Semiconductor assembly and refrigeration appliance

Abstract

The application provides a semiconductor combination structure and a refrigeration device. The semiconductor combination structure comprises a heat dissipation fixed assembly and a semiconductor plug-in assembly. The heat dissipation fixed assembly comprises a heat dissipation plate and an insulation plate, and the heat dissipation plate and the insulation plate are fixedly connected and form a plug-in slot. The semiconductor plug-in assembly comprises a cryogenic box and a semiconductor refrigeration sheet. A cryogenic chamber is formed in the cryogenic box, the semiconductor refrigeration sheet is arranged on the side wall of the cryogenic box, the semiconductor refrigeration sheet has a cold end and a hot end, the hot end is fixedly connected with a heat conduction plate, the cold end is used for providing cold energy for the cryogenic chamber, and one end of the heat conduction plate extending out of the semiconductor refrigeration sheet is matched with the plug-in slot. The semiconductor refrigeration sheet is arranged on the side wall of the cryogenic box, and the heat conduction plate is fixed on the hot end side of the semiconductor refrigeration sheet. The heat conduction plate is matched with the plug-in slot of the heat dissipation fixed assembly to form the semiconductor combination structure, the space of the original refrigeration chamber is not occupied, the manufacturing process of the original refrigeration system does not need to be changed, and the combination structure is simple, convenient and flexible.

Description

Technical Field

[0001] This application relates to the field of refrigeration equipment technology, and in particular to a semiconductor combination structure and refrigeration equipment. Background Technology

[0002] Traditional refrigerators and other refrigeration equipment typically use a compression cycle system for cooling. To achieve temperatures below -40°C, a two-stage compression system is usually employed. However, two-stage compression systems suffer from several drawbacks, including high exhaust pressure, high noise, high operating power, and limited size, resulting in low adaptability. Some existing products utilize semiconductor cryogenic chips for ultra-low temperature cryogenic storage, but these typically employ welding to connect the semiconductor cryogenic box to the compression cycle system. This complicates the box design and wastes space when the cryogenic storage is not in use, as it occupies space within the original refrigeration chamber. Therefore, enabling the free assembly and disassembly of semiconductor cryogenic boxes within refrigeration equipment is a pressing technical challenge. Summary of the Invention

[0003] This application provides a semiconductor assembly structure and a cooling device to solve the technical problem of freely assembling and disassembling semiconductor cryogenic boxes in a cooling device.

[0004] To address the aforementioned technical problems, this application provides a semiconductor assembly structure, comprising:

[0005] A heat dissipation fixing assembly, the heat dissipation fixing assembly including a heat dissipation plate and an insulation plate, the heat dissipation plate and the insulation plate being fixedly connected and forming an insertion groove between the heat dissipation plate and the insulation plate;

[0006] A semiconductor connector assembly includes a cryogenic box and a thermoelectric cooler. A cryogenic chamber is formed inside the cryogenic box. The thermoelectric cooler is disposed on the side wall of the cryogenic box and has a cold end and a hot end. A heat-conducting plate is fixedly connected to the hot end. The cold end is used to provide cooling to the cryogenic chamber. One end of the heat-conducting plate extends out of the thermoelectric cooler and matches the connector slot.

[0007] The heat sink has a sealing baffle on the side facing the insulation plate to block the opening of the insertion slot. When the semiconductor insertion assembly is combined with the heat dissipation fixing assembly, the sealing baffle opens the opening of the insertion slot.

[0008] The heat-conducting plate forms a snap-fit ​​groove with the outer wall of the cryogenic box, and the unfixed end of the insulation plate matches the snap-fit ​​groove.

[0009] The outer wall of the cryogenic box is provided with a magnetic connector, which is electrically connected to the semiconductor cooling chip.

[0010] The cold end is connected to the side wall of the cryogenic box or located within the cryogenic chamber.

[0011] The cold end is fixedly connected to a cold guide plate.

[0012] The cooling plate is a superconducting disk, and it extends from the semiconductor cooling chip to the multi-faceted inner wall of the cryogenic box.

[0013] This application also provides a refrigeration device, including an inner liner, the inner liner forming a refrigeration chamber, the refrigeration device having a refrigeration compression system, the refrigeration compression system including an evaporator, the evaporator acting on the refrigeration chamber, and the refrigeration device being fixed with the heat dissipation fixing assembly of the semiconductor assembly structure described above. When the semiconductor insertion assembly is combined with the heat dissipation fixing assembly, the semiconductor insertion assembly is disposed within the refrigeration chamber.

[0014] The inner liner is fitted with an insulating foam layer on its outer periphery, the evaporator is disposed within the insulating foam layer, the heat dissipation fixing component is fixed to the insulating foam layer, the heat dissipation plate is thermally connected to the evaporator, and the insulating plate is located in the refrigeration chamber.

[0015] The inner surface of the inner liner is provided with a magnetic power interface. When the heat dissipation fixing component is combined with the semiconductor plug-in component, the magnetic connector is electrically connected to the magnetic power interface.

[0016] The circuit connecting the magnetic power interface is located inside the insulation foam layer.

[0017] The outer wall of the cryogenic box where the magnetic connector is located is on the same plane as the heat-conducting plate, and the side of the heat dissipation plate away from the evaporator is on the same plane as the inner liner.

[0018] The advantages of this application's embodiments, which differ from existing technologies, are as follows: This application provides a semiconductor assembly structure and a cooling device. The semiconductor assembly structure includes a heat dissipation fixing component and a semiconductor insertion component. The heat dissipation fixing component includes a heat sink and an insulation plate. The heat sink and the insulation plate are fixedly connected, and the heat sink and the insulation plate form an insertion groove. The semiconductor insertion component includes a cryogenic box and a semiconductor cooling chip. A cryogenic chamber is formed inside the cryogenic box. The semiconductor cooling chip is disposed on the side wall of the cryogenic box. The semiconductor cooling chip has a cold end and a hot end. A heat-conducting plate is fixedly connected to the hot end. The cold end is used to provide cooling to the cryogenic chamber. One end of the heat-conducting plate extends out of the semiconductor cooling chip and matches the insertion groove. By placing the semiconductor cooling chip on the side wall of the cryogenic box and fixing a heat-conducting plate on the hot end side of the semiconductor cooling chip, the heat-conducting plate can be matched with the insertion slot of the heat dissipation fixing component to form a semiconductor combination structure. When the semiconductor cryogenic box is needed, it can be combined, and when the semiconductor cryogenic box is not needed, the two can be separated without occupying the space of the original refrigeration chamber and without changing the manufacturing process of the original refrigeration system. The combination structure is simple, convenient and flexible. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein:

[0020] Figure 1 This is a schematic diagram of the cooling system of a semiconductor cascade cooling device in related technologies.

[0021] Figure 2 This describes a specific implementation of the connection structure of the semiconductor cryogenic box in a semiconductor cascade refrigeration device in the related technology.

[0022] Figure 3 A schematic diagram of the overall structure of the semiconductor assembly provided in this application located in a refrigeration device;

[0023] Figure 4 The semiconductor connector assembly provided in this application is a schematic diagram of the structure of a cooling device when combined with a heat dissipation fixing assembly;

[0024] Figure 5 This is a schematic diagram of the heat dissipation fixing component;

[0025] Figure 6 This is a schematic diagram of the structure of a semiconductor connector assembly. Detailed Implementation

[0026] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. It is understood that the specific embodiments described herein are only for explaining this application and not for limiting it. Furthermore, it should be noted that, for ease of description, only the parts related to this application are shown in the accompanying drawings, not all structures. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0027] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.

[0028] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0029] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0030] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a mutually exclusive, independent, or alternative embodiment. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0031] Traditional refrigerators and other refrigeration equipment typically use single-stage compression refrigeration. However, with the increasing demand for ultra-low temperature storage, a two-stage compression system is usually used to achieve ultra-low temperature refrigeration. However, the two-stage compression system has problems such as large size, complex structure, high production cost, and high noise.

[0032] Therefore, related technologies propose a semiconductor cascade cooling device. Please refer to [link / reference]. Figure 1 , Figure 1 This is a schematic diagram of the refrigeration system of a semiconductor cascade refrigeration device in related technologies. The refrigeration system 20 includes a refrigeration loop 30 through which refrigerant flows. The refrigeration loop 30 includes a compressor 31, a condenser 32, a throttling device 33, and an evaporator 34 connected in sequence. The evaporator 34 is configured to supply cooling to the first refrigeration chamber 11 of the refrigeration device 10. The high-temperature, high-pressure gaseous refrigerant, after being compressed by the compressor 31, becomes a low-temperature, low-pressure wet vapor refrigerant after passing through the condenser 32 and the throttling device 33. The wet vapor refrigerant then enters the evaporator 34. As the liquid refrigerant in the wet vapor refrigerant in the evaporator 34 continuously absorbs heat from the first refrigeration chamber 11, the outer surface of the evaporator 34 and the air in the first refrigeration chamber 11 are gradually cooled. To achieve ultra-low temperature storage requirements below the refrigeration temperature of the first refrigeration chamber 11, the first refrigeration chamber 11 also has a second refrigeration chamber 12. The refrigeration system 20 also includes a semiconductor refrigeration device 40. The semiconductor cooling device 40 includes a semiconductor cooling chip 41. The semiconductor cooling chip 41 can operate continuously after being energized, has no pollution sources or rotating parts, and does not produce a rotational effect. The cooling of the semiconductor cooling chip 41 utilizes the Peltier effect of semiconductors. This refers to the phenomenon where, when two different conductors are connected and connected to a DC power supply to form a circuit, heat absorption or release occurs at the junction of the two conductors, creating a temperature difference between the two ends and thus achieving cooling. Therefore, high-precision temperature control can be achieved by controlling the input current. The semiconductor cooling chip 41 has a cold end 411 and a hot end 412. The temperature of the cold end 411 can be controlled by the input current to achieve ultra-low temperatures in the second cooling chamber 12. The hot end 412 is thermally connected to the evaporator 34. The evaporator 34 absorbs heat from both the first cooling chamber 11 and the hot end 412, thereby continuously dissipating heat from the hot end 412 so that the cold end 411 can continuously cool the second cooling chamber 12.

[0033] Ultra-low temperature storage is achieved by using a semiconductor refrigeration device 40 in the refrigeration equipment 10, and the heat of the hot end 412 of the semiconductor refrigeration chip 41 is transferred through the evaporator 34, so that the cold end 411 of the semiconductor refrigeration chip 41 can continuously supply cooling to the second refrigeration chamber 12 without the need for a two-stage compression system. Compared with a two-stage compression system, using a semiconductor refrigeration chip 41 has advantages such as low production cost, small size, and low noise, and can be widely used in production and daily life.

[0034] Please see Figure 2 , Figure 2 This describes a specific implementation of the connection structure of the semiconductor cryogenic box in a semiconductor cascade refrigeration device in related technologies. The refrigeration device 10 has an inner liner 13, within which a first refrigeration chamber 11 is formed. The inner liner 13 is wrapped with an insulation layer 14, and an evaporator 34 is disposed within the insulation layer 14. The evaporator 34 absorbs heat from the inner liner 13 and the first refrigeration chamber 11, gradually lowering their temperatures and achieving refrigeration of the first refrigeration chamber 11. A portion of the evaporator tubes of the evaporator 34 extends out of the inner liner 13 as heat dissipation evaporator tubes 341. The semiconductor refrigeration device 40 includes a semiconductor cryogenic box 42, within which a second refrigeration chamber 12 is formed. A heat-conducting plate 43 is fixedly connected to the hot end 412 of the semiconductor refrigeration chip 41, and a cold-conducting plate 44 is fixedly connected to the cold end 411 of the semiconductor refrigeration chip 41. The semiconductor refrigeration chip 41 and the cold-conducting plate 44 are disposed within the second refrigeration chamber 12. The power cord 45 passes through the insulation layer 14 and the inner liner 13 into the first refrigeration chamber 11 and connects to the semiconductor cooling chip 41. The semiconductor heat-conducting plate 43 and the heat dissipation evaporator tube 341 are fixedly connected by welding. However, the welding connection method restricts the product form of the refrigeration equipment, and this connection method requires extending part of the evaporator tube of the evaporator 34 out of the inner liner 13, thus changing the original design of the refrigeration system 20 and making the internal structure of the refrigeration equipment 10 complex. Furthermore, the welding method makes it difficult to replace or repair the semiconductor cryogenic box 42 or the evaporator 34. Moreover, when cryogenic storage is not needed, the semiconductor cryogenic box 42 will continuously occupy the space of the first refrigeration chamber 11, interfering with the storage of items in the first refrigeration chamber 11, thus wasting usable space. The power cord 45 can only connect to the thermoelectric cooler 41 after entering the first cooling chamber 11. Since the temperature inside the first cooling chamber 11 is low, it will affect the normal use of the power cord 45. Furthermore, the movement of the thermoelectric cooler 42 may cause poor connection between the power cord 45 and the thermoelectric cooler 41, resulting in the thermoelectric cooler 42 failing to cool.

[0035] Therefore, the semiconductor combination structure and cooling equipment provided in this application use a plug-in method to achieve free assembly and disassembly of the cryogenic box, avoiding the problems of structural complexity, difficult assembly and disassembly, and wasted space caused by welding.

[0036] Please see Figures 3 to 6 , Figure 3 This is a schematic diagram of the overall semiconductor assembly structure provided in this application located in a refrigeration device; Figure 4 This is a schematic diagram of the structure of the cooling device when the semiconductor plug-in component provided in this application is combined with the heat dissipation fixing component; Figure 5 This is a schematic diagram of the heat dissipation fixing component; Figure 6 This is a schematic diagram of the structure of a semiconductor connector assembly.

[0037] like Figures 3 to 6 As shown, this application provides a specific embodiment of a semiconductor assembly structure. The semiconductor assembly structure 50 includes a heat dissipation fixing component 100 and a semiconductor insertion component 200. The heat dissipation fixing component 100 includes a heat sink 101 and an insulation plate 102. The heat sink 101 can dissipate heat. The side of the heat sink 101 near the insulation plate 102 and the side of the insulation plate 102 near the heat sink 101 are fixedly connected by snap-fit, welding or other methods, and the heat sink 101 and the insulation plate 102 form an insertion groove 103. The semiconductor insertion component 200 includes a cryogenic box 201 and a semiconductor cooling chip 202. The outer shell of the cryogenic box 201 is made of insulation material, and the inner shell of the cryogenic box 201 can be made of a heat-conducting material such as aluminum sheet. A cryogenic chamber 210 is formed inside the cryogenic box 201, and the semiconductor cooling chip 202 is disposed on the side wall of the cryogenic box 201. The semiconductor cooling chip 202 has a cold end 2021 and a hot end 2022. A heat-conducting plate 203 is fixed to the surface of the hot end 2022. The cold end 2021 is used to provide cooling to the cryogenic chamber 210. One end of the heat-conducting plate 203 extending from the thermoelectric cooler 202 matches the insertion slot 103, that is, one end of the heat-conducting plate 203 extending from the thermoelectric cooler 202 abuts against the bottom of the insertion slot 103, and the two sides of the heat-conducting plate 203 are in contact with the sidewalls of the insertion slot 103. The heat-conducting plate 203 is in contact with the heat sink 101, so that the heat from the hot end 2022 of the semiconductor can be transferred to the heat sink 101 for heat transfer. Therefore, it is only necessary to insert the heat-conducting plate 203 of the semiconductor insertion assembly 200 into the insertion slot 103 to complete the combination of the heat dissipation fixing assembly 100 and the semiconductor insertion assembly 200, and the combination is stable. When no assembly is required, simply remove the heat-conducting plate 203 from the insertion slot 103 to separate the heat dissipation fixing component 100 from the semiconductor insertion component 200. The assembly and disassembly are simple and convenient.

[0038] In some specific implementations, such as Figure 4 , Figure 5As shown, a sealing baffle 104 is provided on the side of the heat sink 101 facing the insulation plate 102 to cover the opening of the insertion slot 103. Without the sealing baffle 104 covering the opening of the insertion slot 103, moisture will enter the insertion slot 103. In low-temperature environments, frost will form inside the insertion slot 103, preventing the heat-conducting plate 203 from adhering to the side wall of the insertion slot 103 after insertion, resulting in an unstable assembly between the heat dissipation fixing component 100 and the semiconductor insertion component 200. Using the sealing baffle 104 to cover the opening of the insertion slot 103 prevents moisture from entering the insertion slot 103 and prevents frost formation inside the insertion slot 103. Figure 3 The image shows a specific embodiment of the sealing baffle 104 provided in this application. The sealing baffle 104 provided in this embodiment is an elastic baffle. When the semiconductor insertion assembly 200 is combined with the heat dissipation fixing assembly 100, the elastic baffle opens the slot of the insertion groove 103, allowing the heat-conducting plate 203 to be smoothly inserted into the insertion groove 103. The side of the elastic baffle away from the heat dissipation plate 101 is in contact with the side of the heat-conducting plate 203 away from the hot end 2022, causing the side of the heat-conducting plate 203 away from the heat dissipation plate 101 to be in contact with the insulation plate 102. Therefore, the elastic baffle not only blocks the slot of the insertion groove 103 but also ensures that there are no gaps between the heat dissipation plate 101, the heat-conducting plate 203, and the insulation plate 102, thereby enhancing the heat transfer efficiency between the heat-conducting plate 203 and the heat dissipation plate 101 and quickly transferring the heat from the hot end 2022 of the semiconductor cooling chip 202. Furthermore, due to its good sealing performance at the combined connection, frost formation can be avoided. In some specific embodiments, the sealing baffle 104 can also be other components that shield the insertion slot 103. For example, a groove facing the insulation plate 102 is provided at the heat sink 101, and the sealing baffle 104 can be accommodated in the groove. When the semiconductor insertion assembly 200 and the heat dissipation fixing assembly 100 are not combined, the sealing baffle 104 extends out of the groove to shield the insertion slot 103; when the semiconductor insertion assembly 200 and the heat dissipation fixing assembly 100 are combined, the sealing baffle 104 retracts into the groove to open the slot of the insertion slot 103.

[0039] In some specific implementations, such as Figure 3 , Figure 5 , Figure 6As shown, a snap-fit ​​groove 205 is formed between the heat-conducting plate 203 and the outer wall of the cryogenic box 201. The unfixed end of the insulation plate 102 matches the snap-fit ​​groove 205, that is, the unfixed end of the insulation plate 102 abuts against the top of the snap-fit ​​groove 205, and the two sides of the insulation plate 102 are in contact with the side walls of the snap-fit ​​groove 205. When the insulation plate 102 and the snap-fit ​​groove 205 are in contact, the thermoelectric cooler 202 is well sealed, that is, there is no gap between the hot end 2022 of the thermoelectric cooler 202 and the insulation plate 102. In other words, the heat of the hot end 2022 is isolated by the insulation plate 102 and will not be conducted to the cooling chamber 310 from the gap, so that the heat of the hot end 2022 can be concentrated on the heat-conducting plate 203 for heat conduction.

[0040] In some specific implementations, such as Figure 3 , Figure 4 As shown, the outer wall of the cryogenic box 201 is provided with a magnetic connector 2011, which is electrically connected to the thermoelectric cooler 202. When the magnetic connector 2011 is energized, the thermoelectric cooler 202 can be quickly energized, avoiding the operational difficulties in the process of directly connecting the power supply to the thermoelectric cooler 202 through the power cord or the influence of the cooling on the power cord.

[0041] In some specific embodiments, the cold end 2021 is directly connected to the side wall of the cryogenic box 201 or is located within the cryogenic chamber 210. When the cold end 2021 is directly connected to the side wall of the inner liner of the cryogenic box 201, the cold energy of the cold end 2021 is directly transferred to the inner liner, thereby lowering the temperature of the inner liner to the cryogenic temperature. When the cold end 2021 is located within the cryogenic chamber 210, the cold energy of the cold end 2021 is indirectly transferred to the inner liner of the cryogenic box 201, thereby lowering the temperature of the inner liner to the cryogenic temperature.

[0042] In some specific implementations, such as Figure 6 As shown, a cold end 2021 of the semiconductor cooling chip 202 is fixedly connected to a cold-conducting plate 204. The cold-conducting plate 204 directly contacts the cold end 2021 and directly transfers the cooling energy to the inner wall of the cryogenic box 201. The cold-conducting plate 204 can make the cooling energy transfer faster and more uniform. At the same time, some cooling fans and other devices can be added to play the role of rapid or uniform cooling.

[0043] In some specific embodiments, the cold-conducting plate 204 extends from the semiconductor cooling chip 202 to the multi-faceted inner wall of the cryogenic box 201. For example... Figure 6As shown, in this embodiment, the cold-conducting plate 204 extends from the semiconductor cooling chip 202 to the bottom inner wall of the cryogenic box 201. When an item is placed in the cryogenic box 201 and directly abuts against the cold-conducting plate 204, the cold-conducting plate 204 can directly transfer cold energy to the item. However, it is not limited to this embodiment; the cold-conducting plate 204 can extend to multiple inner walls of the cryogenic box 201 to achieve more uniform cooling when the item is in contact with the cryogenic box 201 on multiple sides.

[0044] In some specific embodiments, the cooling plate 204 can also be a superconducting disk. Compared with ordinary materials, the superconducting disk can conduct heat quickly, and when in use, items can be placed in the superconducting disk to achieve quick freezing.

[0045] like Figure 3 , Figure 4 As shown, this application provides a specific embodiment of a cooling device 60 having a semiconductor combination structure 50. For example... Figure 3 As shown, the refrigeration device 60 includes an inner liner 300, within which a refrigeration chamber 310 is formed. The refrigeration device 60 also includes a refrigeration compression system 400. The refrigeration compression system 400 includes an evaporator 401, which acts on the refrigeration chamber 310, absorbing heat from the inner liner 300 and the refrigeration chamber 310, thereby continuously lowering the temperature of the inner liner 300 and the refrigeration chamber 310 to achieve cooling of the refrigeration chamber 310. The refrigeration device 60 is fixed with a heat dissipation fixing component 100. When the semiconductor connector component 200 is combined with the heat dissipation fixing component 100, the semiconductor connector component 200 is disposed within the refrigeration chamber 310, thus placing the cryogenic box 201 within the refrigeration chamber 310, forming a cascade refrigeration system. When the cryogenic box 201 is not needed, the semiconductor connector component 200 can be separated from the heat dissipation fixing component 100, thus eliminating the need to occupy storage space in the refrigeration chamber 310.

[0046] To prevent heat from being conducted from the hot end 2022 of the semiconductor cooling chip 202 to the cooling chamber 310 when the semiconductor connector 200 is combined with the heat dissipation fixing assembly 100, thereby affecting the cooling effect within the cooling chamber 310, in some embodiments, such as Figure 3 , Figure 4As shown, the inner liner 300 of the refrigeration equipment 60 is fitted with an insulation layer 500 on its outer periphery, and the evaporator 401 is disposed within the insulation layer 500. The heat dissipation plate 101 in the heat dissipation fixing assembly 100 is fixed to the insulation layer 500. The heat dissipation plate 101 is thermally connected to part of the evaporator 401, eliminating the need for additional heat dissipation components. The heat absorbed by the evaporator 401 of the refrigeration compression system 400 itself is conducted to the heat dissipation plate 101, carrying away the heat from the hot end 2022 of the semiconductor cooling chip 202. Simultaneously, the thermal connection between the heat dissipation plate 101 and the evaporator 401 also removes frost caused by excessively low outer surface temperature of the evaporator 401. The insulation plate 102 extends out of the inner liner 300 and is located within the refrigeration chamber 310, ensuring that the cryogenic box 201 is located within the refrigeration chamber 310, forming a cascade refrigeration system.

[0047] In some implementations, such as Figure 3 , Figure 4 As shown, a magnetic power interface 3011 is provided on the inner surface of the inner liner 300. When the heat dissipation fixing assembly 100 is combined with the semiconductor plug-in assembly 200, the magnetic connector 2011 is electrically connected to the magnetic power interface 3011. That is, when the assembly is completed, power can be quickly supplied, allowing the semiconductor cooling chip 202 to start cooling work quickly without the need for manual adjustment of the circuit 600 power supply connection, further increasing the convenience of free assembly and disassembly of the semiconductor assembly structure 50 and the cooling device 60.

[0048] In some implementations, such as Figure 3 , Figure 4 As shown, the circuit 600 connecting the magnetic power interface 3011 is located within the insulation layer 500. Hiding the circuit 600 within the insulation layer 500 prevents damage to the circuit 600 due to the low temperature of the cooling chamber 310, and also avoids the need for circuit 600 connections during each installation of the semiconductor assembly structure 50. This improves the convenience of assembly and installation, making operation simpler and less strenuous.

[0049] In some implementations, such as Figure 3 , Figure 6 As shown, the outer wall of the cryogenic box 201, where the magnetic connector 2011 is located, is on the same plane as the heat-conducting plate 203, and the side of the heat sink 101 away from the evaporator 401 is on the same plane as the inner liner 300. To ensure good sealing performance at the joint, when the semiconductor connector assembly 200 is combined with the heat dissipation fixing assembly 100, the magnetic connector 2011 and the magnetic power interface 3011 are tightly fitted, the outer wall of the cryogenic box 201 is tightly fitted with the inner liner 300, and the heat sink 101 is also tightly fitted with the heat-conducting plate 203, preventing frost from forming at the joint.

[0050] In some implementations, such as Figure 3 , Figure 6As shown, the surface of the cryogenic box 201 near the heat-conducting plate 203 is in contact with the heat-conducting plate 203, and the surface of the cryogenic box 201 near the thermoelectric cooler 202 is in contact with the thermoelectric cooler 202. This is also to ensure the sealing of the assembly joint, prevent frost formation at the joint, and avoid affecting the cooling of the cooling chamber 310, thus ensuring the overall sealing of the semiconductor assembly structure 50 and the sealing of its connection with the cooling device 60.

[0051] This application provides a semiconductor assembly structure 50 and a cooling device 60. The semiconductor assembly structure 50 includes a heat dissipation fixing component 100 and a semiconductor insertion component 200. The heat dissipation fixing component 100 has a heat sink 101 and an insulation plate 102, which are fixedly connected and form an insertion groove 103. The semiconductor insertion component 200 includes a cryogenic box 201 and a semiconductor cooling chip 202. A cryogenic chamber 210 is formed inside the cryogenic box 201. The semiconductor cooling chip 202 is disposed on the side wall of the cryogenic box 201 and has a cold end 2021 and a hot end 2022. A heat-conducting plate 203 is fixedly connected to the hot end 2022. The cold end 2021 is used to provide cooling to the cryogenic chamber 210. The heat-conducting plate 203 extends out of one end of the semiconductor cooling chip 202 and matches the insertion groove 103. The refrigeration equipment 60 includes an inner liner 300, which forms a refrigeration chamber 310. The refrigeration equipment 60 has a refrigeration compression system 400, which includes an evaporator 401. The evaporator 401 acts on the refrigeration chamber 310. The refrigeration equipment 60 is fixed with a heat dissipation fixing component 100 of a semiconductor assembly structure 50. When the semiconductor plug-in component 200 is combined with the heat dissipation fixing component 100, the semiconductor plug-in component 200 is disposed in the refrigeration chamber 310. By placing the semiconductor cooling chip 202 on the side wall of the cryogenic box 201 and fixing the heat-conducting plate 203 to the hot end 2022 of the semiconductor cooling chip 202, the heat-conducting plate 203 can be matched with the insertion slot 103 of the heat dissipation fixing component 100 to form a semiconductor combination structure 50. When the semiconductor cryogenic box is needed, it can be combined, and when the semiconductor cryogenic box is not needed, the two can be separated without occupying the space of the original refrigeration chamber and without changing the manufacturing process of the original refrigeration system. Low noise and low energy consumption cryogenic storage can be achieved at a lower cost, reducing the risk of welding connection. The combination structure is simple and convenient and flexible to use.

[0052] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A refrigeration device, characterized in that, The device includes an inner liner, the interior of which forms a refrigeration chamber. The refrigeration equipment includes a refrigeration compression system, which includes an evaporator that operates within the refrigeration chamber. The refrigeration equipment is equipped with a semiconductor assembly structure, which includes: A heat dissipation fixing assembly, the heat dissipation fixing assembly including a heat dissipation plate and an insulation plate, the heat dissipation plate and the insulation plate being fixedly connected and forming an insertion groove between the heat dissipation plate and the insulation plate; A semiconductor connector assembly includes a cryogenic box and a thermoelectric cooler. A cryogenic chamber is formed inside the cryogenic box. The thermoelectric cooler is disposed on the side wall of the cryogenic box and has a cold end and a hot end. A heat-conducting plate is fixedly connected to the hot end. The cold end is used to provide cooling to the cryogenic chamber. One end of the heat-conducting plate extends out of the thermoelectric cooler and matches the connector slot. When the semiconductor plug-in assembly is combined with the heat dissipation fixing assembly, the semiconductor plug-in assembly is disposed in the cooling room; The heat sink is provided with a sealing baffle on the side facing the insulation board to block the opening of the insertion slot. When the semiconductor insertion assembly is combined with the heat dissipation fixing assembly, the sealing baffle opens the opening of the insertion slot. Wherein, a snap-fit ​​groove is formed between the heat-conducting plate and the outer wall of the cryogenic box, and the unfixed end of the insulation plate matches the snap-fit ​​groove; The inner liner is fitted with an insulating foam layer on its outer periphery, the evaporator is disposed within the insulating foam layer, the heat dissipation fixing component is fixed to the insulating foam layer, the heat dissipation plate is thermally connected to the evaporator, and the insulating plate is located in the refrigeration chamber.

2. The refrigeration equipment as described in claim 1, characterized in that, The outer wall of the cryogenic box is provided with a magnetic connector, which is electrically connected to the semiconductor cooling chip.

3. The refrigeration equipment as described in claim 1, characterized in that, The cold end is connected to the side wall of the cryogenic box or located within the cryogenic chamber.

4. The refrigeration equipment as described in claim 1, characterized in that, The cold end is fixedly connected to a cold-conducting plate.

5. The refrigeration equipment as described in claim 4, characterized in that, The cooling plate is a superconducting disk, and it extends from the semiconductor cooling chip to the multi-faceted inner wall of the cryogenic box.

6. The refrigeration equipment as described in claim 2, characterized in that, The inner surface of the inner liner is provided with a magnetic power interface. When the heat dissipation fixing component is combined with the semiconductor plug-in component, the magnetic connector is electrically connected to the magnetic power interface.

7. The refrigeration equipment as described in claim 6, characterized in that, The circuit connecting the magnetic power interface is located inside the insulation foam layer.

8. The refrigeration equipment as described in claim 6, characterized in that, The outer wall of the cryogenic box where the magnetic connector is located is on the same plane as the heat-conducting plate, and the side of the heat dissipation plate away from the evaporator is on the same plane as the inner liner.

Images