Thermal barrier coating and method for producing same, high temperature component

Abstract

The application relates to the technical field of coating materials, in particular to a thermal resistance coating and a preparation method thereof and a high-temperature component. The thermal resistance coating comprises a bonding layer, a diffusion resistance layer and a MAX phase material layer, the diffusion resistance layer is arranged on the bonding layer, and the MAX phase material layer is arranged on the surface of the diffusion resistance layer away from the bonding layer; wherein the chemical formula of the MAX phase material is M (n+1) AX n , wherein 2<=n<=4, M is selected from transition metal elements, A is selected from main group elements, and X is selected from carbon elements or nitrogen elements. The thermal resistance coating has high infrared reflectivity, can effectively inhibit infrared radiation and is resistant to high temperature.

Description

Technical Field

[0001] This application relates to the field of coating materials technology, and in particular to a thermal resistance coating and its preparation method, and high-temperature components. Background Technology

[0002] With the development of aero-engines, the temperature of engine exhaust gases has further increased, as has the operating temperature of high-temperature components at the engine tail. Traditional thermal barrier coatings, due to their low phonon thermal conductivity, can provide insulation under temperature gradients at relatively low temperatures. However, as the exhaust gas temperature rises, the heat energy transferred outward through thermal radiation (photon conduction) increases significantly. Furthermore, traditional thermal barrier coating materials, such as YSZ, have infrared transmittance exceeding 70% at high temperatures. Therefore, the energy radiated outward by the exhaust gases can directly heat the high-temperature alloy substrate through the thermal barrier coating, significantly reducing its insulation capability.

[0003] To suppress the transmission of high-temperature combustion heat radiation through traditional thermal barrier coatings, reduce the heating intensity of infrared radiation on the substrate, and improve the thermal insulation performance of the coating at high temperatures, a coating with high infrared reflectivity is often prepared on the surface of the traditional thermal barrier coating to block infrared radiation from passing through. Generally, materials with high infrared reflectivity are usually metals. However, most metals oxidize at high temperatures and cannot be used for extended periods at high temperatures. Rare and precious metals, such as Pt, Pd, Au, and Ag, not only have high reflectivity but also good oxidation resistance, making them a viable high-reflectivity material. However, rare and precious metals have the problem of high cost, and under certain high-temperature conditions, such as Pt coatings shrinking at temperatures exceeding 900°C, leading to voids and performance degradation. Summary of the Invention

[0004] Based on this, the present invention provides a thermal resistance coating that can effectively suppress infrared radiation and is resistant to high temperatures, as well as its preparation method and high-temperature components.

[0005] This application provides a thermal resistance coating comprising an adhesive layer, a diffusion barrier layer, and a MAX phase material layer, wherein the diffusion barrier layer is disposed on the adhesive layer, and the MAX phase material layer is disposed on the surface of the diffusion barrier layer opposite to the adhesive layer; wherein the chemical formula of the MAX phase material is M (n+1) AX n Where 2≤n≤4, M is selected from transition metal elements, A is selected from elements in the main group, and X is selected from carbon or nitrogen elements.

[0006] In some embodiments, the MAX phase material is selected from one or more of Cr2AlC, Ti2AlC, Ti2AlN, Ti3AlC2, and Ti4AlN3.

[0007] In some embodiments, the MAX phase material is selected from one or more of Cr2AlC, Ti2AlC, Ti3AlC2, and Ti2AlN.

[0008] In some embodiments, the adhesive layer is made of PtAl, PtNiAl, PtReAl, or MCrAlY, wherein M is selected from Ni and / or Co.

[0009] In some embodiments, the diffusion barrier layer is a metal oxide layer formed by oxidizing the adhesive layer;

[0010] Alternatively, the diffusion barrier layer may be a YSZ ceramic material layer or a Gd2Zr2O7 ceramic material layer.

[0011] In some embodiments, the thickness of the MAX phase material layer is 0.5 μm to 20 μm.

[0012] In some embodiments, the thickness of the diffusion barrier layer is 1 μm to 150 μm.

[0013] In some embodiments, the thickness of the adhesive layer is 5 μm to 70 μm.

[0014] This application also provides a method for preparing a thermal resistance coating, which includes the following steps:

[0015] A bonding layer is prepared on the surface of the alloy substrate;

[0016] A diffusion-blocking layer is formed on the surface of the adhesive layer; and

[0017] A MAX phase material layer is formed on the surface of the diffusion barrier layer opposite to the adhesive layer, wherein the chemical formula of the MAX phase material is M. (n+1) AX n Where 2≤n≤4, M is selected from transition metal elements, A is selected from elements in the main group, and X is selected from carbon or nitrogen elements.

[0018] In some embodiments, the diffusion barrier layer is a metal oxide layer formed by oxidizing the adhesive layer.

[0019] In some embodiments, the surface roughness Ra of the adhesive layer is controlled to be 0.1 μm to 2 μm.

[0020] In some embodiments, the method of forming a diffusion barrier layer on the surface of the adhesive layer includes a plasma spraying process or a physical vapor deposition process.

[0021] In some embodiments, the surface roughness Ra of the diffusion barrier layer is controlled to be 0.1 μm to 2 μm.

[0022] In some embodiments, the method for forming the MAX phase material layer is a magnetron sputtering process.

[0023] In some embodiments, the method for forming the MAX phase material layer is a low-pressure plasma spraying process.

[0024] In some embodiments, the surface roughness Ra of the MAX phase material layer is controlled to be 0.1 μm to 2 μm.

[0025] In another aspect, this application provides a high-temperature resistant component, which includes a component body and a thermal resistance coating formed on the surface of the component body, wherein the thermal resistance coating is the thermal resistance coating described above.

[0026] The aforementioned thermal resistance coating enhances its high-temperature resistance and high infrared reflectivity (with a minimum average infrared reflectivity greater than 0.8) by forming a MAX phase material layer on the diffusion barrier layer, demonstrating its excellent infrared radiation reflection performance. Furthermore, MAX phase materials are abundant and low-cost. In addition, placing a diffusion barrier layer between the adhesive layer and the MAX phase material layer prevents interdiffusion between the elements in the MAX phase material and the adhesive layer material, ensuring that the original composition of the MAX phase remains unchanged and maintaining its high high-temperature resistance and infrared reflectivity. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0028] Figure 1 A schematic diagram of the structure of a thermal resistance coating obtained according to one embodiment;

[0029] Figure 2 The graph shows the variation of infrared reflectance of the MAX phase coating at high temperature with wavelength in the thermal resistance coating prepared in Example 1.

[0030] Explanation of reference numerals in the attached figures:

[0031] 100, Alloy substrate; 200, Adhesive layer; 300, Diffusion barrier layer; 400, MAX phase material layer. Detailed Implementation

[0032] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of this application.

[0033] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term “and / or” as used herein includes any and all combinations of one or more of the associated listed items. The terms “comprising,” “including,” “having,” “containing,” or any other variations thereof as used herein are intended to cover a non-exclusive inclusion. For example, a composition, step, method, article, or apparatus that includes the listed elements is not necessarily limited to those elements, but may include other elements not expressly listed or elements inherent to such a composition, step, method, article, or apparatus.

[0034] Unless otherwise shown or indicated in the operational embodiments, all figures used to represent the amounts of ingredients, physicochemical properties, etc., in the specification and claims are to be understood to be adjusted by the term "about" in all cases. For example, therefore, unless stated to the contrary, the numerical parameters listed in the foregoing specification and appended claims are approximations, and those skilled in the art can appropriately modify these approximations to obtain the desired characteristics using the teachings disclosed herein. The use of numerical ranges indicated by endpoints includes all numbers within that range and any range within that range; for example, 1 to 5 includes 1, 1.1, 1.3, 1.5, 2, 2.75, 3, 3.80, 4, and 5, etc.

[0035] In this application, the terms "first aspect," "second aspect," "third aspect," "fourth aspect," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or quantity, nor should they be construed as implicitly indicating the importance or quantity of the indicated technical features. Moreover, "first," "second," "third," "fourth," etc., serve only as a non-exhaustive enumeration and should be understood not to constitute a closed limitation on quantity.

[0036] The term "multiple" in this application refers to two or more entities.

[0037] In this application, numerical intervals (i.e., numerical ranges) are involved. Unless otherwise specified, optional numerical distributions within the aforementioned numerical intervals are considered continuous and include the two endpoints (i.e., the minimum and maximum values) of the numerical range, as well as every value between these two endpoints. Unless otherwise specified, when a numerical interval refers only to integers within that interval, it includes the two endpoint integers of the numerical range, as well as every integer between the two endpoints. Furthermore, when multiple ranges are provided to describe features or characteristics, these ranges can be merged. In other words, unless otherwise specified, the ranges disclosed herein should be understood to include any and all subranges to which they are included.

[0038] Traditional coatings with high infrared reflectivity typically use metals as raw materials. However, most metals oxidize at high temperatures, making them unsuitable for prolonged use at high temperatures. While rare and precious metals possess high oxidation resistance and reflectivity, they are expensive and shrink at temperatures exceeding a certain threshold, such as Ag coatings exceeding 600°C, leading to voids and performance degradation. Therefore, this application provides a thermally resistive coating that improves infrared reflectivity and exhibits high-temperature resistance.

[0039] This application provides a thermal resistance coating comprising an adhesive layer, a diffusion barrier layer, and a MAX phase material layer, wherein the diffusion barrier layer is disposed on the adhesive layer, and the MAX phase material layer is disposed on the surface of the diffusion barrier layer opposite to the adhesive layer; wherein the chemical formula of the MAX phase material is M (n+1) AX n Where 2≤n≤4, M is selected from transition metal elements, A is selected from elements in the main group, and X is selected from carbon or nitrogen elements.

[0040] The aforementioned thermal resistance coating enhances its high-temperature resistance and high infrared reflectivity (with a minimum average infrared reflectivity greater than 0.8) by forming a MAX phase material layer on the diffusion barrier layer, demonstrating its excellent infrared radiation reflection performance. Furthermore, MAX phase materials are abundant and low-cost. In addition, placing a diffusion barrier layer between the adhesive layer and the MAX phase material layer prevents the infiltration of A (group A) components from the MAX phase material, ensuring that the original composition of the MAX phase remains unchanged and maintaining its high high-temperature resistance and infrared reflectivity.

[0041] In some embodiments, the MAX phase material may be selected from one or more of Cr2AlC, Ti2AlC, Ti2AlN, Ti3AlC2 and Ti4AlN3; preferably, the MAX phase material is selected from one or more of Cr2AlC, Ti2AlC, Ti3AlC2 and Ti2AlN; more preferably, the MAX phase material is selected from Cr2AlC.

[0042] In some embodiments, the thickness of the MAX phase material layer can be any value between 0.5 μm and 20 μm, for example, it can also be 1 μm, 5 μm, 8 μm, 10 μm, 12 μm, 15 μm, or 18 μm.

[0043] In some embodiments, the material of the adhesive layer is not limited and can be any material commonly used in the art, such as PtAl, PtNiAl, PtReAl or MCrAlY, where M is selected from Ni and / or Co.

[0044] In some embodiments, the thickness of the adhesive layer can be any value between 5 μm and 70 μm, for example, it can also be 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, or 60 μm.

[0045] In some embodiments, the diffusion barrier layer can be a metal oxide layer formed by oxidizing the adhesive layer. It is understood that the adhesive layer oxidizes at high temperatures (above 900°C) to form a metal oxide layer (primarily an Al2O3 layer), which can serve as the diffusion barrier layer.

[0046] In other embodiments, the diffusion barrier layer may also be a YSZ ceramic material layer or a Gd2Zr2O7 ceramic material layer.

[0047] In some embodiments, the thickness of the diffusion barrier layer can be any value between 1 μm and 150 μm, for example, it can also be 5 μm, 10 μm, 15 μm, 20 μm, 30 μm, 40 μm, 50 μm, 80 μm, 100 μm, 120 μm, 130 μm, or 140 μm.

[0048] In some embodiments, the thermal resistance coating can be applied to a high-temperature alloy substrate, wherein the alloy substrate is disposed on the side of the adhesive layer opposite to the diffusion barrier layer. By providing an adhesive layer between the alloy substrate and the diffusion barrier layer, the thermal stress caused by the mismatch in the coefficients of thermal expansion between the alloy substrate and the diffusion barrier layer can be alleviated. At the same time, the adhesive layer can play an anti-oxidation role, thereby improving the bonding strength between the alloy substrate and the diffusion barrier layer and the thermal shock life of the thermal resistance coating.

[0049] In some embodiments, the alloy matrix may be specifically selected from high-temperature alloy matrices, including but not limited to nickel-based high-temperature alloys such as IC21, IC10, GH3230, GH2035, GH2328, or GH901.

[0050] like Figure 1As shown, in some embodiments, the aforementioned thermal resistance coating is applied to a high-temperature alloy substrate 100, and the thermal resistance coating includes an adhesive layer 200, a diffusion barrier layer 300, and a MAX phase material layer 400. The adhesive layer 200 is formed on the alloy substrate 100, the diffusion barrier layer 300 is formed on the surface of the adhesive layer 200 opposite to the alloy substrate 100, and the MAX phase material layer 400 is formed on the surface of the diffusion barrier layer 300 opposite to the adhesive layer 200.

[0051] The following section will provide a detailed description of the prepared thermal resistance coating in conjunction with the preparation method.

[0052] This application also provides a method for preparing a thermal resistance coating, which includes the following steps:

[0053] A bonding layer is prepared on the surface of the alloy substrate;

[0054] A diffusion-blocking layer is formed on the surface of the adhesive layer; and

[0055] A MAX phase material layer is formed on the surface of the diffusion barrier layer facing away from the adhesive layer, wherein the chemical formula of the MAX phase material is M (n+1) AX n Where 2≤n≤4, M is selected from transition metal elements, A is selected from elements in the main group, and X is selected from carbon or nitrogen elements.

[0056] In this application, the method for forming an adhesive layer on the alloy substrate can employ coating preparation processes commonly used in the art. In some embodiments, multi-arc ion plating technology can be used. Specifically, the steps for forming an adhesive layer on the alloy substrate using multi-arc ion plating technology can be as follows: placing the alloy substrate on the sample stage of a vacuum chamber, with the distance between the sample and the target material approximately 10 mm to 100 mm, a substrate bias voltage of -30V to -50V, a furnace temperature of 400℃ to 500℃, a rotation speed of 5 rpm / min, and an arc ignition current of 180A.

[0057] In some embodiments, the surface roughness Ra of the adhesive layer is controlled to be 0.1 μm to 2 μm.

[0058] In some embodiments, the diffusion barrier layer is a metal oxide layer formed by oxidizing the adhesive layer. The specific fabrication process can be as follows: the adhesive layer is pre-oxidized to form the diffusion barrier layer (metal oxide layer) through a pre-oxidation process. The pre-oxidation parameters include: a pre-oxidation temperature of 900℃~1050℃ and a pre-oxidation time of 2h~4h.

[0059] In other embodiments, when the diffusion barrier layer is a YSZ ceramic material layer or a Gd2Zr2O7 ceramic material layer, the method used to form the diffusion barrier layer on the surface of the adhesive layer can be plasma spraying or physical vapor deposition. The specific process parameters for plasma spraying are as follows: plasma power 30kW~70kW, spraying distance 30mm~90mm, main gas Ar with a flow rate of 60SCFH~120SCFH, auxiliary gas He with a flow rate of 30SCFH~50SCFH, carrier gas Ar with a flow rate of 2SCFH~5SCFH, and powder feed rate 1%~2% RPM. Furthermore, after forming the diffusion barrier layer using plasma spraying or physical vapor deposition, the surface roughness Ra of the diffusion barrier layer needs to be controlled to be 0.1μm~2μm.

[0060] In some embodiments, the process used to form the MAX phase material layer can be magnetron sputtering or low-pressure plasma spraying. Low-pressure plasma spraying operates at a pressure lower than atmospheric pressure and is typically performed in an inert protective atmosphere, such as Ar. Furthermore, after forming the MAX phase material layer using low-pressure plasma spraying, the surface roughness Ra of the MAX phase material layer needs to be controlled to be 0.1 μm to 2 μm. A specific method for forming the MAX phase material layer using magnetron sputtering is as follows: the alloy substrate and the MAX phase material target are placed in a magnetron sputtering instrument. The current used in the magnetron sputtering process is a DC power supply, the substrate temperature is 200℃ to 600℃, the sample bias voltage is 20W to 60W, the bias voltage loading time is 1min to 20min, the sputtering power is 100W to 500W, the pre-sputtering time is 1min to 10min, the sputtering time is 5000s to 15000s, the carrier gas is argon, and the gas flow rate is 10sccm to 60sccm.

[0061] Furthermore, when preparing the MAX phase material layer using magnetron sputtering, the surface roughness Ra of the diffusion barrier layer is controlled to be 0.1 μm to 2 μm.

[0062] In some embodiments, the steps of polishing and cleaning the adhesive layer may also be included.

[0063] In some embodiments, before forming the adhesive layer on the alloy substrate, a surface pretreatment step may be included, specifically, the alloy substrate may be subjected to surface sandblasting or cleaning.

[0064] In another aspect, this application provides a high-temperature resistant component, which includes a component body and a thermal resistance coating formed on the surface of the component body, wherein the thermal resistance coating is the thermal resistance coating described above.

[0065] It is understandable that high-temperature resistant components can be aircraft engine turbine blades, tail nozzles, heat shields, etc.

[0066] To make the objectives, technical solutions, and advantages of this application clearer and more concise, the following specific embodiments are used for illustration, but this application is by no means limited to these embodiments. The embodiments described below are merely preferred embodiments of this application and can be used to describe this application, but should not be construed as limiting the scope of this application. It should be noted that any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

[0067] To better illustrate this application, the following description, in conjunction with specific embodiments, further explains its content. The following are specific embodiments.

[0068] Example 1

[0069] In this embodiment, the MAX phase coating material is specifically Cr2AlC, and the specific preparation steps for the thermal resistance coating are as follows:

[0070] (1) The high-temperature alloy substrate (grade GH3230) was sandblasted. The sandblasting pressure was 4 MPa, and the sandblasting medium was 200-mesh zirconia balls. The sandblasted high-temperature alloy substrate was then ultrasonically cleaned.

[0071] (2) A bonding layer (NiCrAlY) with a thickness of about 50 μm is prepared on the high-temperature alloy substrate obtained in step (1) by multi-arc ion plating technology. The specific parameters of multi-arc ion plating technology are as follows: substrate bias voltage is -30V, furnace temperature is 500℃, rotation speed is 5rpm / min, and arc ignition current is 180A.

[0072] (3) The NiCrAlY bonding layer was polished with sandpaper until the roughness Ra was 0.5μm, and the polished NiCrAlY bonding layer was ultrasonically cleaned.

[0073] (4) An Al2O3 diffusion barrier layer with a thickness of about 2 μm and a surface roughness of 0.5 μm is prepared on the NiCrAlY bonding layer obtained in step (3) by pre-oxidation technology; wherein, the specific parameters of pre-oxidation are as follows: under atmospheric conditions, pre-oxidation is carried out at 950℃ for 3 h;

[0074] (5) A MAX phase material (Cr2AlC) coating with a thickness of approximately 2 μm and a surface roughness of 0.5 μm is prepared on the surface of the Al2O3 diffusion barrier layer obtained in step (4) using magnetron sputtering technology to obtain a thermal resistance coating. The magnetron sputtering technology uses a DC power supply, a substrate temperature of 300℃, a sample bias voltage of 30W, a sputtering power of 300W, a sputtering time of 7000s, and argon as the carrier gas with a flow rate of 30 sccm.

[0075] The infrared reflectance of the MAX phase coating material in the thermal resistance coating prepared in this embodiment varies with wavelength at high temperature as follows: Figure 2 As shown. By Figure 2 It can be seen that the average infrared reflectance of the thermal resistance coating in the infrared band range of 3μm to 14μm is higher than 0.8, indicating that it has excellent infrared radiation reflection characteristics. After oxidation at 1100℃ for 20h, the average infrared reflectance of the thermal resistance coating prepared in this embodiment is still higher than 0.8 in the infrared band range of 3μm to 14μm. Therefore, the coating prepared in this embodiment can withstand a high temperature of 1100℃.

[0076] Example 2

[0077] The preparation method of Example 2 is basically the same as that of Example 1, except that: a YSZ diffusion barrier layer is prepared on the side of the adhesive layer away from the high-temperature alloy substrate using plasma spraying technology instead of forming the diffusion barrier layer by oxidation of the adhesive layer in Example 1. The specific steps are as follows:

[0078] (1) The high-temperature alloy substrate (grade GH3230) was sandblasted. The sandblasting pressure was 4 MPa, and the sandblasting medium was 200-mesh zirconia balls. The sandblasted high-temperature alloy substrate was then ultrasonically cleaned.

[0079] (2) A bonding layer (NiCrAlY) with a thickness of about 50 μm is prepared on the high-temperature alloy substrate obtained in step (1) by multi-arc ion plating technology. The specific parameters of multi-arc ion plating technology are as follows: substrate bias voltage is -30V, furnace temperature is 500℃, rotation speed is 5rpm / min, and arc ignition current is 180A.

[0080] (3) A YSZ diffusion barrier layer with a thickness of 100 μm was prepared on the NiCrAlY bonding layer obtained in step (2) by plasma spraying technology. The specific process parameters of plasma spraying are as follows: plasma power 50KW, spraying distance 60mm, main gas is Ar with a flow rate of 80SCFH, auxiliary gas is He with a flow rate of 40SCFH, carrier gas is Ar with a flow rate of 3SCFH, and powder feeding rate is 2% RPM;

[0081] (4) Grind the YSZ diffusion barrier layer with sandpaper until its roughness Ra is 0.5μm, and then perform ultrasonic cleaning on the ground YSZ diffusion barrier layer.

[0082] (5) A MAX phase material (Cr2AlC) coating with a thickness of approximately 2 μm and a surface roughness of 0.5 μm is prepared on the surface of the YSZ diffusion barrier layer obtained in step (4) using magnetron sputtering technology to obtain a thermal resistance coating. The magnetron sputtering technology uses a DC power supply, a substrate temperature of 300℃, a sample bias voltage of 30W, a sputtering power of 300W, a sputtering time of 7000s, and argon as the carrier gas with a flow rate of 30 sccm.

[0083] In this embodiment, the MAX thermal resistance coating exhibits an average infrared reflectance higher than 0.75 in the infrared band range of 3μm to 14μm, indicating its excellent infrared radiation reflection characteristics. In addition to preventing interdiffusion between the MAX phase layer and the adhesive layer, YSZ, due to its low thermal conductivity, also provides a certain degree of thermal protection to the alloy substrate and possesses high-temperature resistance.

[0084] Example 3

[0085] The preparation method of Example 3 is basically the same as that of Example 1, except that Ti2AlC is used instead of Cr2AlC in Example 1; the specific steps are as follows:

[0086] (1) The high-temperature alloy substrate (grade GH3230) was sandblasted. The sandblasting pressure was 4 MPa, and the sandblasting medium was 200-mesh zirconia balls. The sandblasted high-temperature alloy substrate was then ultrasonically cleaned.

[0087] (2) A bonding layer (PtNiAl) with a thickness of about 50 μm is prepared on the high-temperature alloy substrate obtained in step (1) by multi-arc ion plating technology. The specific parameters of multi-arc ion plating technology are as follows: substrate bias voltage is -30V, furnace temperature is 500℃, rotation speed is 5rpm / min, and arc ignition current is 180A.

[0088] (3) The PtNiAl bonding layer was sanded with sandpaper until the roughness Ra was 0.5 μm and then ultrasonically cleaned.

[0089] (4) An Al2O3 diffusion barrier layer with a thickness of about 2 μm and a surface roughness of 0.5 μm is prepared on the PtNiAl bonding layer obtained in step (3) by pre-oxidation technology; wherein, the specific parameters of pre-oxidation are as follows: under atmospheric conditions, the pre-oxidation temperature is controlled at 950℃ and the time is 3h;

[0090] (5) A MAX phase material (Ti2AlC) coating with a thickness of approximately 2 μm and a surface roughness of 0.5 μm is prepared on the surface of the Al2O3 diffusion barrier layer obtained in step (4) using magnetron sputtering technology to obtain a thermal resistance coating. The magnetron sputtering technology uses a DC power supply, a substrate temperature of 300℃, a sample bias voltage of 30W, a sputtering power of 300W, a sputtering time of 7000s, and argon as the carrier gas with a flow rate of 30 sccm.

[0091] The thermal resistance coating prepared in this embodiment has an average infrared reflectance of over 0.68 in the infrared band range of 3μm to 14μm, indicating that it has excellent infrared radiation reflection characteristics.

[0092] Example 4

[0093] The preparation method of Example 4 is basically the same as that of Example 1, except that Ti3AlC2 is used instead of Cr2AlC in Example 1; the specific steps are as follows:

[0094] (1) The high-temperature alloy substrate (grade GH3230) was sandblasted. The sandblasting pressure was 4 MPa, and the sandblasting medium was 200-mesh zirconia balls. The sandblasted high-temperature alloy substrate was then ultrasonically cleaned.

[0095] (2) A bonding layer (NiCrAlY) with a thickness of about 50 μm is prepared on the high-temperature alloy substrate obtained in step (1) by multi-arc ion plating technology. The specific parameters of multi-arc ion plating technology are as follows: substrate bias voltage is -30V, furnace temperature is 500℃, rotation speed is 5rpm / min, and arc ignition current is 180A.

[0096] (3) The NiCrAlY bonding layer was sanded with sandpaper until the roughness Ra was 0.5μm and then ultrasonically cleaned.

[0097] (4) An Al2O3 diffusion barrier layer with a thickness of about 2 μm and a surface roughness of 0.5 μm is prepared on the NiCrAlY bonding layer obtained in step (3) by pre-oxidation technology; wherein, the specific parameters of pre-oxidation are as follows: under atmospheric conditions, the pre-oxidation temperature is controlled at 950℃ for 3 hours;

[0098] (5) A MAX phase material (Ti3AlC2) coating with a thickness of approximately 2 μm and a surface roughness of 0.5 μm is prepared on the surface of the Al2O3 diffusion barrier layer obtained in step (4) using magnetron sputtering technology to obtain a thermal resistance coating. The magnetron sputtering technology uses a DC power supply, a substrate temperature of 300℃, a sample bias voltage of 30W, a sputtering power of 300W, a sputtering time of 7000s, and argon as the carrier gas with a flow rate of 30 sccm.

[0099] The thermal resistance coating prepared in this embodiment has an average infrared reflectance of over 0.7 in the infrared band range of 3μm to 14μm, indicating that it has excellent infrared radiation reflection characteristics.

[0100] Example 5

[0101] The preparation method of Example 5 is basically the same as that of Example 1, except that Ti2AlN is used instead of Cr2AlC in Example 1; the specific steps are as follows:

[0102] (1) The high-temperature alloy substrate (grade GH3230) was sandblasted. The sandblasting pressure was 4 MPa, and the sandblasting medium was 200-mesh zirconia balls. The sandblasted high-temperature alloy substrate was then ultrasonically cleaned.

[0103] (2) A bonding layer (NiCrAlY) with a thickness of about 50 μm is prepared on the high-temperature alloy substrate obtained in step (1) by multi-arc ion plating technology. The specific parameters of multi-arc ion plating technology are as follows: substrate bias voltage is -30V, furnace temperature is 500℃, rotation speed is 5rpm / min, and arc ignition current is 180A.

[0104] (3) The NiCrAlY bonding layer was polished with sandpaper until the roughness Ra was 0.5μm, and the polished NiCrAlY bonding layer was ultrasonically cleaned.

[0105] (4) An Al2O3 diffusion barrier layer with a thickness of 2 μm and a surface roughness of 0.5 μm is prepared on the NiCrAlY bonding layer obtained in step (3) by pre-oxidation technology; wherein, the specific parameters of pre-oxidation are as follows: under atmospheric conditions, the pre-oxidation temperature is controlled at 950℃ for 3 hours;

[0106] (5) A MAX phase material (Ti2AlN) coating with a thickness of approximately 2 μm and a surface roughness of 0.5 μm is prepared on the surface of the Al2O3 diffusion barrier layer obtained in step (4) using magnetron sputtering technology to obtain a thermal resistance coating. The magnetron sputtering technology uses a DC power supply, a substrate temperature of 300℃, a sample bias voltage of 30W, a sputtering power of 300W, a sputtering time of 7000s, and argon as the carrier gas with a flow rate of 30 sccm.

[0107] The thermal resistance coating prepared in this embodiment has an average infrared reflectance of over 0.65 in the infrared band range of 3μm to 14μm, indicating that it has excellent infrared radiation reflection characteristics.

[0108] Example 6

[0109] The preparation process of this embodiment is basically the same as that of Example 1, except that the thickness of the MAX phase material layer in step (5) is about 10 μm and the surface roughness is 1 μm. The thermal resistance coating prepared in this embodiment has an average infrared reflectance of more than 0.8 in the infrared band range of 3 μm to 14 μm, indicating that it has excellent infrared radiation reflection characteristics.

[0110] Example 7

[0111] The preparation process of this embodiment is basically the same as that of Embodiment 1, except that the method for preparing the MAX phase material layer in step (5) is a low-pressure plasma spraying process, and the specific steps are as follows:

[0112] A MAX phase material (Cr2AlC) coating with a thickness of approximately 20 μm was prepared on the surface of the Al2O3 diffusion barrier layer obtained in step (4) using a low-pressure plasma spraying process. The surface roughness of the MAX phase material (Cr2AlC) coating was then controlled to 0.5 μm by sanding, resulting in a final thermal resistance coating thickness of approximately 15 μm. The specific parameters of the low-pressure plasma spraying process are as follows: spraying current 1000 A, spraying distance 900 mm, substrate temperature 600 °C, and powder feed rate 2% RPM.

[0113] The thermal resistance coating prepared in this embodiment has an average infrared reflectance of over 0.8 in the infrared band range of 3μm to 14μm, indicating that it has excellent infrared radiation reflection characteristics.

[0114] Comparative Example 1

[0115] The preparation method of Comparative Example 1 is basically the same as that of Example 1, except that Ti3SiC2 is used instead of Cr2AlC in Example 1; the specific steps are as follows:

[0116] (1) The high-temperature alloy substrate (grade GH3230) was sandblasted. The sandblasting pressure was 4 MPa, and the sandblasting medium was 200-mesh zirconia balls. The sandblasted high-temperature alloy substrate was then ultrasonically cleaned.

[0117] (2) A bonding layer (NiCrAlY) with a thickness of about 50 μm is prepared on the high-temperature alloy substrate obtained in step (1) by multi-arc ion plating technology. The specific parameters of multi-arc ion plating technology are as follows: substrate bias voltage is -30V to -50V, furnace temperature is 400℃ to 500℃, rotation speed is 5 rpm / min, and arc ignition current is 180A.

[0118] (3) The NiCrAlY bonding layer was sanded with sandpaper until the roughness Ra was 0.5μm and then ultrasonically cleaned.

[0119] (4) An Al2O3 diffusion barrier layer with a thickness of about 2 μm and a surface roughness of 0.5 μm is prepared on the NiCrAlY bonding layer obtained in step (3) by pre-oxidation technology; wherein, the specific parameters of pre-oxidation are as follows: under atmospheric conditions, the pre-oxidation temperature is controlled at 950℃ and the time is 3h;

[0120] (5) A MAX phase material (Ti3SiC2) coating with a thickness of approximately 2 μm and a surface roughness of 0.5 μm is prepared on the surface of the Al2O3 diffusion barrier layer obtained in step (3) using magnetron sputtering technology to obtain a thermal resistance coating. The magnetron sputtering technology uses a DC power supply, a substrate temperature of 300℃, a sample bias voltage of 30W, a sputtering power of 300W, a sputtering time of 7000s, and argon as the carrier gas with a flow rate of 30 sccm.

[0121] The thermal resistance coating prepared in this comparative example has an average infrared reflectance of only 0.55 in the infrared band range of 3μm to 14μm, indicating that its infrared reflectance performance is poor after high-temperature oxidation.

[0122] The raw materials used in the preparation methods of Examples 1-7 and Comparative Example 1 are listed in Table 1 below:

[0123] Table 1

[0124]

[0125]

[0126] The thermal resistance coatings prepared in Examples 1-7 and Comparative Example 1 were subjected to performance tests, and the test results are shown in Table 2 below.

[0127] Infrared reflectivity was tested according to the national standard GJB5023.

[0128] High temperature resistance test: The thermal resistance coating was kept at 1100℃ for 20 hours in an atmospheric atmosphere, and the infrared reflectance of the thermal resistance coating was measured.

[0129] Table 2

[0130]

[0131] As shown in Table 2 above, a comparison of the reflectance data of the thermal resistance coatings prepared in Examples 1-7 and Comparative Example 1 after oxidation reveals that the thermal resistance coatings prepared using the MAX phase material in the examples all exhibit high average infrared reflectance. Moreover, compared with other examples, the thermal resistance coating prepared in Example 1 using Cr2AlC as the MAX phase material layer has the best infrared radiation reflection characteristics and high-temperature stability.

[0132] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0133] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims, and the specification and drawings can be used to interpret the scope of the claims.

Claims

1. A thermal resistance coating, characterized in that, The coating comprises an adhesive layer, a diffusion barrier layer, and a MAX phase material layer. The diffusion barrier layer is disposed on the adhesive layer, and the MAX phase material layer is disposed on the surface of the diffusion barrier layer opposite to the adhesive layer, and the MAX phase material layer is the outermost layer of the thermal resistance coating. The chemical formula of the MAX phase material is M. (n+1) AX n Wherein, 2≤n≤4, M is selected from transition metal elements, A is selected from aluminum elements, and X is selected from carbon elements or nitrogen elements; the diffusion barrier layer is a metal oxide layer formed by oxidation of the adhesive layer, or the diffusion barrier layer is a Gd2Zr2O7 ceramic material layer; the average infrared reflectance of the thermal resistance coating in the infrared band range of 3μm~14μm is greater than 0.

65.

2. The thermal resistance coating as described in claim 1, characterized in that, The MAX phase material is selected from one or more of Cr2AlC, Ti2AlC, Ti2AlN, Ti3AlC2 and Ti4AlN3.

3. The thermal resistance coating as described in claim 2, characterized in that, The MAX phase material is selected from one or more of Cr2AlC, Ti2AlC, Ti3AlC2 and Ti2AlN.

4. The thermal resistance coating as described in claim 1, characterized in that, The adhesive layer is made of PtAl, PtNiAl, PtReAl, NiCrAlY, CoCrAlY, or NiCoCrAlY.

5. The thermal resistance coating according to any one of claims 1 to 4, characterized in that, The thickness of the MAX phase material layer is 0.5 μm to 20 μm.

6. The thermal resistance coating according to any one of claims 1 to 4, characterized in that, The thickness of the diffusion barrier layer is 1 μm to 150 μm.

7. The thermal resistance coating according to any one of claims 1 to 4, characterized in that, The thickness of the adhesive layer is 5 μm to 70 μm.

8. A method for preparing a thermal resistance coating as described in claim 1, characterized in that, Includes the following steps: A bonding layer is prepared on the surface of the alloy substrate; A diffusion barrier layer is formed on the surface of the adhesive layer; the diffusion barrier layer is a metal oxide layer formed by oxidation of the adhesive layer, or the diffusion barrier layer is a Gd2Zr2O7 ceramic material layer; as well as A MAX phase material layer is formed on the surface of the diffusion barrier layer opposite to the adhesive layer as the outermost layer of the thermal resistance coating, wherein the chemical formula of the MAX phase material is M (n+1) AX n Where 2≤n≤4, M is selected from transition metal elements, A is selected from aluminum elements, and X is selected from carbon or nitrogen elements; The thermal resistance coating has an average infrared reflectance greater than 0.65 in the infrared band range of 3μm to 14μm.

9. The preparation method according to claim 8, characterized in that, The surface roughness Ra of the adhesive layer is controlled to be 0.1 μm to 2 μm.

10. The preparation method according to claim 8, characterized in that, The method for forming a diffusion barrier layer on the surface of the adhesive layer includes plasma spraying or physical vapor deposition.

11. The preparation method according to claim 10, characterized in that, The surface roughness Ra of the diffusion barrier layer is controlled to be 0.1 μm to 2 μm.

12. The preparation method according to any one of claims 8 to 11, characterized in that, The method for forming the MAX phase material layer is magnetron sputtering.

13. The preparation method according to any one of claims 8 to 11, characterized in that, The method for forming the MAX phase material layer is a low-pressure plasma spraying process.

14. The preparation method according to claim 13, characterized in that, The surface roughness Ra of the MAX phase material layer is controlled to be 0.1 μm to 2 μm.

15. A high-temperature resistant component, characterized in that, It includes a component body and a thermal resistance coating formed on the surface of the component body, wherein the thermal resistance coating is the thermal resistance coating according to any one of claims 1 to 7.

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