Method and apparatus for determining sub-chip of quantum chip, and electronic device
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- BEIJING BAIDU NETCOM SCI & TECH CO LTD
- Filing Date
- 2023-10-20
- Publication Date
- 2026-06-12
AI Technical Summary
In quantum computing, how to efficiently select a portion of the qubits on a quantum chip to form a sub-chip, ensuring optimal overall performance and meeting the requirements of computing tasks, especially under topological constraints, is a problem that existing technologies struggle to solve effectively.
By determining the pre-pattern of the quantum chip, adopting a square tessellation configuration with a rectangular outline, calculating the connectivity of candidate patterns, selecting target sub-chips from them, constructing the topological structure diagram of candidate sub-chips using the chip information and quantum gate information of the quantum chip, and selecting the optimal sub-chip by combining distance weights.
This technology enables efficient selection of the best-performing sub-chip on a quantum chip, reducing the number of repetitive calculations. It is applicable to quantum chips with different structures, improving computational efficiency and meeting the requirements of computational tasks.
Smart Images
Figure CN118114778B_ABST
Abstract
Claims
1. A method for determining a sub-chip of a quantum chip, comprising: Determine the number of qubits required based on the computational task; In response to the quantity meeting a preset condition, a target configuration consisting of multiple node identifiers is determined; Based on the pre-detailed pattern of the quantum chip, multiple candidate patterns corresponding to the target configuration are determined. The pre-detailed pattern is a square tessellation pattern with a rectangular outline. The pre-detailed pattern includes multiple first nodes corresponding to multiple qubits of the quantum chip. Each candidate pattern includes multiple second nodes corresponding to some qubits of the quantum chip. Based on the target configuration, determine the connectivity algorithm; Using the connectivity algorithm, the connectivity of multiple candidate sub-chips corresponding to the multiple candidate characterization maps is calculated based on the qubits corresponding to the multiple second nodes on the characterization paths of the multiple candidate characterization maps. Based on the connectivity, a target sub-chip is determined from the plurality of candidate sub-chips; Specifically, the connectivity algorithm is used to calculate the connectivity of multiple candidate sub-chips corresponding to the multiple candidate characterization maps based on the qubits corresponding to the multiple second nodes on the characterization paths of the multiple candidate characterization maps, including: Based on the qubits corresponding to the multiple second nodes on the characterization path of the multiple candidate characterization patterns, determine the qubits located at both ends on the characterization path of the multiple candidate characterization patterns; Based on the distance weights between multiple qubits in the pre-etched pattern, the first distance weight between the qubits located at the two endpoints is determined; Using the connectivity algorithm, the connectivity of multiple candidate sub-chips corresponding to the multiple candidate characterization maps is calculated based on the first distance weight.
2. The method according to claim 1, wherein, In response to the quantity satisfying a preset condition, a target configuration consisting of multiple node identifiers is determined, including: In response to the quantity meeting a preset condition, the arrangement and connection method of multiple node identifiers are determined; Based on the arrangement and connection methods, at least one target configuration consisting of the plurality of node identifiers is determined.
3. The method according to claim 2, wherein, In response to the quantity meeting a preset condition, the arrangement and connection method of multiple node identifiers are determined, including: Based on the computational task, determine the target algorithm; In response to the quantity satisfying a preset quantity and the target algorithm satisfying a preset algorithm, the arrangement and connection methods of multiple node identifiers are determined; The preset algorithm is either a variable quantum algorithm or a quantum approximation optimization algorithm.
4. The method according to any one of claims 1 to 3, wherein, The target configuration is a circular or chain-like configuration.
5. The method according to claim 1, wherein, Based on the pre-pattern of the quantum chip, multiple candidate patterns corresponding to the target configuration are determined, including: The traversal rules are determined based on the number of rows and columns of the pre-drawn pattern of the quantum chip and the number of qubits contained in the quantum chip. According to the traversal rules, the pre-characterized map is traversed to obtain multiple candidate characterized maps corresponding to the target configuration.
6. The method according to claim 5, wherein, According to the traversal rules, the pre-characterized map is traversed to obtain multiple candidate characterized maps corresponding to the target configuration, including: According to the traversal rules, the starting first node, initial shape, and direction of the single step of traversal are determined based on the pre-characterized map, wherein the direction of the single step is parallel to one side of the rectangular outline of the pre-characterized map; Based on the initial first node, the initial shape, and the direction of the single step, the pre-characterized map is traversed to obtain multiple candidate characterized maps corresponding to the target configuration.
7. The method according to claim 6, wherein, Based on the initial first node, the initial shape, and the direction of the single step, the pre-characterized map is traversed to obtain multiple candidate characterized maps corresponding to the target configuration, including: The pre-delineated map is traversed based on the initial first node, the initial shape, and the direction of the single step; The traversal ends when the number of multiple characterization maps corresponding to the target configuration obtained by the traversal meets the threshold, thus obtaining multiple candidate characterization maps corresponding to the target configuration.
8. The method according to claim 1, wherein, Determining the first distance weight between the qubits located at the two endpoints based on the distance weight between multiple qubits in the pre-defined pattern includes: Based on the distance weights between multiple qubits in the pre-etched pattern, a second distance weight is determined between every two adjacent qubits of the quantum chip; The first distance weight between the qubits located at the two ends is determined based on the second distance weight.
9. The method according to claim 1, wherein, Determining the first distance weight between the qubits located at the two endpoints based on the distance weight between multiple qubits in the pre-defined pattern includes: Based on the distance weights between multiple qubits in the pre-characterized pattern, a third distance weight is determined between every two adjacent qubits on the characterization path of the multiple candidate characterization patterns. The first distance weight between the qubits located at the two ends is determined based on the third distance weight.
10. The method according to claim 1, wherein, Using the connectivity algorithm, based on the qubits corresponding to the multiple second nodes on the characterization paths of the multiple candidate characterization maps, the connectivity of the multiple candidate sub-chips corresponding to the multiple candidate characterization maps is calculated, further comprising: Based on the distance weights between multiple qubits in the pre-characterized pattern, a third distance weight is determined between every two adjacent qubits on the characterization path of the multiple candidate characterization patterns. The average distance weight is determined based on the third distance weight. Using the connectivity algorithm, the connectivity of multiple candidate sub-chips corresponding to the multiple candidate characterization maps is calculated based on the average distance weight.
11. The method according to claim 10, wherein, Based on the distance weights between multiple qubits in the pre-delineated pattern, a third distance weight is determined between every two adjacent qubits on the marking path of the multiple candidate marking patterns, including: Based on the distance weights between multiple qubits in the pre-etched pattern, a second distance weight is determined between every two adjacent qubits of the quantum chip; Based on the second distance weight, a third distance weight is determined between each pair of adjacent qubits on the characterization path of the plurality of candidate characterization maps.
12. The method according to any one of claims 1 to 3, 5 to 11, further comprising: Based on the chip information of the quantum chip, the number of qubits and the quantum gate information of the quantum chip are determined, wherein the quantum gate information characterizes the communication relationship between each qubit of the quantum chip; Based on the quantity information and the quantum gate information, a first topological structure diagram of the quantum chip is determined, wherein the first topological structure diagram is composed of a plurality of first nodes representing each quantum bit and edges representing the communication relationship between every two directly adjacent quantum bits of the quantum chip; Based on the quantum gate information, determine the distance weights between each qubit; and Based on the distance weights and the first topological structure diagram, a pre-detailed pattern of the quantum chip is obtained.
13. The method according to claim 12, wherein, Based on the quantum gate information, the distance weights between each qubit are determined, including: Based on the quantum gate information, determine every two directly adjacent qubits in the quantum chip; Based on the chip information, determine the fidelity of the two-qubit gate between every two directly adjacent qubits; Based on the fidelity, the distance weights between each quantum bit are determined.
14. The method according to claim 12, wherein, Based on the quantity information and the quantum gate information, the first topological structure diagram of the quantum chip is determined, including: Based on the quantity information and the quantum gate information, the target drawing function is determined; Based on the target drawing function, a first topological structure diagram is used to determine the target structural shape of the quantum chip.
15. A device for determining a sub-chip of a quantum chip, comprising: The first determining module is used to determine the number of qubits required based on the computational task. The second determining module is used to determine a target configuration consisting of multiple node identifiers in response to the quantity meeting a preset condition. The third determining module is used to determine multiple candidate patterns corresponding to the target configuration based on the pre-pattern of the quantum chip. The pre-pattern is a square tessellation pattern with a rectangular outline. The pre-pattern includes multiple first nodes corresponding to multiple qubits of the quantum chip. Each candidate pattern includes multiple second nodes corresponding to some qubits of the quantum chip. The fourth determining module includes a fourth determining submodule and a calculation submodule. The fourth determining submodule is used to determine a connectivity algorithm based on the target configuration. The calculation submodule is used to use the connectivity algorithm to calculate the connectivity of multiple candidate sub-chips corresponding to the multiple candidate characterization maps based on the qubits corresponding to the multiple second nodes on the characterization paths of the multiple candidate characterization maps. The fifth determining module is used to determine the target sub-chip from the plurality of candidate sub-chips based on the connectivity. The calculation submodule is used for: The second determining unit is used to determine the qubits located at both ends of the characterization path of the multiple candidate characterization patterns based on the qubits corresponding to the multiple second nodes on the characterization path of the multiple candidate characterization patterns. The third determining unit is used to determine the first distance weight between the qubits located at the two endpoints based on the distance weight between the multiple qubits of the pre-etched pattern; The first computing unit is used to calculate the connectivity of the multiple candidate sub-chips corresponding to the multiple candidate characterization maps based on the first distance weight using the connectivity algorithm.
16. The apparatus according to claim 15, wherein, The second determining module includes: The first determining submodule is used to determine the arrangement and connection method of multiple node identifiers in response to the quantity meeting the preset conditions; The second determining submodule is used to determine at least one target configuration composed of the plurality of node identifiers based on the arrangement and the connection method.
17. The apparatus according to claim 16, wherein, The first determining submodule is used for Based on the computational task, determine the target algorithm; In response to the quantity satisfying a preset quantity and the target algorithm satisfying a preset algorithm, the arrangement and connection methods of multiple node identifiers are determined; The preset algorithm is either a variable quantum algorithm or a quantum approximation optimization algorithm.
18. The apparatus according to any one of claims 15 to 17, wherein, The target configuration is a circular or chain-like configuration.
19. The apparatus according to claim 15, wherein, The third determining module includes: The third determining submodule is used to determine the traversal rules based on the number of rows and columns of the pre-etched pattern of the quantum chip and the number of qubits contained in the quantum chip; The traversal submodule is used to traverse the pre-characterized map according to the traversal rules to obtain multiple candidate characterized maps corresponding to the target configuration.
20. The apparatus according to claim 19, wherein, The traversal submodule includes: The first determining unit is configured to determine, based on the traversal rules and the pre-characterized map, the starting first node, the initial shape, and the direction of the single step of traversal, wherein the direction of the single step is parallel to one side of the rectangular outline of the pre-characterized map. The traversal unit is used to traverse the pre-characterized map according to the initial first node, the initial shape, and the direction of the single step, to obtain multiple candidate characterized maps corresponding to the target configuration.
21. The apparatus according to claim 20, wherein, The traversal unit is used for: The pre-delineated map is traversed based on the initial first node, the initial shape, and the direction of the single step; The traversal ends when the number of multiple characterization maps corresponding to the target configuration obtained by the traversal meets the threshold, thus obtaining multiple candidate characterization maps corresponding to the target configuration.
22. The apparatus according to claim 15, wherein, The third determining unit is further configured to: Based on the distance weights between multiple qubits in the pre-etched pattern, a second distance weight is determined between every two adjacent qubits of the quantum chip; The first distance weight between the qubits located at the two ends is determined based on the second distance weight.
23. The apparatus according to claim 15, wherein, The third determining unit is further configured to: Based on the distance weights between multiple qubits in the pre-characterized pattern, a third distance weight is determined between every two adjacent qubits on the characterization path of the multiple candidate characterization patterns. The first distance weight between the qubits located at the two ends is determined based on the third distance weight.
24. The apparatus according to claim 15, wherein, The calculation submodule is also used for: The fourth determining unit is used to determine the third distance weight between each pair of adjacent qubits on the marking path of the plurality of candidate marking patterns based on the distance weight between the plurality of qubits in the pre-marking pattern. The fifth determining unit is used to determine the average distance weight based on the third distance weight; The second calculation unit is used to calculate the connectivity of multiple candidate sub-chips corresponding to the multiple candidate characterization maps based on the average distance weight using the connectivity algorithm.
25. The apparatus according to claim 24, wherein, The fourth determining unit is used for: Based on the distance weights between multiple qubits in the pre-etched pattern, a second distance weight is determined between every two adjacent qubits of the quantum chip; Based on the second distance weight, a third distance weight is determined between each pair of adjacent qubits on the characterization path of the plurality of candidate characterization maps.
26. The apparatus according to any one of claims 15 to 17, 19 to 25, further comprising: The sixth determining module is used to determine the number of qubits and the quantum gate information of the quantum chip based on the chip information of the quantum chip, wherein the quantum gate information characterizes the communication relationship between each qubit of the quantum chip; The seventh determining module is used to determine a first topological structure diagram of the quantum chip based on the quantity information and the quantum gate information, wherein the first topological structure diagram is composed of a plurality of first nodes representing each quantum bit and edges representing the communication relationship between every two directly adjacent quantum bits of the quantum chip; The eighth determining module is used to determine the distance weights between the qubits based on the quantum gate information; and A generation module is used to obtain a pre-detailed pattern of the quantum chip based on the distance weights and the first topology diagram.
27. The apparatus according to claim 26, wherein, The eighth determining module is used for: Based on the quantum gate information, determine every two directly adjacent qubits in the quantum chip; Based on the chip information, determine the fidelity of the two-qubit gate between every two directly adjacent qubits; Based on the fidelity, the distance weights between each quantum bit are determined.
28. The apparatus according to claim 26, wherein, The seventh determination module is used for: Based on the quantity information and the quantum gate information, the target drawing function is determined; Based on the target drawing function, a first topological structure diagram is used to determine the target structural shape of the quantum chip.
29. An electronic device comprising: At least one processor; as well as A memory communicatively connected to the at least one processor; wherein, The memory stores instructions that can be executed by the at least one processor to enable the at least one processor to perform the method of any one of claims 1 to 14.
30. A non-transitory computer-readable storage medium storing computer instructions, wherein, The computer instructions are used to cause the computer to perform the method according to any one of claims 1 to 14.
31. A computer program product comprising a computer program that, when executed by a processor, implements the method according to any one of claims 1 to 14.