Delivery and rinse system for high viscosity chemicals used in the manufacture of semiconductor chips

Abstract

The application discloses a delivery and flushing system for high-viscosity chemicals used for manufacturing semiconductor chips, which comprises a plurality of chemical storage tanks, the bottom of each of the plurality of chemical storage tanks is provided with a first delivery structure penetratingly fixed, and one end of the first delivery structure is provided with a same driving mechanism; a mixing tank is fixedly installed at one end of the first delivery structure, and one end of the first delivery structure on both sides extends into the inside of the mixing tank. In the application, the high-viscosity chemicals are effectively delivered and mixed, the cleaning effect on the semiconductor chips is improved, various impurities on the surface of the semiconductor chips are removed, the coating cleaning area and the flushing area are integrated and driven by the same power, the energy consumption of the whole flushing system is reduced, the coating cleaning area and the flushing area are adjusted, and the waste of chemicals and high-purity water is avoided.

Description

Technical Field

[0001] This invention relates to the field of semiconductor chip technology, and more specifically, to a delivery and rinsing system for high-viscosity chemicals used in the manufacture of semiconductor chips. Background Technology

[0002] To ensure high reliability, stability, and lifespan of semiconductor devices, improve semiconductor product yield, and prevent circuit failures caused by contaminants, semiconductors need to be cleaned. This includes cleaning semiconductor chips, WBCs, power modules, power devices, power electronics, discrete devices, BGA ball-mounting residues, chip silver paste printing residues, power LED flip chips, PoP stacked chip assembly, SIP system-in-package chips, DCB, COB, and IGBT power module semiconductor packaging. Residual materials after semiconductor packaging and soldering, including flux, solder paste, ball solder paste, solder paste residues, and metallic contaminants (particulate contamination, alkaline metals, heavy metals, etc.) and organic dirt, need to be cleaned.

[0003] In semiconductor manufacturing, cleaning is a crucial step throughout the entire wafer fabrication process. The quality of the cleaning process is key to improving yield. Wet cleaning is one of the commonly used methods, and wet chemicals (including high-viscosity chemicals) are among the most important materials used. They are applied in various manufacturing steps, such as etching, cleaning, and coating, and these chemicals have a significant impact on the chip's manufacturing quality, performance, and reliability. The wet cleaning process involves using various chemical solutions to react with impurities on the wafer surface, generating water-soluble substances. These substances are then rinsed with high-purity water, sequentially removing various impurities from the wafer surface.

[0004] Currently, there are several shortcomings in the cleaning process of semiconductor chips: (1) Due to the use of high-viscosity chemicals, the general pumping structure cannot complete the chemical delivery operation. Moreover, when delivering chemicals, multiple chemicals do not mix well before falling onto the semiconductor chip, resulting in a relatively poor cleaning effect. (2) After cleaning the semiconductor chip with chemicals, a high-purity water rinsing device needs to be added afterward to remove various impurities from the wafer surface. However, the cleaning structure and rinsing structure are set up independently and cannot be driven by the same power source, resulting in high energy consumption. Furthermore, when dealing with semiconductor chips of different sizes, the cleaning and rinsing areas are not adjustable, leading to a certain waste of chemicals and high-purity water. Therefore, there is an urgent need for a high-viscosity chemical delivery and rinsing system for manufacturing semiconductor chips to solve the above problems. Summary of the Invention

[0005] In view of the problems in the related technologies, the present invention proposes a delivery and rinsing system for high-viscosity chemicals used in the manufacture of semiconductor chips, so as to overcome the above-mentioned technical problems existing in the existing related technologies.

[0006] The technical solution of this invention is implemented as follows:

[0007] A conveying and rinsing system for high-viscosity chemicals used in the manufacture of semiconductor chips includes multiple chemical storage tanks, each of which has a first conveying structure fixed through its bottom, and one end of the first conveying structure is provided with the same driving mechanism.

[0008] A mixing tank is fixedly installed at one end of the first conveying structure, and one end of the first conveying structure located on both sides extends into the interior of the mixing tank, while one end of the first conveying structure located in the middle penetrates through the bottom of the mixing tank.

[0009] A second conveying structure, one end of which extends into the interior of the mixing tank and is fixed to one end of the first conveying structure located in the middle;

[0010] A coating assembly, which is rotatably disposed at the other end of the second conveying structure;

[0011] A rinsing assembly, wherein the rinsing assembly is fixed to one end of the coating assembly;

[0012] A width adjustment component is disposed between one end of the rinsing component and the other end of the coating component.

[0013] Furthermore, the first conveying structure includes a first conveying pipe fixedly installed between the bottom inner wall of the chemical storage tank and the bottom inner wall of the mixing tank, and a first auger is rotatably connected inside the first conveying pipe. The bottom of the first conveying pipe located inside the chemical storage tank is provided with a feed chute, and one end of the bottom of the first conveying pipe located in the middle position is provided with a filling chute.

[0014] Furthermore, one end of the first conveying pipe located in the middle position is designed to be sealed, and the second conveying structure includes a second conveying pipe fixed to one end of the first conveying pipe located in the middle position. A second auger is rotatably connected to the inner wall of the second conveying pipe. One end of the second auger is fixed to one end of the first auger. An injection pipe is fixedly connected between the top of one side of the mixing tank and the top side of the second conveying pipe.

[0015] Furthermore, the drive mechanism includes a side frame fixedly installed between the outer walls of the chemical storage tank, and a drive shaft is rotatably connected to both sides of the inner wall of the side frame. Both ends of the drive shaft are fixedly fitted with a first bevel gear that meshes with the other end of the first auger. A first rotary motor for driving the first auger to rotate is fixedly installed at the middle position of one side of the side frame.

[0016] Furthermore, the coating assembly consists of an L-shaped feeding seat, and an L-shaped feeding channel is provided inside the L-shaped feeding seat. A second sealing post is inserted into one end of the L-shaped feeding channel. A discharge narrow groove is provided at the bottom center of the L-shaped feeding channel. A bottom frame is fixedly installed at the bottom of the L-shaped feeding seat, and a coating roller is rotatably connected to the inner wall of the bottom frame. The coating roller is attached to the bottom of the discharge narrow groove.

[0017] Furthermore, the top of the L-shaped conveying seat is fixed with a feed cylinder cover that communicates with the L-shaped conveying channel, and the outer wall of the feed cylinder cover is rotatably connected to an installation sleeve through a sealed bearing. One end of the installation sleeve is fixed to one end of the second conveying pipe, and the interior of the second conveying pipe communicates with the interior of the installation sleeve. The outer wall of the feed cylinder cover is provided with guide holes that are evenly spaced and distributed in a ring, and the guide holes are located inside the installation sleeve.

[0018] Furthermore, a rotating tube is fixed to the top of the feed cylinder cover, and a large transmission wheel is fixed to the top of the outer wall of the rotating tube. A stirring shaft is rotatably connected to the middle position of the mixing tank, and a small transmission wheel is fixed to the top of the outer wall of the stirring shaft. A transmission belt drives the outer wall of the small transmission wheel and the outer wall of the large transmission wheel. A second rotary motor for driving the stirring shaft to rotate is fixedly installed on the top of the mixing tank, and equally spaced stirring blades are fixedly installed on the bottom of the outer wall of the stirring shaft. A waste discharge pipe is fixed to the bottom of the mixing tank, and a valve is fixedly installed on the waste discharge pipe.

[0019] Furthermore, the flushing assembly includes an infusion seat fixed to the outer wall of one end of the L-shaped feeding seat, and a spray channel is provided inside the infusion seat. The bottom of the spray channel is fixedly installed with nozzles that are inclined at equal intervals. A first sealing column is inserted into one end of the spray channel. A liquid guide hole is provided between one side of the L-shaped feeding channel and the outer wall of one end of the L-shaped feeding seat, and the liquid guide hole communicates with the spray channel. A liquid guide pipe is fixed to one side of the liquid guide hole, passing through the feed cylinder cover and the rotating pipe. The liquid guide pipe is fixedly connected to the feed cylinder cover. The top of the liquid guide pipe is rotatably connected to the injection pipe through a sealing bearing, and an infusion pump is fixedly installed at the bottom end of the injection pipe.

[0020] Furthermore, the width adjustment component includes a mounting frame fixedly installed on the outer wall of one side of the L-shaped feed seat, and a U-shaped plate fixedly installed on the outer wall of one side of the mounting frame. A bidirectional screw passing through the mounting frame is rotatably connected between the two ends of the U-shaped plate. A forward and reverse motor is fixedly installed on the top of the mounting frame, and a second bevel gear meshing with the output shaft of the forward and reverse motor and the outer wall of the bidirectional screw is fixedly fixed. Movable plates are screwed to both ends of the bidirectional screw. The two movable plates are fixedly connected to one end of the first sealing column and one end of the second sealing column, respectively. Guide grooves are opened at both ends of one side of the U-shaped plate, and guide blocks inserted into the guide grooves are fixed to one end of the two movable plates.

[0021] Furthermore, an inclined cleaning scraper is fixedly installed on one side of the bottom of the infusion stand, and baffles are fixed on both sides of the bottom frame near the nozzle.

[0022] The beneficial effects of this invention are:

[0023] The present invention provides a conveying and rinsing system for high-viscosity chemicals used in the manufacture of semiconductor chips. The system comprises a chemical storage tank, a drive mechanism, a first conveying structure, a mixing tank, and a second conveying structure. It employs a screw conveyor method to simultaneously convey multiple chemicals and allows for mixing within the mixing tank. This effectively performs simultaneous conveying and mixing of high-viscosity chemicals, improving the subsequent cleaning effect on the semiconductor chips, increasing the overall system efficiency, and meeting the demand for high-purity chemical conveying.

[0024] The present invention provides a conveying and rinsing system for high-viscosity chemicals used in the manufacture of semiconductor chips. The system comprises a rinsing assembly, a feed shroud, a mounting sleeve, a rotating tube, and a coating assembly. The system can rotate and coat the chemicals onto the semiconductor chip to achieve a complete coating effect. Then, the rinsing assembly sprays high-purity water onto the semiconductor chip to remove various impurities from the surface of the semiconductor chip. This allows the coating and rinsing areas to be integrated and driven by the same power source, reducing the energy consumption of the entire rinsing system.

[0025] The present invention provides a high-viscosity chemical delivery and rinsing system for manufacturing semiconductor chips. By setting a width adjustment component, a first sealing column and a second sealing column, the length of the spray channel and the L-shaped material delivery channel can be adjusted, thereby changing the width of the chemicals and high-purity water. This allows the chemicals and high-purity water to adhere effectively to semiconductor chips of different volumes, facilitating the adjustment of the coating and cleaning areas and rinsing areas, and avoiding the waste of chemicals and high-purity water. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of the overall structure of the delivery and rinsing system for high-viscosity chemicals used in the manufacture of semiconductor chips according to the present invention.

[0028] Figure 2 This is a bottom view of the delivery and rinsing system for high-viscosity chemicals used in the manufacture of semiconductor chips according to the present invention.

[0029] Figure 3 This is an overall cross-sectional view of the delivery and rinsing system for high-viscosity chemicals used in the manufacture of semiconductor chips according to the present invention.

[0030] Figure 4 This is a top cross-sectional view of the delivery and rinsing system for high-viscosity chemicals used in the manufacture of semiconductor chips according to the present invention.

[0031] Figure 5 This is a schematic diagram of the feed tank and injection tank structure of the conveying and rinsing system for high-viscosity chemicals used in the manufacture of semiconductor chips according to the present invention.

[0032] Figure 6 This is a schematic diagram of the agitator and feed hole structure of the conveying and rinsing system for high-viscosity chemicals used in the manufacture of semiconductor chips according to the present invention.

[0033] Figure 7 This is a schematic diagram of the width adjustment component of the delivery and rinsing system for high-viscosity chemicals used in the manufacture of semiconductor chips according to the present invention.

[0034] Figure 8 This is a schematic diagram of the spray channel and L-shaped material conveying channel structure of the delivery and rinsing system for high-viscosity chemicals used in the manufacture of semiconductor chips according to the present invention.

[0035] Figure 9 This is a schematic diagram of the infusion base and cleaning scraper structure of the delivery and rinsing system for high-viscosity chemicals used in the manufacture of semiconductor chips according to the present invention.

[0036] Figure 10 This is a schematic diagram of the L-shaped feed seat and baffle structure of the conveying and rinsing system for high-viscosity chemicals used in the manufacture of semiconductor chips according to the present invention.

[0037] In the picture:

[0038] 1. Chemical storage tank; 2. Drive mechanism; 201. Side frame; 202. First rotary motor; 203. Drive shaft; 204. First bevel gear; 3. First conveying structure; 302. First conveying pipe; 302. First auger; 303. Feed chute; 304. Injection chute; 4. Mixing tank; 5. Second conveying structure; 501. Second conveying pipe; 502. Second auger; 503. Injection pipe; 6. Width adjustment assembly; 601. U-shaped plate; 602. Movable plate; 603. Bidirectional screw; 604. Forward and reverse motor; 605. Mounting frame; 606. Guide groove; 7. Flushing assembly; 701. Infusion pump; 702, Injection pipe; 703, Guide pipe; 704, Infusion seat; 705, Nozzle; 706, Spray channel; 707, Guide hole; 8, Feed cylinder cover; 9, Mounting sleeve; 10, Rotary tube; 11, Coating assembly; 1101, L-shaped feed seat; 1102, Base frame; 1103, Coating roller; 1104, L-shaped feed channel; 1105, Narrow discharge chute; 12, Drive belt; 13, Second rotary motor; 14, Stirring blade; 15, Stirring shaft; 16, Large drive wheel; 17, Guide hole; 18, First sealing column; 19, Second sealing column; 20, Cleaning scraper; 21, Baffle. Detailed Implementation

[0039] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention are within the scope of protection of the present invention.

[0040] Please see Figure 1-10 A conveying and rinsing system for high-viscosity chemicals used in the manufacture of semiconductor chips includes multiple chemical storage tanks 1, with a first conveying structure 3 fixed through the bottom of each of the multiple chemical storage tanks 1, and a common driving mechanism 2 provided at one end of the first conveying structure 3.

[0041] A mixing tank 4 is fixedly installed at one end of a first conveying structure 3. One end of the first conveying structure 3 located on both sides extends into the interior of the mixing tank 4, while the other end of the first conveying structure 3 located in the middle penetrates the bottom of the mixing tank 4. The first conveying structure 3 includes a first conveying pipe 301 fixedly installed between the bottom inner wall of the chemical storage tank 1 and the bottom inner wall of the mixing tank 4. A first auger 302 is rotatably connected inside the first conveying pipe 301. Each of the first conveying pipes 301 located inside the chemical storage tank 1 has a feed chute 303 at its bottom. A filling trough 304 is provided at one bottom end of the pipe 301. The drive mechanism 2 includes a side frame 201 fixedly installed between the outer walls of the chemical storage tank 1. Both sides of the inner wall of the side frame 201 are rotatably connected to a drive shaft 203. Both ends of the drive shaft 203 are fixedly connected to the other end of the first auger 302 with a first bevel gear 204 that meshes with each other. A first rotary motor 202 for driving the first auger 302 to rotate is fixedly installed at the middle position of one side of the side frame 201. Multiple chemicals are mixed through the mixing tank 4, effectively conveying and mixing high-viscosity chemicals at the same time.

[0042] The second conveying structure 5 has one end extending into the interior of the mixing tank 4 and fixed to one end of the first conveying structure 3 located in the middle position. One end of the first conveying pipe 301 located in the middle position is designed to be sealed. The second conveying structure 5 includes a second conveying pipe 501 fixed to one end of the first conveying pipe 301 located in the middle position. A second auger 502 is rotatably connected to the inner wall of the second conveying pipe 501. One end of the second auger 502 is fixed to one end of the first auger 302. A filling pipe 503 is fixedly connected between the top side of one side of the mixing tank 4 and the top side of the second conveying pipe 501. The driving mechanism 2, the first conveying structure 3, the mixing tank 4 and the second conveying structure 5 are used to form a conveying system for high-viscosity chemicals used in the manufacture of semiconductor chips. The auger conveying method is used to achieve the effect of simultaneous conveying of multiple chemicals.

[0043] The coating assembly 11 is rotatably mounted at the other end of the second conveying structure 5. The coating assembly 11 consists of an L-shaped conveying seat 1101, with an L-shaped conveying channel 1104 inside. A second sealing post 19 is inserted into one end of the L-shaped conveying channel 1104. A discharge narrow groove 1105 is formed at the bottom center of the L-shaped conveying channel 1104. A bottom frame 1102 is fixedly mounted on the bottom of the L-shaped conveying seat 1101, and a coating roller 1103 is rotatably connected to the inner wall of the bottom frame 1102. The coating roller 1103 is fitted against the bottom of the discharge narrow groove 1105. A feed cylinder cover 8 communicating with the L-shaped conveying channel 1104 is fixedly mounted on the top of the L-shaped conveying seat 1101, and the outer wall of the feed cylinder cover 8 is connected by a sealed bearing. A mounting sleeve 9 is rotatably connected. One end of the mounting sleeve 9 is fixed to one end of the second conveying pipe 501. The interior of the second conveying pipe 501 is connected to the interior of the mounting sleeve 9. The outer wall of the feed cylinder cover 8 is provided with guide holes 17 that are evenly distributed in a ring. The guide holes 17 are located inside the mounting sleeve 9. The mixed high-viscosity chemical is introduced into the mounting sleeve 9 by the squeezing action of the second auger 502. It is then attached to the coating roller 1103 through the guide holes 17, the feed cylinder cover 8, the L-shaped conveying channel 1104 and the discharge narrow groove 1105. The chemical is then rotated and coated onto the semiconductor chip by the rotating coating roller 1103, so that the mixed high-viscosity chemical reacts chemically with various impurity particles on the surface of the semiconductor chip.

[0044] The rinsing assembly 7 is fixed to one end of the coating assembly 11. The rinsing assembly 7 includes a liquid infusion seat 704 fixed to the outer wall of one end of the L-shaped material infusion seat 1101. A spray channel 706 is formed inside the liquid infusion seat 704. An equally spaced, inclined nozzle 705 is fixedly installed at the bottom of the spray channel 706. A first sealing post 18 is inserted into one end of the spray channel 706. A guide hole 707 is formed between one side of the L-shaped material infusion channel 1104 and the outer wall of one end of the L-shaped material infusion seat 1101, and the guide hole 707 communicates with the spray channel 706. A liquid guide pipe 703 is fixed on one side of the 07, passing through the feed cylinder cover 8 and the rotating pipe 10. The liquid guide pipe 703 is fixedly connected to the feed cylinder cover 8. The top of the liquid guide pipe 703 is rotatably connected to the injection pipe 702 through a sealed bearing. The bottom end of the injection pipe 702 is fixedly installed with a delivery pump 701. High-purity water is pumped into the injection pipe 702, the liquid guide hole 707 and the spray channel 706 through the delivery pump 701. The high-purity water is sprayed onto the semiconductor chip by the spraying action of the nozzle 705 and the rotation action of the delivery seat 704, which facilitates the removal of various impurities on the surface of the semiconductor chip.

[0045] Width adjustment component 6 is disposed between one end of rinsing component 7 and the other end of coating component 11. Width adjustment component 6 includes a mounting frame 605 fixedly mounted on the outer wall of one side of L-shaped feed seat 1101, and a U-shaped plate 601 fixedly mounted on the outer wall of one side of mounting frame 605. A bidirectional screw 603 passing through mounting frame 605 is rotatably connected between the two ends of U-shaped plate 601. A forward and reverse motor 604 is fixedly mounted on the top of mounting frame 605, and a second bevel gear meshing with the output shaft of forward and reverse motor 604 and the outer wall of bidirectional screw 603 is fixedly mounted. Movable plates 602 are screwed to both ends of bidirectional screw 603. The two movable plates 602 are respectively connected to the first sealing column 18. One end of the first sealing post 18 and the second sealing post 19 are fixedly connected. Both ends of one side of the U-shaped plate 601 are provided with guide grooves 606, and one end of each of the two movable plates 602 is fixed with a guide block inserted into the guide groove 606. The second bevel gear and the bidirectional screw 603 are rotated by a forward and reverse motor 604. The distance between the two movable plates 602 is adjusted so that the first sealing post 18 and the second sealing post 19 can move in the liquid spray channel 706 and the L-shaped material conveying channel 1104, respectively. The length of the liquid spray channel 706 and the L-shaped material conveying channel 1104 is adjusted to change the discharge width of chemicals and high-purity water, which facilitates the adjustment of the coating cleaning area and the rinsing area, thereby enabling the rinsing operation of semiconductor chips of different volumes.

[0046] In this invention, a rotating tube 10 is fixed to the top of the feed cylinder shroud 8, and a large transmission wheel 16 is fixed to the top of the outer wall of the rotating tube 10. A stirring shaft 15 is rotatably connected to the middle position of the mixing tank 4, and a small transmission wheel is fixed to the top of the outer wall of the stirring shaft 15. A transmission belt 12 is drivingly connected between the outer wall of the small transmission wheel and the outer wall of the large transmission wheel 16. A second rotary motor 13 for driving the stirring shaft 15 to rotate is fixedly installed on the top of the mixing tank 4, and stirring blades 14 distributed at equal intervals are fixedly installed on the bottom of the outer wall of the stirring shaft 15. A waste discharge pipe is fixed to the bottom of the mixing tank 4, and a valve is fixedly installed on the waste discharge pipe. The rotation of the second rotary motor 13 drives the stirring shaft 15, stirring blade 14, small transmission wheel, transmission belt 12 and large transmission wheel 16 to rotate simultaneously. The stirring action of the stirring blade 14 can mix a variety of high viscosity chemicals in the mixing tank 4, and can also drive the rinsing component 7 and coating component 11 to rotate simultaneously, so that the coating cleaning area and the rinsing area are set as one unit and driven by the same power, reducing the energy consumption of the entire rinsing system.

[0047] In this invention, an inclined cleaning scraper 20 is fixedly installed on one side of the bottom of the infusion base 704, and baffles 21 are fixed on both sides of the bottom frame 1102 near the nozzle 705. The rotating cleaning scraper 20 cleans the surface of the semiconductor chip after rinsing, so that impurities can be effectively removed from the surface of the semiconductor chip. The baffles 21 block the high-purity water sprayed from the nozzle 705, preventing the high-purity water from contacting the high-viscosity chemicals at the first time, thereby affecting the rinsing effect.

[0048] In summary, with the aid of the above-mentioned technical solution of the present invention: Multiple chemical storage tanks 1 store different types of high-viscosity chemicals. When needed, the user starts the first rotary motor 202 in the drive mechanism 2, which drives the first bevel gear 204 and the transmission shaft 203 to rotate, causing the first augers 302 in the multiple first conveying structures 3 to rotate in the first conveying pipe 301. Simultaneously, the second augers 502 in the second conveying structure 5 also rotate in the second conveying pipe 501. Through the squeezing action of the first augers 302, the high-viscosity chemicals in the chemical storage tanks 1 are introduced into the mixing tank 4 through the feed chute 303 and the injection chute 304. At this time, the user starts the second rotary motor 13... The rotation of the second rotary motor 13 drives the stirring shaft 15, stirring blades 14, small transmission wheel, transmission belt 12, and large transmission wheel 16 to rotate simultaneously. This allows for the mixing of various high-viscosity chemicals within the mixing tank 4 through the agitation of the stirring blades 14, effectively performing simultaneous conveying and mixing of the high-viscosity chemicals. Then, under the extrusion action of the first auger 302, the mixed high-viscosity chemicals are introduced into the second conveying pipe 501 through the injection pipe 503. The extrusion action of the second auger 502 further guides the mixed high-viscosity chemicals into the mounting sleeve 9, where they adhere to the coating roller 1103 through the guide hole 17, feed cylinder cover 8, L-shaped conveying channel 1104, and discharge narrow groove 1105. Finally, the large transmission belt... The rotation of wheel 16 drives the rotating tube 10, feed cylinder cover 8, L-shaped feed seat 1101, infusion seat 704, and cleaning scraper 20 to rotate. The rotating coating roller 1103 applies chemicals to the semiconductor chip, causing the mixed high-viscosity chemicals to react chemically with various impurities on the semiconductor chip surface, generating water-soluble substances. Before this, the user connects the infusion pump 701 in the rinsing assembly 7 to a high-purity water storage device. The infusion pump 701 pumps high-purity water into the injection pipe 702, guide hole 707, and spray channel 706. The spraying action of the nozzle 705 and the rotation of the infusion seat 704 propel the high-purity water onto the semiconductor chip, removing impurities from its surface. This process removes impurities and implements a pre-coating cleaning followed by rinsing operation. A rotating cleaning scraper 20 cleans the surface of the rinsed semiconductor chip. When rinsing semiconductor chips of different sizes, the user uses the forward / reverse motor 604 within the width adjustment assembly 6 to rotate the second bevel gear and the bidirectional screw 603, adjusting the distance between the two movable plates 602. This allows the first sealing column 18 and the second sealing column 19 to move within the spray channel 706 and the L-shaped material conveying channel 1104, respectively. Adjusting the length of the spray channel 706 and the L-shaped material conveying channel 1104 changes the width of the chemicals and high-purity water, facilitating the adjustment of the coating cleaning area and the rinsing area, thus enabling rinsing operations on semiconductor chips of different sizes.

[0049] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A delivery and rinsing system for high-viscosity chemicals used in the manufacture of semiconductor chips, characterized in that, It includes multiple chemical storage tanks (1), and a first conveying structure (3) is fixed through the bottom of each of the multiple chemical storage tanks (1), and a same driving mechanism (2) is provided at one end of the first conveying structure (3). A mixing tank (4) is fixedly installed at one end of the first conveying structure (3), and one end of the first conveying structure (3) located on both sides extends into the interior of the mixing tank (4), and one end of the first conveying structure (3) located in the middle penetrates the bottom of the mixing tank (4). The second conveying structure (5) has one end extending into the interior of the mixing tank (4) and fixed to one end of the first conveying structure (3) located in the middle position; A coating assembly (11) is rotatably disposed at the other end of the second conveying structure (5); A rinsing assembly (7) is fixed to one end of the coating assembly (11); Width adjustment component (6), the width adjustment component (6) is disposed between one end of the rinsing component (7) and the other end of the coating component (11); The coating assembly (11) consists of an L-shaped feeding seat (1101), and an L-shaped feeding channel (1104) is provided inside the L-shaped feeding channel (1104). A second sealing post (19) is inserted into one end of the L-shaped feeding channel (1104). A discharge narrow groove (1105) is provided at the middle of the bottom of the L-shaped feeding channel (1104). A bottom frame (1102) is fixedly installed at the bottom of the L-shaped feeding seat (1101), and a coating roller (1103) is rotatably connected to the inner wall of the bottom frame (1102). The coating roller (1103) is attached to the bottom of the discharge narrow groove (1105). The rinsing assembly (7) includes components fixed to the L-shaped feeding seat (1101). 1) An infusion seat (704) is located on one end of the outer wall, and a spray channel (706) is provided inside the infusion seat (704). A nozzle (705) is fixedly installed at equal intervals and in an inclined shape at the bottom of the spray channel (706). A first sealing column (18) is inserted into one end of the spray channel (706). A guide hole (707) is provided between one side of the L-shaped conveying channel (1104) and one end of the outer wall of the L-shaped conveying seat (1101), and the guide hole (707) communicates with the spray channel (706). A guide pipe (703) is fixed on one side of the guide hole (707) and passes through the feed cylinder cover (8) and the rotating pipe (10). The guide pipe (703) is connected to the feed cylinder cover. (8) Fixed connection: The top of the liquid guide tube (703) is rotatably connected to the injection tube (702) through a sealed bearing, and the bottom end of the injection tube (702) is fixedly installed with an infusion pump (701). The width adjustment component (6) includes a mounting frame (605) fixedly installed on one side of the outer wall of the L-shaped feed seat (1101), and a U-shaped plate (601) is fixedly installed on one side of the outer wall of the mounting frame (605). A bidirectional screw (603) passing through the mounting frame (605) is rotatably connected between the two ends of the U-shaped plate (601). A forward and reverse motor (604) is fixedly installed on the top of the mounting frame (605), and the output shaft of the forward and reverse motor (604) is connected to the bidirectional screw. The outer wall of the screw (603) is fixed with a meshing second bevel gear. Both ends of the bidirectional screw (603) are screwed with movable plates (602). The two movable plates (602) are fixedly connected to one end of the first sealing column (18) and one end of the second sealing column (19), respectively. Both ends of one side of the U-shaped plate (601) are provided with guide grooves (606), and one end of the two movable plates (602) is fixed with a guide block inserted into the guide groove (606). The bottom side of the infusion seat (704) is fixedly installed with an inclined cleaning scraper (20). Both sides of the bottom frame (1102) near the nozzle (705) are fixed with baffles (21).

2. The delivery and rinsing system for high-viscosity chemicals used in the manufacture of semiconductor chips according to claim 1, characterized in that, The first conveying structure (3) includes a first conveying pipe (301) fixedly installed between the bottom inner wall of the chemical storage tank (1) and the bottom inner wall of the mixing tank (4), and a first auger (302) is rotatably connected inside the first conveying pipe (301). The bottom of the first conveying pipe (301) located in the chemical storage tank (1) is provided with a feed trough (303), and the bottom end of the first conveying pipe (301) located in the middle position is provided with a filling trough (304).

3. The delivery and rinsing system for high-viscosity chemicals used in the manufacture of semiconductor chips according to claim 2, characterized in that, One end of the first conveying pipe (301) located in the middle position is designed to be sealed, and the second conveying structure (5) includes a second conveying pipe (501) fixed to one end of the first conveying pipe (301) located in the middle position. The inner wall of the second conveying pipe (501) is rotatably connected to a second auger (502). One end of the second auger (502) is fixed to one end of the first auger (302). A feeding pipe (503) is fixedly connected between the top of one side of the mixing tank (4) and the top side of the second conveying pipe (501).

4. The delivery and rinsing system for high-viscosity chemicals used in the manufacture of semiconductor chips according to claim 3, characterized in that, The drive mechanism (2) includes a side frame (201) fixedly installed between the outer walls of the chemical storage tank (1), and a drive shaft (203) is rotatably connected to both sides of the inner wall of the side frame (201). Both ends of the drive shaft (203) are fixedly connected to the other end of the first auger (302) with a first bevel gear (204) meshing with it. A first rotary motor (202) for driving the first auger (302) to rotate is fixedly installed in the middle of one side of the side frame (201).

5. The delivery and rinsing system for high-viscosity chemicals used in the manufacture of semiconductor chips according to claim 4, characterized in that, The top of the L-shaped material conveying seat (1101) is fixed with a feed cylinder cover (8) that communicates with the L-shaped material conveying channel (1104), and the outer wall of the feed cylinder cover (8) is rotatably connected to an installation sleeve (9) through a sealed bearing. One end of the installation sleeve (9) is fixed to one end of the second conveying pipe (501), and the interior of the second conveying pipe (501) communicates with the interior of the installation sleeve (9). The outer wall of the feed cylinder cover (8) is provided with guide holes (17) that are evenly spaced and distributed in a ring, and the guide holes (17) are located inside the installation sleeve (9).

6. The delivery and rinsing system for high-viscosity chemicals used in the manufacture of semiconductor chips according to claim 5, characterized in that, The top of the feed cylinder cover (8) is fixed with a rotating pipe (10), and the top of the outer wall of the rotating pipe (10) is fixed with a large transmission wheel (16). The middle position of the mixing tank (4) is rotatably connected with a stirring shaft (15), and the top of the outer wall of the stirring shaft (15) is fixed with a small transmission wheel. The outer wall of the small transmission wheel is connected to the outer wall of the large transmission wheel (16) by a transmission belt (12). The top of the mixing tank (4) is fixedly installed with a second rotary motor (13) for driving the stirring shaft (15) to rotate, and the bottom of the outer wall of the stirring shaft (15) is fixedly installed with equally spaced stirring plates (14). The bottom of the mixing tank (4) is fixed with a waste discharge pipe, and a valve is fixedly installed on the waste discharge pipe.

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