A boron nitride / alumina composite film material, its preparation method and application
By adding alumina particles between boron nitride nanosheets to change their alignment and form vertical thermal conduction pathways, the heat dissipation problem of boron nitride materials in electronic devices is solved, achieving high thermal conductivity, simplifying the preparation process, and reducing costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SUZHOU IND PARK MONASH RESEARCH INSTITUTE OF SCIENCE & TECHNOLOGY
- Filing Date
- 2024-01-23
- Publication Date
- 2026-05-26
AI Technical Summary
Existing boron nitride materials suffer from heat dissipation problems in electronic devices, especially due to limited through-surface thermal conductivity and high-temperature, high-pressure sintering conditions that restrict large-scale production, as well as high costs.
Alumina particles were used as space-occupying additives to change the arrangement and orientation of boron nitride nanosheets, forming vertical thermal conduction pathways. Boron nitride/alumina composite membranes were prepared by simple mixing, filtration and rapid sintering.
The thermal conductivity of boron nitride/alumina composite films was significantly improved, the cost was reduced, the preparation process was simplified, the sintering efficiency was improved, and the mechanical properties of the composite films were enhanced.
Smart Images

Figure CN118125828B_ABST