Gold finger defect review method and device, equipment and storage medium

Abstract

The application relates to a gold finger defect review method, device, equipment and storage medium, which is applied to the field of gold finger defect detection and comprises the following steps: acquiring a gold finger defect image to be reviewed, wherein the gold finger defect image contains a plurality of gold fingers; recognizing defects in the gold finger defect image and generating defect contours corresponding to the defects; determining a target gold finger where the defect contour is located in the gold finger defect image and generating a gold finger contour corresponding to the target gold finger; determining a caliper according to the specific position of the defect contour relative to the gold finger contour; and reviewing the type of the defect according to the caliper, wherein the type of the defect includes an acceptance defect and a rejection defect. The application has the technical effect of reducing the over-checking rate during gold finger defect detection.

Description

[0001] This application is a divisional application. The original application has the application number 202310721774.2 and the application date is June 16, 2023. The invention is entitled "Method, Apparatus, Equipment and Storage Medium for Reviewing Defects in Gold Fingers". Technical Field

[0002] This application relates to the technical field of gold finger defect detection, and in particular to a gold finger defect verification method, apparatus, equipment and storage medium. Background Technology

[0003] The gold finger area is a region on a printed circuit board (PCB) composed of multiple gold-colored conductive contacts used for signal transmission. It is called a "gold finger" because its surface is gold-plated and the conductive contacts are arranged in a finger-like pattern. In a PCB, the gold finger serves as the exit point for external network connections and is a critical area affecting the PCB's quality.

[0004] Currently, when inspecting defects in the gold finger area, an automatic optical inspection machine is usually used to capture inspection images of the gold finger area. Then, by referring to fixed calipers, the size of the defect point in the inspection image is used to determine whether the defect is an acceptable defect or a rejection defect.

[0005] However, for some printed circuit boards with inconsistent gold finger widths, this method of judging defects based on the size of the defect point by referring to fixed gauges can lead to some acceptable defects being mistakenly judged as rejected defects, resulting in a high pass rate. Summary of the Invention

[0006] To help reduce the over-detection rate during the gold finger defect detection process, this application provides a gold finger defect verification method, apparatus, equipment, and storage medium.

[0007] Firstly, this application provides a method for reviewing defects in gold fingers, employing the following technical solution: The method includes:

[0008] Obtain a defect image of a gold finger to be reviewed, wherein the defect image contains a plurality of gold fingers;

[0009] Identify defects in the gold finger defect image and generate a defect contour corresponding to the defect;

[0010] Identify the target gold finger containing the defect contour within the gold finger defect image, and generate a gold finger contour corresponding to the target gold finger;

[0011] The gauge is determined based on the specific position of the defect profile relative to the gold finger profile.

[0012] The type of defect is verified according to the card specifications. The types of defects include acceptance defects and rejection defects.

[0013] In one specific implementation, determining the gauge based on the specific position of the defect profile relative to the gold finger profile includes:

[0014] The gold finger contour is divided into several core regions based on the spacing between opposite sides of the gold finger contour.

[0015] Determine the target verification area where the defect contour is located;

[0016] The gauge is determined based on the spacing between opposite sides of the target verification area and the preset gauge coefficient.

[0017] In one specific implementation scheme, the side spacing of the target verification area includes:

[0018] If the spacing between opposite sides of the target verification area is a unique value, then the unique value is set as the spacing between opposite sides of the target verification area;

[0019] If the spacing between opposite sides of the target verification region is not unique, then the minimum spacing between opposite sides in the target verification region is set as the spacing between opposite sides of the target verification region.

[0020] In one specific implementation, the type of defect reviewed according to the card specification includes:

[0021] The direction of the line segments containing the parallel opposite sides within the outline of the gold finger is set as the y direction, and the direction perpendicular to the y direction is set as the x direction.

[0022] Determine the maximum diameter of the defect area along the x-direction and compare the maximum diameter with the caliper gauge; if the maximum diameter is greater than the caliper gauge, then determine that the defect type corresponding to the defect area is a rejection defect; otherwise, determine that the defect type corresponding to the defect area is an acceptance defect.

[0023] In one specific implementation, determining the gauge based on the specific position of the defect profile relative to the gold finger profile includes:

[0024] The direction of the line segments containing the parallel opposite sides within the outline of the gold finger is set as the y direction, and the direction perpendicular to the y direction is set as the x direction.

[0025] Identify the two endpoints of the defect region with the largest distance along the y-direction, and draw two parallel lines along the x-direction that pass through the two endpoints respectively;

[0026] The area between the two parallel lines that overlaps with the outline of the gold finger is defined as the verification area;

[0027] The gauge is determined based on the spacing of the verification area along the x-direction and the preset gauge coefficient.

[0028] In one specific implementation scheme, the spacing of the verification region along the x-direction includes:

[0029] If the spacing of the verification area along the x-direction is a unique value, then the unique value is set as the spacing of the verification area along the x-direction;

[0030] If the spacing of the verification region along the x-direction is not unique, then the minimum spacing of the verification region along the x-direction is set to the spacing of the verification region along the x-direction.

[0031] In one specific implementation, the type of defect reviewed according to the card specification includes:

[0032] Determine the maximum diameter of the defect area along the x-direction and compare the maximum diameter with the caliper gauge; if the maximum diameter is greater than the caliper gauge, then determine that the defect type corresponding to the defect area is a rejection defect; otherwise, determine that the defect type corresponding to the defect area is an acceptance defect.

[0033] Secondly, this application provides a gold finger defect verification device, which adopts the following technical solution: the device includes:

[0034] The defect image acquisition module is used to acquire defect images of gold fingers to be reviewed, wherein the gold finger defect image contains a number of gold fingers;

[0035] The defect contour generation module is used to identify defects in the gold finger defect image and generate defect contours corresponding to the defects.

[0036] The gold finger contour generation module is used to determine the target gold finger where the defect contour is located within the gold finger defect image, and generate a gold finger contour corresponding to the target gold finger.

[0037] The defect gauge determination module is used to determine the gauge based on the specific position of the defect contour relative to the gold finger contour.

[0038] The defect type determination module is used to verify the type of the defect according to the card specification. The defect type includes acceptable defects and rejection defects.

[0039] Thirdly, this application provides a computer device that adopts the following technical solution: it includes a memory and a processor, wherein the memory stores a computer program that can be loaded by the processor and executed as any of the above-described gold finger defect verification methods.

[0040] Fourthly, this application provides a computer-readable storage medium that stores a computer program capable of being loaded by a processor and executing any of the above-mentioned gold finger defect verification methods.

[0041] In summary, this application has the following beneficial technical effects:

[0042] This application's solution involves re-inspecting gold finger defects obtained during the initial inspection. During the re-inspection, the gauge is determined based on the specific position of the defect relative to the target gold finger. This ensures that for printed circuit boards with inconsistent gold finger widths, the gauge corresponding to different width areas of the gold finger will be different. In other words, the gauge corresponding to different width areas of the gold finger is adapted to the width of the gold finger, thereby reducing the possibility of some acceptable defects being mistakenly judged as rejection defects and lowering the pass rate during gold finger defect detection. Attached Figure Description

[0043] Figure 1 This is a schematic diagram used to illustrate the existing methods for determining the types of defects in gold fingers;

[0044] Figure 2 This is a flowchart of the gold finger defect verification method in the embodiments of this application;

[0045] Figure 3 This is a schematic diagram illustrating the gold finger region division method in an embodiment of this application;

[0046] Figure 4 This is a schematic diagram illustrating the direction division method in an embodiment of this application;

[0047] Figure 5 This is a schematic diagram illustrating the method for determining the review area in an embodiment of this application;

[0048] Figure 6 This is a schematic diagram illustrating different review areas in the embodiments of this application;

[0049] Figure 7 This is a schematic diagram of the gold finger defect verification device in the embodiments of this application;

[0050] Figure 8 This is a schematic diagram used to illustrate a computer device in the embodiments of this application.

[0051] Reference numerals: 701, Defect image acquisition module; 702, Defect contour generation module; 703, Gold finger contour generation module; 704, Defect gauge determination module; 705, Defect type determination module. Detailed Implementation

[0052] The following is in conjunction with the appendix Figure 1-8 This application will be described in further detail.

[0053] This application discloses a method for reviewing defects in gold fingers. This method is used to review the results of defect detection in the gold finger area. Specifically, the review object of this defect review method is a gold finger defect that has undergone preliminary defect detection and has preliminary detection results. The reason for reviewing gold finger defects is that the tolerance for defects on a printed circuit board is directly proportional to the width of the opposite sides of the gold finger. The larger the width of the opposite sides, the larger the tolerable defect. When the widths of the opposite sides of the gold fingers on the printed circuit board are inconsistent, the existing method of judging defects based on the size of the defect point using fixed gauges may result in some acceptable defects being mistakenly judged as rejected defects. Furthermore, it should be noted that some steps of the gold finger defect review method disclosed in this application can also be selectively integrated into the initial inspection of gold finger defects. For example, the step of "determining the gauge based on the specific position of the defect outline relative to the gold finger outline to determine the defect type" can also be used in the initial inspection process of gold finger defects. This is not a limitation of the invention and will not be elaborated upon here.

[0054] Specifically, refer to Figure 1 For a defect point 'a' of the same size, if 'a' is located in the first region Q1 on the target gold finger, then the defect is essentially a rejection defect; if 'a' is located in the second region Q2 on the target gold finger, then the defect is essentially an acceptable defect. However, according to the existing method of judging defects based on the size of the defect point by referring to a fixed caliper, regardless of which region of the gold finger the defect point is located in, it will be judged as a rejection defect because the size of the defect point exceeds the caliper, resulting in a high pass rate for gold finger defect detection results. In order to help reduce the pass rate of gold finger defect results, this application proposes a gold finger defect review method.

[0055] Reference Figure 2 The method includes the following steps:

[0056] S10, Obtain the gold finger defect image to be reviewed. The gold finger defect image contains several gold fingers.

[0057] Specifically, the gold finger defect image to be reviewed is that which has undergone preliminary defect detection and has preliminary detection results; the gold finger defect image usually contains patterns of several adjacent gold fingers.

[0058] S20 identifies defects in the gold finger defect image and generates a defect contour corresponding to the defect.

[0059] Specifically, the system identifies the exact location of the defect in the gold finger defect image and generates a defect contour corresponding to the defect. The defect contour line is also the boundary line of the defect.

[0060] S30, determine the target gold finger where the defect contour is located in the gold finger defect image, and generate the gold finger contour corresponding to the target gold finger.

[0061] Specifically, based on the specific location of the defect in the gold finger defect image, the target gold finger containing the defect contour in the gold finger defect image is determined, which is the gold finger with the defect; then, the gold finger contour corresponding to the target gold finger is generated.

[0062] S40, determine the gauge based on the specific position of the defect profile relative to the gold finger profile.

[0063] Specifically, first, determine the exact location of the defect on the gold finger, and then calculate the corresponding card gauge based on the exact location of the defect on the gold finger.

[0064] S50, based on the type of defect in the card specification review, the types of defects include acceptance defects and rejection defects.

[0065] Specifically, the defect at that location is determined based on the calculated card specifications to see if it meets the card specifications. If it does, the defect is classified as an acceptable defect; otherwise, it is classified as a rejected defect.

[0066] It should be noted that, since this application is to re-inspect the defect images of the gold fingers, the initial defect type corresponding to the gold finger defect images to be reviewed is the rejection defect; after review, it is finally determined to be an acceptable defect, that is, the initial defect type is changed to an acceptable defect; after review, it is finally determined to be a rejection defect, that is, the initial defect type is not changed.

[0067] In this application, the gauge used to verify defect types is not a fixed value, but rather calculated based on the specific location of the defect on the gold finger. This means that the gauge corresponding to different areas of the gold finger is not identical. Consequently, for printed circuit boards with inconsistent gold finger widths, the gauges corresponding to different width areas of the gold finger will differ. In other words, the gauges corresponding to different width areas of the gold finger are adapted to the width of the gold finger, thereby reducing the possibility of some acceptable defects being mistakenly identified as rejection defects. This allows some acceptable defects that are mistakenly identified as rejection defects to be identified and corrected, thus reducing the pass rate during gold finger defect detection.

[0068] In one embodiment, determining the caliper gauge based on the specific position of the defect profile relative to the gold finger profile can be specifically performed as follows:

[0069] After generating the gold finger contour corresponding to the target gold finger, the gold finger contour is first divided into several core regions based on the spacing between opposite sides, for example, referring to... Figure 3The gold finger area is divided into regions 1, 2, 3, 4, and N. Then, the target verification area containing the defect contour is determined. Based on the above region division, region 3, where the defect contour is located, is determined as the target verification area. The calibration is then determined based on the side spacing of the target verification area and a preset calibration coefficient. Specifically, the calibration is obtained by multiplying the side spacing of the target verification area by the preset calibration coefficient. For example, if the side spacing of the target verification area is 'a' and the preset calibration coefficient is 0.3, then the final calibration is 0.3a. The side spacing can be obtained by actual measurement of the gold finger contour image, while the calibration coefficient is preset by the user according to actual needs.

[0070] The gold finger contour is divided into several verification areas based on the side-to-side spacing of the gold finger contour. Then, the corresponding gauges for each verification area are determined. This method allows the gauges for different width areas of the gold finger to be adapted to the width of the gold finger, thereby reducing the possibility of some acceptable defects being mistakenly identified as rejection defects. It also allows some acceptable defects that are mistakenly identified as rejection defects to be identified and corrected, thus reducing the over-detection rate during gold finger defect detection.

[0071] It should be noted that when determining the spacing between opposite sides of the target review area, if the spacing between opposite sides of the target review area is a unique value, such as in areas 1 and 3, then this unique value is set as the spacing between opposite sides of the target review area. If the spacing between opposite sides of the target review area is not a unique value, such as in areas 2 and 4, then the minimum spacing between opposite sides of the target review area is set as the spacing between opposite sides of the target review area. That is, assuming the spacing of area 2 is between a and b and a is less than b, then spacing a is set as the spacing between opposite sides of the target review area. For target review areas where the spacing between opposite sides is not unique, the standard is determined based on the standard based on the shortest spacing in that area. That is, any defect that meets this standard and is located anywhere in the target review area can be judged as an acceptable defect. This improves the accuracy of type review for defects in target review areas where the spacing between opposite sides is not unique.

[0072] In one embodiment, refer to Figure 4 The method for reviewing defects based on the card specification can be specifically implemented as follows:

[0073] First, the direction of the line segments containing the parallel opposite sides within the gold finger outline is set as the y-direction, and then the direction perpendicular to the y-direction is set as the x-direction. It is understood that the direction of the line segments containing the parallel opposite sides within the gold finger outline can also be set as the x-direction, and then the direction perpendicular to the x-direction can be set as the y-direction; this is not a limitation. This embodiment uses the example of setting the direction of the line segments containing the parallel opposite sides within the gold finger outline as the y-direction and then setting the direction perpendicular to the y-direction as the x-direction for explanation. After determining the x-direction and y-direction, the maximum diameter D1 of the defect area along the x-direction is determined. Then, this maximum diameter is compared with the gauge corresponding to the target review area, that is, the maximum diameter of the defect area is numerically compared with the gauge corresponding to the target area where the defect is located. If the maximum diameter of the defect is greater than the gauge corresponding to the target review area, the defect type corresponding to the defect area is determined to be a rejection defect; otherwise, the defect type corresponding to the defect area is determined to be an acceptance defect.

[0074] In one embodiment, the method of determining the caliper gauge based on the specific position of the defect profile relative to the gold finger profile can also be specifically implemented as follows:

[0075] After generating the gold finger contour corresponding to the target gold finger, the direction of the line segments containing the parallel opposite sides within the gold finger contour is first set as the y-direction, and the direction perpendicular to the y-direction is set as the x-direction. It is understood that the direction of the line segments containing the parallel opposite sides within the gold finger contour can also be set as the x-direction, and then the direction perpendicular to the x-direction can be set as the y-direction; this is not limited here. This embodiment uses the example of setting the direction of the line segments containing the parallel opposite sides within the gold finger contour as the y-direction, and then setting the direction perpendicular to the y-direction as the x-direction. After determining the x-direction and y-direction, the two endpoints with the largest distance along the y-direction in the defect area are determined; refer to... Figure 5 That is, endpoints m and n. Then, two parallel lines L1 and L2 are drawn along the x-direction, passing through the two endpoints respectively. The area between the two parallel lines that overlaps with the gold finger contour is set as the verification area. Then, the caliber is determined according to the spacing of the verification area along the x-direction and the preset caliber coefficient. Specifically, the caliber is obtained by multiplying the spacing between opposite sides of the verification area with the preset caliber coefficient. For example, if the spacing between opposite sides of the verification area is a and the preset caliber coefficient is 0.3, then the final caliber is 0.3a. The spacing between opposite sides can be obtained by actual measurement of the gold finger contour image, and the caliber coefficient is preset by the user according to actual needs.

[0076] Based on the specific location of the defect contour, a verification area corresponding to the defect contour is divided within the gold finger contour. Then, the corresponding gauge for the verification area is determined separately. The defect type corresponding to the defect contour is then judged based on the gauge. This method allows the gauges corresponding to different width areas of the gold finger to be adapted to the width of the gold finger, thereby reducing the possibility of some acceptable defects being mistakenly judged as rejection defects. It also allows some acceptable defects that are mistakenly judged as rejection defects to be identified and corrected, thereby reducing the over-inspection rate during gold finger defect detection.

[0077] It should be noted that, referring to Figure 6 When determining the spacing between opposite sides of the verification area, if the determined spacing between opposite sides of the verification area is a unique value, such as in area 11, then this unique value is set as the spacing between opposite sides of the verification area; if the spacing between opposite sides of the verification area is not a unique value, such as in area 12, then the minimum spacing between opposite sides of the verification area is set as the spacing between opposite sides of the verification area; that is, assuming that the spacing in area 12 is between a and b and a is less than b, then the spacing a is set as the spacing between opposite sides of the verification area; for verification areas where the spacing between opposite sides is not unique, the determined standard is the standard determined based on the shortest spacing in that area, that is, any defect that meets the standard can be judged as an acceptable defect if it is located at any position in the verification area; thus improving the accuracy of type verification for defects in verification areas where the spacing between opposite sides is not unique.

[0078] In one embodiment, the method of verifying the defect type based on the caliper can be specifically implemented as follows: after determining the caliper of the verification area corresponding to the defect contour, firstly determine the maximum diameter D2 of the defect area along the x direction, and then compare the maximum diameter with the caliper corresponding to the verification area, that is, compare the maximum diameter of the defect area with the caliper corresponding to the target area where the defect is located; if the maximum diameter of the defect is greater than the caliper corresponding to the target verification area, then the defect type corresponding to the defect area is determined to be a rejection defect; otherwise, the defect type corresponding to the defect area is determined to be an acceptance defect.

[0079] It should be noted that the two methods described above for determining the gauge based on the specific position of the defect profile relative to the gold finger profile can be applied separately as two different review schemes, or they can be integrated into a single review scheme for joint application; for example, for... Figure 3 The regions divided into Region 1, Region 2, Region 3, Region 4, and Region N can each be assigned a different verification method. During implementation, one verification method can be used to determine the gauge designation for regions with unique side spacing, such as Region 1 and Region 3, while another verification method can be used to determine the gauge designation for regions with non-unique side spacing, such as Region 2 and Region 4. It should be understood that, in the specific implementation process, the two methods for determining the gauge designation can be flexibly selected according to the needs and actual situation.

[0080] Figure 2 This is a flowchart illustrating a method for reviewing defects in gold fingers in one embodiment. It should be understood that, although... Figure 2 The steps in the flowchart are shown sequentially as indicated by the arrows, but these steps are not necessarily executed in the order indicated by the arrows; unless explicitly stated otherwise, there is no strict order requirement for the execution of these steps, and they can be executed in other orders; and Figure 2 At least some of the steps in the process may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these sub-steps or stages is not necessarily sequential, but can be executed in turn or alternately with other steps or at least some of the sub-steps or stages of other steps.

[0081] Based on the above method, this application also discloses a gold finger defect verification device.

[0082] Reference Figure 7 The device includes the following modules:

[0083] The defect image acquisition module 701 is used to acquire the defect image of the gold finger to be reviewed. The gold finger defect image contains several gold fingers.

[0084] The defect contour generation module 702 is used to identify defects in the gold finger defect image and generate defect contours corresponding to the defects.

[0085] The gold finger contour generation module 703 is used to determine the target gold finger where the defect contour is located in the gold finger defect image, and generate the gold finger contour corresponding to the target gold finger.

[0086] Defect gauge determination module 704 is used to determine the gauge based on the specific position of the defect profile relative to the gold finger profile.

[0087] The defect type determination module 705 is used to verify the type of defect according to the card specifications. The defect types include acceptable defects and rejected defects.

[0088] In one embodiment, the defect gauge determination module 704 is specifically used to divide the gold finger contour into several verification areas according to the spacing between opposite sides of the gold finger contour; determine the target verification area where the defect contour is located; and determine the gauge according to the spacing between opposite sides of the target verification area and the preset gauge coefficient.

[0089] In one embodiment, the defect card determination module 704 is specifically used to set the unique value as the side spacing of the target review area if the side spacing of the target review area is unique; and to set the minimum side spacing of the target review area as the side spacing of the target review area if the side spacing of the target review area is not unique.

[0090] In one embodiment, the defect type determination module 705 is specifically used to set the direction of the line segments containing the parallel opposite sides within the gold finger contour as the y direction, and set the direction perpendicular to the y direction as the x direction; determine the maximum diameter of the defect area along the x direction, and compare the maximum diameter with the caliper; if the maximum diameter is greater than the caliper, then the defect type corresponding to the defect area is determined to be a rejection defect; otherwise, the defect type corresponding to the defect area is determined to be an acceptance defect.

[0091] In one embodiment, the defect gauge determination module 704 is specifically used to set the direction of the line segments containing the parallel opposite sides within the gold finger contour as the y direction, and set the direction perpendicular to the y direction as the x direction; determine the two endpoints of the defect area with the largest distance along the y direction, and draw two parallel lines along the x direction that pass through the two endpoints respectively; set the area between the two parallel lines that overlaps with the gold finger contour as the verification area; and determine the gauge based on the distance of the verification area along the x direction and the preset gauge coefficient.

[0092] In one embodiment, the defect card determination module 704 is specifically used to set the unique value as the spacing of the review area along the x-direction if the spacing of the review area along the x-direction is a unique value; and to set the minimum spacing of the review area along the x-direction as the spacing of the review area along the x-direction if the spacing of the review area along the x-direction is not a unique value.

[0093] In one embodiment, the defect type determination module 705 is specifically used to determine the maximum diameter of the defect area along the x-direction and compare the maximum diameter with the caliper gauge; if the maximum diameter is greater than the caliper gauge gauge, the defect type corresponding to the defect area is determined to be a rejection defect; otherwise, the defect type corresponding to the defect area is determined to be an acceptance defect.

[0094] The gold finger defect verification device provided in this application embodiment can be applied to the gold finger defect verification method provided in the above embodiment. For relevant details, please refer to the above method embodiment. The implementation principle and technical effect are similar, and will not be repeated here.

[0095] It should be noted that the gold finger defect verification device provided in this embodiment is only illustrated by the above-described division of functional modules / units when performing gold finger defect verification. In practical applications, the above functions can be assigned to different functional modules / units as needed, that is, the internal structure of the gold finger defect verification device can be divided into different functional modules / units to complete all or part of the functions described above. Furthermore, the implementation method of the gold finger defect verification method provided in the above method embodiment and the implementation method of the gold finger defect verification device provided in this embodiment belong to the same concept. The specific implementation process of the gold finger defect verification device provided in this embodiment is detailed in the above method embodiment and will not be repeated here.

[0096] This application also discloses a computer device.

[0097] Specifically, such as Figure 8 As shown, the computer device can be a desktop computer, laptop computer, handheld computer, or cloud server, etc. The computer device may include, but is not limited to, a processor and memory. The processor and memory can be connected via a bus or other means. The processor can be a Central Processing Unit (CPU). The processor can also be other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs) or other programmable logic devices, graphics processing units (GPUs), embedded neural network processing units (NPUs) or other dedicated deep learning coprocessors, discrete gate or transistor logic devices, discrete hardware components, or combinations of the above types of chips.

[0098] Memory, as a non-transitory computer-readable storage medium, can be used to store non-transitory software programs, non-transitory computer-executable programs, and modules, such as the program instructions / modules corresponding to the methods in the above embodiments of this application. The processor executes various functional applications and data processing by running the non-transitory software programs, instructions, and modules stored in the memory, thereby implementing the methods in the above embodiments. The memory may include a program storage area and a data storage area, wherein the program storage area may store the operating system and at least one application program required for a function; the data storage area may store data created by the processor, etc. Furthermore, the memory may include high-speed random access memory and may also include non-transitory memory, such as at least one disk storage device, flash memory device, or other non-transitory solid-state storage device. In some embodiments, the memory may optionally include memory remotely located relative to the processor, and these remote memories can be connected to the processor via a network. Examples of such networks include, but are not limited to, the Internet, corporate intranets, local area networks, mobile communication networks, and combinations thereof.

[0099] This application also discloses a computer-readable storage medium.

[0100] Specifically, the computer-readable storage medium is used to store a computer program, which, when executed by a processor, implements the methods described in the above-described method embodiments. Those skilled in the art will understand that implementing all or part of the processes in the methods described in the above-described embodiments of this application can be accomplished by a computer program instructing related hardware. The program can be stored in a computer-readable storage medium, and when executed, it can include the processes of the embodiments described above. The storage medium can be a magnetic disk, optical disk, read-only memory (ROM), random access memory (RAM), flash memory, hard disk drive (HDD), or solid-state drive (SSD), etc.; the storage medium can also include combinations of the above types of memory.

[0101] This specific embodiment is merely an explanation of the present invention and is not intended to limit the invention. After reading this specification, those skilled in the art can make modifications to this embodiment without contributing any inventive step, but such modifications are protected by patent law as long as they are within the scope of the claims of the present invention.

Claims

1. A method for verifying defects in gold fingers, characterized in that, The method includes: Obtain a defect image of a gold finger to be reviewed, wherein the defect image contains a plurality of gold fingers; Identify defects in the gold finger defect image and generate a defect contour corresponding to the defect; Identify the target gold finger containing the defect contour within the gold finger defect image, and generate a gold finger contour corresponding to the target gold finger; The gauge is determined based on the specific position of the defect profile relative to the gold finger profile. The type of defect is verified according to the card specifications, and the type of defect includes acceptable defects and rejection defects; The step of determining the gauge based on the specific position of the defect contour relative to the gold finger contour includes: The direction of the line segments containing the parallel opposite sides within the outline of the gold finger is set as the y direction, and the direction perpendicular to the y direction is set as the x direction. Identify the two endpoints of the defect region with the largest distance along the y-direction, and draw two parallel lines along the x-direction that pass through the two endpoints respectively; The area between the two parallel lines that overlaps with the outline of the gold finger is defined as the verification area; The gauge is determined based on the spacing of the verification area along the x-direction and the preset gauge coefficient.

2. The method according to claim 1, characterized in that, The spacing of the verification region along the x-direction includes: If the spacing of the verification area along the x-direction is a unique value, then the unique value is set as the spacing of the verification area along the x-direction; If the spacing of the verification region along the x-direction is not unique, then the minimum spacing of the verification region along the x-direction is set to the spacing of the verification region along the x-direction.

3. The method according to claim 1, characterized in that, The types of defects reviewed according to the card specifications include: Determine the maximum diameter of the defect area along the x-direction and compare the maximum diameter with the caliper gauge; if the maximum diameter is greater than the caliper gauge, then determine that the defect type corresponding to the defect area is a rejection defect; otherwise, determine that the defect type corresponding to the defect area is an acceptance defect.

4. A device for verifying defects in gold fingers, characterized in that, The device includes: The defect image acquisition module (701) is used to acquire the defect image of the gold finger to be reviewed, wherein the gold finger defect image contains a plurality of gold fingers; The defect contour generation module (702) is used to identify defects in the gold finger defect image and generate a defect contour corresponding to the defect; The gold finger contour generation module (703) is used to determine the target gold finger where the defect contour is located in the gold finger defect image, and generate a gold finger contour corresponding to the target gold finger. The defect gauge determination module (704) is used to determine the gauge based on the specific position of the defect profile relative to the gold finger profile. The defect type determination module (705) is used to verify the type of the defect according to the card specification, wherein the defect type includes acceptable defects and rejection defects; The defect gauge determination module (704) is specifically used to set the direction of the line segments containing the parallel opposite sides within the gold finger contour as the y direction, and set the direction perpendicular to the y direction as the x direction; determine the two endpoints of the defect area with the largest distance along the y direction, and draw two parallel lines along the x direction that pass through the two endpoints respectively; set the area between the two parallel lines that overlaps with the gold finger contour as the verification area; and determine the gauge based on the distance along the x direction of the verification area and the preset gauge coefficient.

5. A computer device, characterized in that, It includes a memory and a processor, wherein the memory stores a computer program that can be loaded by the processor and executed according to any one of claims 1 to 3.

6. A computer-readable storage medium, characterized in that, The computer program is stored that can be loaded by a processor and executed according to any one of claims 1 to 3.

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