Crystal frequency chip automatic sorting device and method

Abstract

The application provides a crystal frequency slice automatic sorting device and method, which comprises a negative pressure limiting device for grabbing the crystal frequency slice, a driving device for controlling rotation of the negative pressure limiting device, and a sorting device located below a rotation path of the negative pressure limiting device. The sorting device comprises a first sorting assembly in a ring shape and a second sorting assembly. The first sorting assembly and the second sorting assembly are coaxially arranged, and the first sorting assembly is located at an inner side position of the second sorting assembly. The negative pressure limiting device comprises a negative pressure limiting assembly and a telescopic joint for controlling linear movement of the negative pressure limiting assembly. The application solves the problems of low sorting efficiency, damage to the surface of the crystal frequency slice, and poor sorting effect in the traditional sorting process.

Description

Technical Field

[0001] This invention relates to the field of crystal frequency wafer processing technology, and in particular to an automatic sorting device and method for crystal frequency wafers. Background Technology

[0002] During the manufacturing process, the thickness and surface defects of crystal frequency wafers are important inspection items. After inspection, the crystal frequency wafers are sorted and transported according to different quality to meet the needs of crystal frequency wafer production and processing.

[0003] Taking the thickness sorting of crystal frequency wafers as an example, some sorting equipment uses two relatively rolling sorting rollers to achieve continuous sorting of crystal frequency wafers. The gap between the two sorting rollers gradually increases to achieve continuous sorting of crystal frequency wafers of different thicknesses. However, the above method poses a risk of secondary damage to the surface of the crystal frequency wafers. In addition, the crystal frequency wafers move directionally during the sorting process. Under the combined interference of inertia and stacking blockage, the sorting accuracy of some frequency wafers is low.

[0004] Some devices use a separate gripping device to grab the crystal frequency wafers and place them individually at a predetermined position for inspection. This method of inspecting crystal frequency wafers has the advantages of high inspection accuracy and minimal damage to the crystal frequency wafers. However, the above inspection method has the problems of low inspection efficiency and complex sorting structure, and is not suitable for the inspection and sorting of large batches of crystal frequency wafers. Summary of the Invention

[0005] To address the above problems, this invention provides an automatic crystal frequency wafer sorting device and method, which solves the problems of low sorting efficiency, damage to the surface of crystal frequency wafers, and poor sorting effect in traditional sorting processes.

[0006] To solve the above problems, the technical solution adopted by the present invention is as follows: An automatic crystal frequency wafer sorting device includes a negative pressure limiting device for gripping crystal frequency wafers, a driving device for controlling the rotation of the negative pressure limiting device, and a sorting device located below the rotation path of the negative pressure limiting device. The sorting device includes a first sorting component and a second sorting component in an annular shape, which are coaxially arranged, with the first sorting component located inside the second sorting component. The negative pressure limiting device includes a negative pressure limiting component and a telescopic joint for controlling the linear movement of the negative pressure limiting component. The telescopic joint controls the negative pressure limiting component to be positioned sequentially above the first and second sorting components at predetermined positions to achieve the sorting and unloading of crystal frequency wafers.

[0007] Through the above design, frequency chip one and frequency chip two can fall to different positions at different times, realizing the sorting and unloading of crystal frequency chips. Multiple crystal frequency chips can be sorted and unloaded at one time, with high sorting efficiency. At the same time, the crystal frequency chips fall at a low height and there are no continuously rolling working elements, resulting in minimal damage to the surface of the crystal frequency chips.

[0008] Preferably, the negative pressure limiting assembly includes a negative pressure limiting rod and a plurality of negative pressure limiting elements fixed to the side wall of the negative pressure limiting rod, thereby controlling the predetermined negative pressure limiting elements to be in an unadsorbed state to achieve the sorting and unloading of the crystal frequency wafer.

[0009] Preferably, the telescopic joint has a telescopic end, the negative pressure limiting rod is rotatably connected to the telescopic end, and a rotary joint is installed at the rotatable connection between the negative pressure limiting rod and the telescopic end, so as to control the negative pressure limiting rod to tilt outward at a predetermined angle.

[0010] The above structural design avoids mutual interference between crystal frequency chips during the descent process, ensuring the accuracy of the crystal frequency chip's descent position and preventing the crystal frequency chip from falling into other receiving positions, thus ensuring the stability of the crystal frequency chip's descent.

[0011] Preferably, a deflection detection component is provided on the rotation path of the negative pressure limiting component, and the deflection detection component is electrically connected to the control rotation joint.

[0012] With the above structural design, when the length of the grasped crystal frequency chip is adjusted, the angle of deflection of the negative pressure limit rod 331 can be automatically adjusted and detected to meet the control requirements.

[0013] Preferably, the second sorting component includes an annular second sorting body, with a second guide plate inclined outward at the upper end of the second sorting body, a second guide pipe at the lower end of the second sorting body, and a vibration element fixed to the side wall of the second sorting body.

[0014] Preferably, it further includes a detection device, which is located on the rotation path of the negative pressure limiting device and is vertically arranged outside the rotation path of the negative pressure limiting device.

[0015] Preferably, the detection device includes a detection mounting frame and a detection element disposed on the side wall of the detection mounting frame, and controls the detection element to move along the length direction of the negative pressure limiting rod to complete the continuous detection of the thickness of multiple crystal frequency plates.

[0016] Preferably, the side wall of the detection mounting frame has a detection groove, and two detection mounting seats are slidably connected to the inner wall of the detection groove. The detection element is disposed on the first side wall of the detection mounting seat, and the second side walls of the two detection mounting seats are respectively rotatably connected to detection control rods. The end of the detection control rod away from the detection mounting seat is rotatably connected, and the side wall of the detection mounting frame is provided with an adjustment control component for adjusting the angle between the two detection control rods.

[0017] Preferably, it further includes a vibrating feeding device, which corresponds one-to-one with the detection device, and the vibrating feeding device is located in front of the detection device; the vibrating feeding device includes a vibrating feeding base, a vibrating feeding disc is installed on the upper end of the vibrating feeding base, a vibrating feeding plate is provided at the end of the vibrating feeding disc, a vibrating feeding channel is opened at the upper end of the vibrating feeding channel, and a limit protrusion is fixed at the end of the vibrating feeding channel.

[0018] An automatic sorting method for crystal frequency wafers, using the aforementioned automatic sorting equipment for crystal frequency wafers, includes the following steps: S1, using a negative pressure limiting device to grip multiple crystal frequency wafers under negative pressure, and after the negative pressure gripping is completed, detecting the multiple crystal frequency wafers and separating the detected multiple crystal frequency wafers into frequency wafer one and frequency wafer two; S2, controlling the negative pressure limiting component to be positioned above the first sorting component via a telescopic joint to realize the unloading of frequency wafer one; S3, controlling the negative pressure limiting component to be positioned above the second sorting component via a telescopic joint to realize the unloading of frequency wafer two.

[0019] The beneficial effects of this invention are as follows: Compared with existing sorting technologies, this invention can control frequency chip one and frequency chip two to fall to different positions at different times, thereby realizing the sorting and unloading of crystal frequency chips. Multiple crystal frequency chips can be sorted and unloaded at one time, resulting in high sorting efficiency. At the same time, the crystal frequency chips fall to a low height, and there are no continuously rolling working elements, resulting in minimal damage to the surface of the crystal frequency chips. Attached Figure Description

[0020] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0021] Figure 2 For the present invention Figure 1 A top-view structural diagram.

[0022] Figure 3 For the present invention Figure 1 A schematic diagram of the main structure.

[0023] Figure 4 For the present invention Figure 2 A magnified structural diagram at point A.

[0024] Figure 5 For the present invention Figure 3 A magnified structural diagram at point B.

[0025] Figure 6 This is a three-dimensional structural diagram of the detection device of the present invention.

[0026] Figure 7 For the present invention Figure 6 A schematic diagram of the main structure.

[0027] Figure 8 This is a three-dimensional structural diagram of the sorting device of the present invention.

[0028] Figure 9 For the present invention Figure 8 A schematic diagram of the main structure.

[0029] In the diagram: 100, drive unit; 110, drive base; 120, drive turntable; 200, sorting device; 210, first sorting component; 220, second sorting component; 221, second guide plate; 222, second sorting body; 223, second guide pipe; 300, negative pressure limiting device; 310, telescopic joint; 311, telescopic base; 312, telescopic end; 313, guide bar; 320, rotary joint; 330, negative pressure limiting component; 331, negative pressure limiting rod; 332 333. Negative pressure limiting seat; 400. Negative pressure limiting element; 410. Detection device; 411. Detection mounting bracket; 420. Detection element; 430. Detection control rod; 431. Detection mounting base; 440. Adjustment control assembly; 441. Control screw; 442. Control block; 443. Control motor; 500. Vibrating feeding device; 510. Feeding base; 520. Vibrating feeding plate; 530. Vibrating feeding plate; 531. Vibrating feeding channel; 532. Limiting protrusion. Detailed Implementation

[0030] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0031] During the manufacturing process, the thickness and surface defects of crystal frequency wafers are important inspection items. After inspection, the crystal frequency wafers are sorted and transported according to different quality to meet the needs of crystal frequency wafer production and processing.

[0032] Taking the thickness sorting of crystal frequency wafers as an example, some sorting equipment uses two relatively rolling sorting rollers to achieve continuous sorting of crystal frequency wafers. The gap between the two sorting rollers gradually increases to achieve continuous sorting of crystal frequency wafers of different thicknesses. However, the above method poses a risk of secondary damage to the surface of the crystal frequency wafers. In addition, the crystal frequency wafers move directionally during the sorting process. Under the combined interference of inertia and stacking blockage, the sorting accuracy of some frequency wafers is low.

[0033] Some devices use a separate gripping device to grab the crystal frequency wafers and place them individually at a predetermined position for inspection. This method of inspecting crystal frequency wafers has the advantages of high inspection accuracy and minimal damage to the crystal frequency wafers. However, the above inspection method has the problems of low inspection efficiency and complex sorting structure, and is not suitable for the inspection and sorting of large batches of crystal frequency wafers.

[0034] To solve the above problems, please refer to the appendix. Figure 1 -Appendix Figure 9 An automatic crystal frequency slice sorting device includes a negative pressure limiting device 300 for gripping crystal frequency slices, a drive device 100 for controlling the rotation of the negative pressure limiting device 300, and a sorting device 200 located below the rotation path of the negative pressure limiting device 300. During the sorting process, the drive device 100 controls the rotation of the negative pressure limiting device 300 to complete the negative pressure gripping of the crystal frequency slices. After the crystal frequency slices are detected, the crystal frequency slices on the surface of the negative pressure limiting device 300 are divided into frequency slice one and frequency slice two. Frequency slice one and frequency slice two are then controlled to fall into the sorting device 200 in sequence, realizing the sorting and conveying of crystal frequency slices of different qualities and meeting the sorting and processing requirements.

[0035] Specifically, the sorting device 200 includes a ring-shaped first sorting component 210 and a second sorting component 220. The first sorting component 210 and the second sorting component 220 are coaxially arranged, with the first sorting component 210 located inside the second sorting component 220. During the sorting process, frequency slice one and frequency slice two are controlled to fall into the first sorting component 210 and the second sorting component 220, completing the automatic sorting of crystal frequency slices. Through the above sorting method, multiple crystal frequency slices can be sorted and unloaded at one time, resulting in high sorting efficiency. At the same time, the crystal frequency slices fall at a low height, and there are no continuously rolling working elements, resulting in minimal damage to the surface of the crystal frequency slices.

[0036] Specifically, the negative pressure limiting device 300 includes a negative pressure limiting component 330 and a telescopic joint 310 for controlling the linear movement of the negative pressure limiting component 330. The telescopic joint 310 controls the negative pressure limiting component 330 to be positioned at predetermined positions above the first sorting component 210 and the second sorting component 220 to achieve the sorting and unloading of crystal frequency wafers. During the sorting process, the telescopic joint 310 controls the linear movement of the negative pressure limiting component 330, so that the negative pressure limiting component 330 is positioned at predetermined positions above the first sorting component 210 and the second sorting component 220 respectively. After the negative pressure limiting component 330 reaches the predetermined positions above the first sorting component 210 and the second sorting component 220, the corresponding negative pressure limiting component 330 is controlled to be in an unadsorbed state, and frequency wafer one and frequency wafer two fall to different positions at different times to achieve the sorting and unloading of crystal frequency wafers.

[0037] It should be noted that the negative pressure limiting component 330 has multiple negative pressure gripping points. Each negative pressure gripping point can grip a crystal frequency chip with negative pressure. After the crystal frequency chip is inspected, it is divided into frequency chip one and frequency chip two according to whether the surface quality of the crystal frequency chip meets the requirements. The relevant data is then transmitted to the negative pressure gripping point of the negative pressure limiting component 330 to achieve separate control and meet the needs of separating and unloading frequency chip one and frequency chip two at different positions.

[0038] It should also be noted that the negative pressure limiting component 330 is positioned in a relatively vertical position to continuously convey and sort multiple crystal frequency wafers. By setting the negative pressure limiting component 330 vertically, the crystal frequency wafers on the surface of the negative pressure limiting component 330 can fall to a predetermined position under the action of gravity, reducing the lateral space occupied by the bottom sorting device 200 and reducing the overall volume of the equipment; it is especially suitable for sorting and unloading when there are many crystal frequency wafers on the surface of the negative pressure limiting component 330.

[0039] In summary, the above design enables frequency chip one and frequency chip two to fall to different positions at different times, achieving the sorting and unloading of crystal frequency chips. Multiple crystal frequency chips can be sorted and unloaded at one time, resulting in high sorting efficiency. At the same time, the crystal frequency chips fall at a low height, and there are no continuously rolling working elements, minimizing damage to the surface of the crystal frequency chips.

[0040] Please refer to the appendix for details. Figure 5 Specifically, the negative pressure limiting assembly 330 includes a negative pressure limiting rod 331 and multiple negative pressure limiting elements 333 fixed to the side wall of the negative pressure limiting rod 331. The predetermined negative pressure limiting elements 333 are controlled in a non-adsorption state to achieve the sorting and unloading of the crystal frequency wafers. The multiple negative pressure limiting elements 333 are arranged at equal intervals along the length of the negative pressure limiting rod 331. The installation spacing of the negative pressure limiting elements 333 is determined according to the size of the crystal frequency wafer to ensure that the negative pressure limiting elements 333 can be adsorbed with the center position of the corresponding crystal frequency wafer under negative pressure gripping.

[0041] Each negative pressure limiting element 333 here is connected to a negative pressure control device through a separate pipeline. The pipeline is equipped with a control valve to control the corresponding negative pressure limiting element 333 to be in a negative pressure adsorption or non-adsorption state. This enables individual control of the crystal frequency sheet adsorbed on the surface of the negative pressure limiting element 333, thereby enabling the individual feeding of frequency sheet one and frequency sheet two at different times and positions.

[0042] Specifically, the telescopic joint 310 has a telescopic end 312, a negative pressure limiting rod 331 rotatably connected to the telescopic end 312, and a rotary joint 320 is installed at the rotatable connection between the negative pressure limiting rod 331 and the telescopic end 312. The rotary joint 320 controls the negative pressure limiting rod 331 to tilt outward by a predetermined angle. The rotary joint 320 can be an electrically controlled rotary joint, which can control the negative pressure limiting rod 331 to deflect by a predetermined angle. By controlling the negative pressure limiting rod 331 to deflect outward by a predetermined angle, multiple frequency chips can be staggered on the horizontal projection plane, allowing the crystal frequency chips to descend freely on a separate vertical line, avoiding collisions between the crystal frequency chips and ensuring stable descent of the crystal frequency chips.

[0043] The above structural design avoids mutual interference between crystal frequency chips during the descent process, ensuring the accuracy of the crystal frequency chip's descent position and preventing the crystal frequency chip from falling into other receiving positions, thus ensuring the stability of the crystal frequency chip's descent.

[0044] A deflection detection component is provided on the rotation path of the negative pressure limiting component 330. The deflection detection component is electrically connected to the control rotation joint 320. The deflection detection component can detect the deflection angle of the negative pressure limiting rod 331 and feed the deflection angle back to the rotation joint 320 to achieve automatic correction. At the same time, with the above structure, when the length of the grasped crystal frequency chip is adjusted, the deflection angle of the negative pressure limiting rod 331 can be automatically adjusted and detected to meet the control requirements.

[0045] Please refer to the appendix for details. Figure 9 Furthermore, the second sorting assembly 220 includes an annular second sorting body 222. The upper end of the second sorting body 222 is connected to a second guide plate 221 that is inclined outward, and the lower end of the second sorting body 222 is connected to a second guide pipe 223. A vibration element is fixed to the side wall of the second sorting body 222. The open design of the second guide plate 221 can increase the lateral dimension of the crystal frequency plate's descent. At the same time, the contraction design of the second sorting body 222 can concentrate the vibration of the crystal frequency plate. Under the action of the vibration element, the crystal frequency plate moves in a direction and is discharged from the second guide pipe 223.

[0046] The second sorting body 222 here has an internal inclined design and its bottom is a continuously changing arc. The second material guide pipe 223 is located at the bottom of the arc. During the continuous vibration of the vibrating element, the crystal frequency wafers are continuously discharged. At the same time, the second sorting body 222 here is a continuous ring, and the crystal frequency wafers discharged from each position can all descend from the second material guide pipe 223, which further improves the efficiency of the crystal frequency wafer descent.

[0047] A detection device 400 is also provided on the outside of the sorting device 200. The detection device 400 is located on the rotation path of the negative pressure limiting device 300 and is vertically arranged on the outside of the rotation path of the negative pressure limiting device 300. By setting the detection device 400, the crystal frequency sheet adsorbed by negative pressure on the surface of the negative pressure limiting device 300 can be detected to determine the surface quality of the crystal frequency sheet. According to whether the crystal frequency sheet meets the quality requirements, the crystal frequency sheet is divided into frequency sheet one and frequency sheet two.

[0048] The detection device 400 is vertically positioned outside the negative pressure limiting device 300, which is consistent with the vertical position of the negative pressure limiting device 300, allowing multiple crystal frequency chips to be continuously detected in a vertical state, thus meeting the detection requirements.

[0049] The detection device 400 includes a detection mounting frame 410 and a detection element 420 disposed on the side wall of the detection mounting frame 410. The detection element 420 is controlled to move along the length direction of the negative pressure limiting rod 331 to complete the continuous detection of the thickness of multiple crystal frequency wafers. During the continuous movement, the detection element 420 detects the crystal frequency wafers on the side wall of the negative pressure limiting rod 331. The detection element 420 can be selected as an existing optical detection element to scan for defects on the surface of the crystal frequency wafers and perform optical detection of the thickness to meet the requirements of continuous detection. After the surface detection of multiple crystal frequency wafers is completed, the negative pressure limiting rod 331 is controlled to rotate to the upper unloading position of the sorting device 200 to realize the sorting and unloading of the crystal frequency wafers.

[0050] A detection groove 411 is formed on the side wall of the detection mounting bracket 410. Two detection mounting seats 431 are slidably connected to the inner wall of the detection groove 411. The detection element 420 is set on the first side wall of the detection mounting seat 431. Detection control rods 430 are rotatably connected to the second side walls of the two detection mounting seats 431 respectively. The end of the detection control rod 430 away from the detection mounting seat 431 is rotatably connected. An adjustment control component 440 is provided on the side wall of the detection mounting bracket 410 to adjust the angle between the two detection control rods 430. By adjusting the control component 440, the angle between the two detection control rods 430 can be adjusted synchronously, thereby controlling the sliding position of the two detection mounting seats 431, so that the two detection elements 420 move closer or further away from each other, realizing continuous detection of multiple crystal frequency plates on the side wall of the negative pressure limiting rod 331. Through the above detection method, the crystal frequency plates can be stably and quickly detected, and the detection efficiency is doubled. It is suitable for continuous detection of negative pressure limiting rods 331 with large length dimensions.

[0051] The adjustment and control component 440 here can be selected as a hydraulic telescopic rod, an electric telescopic rod, or other telescopic element. During the extension and retraction process, it ensures that the two detection control rods 430 move linearly on the same horizontal straight line at their rotational connection. When the span of the detection element 420 is large, it can be selected as a combination of control screw 441, control block 442, and control motor 443. During the process of the control motor 443 driving the control screw 441 to rotate, it can drive the control block 442 to move linearly, thus completing the drive control.

[0052] The automatic sorting equipment also includes a vibrating feeding device 500, which vibrates the crystal frequency wafers to meet the requirements of vibration detection. Multiple vibrating feeding devices 500 and detection devices 400 can be configured, with each device corresponding to one of the other, and the vibrating feeding device 500 located in front of the detection device 400. During rotation, the negative pressure limiting device 300 passes sequentially through the vibrating feeding device 500 and the detection device 400. When the negative pressure limiting device 300 rotates to the side of the vibrating feeding device 500, it completes the negative pressure gripping of multiple crystal frequency wafers. After the negative pressure gripping of multiple crystal frequency wafers is completed, the negative pressure limiting device 300 is controlled to rotate to the side of the detection device 400 to complete the continuous detection of the crystal frequency wafers.

[0053] The vibrating feeding device 500 includes a vibrating feeding base 510, a vibrating feeding plate 520 mounted on the upper end of the vibrating feeding base 510, a vibrating feeding plate 530 provided at the end of the vibrating feeding plate 520, a vibrating feeding channel 531 opened at the upper end of the vibrating feeding channel 531, and a limiting protrusion 532 fixed at the end of the vibrating feeding channel 531. During continuous vibration, the crystal frequency plate moves continuously along the vibrating feeding channel 531 and is eventually limited by the limiting protrusion 532. Under the limitation of the limiting protrusion 532, two adjacent crystal frequency plates are in a state of mutual abutment, ensuring the accuracy of the position between the crystal frequency plates. The installation position of the limiting protrusion 532 can be adjusted according to the length of the crystal frequency plate.

[0054] It should also be noted that the vibrating feed plate 530 is arranged horizontally. The negative pressure limiting component 330 of the negative pressure limiting device 300 is rotated to a horizontal state, which can realize the negative pressure gripping of multiple crystal frequency wafers in the vibrating feed channel 531. At the same time, during the detection and sorting process, the negative pressure limiting component 330 is controlled to be in a relatively vertical state to ensure the stability of the crystal frequency wafer sorting and feeding.

[0055] The invention will be further described below in conjunction with its usage.

[0056] An automatic crystal frequency wafer sorting method, using the aforementioned automatic crystal frequency wafer sorting equipment, includes the following steps: S1. Multiple crystal frequency wafers are gripped under negative pressure by a negative pressure limiting device 300. After the negative pressure gripping is completed, the multiple crystal frequency wafers are tested and divided into frequency wafer one and frequency wafer two according to the quality requirements of the crystal frequency wafers. Here, frequency wafer one is defined as a crystal frequency wafer that meets the quality requirements and frequency wafer two is a crystal frequency wafer that does not meet the quality requirements. Frequency wafer one and frequency wafer two are sorted and unloaded to different positions to realize the sorting and unloading of crystal frequency wafers.

[0057] S2. By controlling the negative pressure limiting component 330 to be positioned above the first sorting component 210 through the telescopic joint 310, the first frequency piece is unloaded. During this process, the negative pressure limiting element 333 corresponding to the first frequency piece is controlled to be in an unadsorbed state. The first frequency piece falls into the first sorting component 210 under the action of gravity, and is subsequently collected and transported in a centralized manner.

[0058] S3. The negative pressure limiting component 330 is controlled to be above the second sorting component 220 by the telescopic joint 310 to realize the unloading of frequency piece 2; during this process, the negative pressure limiting element 333 corresponding to frequency piece 2 is controlled to be in an unadsorbed state, and frequency piece 2 falls into the second sorting component 220 under the action of gravity, and is subsequently collected and transported in a centralized manner.

[0059] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An automatic crystal frequency wafer sorting device, comprising a negative pressure limiting device (300) for gripping crystal frequency wafers, a driving device (100) for controlling the rotation of the negative pressure limiting device (300), and a sorting device (200) located below the rotation path of the negative pressure limiting device (300), characterized in that: The sorting device (200) includes a first sorting component (210) and a second sorting component (220) in an annular shape. The first sorting component (210) and the second sorting component (220) are arranged coaxially, and the first sorting component (210) is located inside the second sorting component (220). The negative pressure limiting device (300) includes a negative pressure limiting component (330) and a telescopic joint (310) for controlling the linear movement of the negative pressure limiting component (330). The telescopic joint (310) controls the negative pressure limiting component (330) to be positioned at predetermined positions above the first sorting component (210) and the second sorting component (220) to achieve the sorting and unloading of crystal frequency wafers. The negative pressure limiting assembly (330) includes a negative pressure limiting rod (331) and a plurality of negative pressure limiting elements (333) fixed to the side wall of the negative pressure limiting rod (331), thereby controlling the predetermined negative pressure limiting elements (333) to be in a non-adsorbed state to achieve the sorting and unloading of crystal frequency wafers. The telescopic joint (310) has a telescopic end (312), the negative pressure limiting rod (331) is rotatably connected to the telescopic end (312), and a rotary joint (320) is installed at the rotatable connection between the negative pressure limiting rod (331) and the telescopic end (312). The negative pressure limiting rod (331) is tilted outward at a predetermined angle by the rotary joint (320). A deflection detection component is provided on the rotation path of the negative pressure limiting component (330), and the deflection detection component is electrically connected to the control rotation joint (320).

2. The automatic crystal frequency wafer sorting device according to claim 1, characterized in that, The second sorting assembly (220) includes an annular second sorting body (222), the upper end of the second sorting body (222) is connected to a second guide plate (221) that is inclined outward, the lower end of the second sorting body (222) is connected to a second guide pipe (223), and a vibration element is fixed on the side wall of the second sorting body (222).

3. The automatic crystal frequency wafer sorting device according to claim 1, characterized in that, It also includes a detection device (400), which is located on the rotation path of the negative pressure limiting device (300) and is vertically arranged outside the rotation path of the negative pressure limiting device (300).

4. The automatic crystal frequency wafer sorting device according to claim 3, characterized in that, The detection device (400) includes a detection mounting frame (410) and a detection element (420) disposed on the side wall of the detection mounting frame (410). The detection element (420) is controlled to move along the length direction of the negative pressure limiting rod (331) to complete the continuous detection of the thickness of multiple crystal frequency plates.

5. The automatic crystal frequency wafer sorting device according to claim 4, characterized in that, The detection mounting bracket (410) has a detection groove (411) on its side wall. Two detection mounting seats (431) are slidably connected to the inner wall of the detection groove (411). The detection element (420) is set on the first side wall of the detection mounting seat (431). The second side walls of the two detection mounting seats (431) are respectively rotatably connected to detection control rods (430). The end of the detection control rod (430) away from the detection mounting seat (431) is rotatably connected. The side wall of the detection mounting bracket (410) is provided with an adjustment control component (440) for adjusting the angle between the two detection control rods (430).

6. The automatic crystal frequency wafer sorting device according to claim 1, characterized in that, It also includes a vibrating feeding device (500), which corresponds one-to-one with the detection device (400), and the vibrating feeding device (500) is located in front of the detection device (400); the vibrating feeding device (500) includes a vibrating feeding base (510), a vibrating feeding plate (520) is installed on the upper end of the vibrating feeding base (510), a vibrating feeding plate (530) is provided at the end of the vibrating feeding plate (520), a vibrating feeding channel (531) is opened at the upper end of the vibrating feeding channel (531), and a limit protrusion (532) is fixed at the end of the vibrating feeding channel (531).

7. An automatic sorting method for crystal frequency wafers, characterized in that, The automatic crystal frequency wafer sorting device according to any one of claims 1-6 includes the following steps: S1. Multiple crystal frequency chips are gripped under negative pressure by a negative pressure limiting device (300). After the negative pressure gripping is completed, the multiple crystal frequency chips are tested and the tested multiple crystal frequency chips are divided into frequency chip one and frequency chip two. S2. By controlling the negative pressure limiting component (330) to be located above the first sorting component (210) through the telescopic joint (310), the frequency chip one is unloaded; S3. By controlling the negative pressure limiting component (330) to be located above the second sorting component (220) through the telescopic joint (310), the frequency chip 2 is unloaded.

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