一种具备过压泄荷功能的磨抛一体晶片减薄机
By using a constant pressure cylinder in the wafer thinning machine to achieve overpressure relief protection and functional integration of the spindle unit, the problems of high breakage rate and increased cost in silicon carbide wafer processing are solved, and the processing accuracy and equipment efficiency are improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- DALIAN UNIV OF TECH
- Filing Date
- 2024-03-29
- Publication Date
- 2026-07-17
AI Technical Summary
Existing wafer thinning machines lack effective overvoltage protection measures when processing ultrahard materials such as silicon carbide, resulting in a high breakage rate. Furthermore, the multi-axis structure increases equipment costs and the difficulty of debugging and maintenance.
A constant pressure cylinder is used as the overpressure relief protection element of the spindle unit. By adjusting the cylinder's air intake pressure and direction, the spindle unit can be floated or rigidly connected in the Z direction. Combined with the optimized arrangement of the center support point and guide rail, the grinding and polishing functions are integrated.
It reduces the breakage rate, decreases equipment costs, improves the rigidity and machining accuracy of the spindle system, and simplifies the debugging and maintenance of multi-axis equipment.
Smart Images
Figure CN118106864B_ABST