屏蔽结构和电子设备
By introducing a second shielding layer and highly conductive materials into electronic devices, the electromagnetic interference problem caused by the increased integration of electronic devices is solved, achieving effective shielding against low-frequency interference and miniaturized device design.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- HUAWEI TECH CO LTD
- Filing Date
- 2024-01-16
- Publication Date
- 2026-07-17
AI Technical Summary
As the integration of electronic devices increases, electromagnetic interference problems in electronic devices are becoming increasingly serious. Existing shielding structures are difficult to effectively shield low-frequency electromagnetic interference and occupy additional planar design space, affecting the reliability and miniaturization of equipment.
Introducing at least one second shielding layer into electronic devices, set within the first shielding layer, and forming a small shielding cavity through multiple sub-layers, combined with highly conductive and high-loss materials, enhances the electromagnetic shielding effect while avoiding occupying additional planar design space.
It improves the shielding effect of electronic devices against electromagnetic interference, especially low-frequency interference, enhances the reliability and flexibility of the devices, and supports the miniaturization design of the devices.
Smart Images
Figure CN118139395B_ABST