The cutting device further includes a control unit that controls the valve mechanism to change from the first state to the second state each time one of the objects to be cut is processed. The control unit controls the valve mechanism to change from the first state to the second state after the object to be cut has undergone final treatment with water while it is adsorbed on the workbench or the holding mechanism.

3. The cutting device according to claim 2, wherein, The suction path connects the holding mechanism and the vacuum pump. The control unit controls the valve mechanism to change from the first state to the second state after the cleaning of the side of the object to be cut with water is completed while the object to be cut is held in the holding mechanism.

4. The cutting device according to claim 2, wherein, The suction path connects the worktable and the vacuum pump. The control unit controls the valve mechanism to change from the first state to the second state after the cleaning of the cut surface of the object to be cut with water is completed while the object to be cut is held on the workbench.

5. The cutting device according to any one of claims 1 to 4, wherein, The valve mechanism includes a drainage valve located downstream of the second storage tank in the drainage path. The drainage valve is a check valve.

6. A method for manufacturing a cut article, comprising a method for manufacturing a cut article using the cutting device according to any one of claims 1 to 5, comprising: The step of manufacturing the cut product by cutting the object to be cut on the worktable by the cutting mechanism into single pieces.

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