Double sided tape die cutting apparatus

CN118081878BActive Publication Date: 2026-06-19SUZHOU UNITE ELECTRONICS

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SUZHOU UNITE ELECTRONICS
Filing Date
2024-03-22
Publication Date
2026-06-19

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Abstract

This invention relates to the technical field of double-sided adhesive tape processing, and discloses a double-sided adhesive tape die-cutting device, comprising two horizontally arranged die-cutting turntables, several upper molds penetrating the upper die-cutting turntable, and several lower molds penetrating the lower die-cutting turntable; a rotating sleeve is coaxially fixed between the two die-cutting turntables, and the inner circumference of the rotating sleeve is provided with hydraulic components for the upper and lower molds to cut the double-sided adhesive tape; a driving component for driving the two die-cutting turntables to rotate is provided on the periphery of the rotating sleeve; a hollow disc is arranged between the two cross-cutting turntables, and several long strips of bristles are fixedly installed on the top and bottom surfaces of the hollow disc. This application has the effect of improving the die-cutting blade of the die-cutting equipment so that double-sided adhesive tape can easily adhere to it.
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