Process carrier

Abstract

A process container includes flanges defining a plurality of slots. At least one of the flanges includes a fastener configured to contact a disk or wafer when it is inserted into one of the plurality of slots defined by the at least one of the flanges. The fastener projects outwardly from the at least one of the flanges into the at least one of the plurality of slots. The fastener includes a tapered portion, wherein the cross-sectional thickness of the at least one fastener increases along the insertion direction of the disk or wafer into the plurality of slots. The fastener may include a continuous ramp or curve. The fastener may include a chamfer. The fastener has a contact area that decreases as it extends from the flange and a smooth transition, thereby reducing friction and corresponding particle shedding when the disk or wafer is inserted into, removed from, or moved simultaneously within the process container.

Description

Technical Field

[0001] This disclosure relates to process carriers for disks or wafers, and more particularly to process carriers including fasteners for securing disks or wafers. Background Technology

[0002] Disks or wafers may be stored in process carriers for transport, storage, and handling, such as during disk or wafer manufacturing. Disks or wafers may be stored in slots. The slots may include fasteners to further secure the disks or wafers within the slots. The fasteners tend to protrude significantly from the slots and provide a prominent surface area for positioning the disk or wafer upon contact with the fasteners. During insertion, holding, and removal of disks or wafers from the process carrier, friction between the disks or wafers and the fasteners can result in friction that causes particulate matter to detach from the process carrier. Summary of the Invention

[0003] This disclosure relates to process carriers for disks or wafers, and more particularly to process carriers including fasteners for securing disks or wafers.

[0004] By providing a smooth transition for the clamps holding the disks or wafers and reducing the point at which the clamps reach their maximum thickness, the process container according to the embodiment can provide sufficient holding force while using a smaller and gentler contact area. This, in turn, reduces particle shedding associated with inserting, storing, or removing disks or wafers from the process container.

[0005] In one embodiment, the process carrier includes a plurality of flanges extending into an internal space of the process carrier, the plurality of flanges defining a plurality of slots. At least one of the plurality of flanges includes a fastener configured to contact the disk or wafer when it is inserted into one of the plurality of slots defined by the at least one of the plurality of flanges. The fastener projects outwardly from the at least one of the plurality of flanges into the plurality of slots. The fastener includes a tapered portion, wherein the cross-sectional thickness of at least one fastener increases along the insertion direction of the disk or wafer into the plurality of slots.

[0006] In an embodiment, the fastener is integrally formed with at least one of the plurality of flanges.

[0007] In one embodiment, at least one of the grooves is defined by two of the plurality of flanges, each of the plurality of flanges comprising the fastener.

[0008] In an embodiment, each of the plurality of flanges includes at least one of the fasteners.

[0009] In one embodiment, the tapered portion extends at least half the length of the fastener in the wafer insertion direction.

[0010] In one embodiment, the tapered portion is concave on the side facing one of the plurality of slots.

[0011] In one embodiment, the fastener further includes a retaining portion having the maximum cross-sectional thickness of the fastener.

[0012] In one embodiment, the retaining portion extends at most one-third of the length of the fastener in the wafer insertion direction.

[0013] In one embodiment, the process carrier includes a curved surface at the intersection of the tapered portion and the holding portion.

[0014] In one embodiment, the fastener includes a chamfer on one side of the fastener, the side of the fastener facing the end of one of the plurality of flanges in the interior space of the process carrier.

[0015] In one embodiment, the process carrier comprises polyetheretherketone (PEEK) material. In another embodiment, the process carrier is entirely made of PEEK material. In yet another embodiment, the PEEK material is a composite material comprising milled carbon fibers. Attached Figure Description

[0016] Figure 1 A process carrier according to an embodiment is shown.

[0017] Figure 2 exhibit Figure 1 A cross-sectional view of the process carrier that houses the disk.

[0018] Figure 3 A front view of a fastener in a process carrier according to an embodiment is shown.

[0019] Figure 4 exhibit Figure 3 Side view of the fastener.

[0020] Figure 5 A perspective view showing a portion of a process carrier containing several fasteners. Detailed Implementation

[0021] This disclosure relates to process carriers for disks or wafers, and more particularly to process carriers including fasteners for securing disks or wafers.

[0022] Figure 1A process carrier according to an embodiment is shown. The process carrier 100 includes a carrier body 102 defining an internal space. The carrier body 102 includes a first sidewall 104, a second sidewall 106, and an end wall 108. A plurality of flanges 110 extend from the first sidewall 104 and the second sidewall 106, extending into the internal space. The flanges 110 define grooves 112, each groove 112 capable of receiving a disk or wafer 114. At least some of the flanges 110 include one or more fasteners 116.

[0023] Process carrier 100 is a carrier for one or more platters or wafers 114. Process carrier 100 can be used for the transport, storage, and handling of platters or wafers 114. Platters or wafers 114 can be any suitable wafer, such as semiconductors, hard disk drive components, etc. In an embodiment, platter or wafer 114 can be a hard disk drive storage platter. Process carrier 100 can be configured to hold each platter or wafer 114 such that the plane of the platter or wafer 114 can be oriented in a generally vertical direction, understood to be that the slot 112 may deviate slightly from perfect perpendicularity due to the size, manufacturing tolerances, etc., of the platter or wafer 114.

[0024] The carrier body 102 defines a process carrier 100. The process carrier 100 can be any suitable material for contacting disks or wafers and undergoing any suitable processing upon receiving the disks or wafers. In embodiments, the carrier body 102 may comprise a polymer material. In embodiments, the carrier body 102 may comprise a polyetheretherketone (PEEK) material. In embodiments, the carrier body 102 is made entirely of PEEK material. In embodiments, the carrier body 102 may be a composite material comprising fibrous materials, such as, as a non-limiting example, milled carbon fibers. The carrier body 102 may be shaped to define an internal space capable of accommodating a predetermined number of disks or wafers 114. The internal space may be defined at least partially by a first sidewall 104, a second sidewall 106, and an endwall 108. The carrier body 102 may be further configured to be placed within a storage container and / or one or more processing tools for processing the disks or wafers 114.

[0025] Flanges 110 extend inwardly from the sidewalls 104, 106 of the carrier body 102. Flanges 110 extend partially into the interior space within the carrier body 102 in the horizontal direction H. Each flange 110 also extends in the vertical direction V along the corresponding sidewalls 104, 106 of the carrier body 102 (from which flanges 110 extend). The flanges 110 are distributed along the longitudinal direction L of the carrier body 102 such that they are located at corresponding positions on the first sidewall 104 and the second sidewall 106. Grooves 112 are defined by the flanges 110. Each groove 112 is sized to accommodate one of a disk or a wafer 114. Grooves 112 can be defined by a pair of adjacent flanges 110 on each of the opposing sidewalls 104, 106 of the carrier body 102.

[0026] The platter or wafer 114 can be any suitable platter or wafer that can be stored in the process carrier 100. As a non-limiting example, the platter or wafer 114 can be a substrate, a semiconductor platter or wafer, a platter for a hard disk drive, etc. The platter or wafer 114 can be placed in the process carrier 100 at any suitable stage of storage, processing, or transport of such platter or wafer. In an embodiment, the platter or wafer 114 is a platter for a hard disk drive. The size and shape of the internal space defined by the carrier body 102 and the size of the slot 112 defined by the distribution and size of the flanges 110 and the fasteners 116 allow the platter or wafer to be inserted into and held within the slot 112.

[0027] The fastener 116 is positioned on the flange 110. The fastener 116 protrudes outward from the flange 110 into the groove 112, such that the fastener 116 provides contact holding the disk or wafer 114 in the corresponding groove 112. When the disk or wafer 114 is held in the groove 112, the fastener 116 can be used to ensure that the disk or wafer 114 remains more closely vertically oriented.

[0028] The fastener 116 can be configured to have a smooth transition from the surface of the flange 110 to the surface of the fastener 116, thereby contacting the disk or wafer 114. In one embodiment, the angle between the surface of the flange 100 and the surface of the fastener 116 at its end is less than 30 degrees. In another embodiment, the angle between the surface of the flange 100 and the surface of the fastener 116 at its end is less than 15 degrees. In yet another embodiment, the angle between the surface of the flange 100 and the surface of the fastener 116 at its end is between 2 and 5 degrees. In one embodiment, as the fastener 116 extends from the flange 110, the surfaces of the fastener 116 and the flange 110 can form continuously curved or inclined surfaces. In one embodiment, the fastener may have a straight bevel as it extends outward from the corresponding flange 110. In another embodiment, the fastener may include a convex curve as it extends outward from the corresponding flange 110. In one embodiment, the fastener extends outward from the corresponding flange 110 and may include a concave curve.

[0029] The fastener 116 may be configured such that a portion of the fastener 116 that contacts the disk or wafer 114 to hold the disk or wafer is positioned close to the bottom of the carrier body 102. In an embodiment, the fastener 116 may reach its maximum thickness at a point where the distance from the exposed point of the fastener 116 on the flange 110 to the point where the flange 110 and the fastener 116 intersect with the carrier body 102 is greater than half. In an embodiment, the fastener 116 may reach its maximum thickness at a point where the distance from the exposed point of the fastener 116 on the flange 110 to the point where the flange 110 and the fastener 116 intersect with the carrier body 102 is greater than three-quarters. The fastener 116 may further include a bevel, wherein the fastener 116 and the flange 110 extend into the interior space of the carrier body 102. In an embodiment, the fastener 116 and the flange 110 are integrally formed. In an embodiment, the fastener 116 may be overmolded onto or connected to the flange 110.

[0030] Figure 2 exhibit Figure 1 A cross-sectional view of the process carrier 100 accommodating a disk or wafer 114. In this view, the cross-section is taken in the horizontal direction of the carrier body 102 of the process carrier 100. The flange 110 and the fastener 116 are visible in the slot 112 closest to the observer, wherein the flange 110 / fastener 116 is located at the junction of the flange 110 and the fastener 116. Figure 2A groove 112 is formed between the cross-sectional lines in the view. A disk or wafer 114 is inserted into the groove 112. When the disk or wafer 114 is fully inserted into the groove 112, the disk or wafer 114 may contact the fastener 116 at the contact portion 112. The contact portion 112 may mechanically support the disk or wafer 114 to maintain the vertical orientation of the disk or wafer 114 within the process container 100. The contact portion 112 may hold the disk or wafer against another flange (e.g., a flange 110 on the opposite side of forming the groove 112) or against another fastener provided on the other flange.

[0031] Figure 3 A front view of a fastener in a process carrier according to an embodiment is shown. The fastener 200 is mounted on a flange 202. The fastener 200 includes a transition region 204 and a contact region 206. The fastener 200 further includes a chamfer 208.

[0032] Flange 202 extends to the process carrier (e.g., as described above and as shown below) Figure 1 and 2 The flange 202 is located within the internal space of the process carrier 100 shown in the illustration. The flange 202 is configured to at least partially define a slot within the process carrier 100. The slot can be used to hold a disk or wafer (e.g., as described above and as shown in the illustration). Figure 1 and 2 (e.g., a disk or wafer 114 shown in the image). A fastener 200 extends outward from a flange 202 into a groove defined by the flange 202; the thickness of the fastener 200 narrows the groove to contact and hold the wafer. Figure 3 In the front view, the fastener 200 extends toward the observer relative to the surface of the flange 202. In an embodiment, the fastener 200 and the flange 202 are integrally formed. In an embodiment, the fastener 200 may be overmolded onto or attached to the flange 202.

[0033] The fastener 200 extends from the flange 202 toward the bottom of the process carrier at a portion of the flange 202. The fastener 200 includes a transition region 204 at its end toward the upper portion of the process carrier. The transition region 204 may be a tapered portion of the fastener 200. The thickness of the fastener 200 increases vertically with the length of the transition region 204, i.e., when moving from the upper part of the process container to the bottom of the flange 202 where it intersects with the wall of the process container. Because the fastener 200 protrudes from the flange 202, the transition region 204 provides a smooth transition from the surface of the flange 202 to the surface of the fastener 200. The transition region 204 may include a straight ramp or a curve. The thickness of the fastener 200 may increase as it moves from the end of the transition region 204 intersecting with the flange 202 to the position where the transition region 204 intersects with the contact region 206. When a disk or wafer is inserted into a slot containing a fastener 200, a transition region 204 guides the disk or wafer.

[0034] Contact area 206 is part of fastener 200, comprising at least the portion of fastener 200 having the greatest thickness and any portion of fastener 200 further towards the bottom of the process container than the portion having the greatest thickness. In an embodiment, at least a portion of the surface of contact area 206 is parallel to the surface of flange 202. The extent to which contact area 206 protrudes from flange 202 may be based on the length of fastener 200 and the angle between the surface of flange 202 and transition area 204. Contact area 206 is configured to contact a disk or wafer to secure the disk or wafer with a reduced tilt compared to flange 202 itself. The degree of tilt reduction may be selected to any suitable permissible tilt, such as the degree of tilt permissible in a particular process or when using a particular tool. In an embodiment, contact area 206 extends from transition area 204 to the sidewalls and / or bottom walls of the process carrier body, such as those described above and as... Figure 1 and 2 The sidewalls 104 and 106 of the carrier body 102 shown are illustrated. The contact area 206 may constitute the end of the fastener 200 closest to the bottom of the process carrier. In an embodiment, the contact area 206 has a constant thickness. In an embodiment, the surface at the junction between the transition area 204 and the contact area 206 is a continuous curve. In an embodiment, the surface of the transition area 204 intersects the surface of the contact area 206 at a predetermined angle. In an embodiment, the intersection of the transition area 204 and the contact area 206 is radial.

[0035] In the fastener 200, the contact area 206 may form only a portion of the total length of the fastener 200 along the flange 202. In one embodiment, the contact area 206 has a length less than half the total length of the fastener 200. In another embodiment, the contact area 206 has a length less than one-quarter the total length of the fastener 200. The contact area 206 may be shaped and sized to reduce the contact area between the fastener 200 and the disk or wafer when the disk or wafer is fully inserted into the slot defined at least partially by the flange 202 and the fastener 200. The size of the contact area between the fastener 200 and the disk or wafer on the contact area 206 may be selected based on the permissible deflection of the disk or wafer in the vertical direction while it is in the process carrier.

[0036] A chamfer 208 may be provided on one or both of the transition region 204 and the contact region 206. The chamfer 208 may be provided on one side of the fastener 200 facing the flange 202 (which faces the interior space of the process carrier). The thickness of the fastener 200 may decrease across the chamfer 208 as it moves horizontally toward the interior space of the process carrier. The chamfer 208 may include a straight edge, a concave curve, or a convex curve. The chamfer 208 may be configured to receive a portion of a bent end of a wafer (e.g., a circular wafer) and provide a smooth transition that guides the bent end of the disk or wafer into a groove defined by the flange 202, allowing the disk or wafer to be secured through the contact region 206 of the fastener 200.

[0037] Figure 4 exhibit Figure 3 A side view of the fastener. (See attached image.) Figure 4 As seen in the side view, the fastener 200 extends outward from the flange 202 into a groove defined between the flange 202 and another flange (not shown), which may contain another fastener (not shown). As it moves from the upper portion of the groove toward the bottom of the groove, the fastener 200 effectively increases the thickness of the flange 202. Figure 4 In the side view, the bevel 208 can be seen on each of the transition region 204 and the contact region 206. Furthermore, it can be seen that... Figure 4 The side view shows an increase in thickness of the fastener 200 in the transition region 204. In the embodiment, as... Figure 4 As shown, flange 202, transition region 204 and contact region 206 can be configured as continuous surfaces, which may include curves in the transition region 204, contact region 206 or the transition from flange 202 to transition region 204 or from transition region 204 to contact region 206, but do not include corners or edges.

[0038] Figure 5 This is a perspective view showing a portion of a process carrier containing several fasteners. As described above, and also as... Figure 3 and 4 As shown in the image, Figure 5 Each of the flanges 202 includes at least one fastener 200, wherein each fastener 200 includes a transition region 204, a contact region 206, and a chamfer 208.

[0039] aspect:

[0040] Aspect 1. A process carrier comprising:

[0041] Multiple flanges extending into the interior space of the process carrier, the multiple flanges defining multiple slots;

[0042] At least one of the plurality of flanges includes a fastener configured to contact the disk or wafer when the disk or wafer is inserted into one of the plurality of slots defined by the at least one of the plurality of flanges.

[0043] The fastener protrudes outward from at least one of the plurality of flanges into one of the plurality of slots.

[0044] The fastener includes a tapered portion, wherein the cross-sectional thickness of the at least one fastener increases along the insertion direction from the disc or wafer into one of the plurality of slots.

[0045] Aspect 2. The process carrier according to aspect 1, wherein the fastener is integrally formed with at least one of the plurality of flanges.

[0046] Aspect 3. The process carrier according to any one of aspects 1 to 2, wherein at least one of the grooves is defined by two of the plurality of flanges, each of the two of the plurality of flanges comprising the fastener.

[0047] Aspect 4. The process carrier according to any one of aspects 1 to 3, wherein each of the plurality of flanges comprises at least one of the fasteners.

[0048] Aspect 5. The process carrier according to any one of aspects 1 to 4, wherein the tapered portion extends at least half the length of the fastener in the wafer insertion direction.

[0049] Aspect 6. The process carrier according to any one of aspects 1 to 5, wherein the conical portion is concave on the side facing one of the plurality of slots.

[0050] Aspect 7. The process carrier according to any one of aspects 1 to 6, wherein the fastener further comprises a retaining portion having the maximum cross-sectional thickness of the fastener.

[0051] Aspect 8. The process carrier according to aspect 7, wherein the retaining portion extends at most one-third of the length of the fastener in the wafer insertion direction.

[0052] Aspect 9. The process carrier according to any one of aspects 7 to 8, wherein the tapered portion and the holding portion intersect at a curved surface.

[0053] Aspect 10. The process carrier according to any one of aspects 1 to 9, wherein the fastener includes a chamfer on one side of the fastener, the side of the fastener facing the end of one of the plurality of flanges in the interior space of the process carrier.

[0054] Aspect 11. The process carrier according to any one of aspects 1 to 10, wherein the process carrier comprises a polyetheretherketone (PEEK) material.

[0055] Aspect 12. The process carrier according to aspect 11, wherein the process carrier is entirely made of PEEK material.

[0056] Aspect 13. The process carrier according to aspect 11, wherein the PEEK material is a composite material comprising milled carbon fibers.

[0057] The examples disclosed in this application are to be regarded in all respects as illustrative rather than restrictive. The scope of the invention is indicated by the appended claims rather than by the foregoing description; and all modifications within the meaning and equivalent scope of the claims are intended to be included therein.

Claims

1. A process carrier, comprising: The main body of the vehicle defines the internal space; Multiple flanges extending into the interior space of the vehicle body, the multiple flanges defining multiple slots; At least one of the plurality of flanges includes a fastener configured to contact the wafer when the wafer is inserted into one of the plurality of slots defined by the at least one of the plurality of flanges; The fastener contacts the wafer at a contact area, the length of which is less than half the total length of the fastener. The fastener protrudes outward from at least one of the plurality of flanges into one of the plurality of slots. The fastener includes a tapered portion, wherein the cross-sectional thickness of the fastener increases along the insertion direction from the wafer to one of the plurality of slots.

2. The process carrier according to claim 1, wherein the fastener is integrally formed with at least one of the plurality of flanges.

3. The process carrier according to claim 1 or 2, wherein at least one of the grooves is defined by two adjacent flanges of the plurality of flanges, each of the two flanges comprising the fastener.

4. The process carrier according to claim 1 or 2, wherein each of the plurality of flanges comprises at least one of the fasteners.

5. The process carrier according to claim 1 or 2, wherein the tapered portion extends at least half the length of the fastener in the insertion direction of the wafer.

6. The process carrier according to claim 1 or 2, wherein the tapered portion is concave on the side facing one of the plurality of slots.

7. The process carrier according to claim 1 or 2, wherein the fastener further comprises a retaining portion having the maximum cross-sectional thickness of the fastener.

8. The process carrier of claim 7, wherein the retaining portion extends at most one-third of the length of the fastener in the insertion direction of the wafer.

9. The process carrier according to claim 7, wherein the intersection of the tapered portion and the holding portion includes a curved surface.

10. The process carrier according to claim 1 or 2, wherein the fastener includes a chamfer on one side of the fastener, the side of the fastener facing the end of one of the plurality of flanges in the interior space of the process carrier.

11. The process carrier according to claim 1 or 2, wherein the process carrier comprises polyetheretherketone (PEEK) material.

12. The process carrier according to claim 11, wherein the process carrier is entirely made of polyetheretherketone (PEEK) material.

13. The process carrier of claim 11, wherein the polyetheretherketone (PEEK) material is a composite material comprising milled carbon fibers.

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