化学机械研磨控制方法、控制系统及其设备
By constructing a nominal grinding time and employing non-feedback automatic control, the removal efficiency and accuracy of chemical mechanical grinding are optimized, solving the problems of low equipment cost and efficiency in existing technologies, and achieving high-efficiency chemical mechanical grinding.
CN118123698BActive Publication Date: 2026-07-17SHANGHAI HUAHONG GRACE SEMICON MFG CORP
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SHANGHAI HUAHONG GRACE SEMICON MFG CORP
- Filing Date
- 2024-03-28
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
Existing chemical mechanical polishing methods rely on sensor feedback and machine control, resulting in low removal efficiency and accuracy, as well as high equipment and time costs.
Method used
By acquiring historical setting and process data of chemical mechanical grinding, a nominal grinding time is constructed. Grinding is then performed using the nominal grinding time and the set removal rate. A non-feedback automatic control method is adopted to optimize removal efficiency and accuracy.
Benefits of technology
It improves the removal accuracy and efficiency of chemical mechanical grinding, reduces equipment costs, reduces errors, and achieves efficient non-feedback automatic control.
✦ Generated by Eureka AI based on patent content.
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Figure CN118123698B_ABST
Abstract
本发明提供一种化学机械研磨控制方法、控制系统及其设备，所述控制方法包括：获取化学机械研磨的历史设定数据及对应的历史过程数据；根据历史设定数据及对应的历史过程数据，获取化学机械研磨的名义研磨时间，并由名义研磨时间及对应的实际研磨时间构建研磨时间匹配表，名义研磨时间包括由历史设定移除速率与历史实际移除速率构建的移除速率补偿及由历史设定研磨前值与实际研磨前值构建的研磨厚度补偿；根据研磨参数获取名义研磨时间，再利用名义研磨时间根据研磨时间匹配表获得研磨时间，并利用研磨时间及设定移除速率对晶圆执行化学机械研磨。在本发明可优化化学机械研磨的移除效率、移除精度及研磨成本。
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