A new wafer table mechanism of a wafer mounter

Abstract

The application provides a novel wafer table mechanism of a wafer mounting machine, and the wafer inner ring can be automatically lifted and the blue film wafer can be automatically replaced. The mechanism mainly comprises a high-precision running Y-axis structure, a high-precision running X-axis structure, a wafer carrier disc structure, an inner ring lifting structure, a compression ring combination and an automatic wafer ring feeding structure. The wafer carrier disc size is increased to solve the 12-inch wafer size problem, and an automatic wafer ring feeding combination is designed. The high-subdivision and high-sensitivity reading head is selected and matched with a 0.5-micron grating ruler, so that the mechanism has high precision and stable performance in the monitoring process. The mechanism effectively solves the problems of large-size wafer film mounting and manual wafer ring replacement, improves the work efficiency and meets the market demand.

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