Display panel and manufacturing method thereof, and display device

Abstract

The present application provides a display panel and a method for preparing the same, and a display device; the display panel includes a driving substrate, a pixel definition layer, a sub-pixel, and a suspension structure. The pixel definition layer is disposed on a side surface of the driving substrate; the pixel definition layer protrudes from the driving substrate to form a pixel accommodation area; the sub-pixel is disposed in the pixel accommodation area; the sub-pixel includes an anode, an organic light-emitting layer, and a cathode stacked in sequence from close to the driving substrate to away from the driving substrate; the suspension structure is disposed on a side of the pixel definition layer away from the driving substrate and surrounds the pixel accommodation area. The display panel also includes a protrusion and an encapsulation layer; the protrusion is disposed on a surface of the suspension structure away from the driving substrate; the encapsulation layer is disposed on a surface of the cathode away from the organic light-emitting layer and covers the suspension structure and the protrusion. The display panel can enhance the adhesion of the encapsulation layer to prevent water vapor from entering the sub-pixel and causing adverse effects on the organic light-emitting layer.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] In the preparation process of OLED (Organic Light-Emitting Diode, OLED) organic light-emitting devices, maskless deposition and photolithography (photo lithography) patterned pixel methods can greatly increase the effective light-emitting area (aperture ratio) of active matrix OLED, which is conducive to greatly increasing pixel density. In order to achieve high resolution and colorization of passive matrix OLED, a cathode isolation column structure is introduced, that is, no metal template is used in the preparation of the device, but before evaporating the organic film and the metal cathode, an insulating partition is made on the substrate, and finally the different pixels of the device are separated to realize the pixel array arrangement. This cathode isolation column structure is also called an overhang structure.

[0003] However, the adhesion between the overhang structure and the encapsulation layer in the existing display panel is insufficient, resulting in the encapsulation layer being easily damaged when impacted by a solution or external force during the manufacturing process, causing water vapor to enter the pixel and adversely affect the organic light-emitting layer. Summary of the invention

[0004] The display panel and its preparation method, and the display device provided in the present application are intended to solve the problem of insufficient adhesion between the overhang structure and the encapsulation layer existing in the existing display panel.

[0005] In order to solve the above technical problems, a technical solution adopted by the present application is: to provide a display panel, comprising:

[0006] Driver substrate;

[0007] A pixel definition layer is disposed on a side surface of the driving substrate; the pixel definition layer protrudes from the driving substrate to form a pixel accommodating area;

[0008] A sub-pixel is arranged in the pixel accommodating area; the sub-pixel comprises an anode, an organic light-emitting layer and a cathode which are stacked in sequence from close to the driving substrate to away from the driving substrate;

[0009] A suspension structure is arranged on a side of the pixel definition layer away from the driving substrate and surrounds the pixel accommodating area;

[0010] Also includes:

[0011] A protrusion, disposed on a surface of the overhanging structure away from the driving substrate;

[0012] The encapsulation layer is disposed on a surface of the cathode that is away from the organic light-emitting layer and covers the overhanging structure and the protruding portion.

[0013] In a specific embodiment, the overhang structure includes:

[0014] A conductive portion, arranged in contact with the cathode;

[0015] An insulating portion, covering a surface of the conductive portion facing away from the pixel definition layer and protruding from the conductive portion;

[0016] The protrusion is a single-layer structure.

[0017] In a specific embodiment, the width of the protrusion along a first direction gradually increases from close to the driving substrate to away from the driving substrate; wherein the first direction is perpendicular to the stacking direction of the display panel.

[0018] In a specific embodiment, a height of the protrusion along the stacking direction is smaller than a height of the overhanging structure along the stacking direction.

[0019] In a specific embodiment, a maximum width of the protruding portion along the first direction is smaller than a width of the conductive portion along the first direction.

[0020] In a specific embodiment, the volume of the protrusion is less than or equal to 0.5 times the volume of the overhang structure.

[0021] In a specific embodiment, the protrusion includes a plurality of sub-protrusions, and the plurality of sub-protrusions are stacked or spaced apart on a surface of the overhang structure away from the pixel definition layer.

[0022] In a specific embodiment, the anode is disposed on a surface of the driving substrate that is not covered by the pixel definition layer, and the pixel definition layer covers a portion of the anode;

[0023] The organic light-emitting layer is disposed on a surface of the anode that is away from the driving substrate; and the organic light-emitting layer covers a portion of the pixel definition layer;

[0024] The cathode is disposed on a surface of the organic light-emitting layer facing away from the anode and completely covers the organic light-emitting layer; and the cathode extends to the side wall of the conductive portion and covers the surface of the pixel definition layer not covered by the organic light-emitting layer and the conductive portion;

[0025] The encapsulation layer covers the side wall of the conductive portion that is not covered by the cathode, the surface of the insulating portion that is not covered by the protruding portion, and the surface of the protruding portion.

[0026] In order to solve the above technical problems, another technical solution adopted by the present application is: to provide a method for preparing a display panel, comprising:

[0027] Providing a preform; the preform comprises a driving substrate, a pixel definition layer and an anode; the pixel definition layer protrudes from the driving substrate to form a pixel accommodating area; the anode is arranged in the pixel accommodating area;

[0028] Etching on the pixel definition layer to form a conductive portion and an insulating portion covering the conductive portion; and making the insulating portion protrude from the side wall of the conductive portion;

[0029] A negative photoresist is coated on a surface of the insulating portion on a side away from the drive substrate, and a protrusion is formed by exposure and development;

[0030] Sequentially evaporating and depositing an organic light-emitting material and a cathode material on a side of the anode away from the drive substrate to form a sub-pixel;

[0031] A non-conductive inorganic material is deposited on a side of the cathode away from the organic light-emitting layer to form an encapsulation layer.

[0032] In order to solve the above technical problems, another technical solution adopted in the present application is: to provide a display device, comprising a display panel as involved in any one of the above items.

[0033] Beneficial effects of the embodiments of the present application: Different from the prior art, the present application provides a display panel and a method for preparing the same, and a display device; the display panel includes a driving substrate, a pixel definition layer, a sub-pixel, and a suspension structure. Wherein, the pixel definition layer is arranged on one side surface of the driving substrate; the pixel definition layer protrudes from the driving substrate to form a pixel accommodation area; the sub-pixel is arranged in the pixel accommodation area; the sub-pixel includes an anode, an organic light-emitting layer, and a cathode stacked in sequence from close to the driving substrate to away from the driving substrate; the suspension structure is arranged on the side of the pixel definition layer away from the driving substrate and surrounds the pixel accommodation area. The display panel also includes a protrusion and an encapsulation layer; wherein the protrusion is arranged on the surface of the overhang structure away from the driving substrate; the encapsulation layer is arranged on the surface of the cathode away from the organic light-emitting layer and covers the overhang structure and the protrusion. By arranging the protrusion on the overhang structure to form an isolation structure between sub-pixels, and making the encapsulation layer cover the protrusion, the contact area between the encapsulation layer and the isolation structure is increased, thereby enhancing the adhesion between the encapsulation layer and the isolation structure, and avoiding the damage of the encapsulation layer during the manufacturing process, resulting in water vapor entering the sub-pixel and causing adverse effects on the organic light-emitting layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 A schematic diagram of the structure of a display panel provided in the first embodiment of the present application;

[0035] Figure 2 A schematic diagram of the structure of a display panel provided in the second embodiment of the present application;

[0036] Figure 3 A schematic diagram of the structure of a display panel provided in the third embodiment of the present application;

[0037] Figure 4 A schematic diagram of the structure of the protruding portion of the display panel provided in the fourth embodiment of the present application;

[0038] Figure 5 A schematic diagram of the structure of the raised portion of the display panel provided in the fifth embodiment of the present application;

[0039] Figure 6 A simplified structural diagram of a display device provided in an embodiment of the present application;

[0040] Figure 7 A flow chart of a method for preparing a display panel provided in one embodiment of the present application;

[0041] Figure 8 A schematic diagram of the structure of a prefabricated component provided in one embodiment of the present application;

[0042] Fig. 9 For Figure 8 A schematic diagram of a structure in which a hanging structure is arranged on the structure shown;

[0043] Fig.10 For Fig. 9 A schematic diagram of a structure in which a protrusion is provided on the structure shown;

[0044] Fig.11 For Fig.10 A schematic diagram of a structure in which an organic light-emitting layer and a cathode are arranged on the structure shown;

[0045] Fig.12 For Fig.11 A schematic diagram of a structure in which an encapsulation layer is provided on the structure shown;

[0046] Fig.13 For Fig.12 Schematic diagram of the structure in which a filling layer and a cover plate are arranged on the structure shown.

[0047] Description of Figure Numbers:

[0048] 100-display panel; 1-driving substrate; 2-pixel definition layer; 3-sub-pixel; 4-overhang structure; 5-raised portion; 6-encapsulation layer; 7-filling layer; 8-cover plate; 10-preform; 11-substrate; 12-driving circuit layer; 31-anode; 32-organic light-emitting layer; 33-cathode; 41-conductive portion; 42-insulating portion; 51-sub-raised portion. DETAILED DESCRIPTION

[0049] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0050] The terms "first", "second", "third" in this application are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second", "third" can expressly or implicitly include at least one of the features. In the description of this application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In the embodiments of this application, all directional indications (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the steps or units listed, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or devices.

[0051] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0052] The present application is described in detail below with reference to the accompanying drawings and embodiments.

[0053] See also Figure 1 , Figure 1 A schematic diagram of the structure of a display panel provided for the first embodiment of the present application; the present application provides a display panel, which may be an organic light emitting diode (OLED) display panel; the display panel may include a driving substrate 1, a pixel definition layer 2, sub-pixels 3, an overhang structure 4, a protrusion 5 and an encapsulation layer 6.

[0054] The driving substrate 1 may include a substrate 11 and a driving circuit layer 12; wherein the substrate 11 may be a glass substrate; or a flexible substrate, wherein the material of the flexible substrate is polyimide (PI). The driving circuit layer 12 may be a TFT circuit layer, and the TFT circuit layer is used to drive the sub-pixel 3 to emit light. The pixel definition layer 2 is disposed on a side surface of the driving substrate 1, and protrudes from the driving substrate 1 to form a plurality of pixel accommodation areas for accommodating the sub-pixels 3; specifically, the pixel definition layer 2 defines a plurality of openings on the driving circuit layer 12, and the openings are the pixel accommodation areas; each film layer of the sub-pixel 3 may be deposited and disposed in the openings.

[0055] The sub-pixel 3 includes an anode 31, an organic light-emitting layer 32 and a cathode 33 which are stacked in sequence from close to the driving substrate 1 to away from the driving substrate 1; wherein the anode 31 is connected to the anode 31 power line, and the cathode 33 is connected to the cathode 33 power line, so that the organic light-emitting layer 32 is conductive and emits light. The overhang structure 4 is arranged on the surface of the pixel definition layer 2 facing away from the driving substrate 1, and the overhang structure 4 protrudes and is arranged around the pixel accommodating area, so as to separate the sub-pixels 3 of different colors and avoid the problem of pixel crosstalk.

[0056] The raised portion 5 is disposed on the side surface of the overhang structure 4 away from the driving substrate 1; the encapsulation layer 6 is disposed on the side surface of the cathode 33 away from the organic light-emitting layer 32 and covers the overhang structure 4 and the raised portion 5. The encapsulation layer 6 is used to provide anti-etching protection for the cathode 33, the organic light-emitting layer 32 and the anode 31 of the sub-pixel 3 in the process of preparing sub-pixels 3 of other colors, so as to prevent the prepared sub-pixel 3 from being damaged by the impact of a solution or an external force in the subsequent preparation process.

[0057] In this way, a protrusion 5 is provided on the overhang structure 4 to form an isolation structure between the sub-pixels 3, and the encapsulation layer 6 covers the protrusion 5 to increase the contact area between the encapsulation layer 6 and the isolation structure, thereby enhancing the adhesion between the encapsulation layer 6 and the isolation structure, thereby preventing the encapsulation layer 6 from being damaged during the manufacturing process, resulting in water vapor entering the sub-pixel 3 and causing adverse effects on the organic light-emitting layer 32.

[0058] like Figure 1As shown, in a specific embodiment, the overhang structure 4 may include a conductive portion 41 serving as a common cathode 33 and an insulating portion 42 covering the conductive portion 41; specifically, the conductive portion 41 and the insulating portion 42 are stacked on the pixel definition layer 2 in a direction from close to the drive substrate 1 to away from the drive substrate 1. The conductive portion 41 is disposed on the surface of the pixel definition layer 2 facing the overhang structure 4, and is disposed in contact with the cathode 33 of the sub-pixel 3, so that the cathodes 33 of different sub-pixels 3 are connected through the conductive portion 41. The insulating portion 42 is disposed on a side surface of the conductive portion 41 away from the pixel definition layer 2, and completely covers a side surface of the conductive portion 41 away from the pixel definition layer 2, and is used to separate sub-pixels 3 of different colors. The raised portion 5 may be a single-layer structure, so as to increase the adhesion area with the encapsulation layer 6, simplify the preparation process, and reduce the production cost.

[0059] Among them, along the first direction X perpendicular to the stacking direction Z of the display panel, the edge of the insulating part 42 protrudes from the edge of the conductive part 41 to form an eaves structure, so that when the organic light-emitting layer 32 and the cathode 33 are deposited by evaporation, the evaporation angle can be changed by the eaves structure so that the cathode 33 can completely cover the organic light-emitting layer 32. Specifically, the material of the conductive part 41 can be one or two conductive metals such as Mo, Al, Mg, Cu, Cr, or conductive oxides such as ITO and IZO; the material of the insulating part 42 can be an inorganic insulating material such as SiNx, SiOx, or an inorganic conductive material such as Ti.

[0060] like Figure 1 As shown, in a specific embodiment, the width d1 of the protrusion 5 along the first direction X gradually increases from the direction close to the driving substrate 1 to the direction away from the driving substrate 1. That is to say, the cross section of the protrusion 5 along the first direction X can be an inverted trapezoid; and the side close to the overhang structure 4 is the short side, and the side away from the overhang structure 4 is the long side. It can be understood that the inverted trapezoidal protrusion 5 has a larger adhesion area with the encapsulation layer 6 at the same height, which can further enhance the adhesion between the protrusion 5 and the encapsulation layer 6.

[0061] Specifically, the height h2 of the protrusion 5 along the stacking direction Z can be smaller than the height h1 of the overhang structure 4 along the stacking direction Z. This ensures that the adhesion area between the protrusion 5 and the encapsulation layer 6 is increased while making the height of the protrusion 5 as small as possible, thereby reducing the overall thickness of the display panel film layer and avoiding adverse effects on the thinness of the display panel.

[0062] Continue reading Figure 1, the anode 31 is arranged on the surface of the driving circuit layer 12 facing the pixel definition layer 2, and is located in the pixel accommodating area, and is etched into a preset pattern. The pixel definition layer 2 is arranged between the anodes 31 of adjacent sub-pixels 3 to space the anodes 31 between the sub-pixels 3 to prevent the anodes 31 of adjacent sub-pixels 3 from being connected to each other and affecting the display effect of the display panel. Specifically, the height of the pixel definition layer 2 along the stacking direction Z can also be greater than the height of the anode 31 along the stacking direction Z to further ensure that the anodes 31 of the sub-pixels 3 cannot be connected to each other; preferably, the two sides of the pixel definition layer 2 can also cover the edge portion of the anode 31 close to the pixel definition layer 2 respectively.

[0063] The organic light-emitting layer 32 is disposed on the surface of the anode 31 facing away from the driving substrate 1. In a specific embodiment, the organic light-emitting layer 32 can be deposited on the display panel by evaporation; the organic light-emitting layer 32 covers the anode 31 and covers part of the first pixel definition layer 2 to completely cover the anode 31, so as to prevent the cathode 33 subsequently evaporated from contacting and conducting with the anode 31, thereby affecting the display effect. Of course, the organic light-emitting layer 32 can also overlap the pixel definition layer 2 and cover part of the pixel definition layer 2 to completely cover the anode 31.

[0064] The cathode 33 is disposed on the surface of the organic light-emitting layer 32 facing away from the anode 31. In a specific embodiment, the cathode 33 can also be deposited on the surface of the organic light-emitting layer 32 by evaporation; during the evaporation process, the evaporation angle can be changed so that the cathode 33 completely covers the organic light-emitting layer 32 and overlaps the pixel definition layer 2 to separate the organic light-emitting layer 32 from the conductive portion 41; and the cathode 33 is arranged in contact with the conductive portion 41, so that the cathode 33 of the sub-pixel 3 is connected to the common cathode 33. Specifically, the cathode 33 covers the portion of the surface of the pixel definition layer 2 that is not covered by the organic light-emitting layer 32 and the conductive portion 41, and covers part of the surface of the side wall of the conductive portion 41.

[0065] The encapsulation layer 6 covers the side wall of the conductive part 41 not covered by the cathode 33, the surface of the insulating part 42 not covered by the protrusion 5, and the surface of the protrusion 5; in the process of preparing the sub-pixel 3 of other colors, the cathode 33, the organic light-emitting layer 32 and the anode 31 of the sub-pixel 3 are protected from etching. Specifically, the encapsulation layer 6 completely covers the surface of the cathode 33 on the side away from the organic light-emitting layer 32, and covers the uncovered part of the side wall of the conductive part 41, the part of the side surface of the insulating part 42 facing the driving substrate 1 not covered by the conductive part 41, the side of the insulating part 42 and the part of the side surface of the insulating part 42 facing the driving substrate 1 not covered by the protrusion 5, and also covers the side wall of the protrusion 5. The encapsulation layer 6 may include a non-conductive inorganic material; specifically, the encapsulation layer 6 may include a silicon-containing inorganic material, such as a SiNx-based inorganic material.

[0066] like Figure 1As shown, in a specific embodiment, the display panel may further include a filling layer 7 and a cover plate 8. After the preparation of all sub-pixels 3 is completed, a filling layer 7 and a cover plate 8 may be set on the display panel for overall packaging to protect the internal film layer of the display panel. Specifically, the filling layer 7 is coated on the side of the encapsulation layer 6 away from the driving substrate 1, and the cover plate 8 is attached to the surface of the side of the filling layer 7 away from the encapsulation layer 6; wherein the surface of the side of the filling layer 7 away from the encapsulation layer 6 is flattened to facilitate the setting of the cover plate 8 on the surface. wherein the filling layer 7 may be an organic material; and the cover plate 8 may be a plastic film such as PET.

[0067] See also Figure 2 , Figure 2 This is a schematic diagram of the structure of the display panel provided in the second embodiment of the present application; the structure of the display panel provided in the second embodiment of the present application is basically the same as that of the display panel provided in the first embodiment of the present application, except that, in the second embodiment of the present application, the maximum width d of the protrusion 5 along the first direction X is smaller than the width d2 of the conductive part 41 along the first direction X. That is, along the first direction X, the maximum width of the protrusion 5 is smaller than the minimum width of the conductive part 41; thus, the process difficulty of manufacturing the protrusion 5 on the surface of the insulating part 42 is increased.

[0068] Specifically, the volume of the protrusion 5 may be less than or equal to 0.5 times the volume of the overhang structure 4; that is, the volume of the protrusion 5 may be less than or equal to one-half the volume of the overhang structure 4. For example, the volume of the protrusion 5 may be any value of 0.1 times, 0.2 times, 0.3 times, 0.4 times or 0.5 times the volume of the overhang structure 4. It can be understood that if the volume of the protrusion 5 is too small, the adhesion area between the protrusion 5 and the encapsulation layer 6 will be smaller, which may cause the encapsulation layer 6 to be damaged by the solution or external force during the manufacturing process; if the volume of the protrusion 5 is too large, it will increase the difficulty of the manufacturing process.

[0069] See also Figure 3 , Figure 3 The structure diagram of the display panel provided in the third embodiment of the present application is substantially the same as that of the display panel provided in the first embodiment of the present application, except that, in the third embodiment of the present application, the volume of the protrusion 5 can be the same as that of the overhang structure 4, so as to further increase the adhesion area between the encapsulation layer 6 and the protrusion 5, thereby enhancing the adhesion between the encapsulation layer 6 and the protrusion 5. Specifically, the maximum width d of the protrusion 5 along the first direction X can be greater than the width d2 of the conductive portion 41 along the first direction X.

[0070] See also Figure 4 and Figure 5 , Figure 4 A schematic diagram of the structure of a protrusion in a display panel provided in a fourth embodiment of the present application; Figure 5A schematic diagram of the structure of the protrusion of the display panel provided in the fifth embodiment of the present application. In some other embodiments, the protrusion 5 may include a plurality of sub-protrusions 51, and the plurality of sub-protrusions 51 may be stacked or spaced apart on the surface of the overhang structure 4 away from the pixel definition layer 2, so as to further increase the adhesion area between the encapsulation layer 6 and the protrusion 5.

[0071] Specifically, the plurality of sub-protrusions 51 may be arranged at intervals along the first direction X on a surface of the insulating portion 42 facing away from the conductive portion 41 (eg, Figure 4 A plurality of sub-protrusions 51 may also be stacked along the stacking direction Z on the surface of the insulating portion 42 facing away from the conductive portion 41 (eg Figure 5 ).

[0072] In some embodiments, the overhang structure 4 can also be set as an inverted trapezoidal single-layer structure; in these embodiments, the overhang structure 4 can also be made by using a negative photoresist after exposure and development. It can be understood that the single-layer overhang structure 4 cannot conduct electricity, so it is necessary to set a conductive metal layer between the overhang structure 4 and the pixel definition layer 2 to turn on the cathode of the sub-pixel 3.

[0073] In other embodiments, the raised portion 5 may also be configured as a double-layer structure similar to the overhang structure 4; wherein the raised portion 5 may include a support portion and a first insulating portion covering the support portion, and the edge of the first insulating portion protrudes from the support portion to form an eaves structure. Of course, in some embodiments, the overhang structure 4 and the raised portion 5 may also be configured as a double-layer structure having an eaves structure.

[0074] The present application provides a display panel, which includes a driving substrate 1, a pixel definition layer 2, a sub-pixel 3 and a suspension structure 4. The pixel definition layer 2 is arranged on a side surface of the driving substrate 1; the pixel definition layer 2 protrudes from the driving substrate 1 to form a pixel accommodation area; the sub-pixel 3 is arranged in the pixel accommodation area; the sub-pixel 3 includes an anode 31, an organic light-emitting layer 32 and a cathode 33 stacked in sequence from close to the driving substrate 1 to away from the driving substrate 1; the suspension structure 4 is arranged on the side of the pixel definition layer 2 away from the driving substrate 1 and surrounds the pixel accommodation area. The display panel also includes a protrusion 5 and an encapsulation layer 6; the protrusion 5 is arranged on the surface of the suspension structure 4 away from the driving substrate 1; the encapsulation layer 6 is arranged on the surface of the cathode 33 away from the organic light-emitting layer 32 and covers the suspension structure 4 and the protrusion 5. A protrusion 5 is provided on the overhang structure 4 to form an isolation structure between the sub-pixels 3, and the encapsulation layer 6 covers the protrusion 5 to increase the contact area between the encapsulation layer 6 and the isolation structure, thereby enhancing the adhesion between the encapsulation layer 6 and the isolation structure, thereby preventing the encapsulation layer 6 from being damaged during the manufacturing process, resulting in water vapor entering the sub-pixel 3 and causing adverse effects on the organic light-emitting layer 32.

[0075] See also Figure 6 , Figure 6 A schematic diagram of the structure of a display device provided in an embodiment of the present application; the present application also provides a display device, which may include the display panel 100 involved in any of the above embodiments. The display device can enhance the adhesion between the encapsulation layer 6 and the isolation structure to avoid the damage of the encapsulation layer 6 during the manufacturing process, resulting in water vapor entering the sub-pixel 3 and causing adverse effects on the organic light-emitting layer 32. The display device can be a product or component with display function such as a mobile phone, a tablet computer, a laptop computer and a television. The display device also includes a mainboard, a control circuit, etc. These structures are the same or similar to the relevant structures of the existing display device. For details, please refer to the prior art and will not be repeated here.

[0076] See also Figure 7-Figure 11 , Figure 7 A flow chart of a method for preparing a display panel provided in one embodiment of the present application; Figure 8 A schematic diagram of the structure of a prefabricated component provided in one embodiment of the present application; Fig. 9 For Figure 8 A schematic diagram of a structure in which a hanging structure is arranged on the structure shown; Fig.10 For Fig. 9 A schematic diagram of a structure in which a protrusion is provided on the structure shown; Fig.11 For Fig.10 A schematic diagram of a structure in which an organic light-emitting layer and a cathode are arranged on the structure shown; Fig.12 For Fig.11 The present application also provides a method for preparing a display panel, which is used to prepare the display panel involved in any of the above embodiments. The steps of the preparation method specifically include:

[0077] Step S1: providing a preform; the preform comprises a driving substrate, a pixel definition layer and an anode; the pixel definition layer protrudes from the driving substrate to form a pixel accommodating area; the anode is arranged in the pixel accommodating area.

[0078] Specifically, Figure 8 As shown, a metal material is deposited on a driving substrate 1 and etched into a preset pattern to form an anode 31; then a pixel definition layer 2 is disposed on the surface of the driving substrate 1 not covered by the anode 31, and the edge of the pixel definition layer 2 covers the edge of the anode 31. The height of the pixel definition layer 2 along the stacking direction Z is greater than the thickness of the anode 31 along the stacking direction Z, and a plurality of openings are formed around the pixel definition layer 2, namely, the pixel accommodating area.

[0079] Step S2: etching the pixel definition layer to form a conductive portion and an insulating portion covering the conductive portion; and making the insulating portion protrude from the side wall of the conductive portion.

[0080] like Fig. 9As shown, in the specific implementation process, one or two conductive metals such as Mo, Al, Mg, Cu, Cr, or conductive oxides such as ITO and IZO are first deposited on the surface of the pixel definition layer 2 away from the driving substrate 1 to form a conductive material layer, and then inorganic insulating materials such as SiNx and SiOx are deposited on the surface of the conductive material layer to form an insulating material layer; finally, the insulating material layer and the conductive material layer are sequentially etched by photolithography to form a conductive portion 41 and an insulating portion 42 to obtain a suspension structure 4, and the edge of the insulating portion 42 is made to protrude from the side wall of the conductive portion 41 to form an eaves structure. Specifically, the photolithography method can be a dry etching method or a wet etching method.

[0081] Of course, in other embodiments, inorganic conductive materials such as Ti may also be deposited on the surface of the conductive material layer to form the insulating portion 42 .

[0082] Step S3: coating a negative photoresist on the surface of the insulating portion facing away from the driving substrate, and forming a protrusion by exposure and development.

[0083] like Fig.10 As shown, negative photoresist is coated on the surface of the side of the insulating portion 42 away from the drive substrate 1 and then exposed; during the exposure process, the part of the negative photoresist that is exposed to light will polymerize and crosslink and solidify, and the part that is not exposed to light will not undergo crosslinking polymerization. The surface of the negative photoresist is more easily polymerized and crosslinked, and the light intensity of the part of the negative photoresist away from the surface gradually weakens. From the surface to the direction away from the surface, the degree of polymerization and crosslinking of the negative photosensitive material gradually weakens. In the development process, the negative photoresist that has not undergone crosslinking polymerization will be washed away.

[0084] A mask is covered on the surface of the negative photoresist away from the insulating portion 42, and the exposed negative photoresist is cross-linked and polymerized by light exposure, while the negative photoresist in the unexposed portion is not polymerized. After the light exposure is preset for a time, the unpolymerized cross-linked negative photoresist is removed by a developer to obtain an inverted trapezoidal protrusion 5. The negative photoresist can be a material such as polyimide or epoxy resin.

[0085] Step S4: depositing an organic light-emitting material and a cathode material in sequence by evaporation on the side of the anode facing away from the driving substrate to form a sub-pixel.

[0086] like Fig.11 As shown, in the specific implementation process, the organic light-emitting layer 32 can be deposited on the display panel by evaporation and completely covers the anode 31; the cathode 33 can also be deposited on the surface of the organic light-emitting layer 32 by evaporation; the anode 31, the organic light-emitting layer 32 and the cathode 33 together constitute the sub-pixel 3.

[0087] Specifically, during the evaporation process, the evaporation angle can be changed so that the cathode 33 completely covers the organic light-emitting layer 32 and at least partially covers the pixel definition layer 2, and at the same time, the cathode 33 covers a portion of the side wall of the conductive part 41 to separate the organic light-emitting layer 32 from the conductive part 41.

[0088] Step S5: depositing a non-conductive inorganic material on the side of the cathode away from the organic light-emitting layer to form an encapsulation layer.

[0089] Specifically, Fig.12 As shown, a non-conductive inorganic material is deposited on the surface of the cathode 33 facing away from the organic light-emitting layer 32 to form an encapsulation layer 6; the encapsulation layer 6 can cover the surface of the cathode 33 facing away from the organic light-emitting layer 32, and cover the uncovered portion of the side wall of the conductive portion 41, the portion of the side surface of the insulating portion 42 facing the driving substrate 1 that is not covered by the conductive portion 41, the side of the insulating portion 42 and the portion of the side surface of the insulating portion 42 facing away from the driving substrate 1 that is not covered by the protrusion 5, and also cover the side wall of the protrusion 5; so as to provide anti-etching protection for each film layer of the sub-pixel 3.

[0090] In a specific implementation process, after the step of forming the encapsulation layer 6 , the following steps may be further included: forming a filling layer 7 on the side of the encapsulation layer 6 away from the drive substrate 1 ; and attaching a cover plate 8 to the surface of the side of the filling layer 7 away from the drive substrate 1 .

[0091] Specifically, Fig.13 As shown, Fig.13 For Fig.12 Schematic diagram of the structure in which a filling layer and a cover plate are arranged on the structure shown; an organic material is deposited on the side of the encapsulation layer 6 away from the driving substrate 1 to form a filling layer 7, and the surface of the filling layer 7 on the side away from the encapsulation layer 6 is flattened; then a plastic film such as PET is attached to the side surface of the filling layer 7 to form a cover plate 8.

[0092] The present application provides a method for preparing a display panel, which comprises providing a preform 10; the preform 10 comprises a driving substrate 1, a pixel definition layer 2 and an anode 31; the pixel definition layer 2 protrudes from the driving substrate 1 to form a pixel accommodating area; the anode 31 is arranged in the pixel accommodating area; then a conductive portion 41 and an insulating portion 42 covering the conductive portion 41 are etched on the pixel definition layer 2; and the insulating portion 42 is made to protrude from the side wall of the conductive portion 41; then a negative photoresist is coated on the surface of the insulating portion 42 facing away from the driving substrate 1, and a protrusion 5 is formed by exposure and development; then an organic light-emitting material and a cathode 33 material are sequentially evaporated and deposited on the side of the anode 31 facing away from the driving substrate 1 to form a sub-pixel 3; and then a non-conductive inorganic material is deposited on the side of the cathode 33 facing away from the organic light-emitting layer 32 to form an encapsulation layer 6. In this way, a protrusion 5 is provided on the overhang structure 4 to form an isolation structure between the sub-pixels 3, and the encapsulation layer 6 covers the protrusion 5 to increase the contact area between the encapsulation layer 6 and the isolation structure, thereby enhancing the adhesion between the encapsulation layer 6 and the isolation structure, thereby preventing the encapsulation layer 6 from being damaged during the manufacturing process, resulting in water vapor entering the sub-pixel 3 and causing adverse effects on the organic light-emitting layer 32.

[0093] The above description is only an implementation method of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A method for preparing a display panel, characterized in that: include: Provide prefabricated parts; The preform comprises a driving substrate, a pixel definition layer and an anode; The pixel definition layer protrudes from the driving substrate to form a pixel accommodating area; The anode is disposed in the pixel accommodating area; Etching on the pixel definition layer to form a conductive portion and an insulating portion covering the conductive portion; and making the insulating portion protrude from the side wall of the conductive portion along a first direction to form an eaves structure, thereby forming an overhang structure; wherein the first direction is perpendicular to the stacking direction of the display panel; A negative photoresist is coated on a surface of the insulating portion on a side away from the driving substrate, and an inverted trapezoidal convex portion is formed by exposure and development; the width of the convex portion along a first direction gradually increases from close to the driving substrate to away from the driving substrate; and the maximum width of the convex portion along the first direction is smaller than the width of the conductive portion along the first direction; After the step of forming the protrusion, an organic light-emitting material and a cathode material are sequentially deposited by evaporation on a side of the anode away from the drive substrate to form an organic light-emitting layer and a cathode, which together with the anode form a sub-pixel; A non-conductive inorganic material is deposited on a side of the cathode away from the organic light-emitting layer to form an encapsulation layer.

2. A display panel, characterized in that: The display panel is manufactured by the method for manufacturing the display panel according to claim 1, comprising: Driver substrate; A pixel definition layer is disposed on a side surface of the driving substrate; the pixel definition layer protrudes from the driving substrate to form a pixel accommodating area; A sub-pixel is arranged in the pixel accommodating area; the sub-pixel comprises an anode, an organic light-emitting layer and a cathode which are stacked in sequence from close to the driving substrate to away from the driving substrate; The overhang structure is arranged on a side of the pixel definition layer away from the driving substrate and surrounds the pixel accommodating area; the overhang structure comprises: A conductive portion, arranged in contact with the cathode; an insulating portion, covering a surface of the conductive portion on one side away from the pixel definition layer and protruding from an edge of the conductive portion along a first direction to form an eaves structure; wherein the first direction is perpendicular to a stacking direction of the display panel; A protrusion is arranged on a surface of the overhanging structure away from the driving substrate; the protrusion is an inverted trapezoid; the width of the protrusion along a first direction gradually increases from close to the driving substrate to away from the driving substrate; the maximum width of the protrusion along the first direction is smaller than the width of the conductive portion along the first direction; The encapsulation layer is disposed on a surface of the cathode that is away from the organic light-emitting layer and covers the overhanging structure and the protruding portion.

3. The display panel according to claim 2, characterized in that: The protrusion is a single-layer structure.

4. The display panel according to claim 3, characterized in that: A height of the protrusion along the stacking direction is smaller than a height of the overhanging structure along the stacking direction.

5. The display panel according to claim 4, characterized in that: The volume of the protrusion is less than or equal to 0.5 times the volume of the overhanging structure.

6. The display panel according to claim 2, characterized in that: Also includes: The protrusion includes a plurality of sub-protrusions, and the plurality of sub-protrusions are stacked or spaced apart on a surface of the overhanging structure away from the pixel definition layer.

7. The display panel according to claim 2, characterized in that: The anode is disposed on a surface of the driving substrate that is not covered by the pixel definition layer, and the pixel definition layer covers a portion of the anode; The organic light-emitting layer is disposed on a surface of the anode that is away from the driving substrate; and the organic light-emitting layer covers a portion of the pixel definition layer; The cathode is disposed on a surface of the organic light-emitting layer facing away from the anode and completely covers the organic light-emitting layer; and the cathode extends to the side wall of the conductive portion and covers the surface of the pixel definition layer not covered by the organic light-emitting layer and the conductive portion; The encapsulation layer covers the side wall of the conductive portion that is not covered by the cathode, the surface of the insulating portion that is not covered by the protruding portion, and the surface of the protruding portion.

8. A display device, characterized in that: Comprising a display panel as described in any one of claims 2-7.

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