Display chip and IC automatic separation device

Abstract

This invention relates to the field of display chip and IC separation technology, specifically an automatic display chip and IC separation device, including a support mechanism, a fixing mechanism mounted on the support mechanism, a pin spacing adjustment mechanism mounted on the support mechanism, a solder cleaning mechanism mounted on the fixing mechanism, and a solder removal mechanism mounted on the solder cleaning mechanism. The support mechanism includes a base plate placed on a platform. By energizing a heating resistance wire until it continuously heats a thermally conductive sleeve, the bottom port of the thermally conductive sleeve can engage with the pins of the display chip. Simultaneously, the bottom port of the thermally conductive sleeve is located in a pre-reserved solder hole within the IC (dust collection circuit). As the high-temperature thermally conductive sleeve is pressed and extends downwards along the pins, the solder between the pins and the solder hole can be removed. At this point, the inverted display chip and IC (dust collection circuit) can be quickly separated under the stable pressure of this device.

Description

Technical Field

[0001] This invention relates to the field of display chip and IC separation technology, specifically to an automatic display chip and IC separation device. Background Technology

[0002] IC, also known as integrated circuit, is a miniature electronic device or component. It is made by using certain processes to fabricate the transistors, diodes, resistors, capacitors, and inductors required for a circuit, as well as the interconnection of wiring, on one or several small pieces of semiconductor wafers or dielectric substrates, and then package them in a casing to become a miniature structure with the required circuit function. The display chip inside the IC is one of the most important components.

[0003] With the rapid development of technology, various electronic devices have emerged, and the consumption of ICs (dust collection circuits) and display chips in electronic devices has been increasing year by year. In order to save resources, it is necessary to disassemble ICs (dust collection circuits) and display chips from discarded electronic devices. However, in the current disassembly process, the pins of the display chip are fixed to the IC (dust collection circuit) by soldering. Since the reserved solder holes on the IC (dust collection circuit) board are extremely small, when the pins of the display chip are removed, the IC (dust collection circuit) board is easily damaged due to the influence of manual operation and the enlargement and squeezing of the reserved solder holes by external equipment. At the same time, when the pins of the display chip are not evenly distributed, the display chip will be damaged.

[0004] The present invention addresses the technical challenge of safely removing the display chip from the IC (dust collection circuit) board while simultaneously preventing damage to both the display chip and the IC board due to manual operation or uneven pressure from external devices. Summary of the Invention

[0005] The present invention aims to solve one of the technical problems existing in the prior art or related technologies.

[0006] Therefore, the technical solution adopted in this invention is as follows:

[0007] An automatic separation device for display chips and ICs includes a support mechanism, a fixing mechanism mounted on the support mechanism, a pin spacing adjustment mechanism mounted on the support mechanism, a solder cleaning mechanism mounted on the fixing mechanism, and a solder removal mechanism mounted on the solder cleaning mechanism. The support mechanism includes a base plate placed on a platform, a sleeve mounted on one side of the top of the base plate, an outer frame fixedly mounted on the top of the base plate, a transmission wheel movably mounted inside the outer frame, a gear disk movably mounted outside the transmission wheel, a rocker arm movably mounted on the outer end plate of the transmission wheel, a load-bearing slide rod movably mounted inside the outer frame and meshing with the gear disk, and a hydraulic rod mounted outside the load-bearing slide rod. The pin spacing adjustment mechanism includes a sliding plate, a slider movably mounted in a slide rail at the bottom of the sliding plate, a support frame fixedly mounted at one end of the bottom of the slider, a limiting vertical rod fixedly mounted at the other end of the bottom of the slider, and a positioning... The fixed mechanism includes two sets of pads on both sides of the slide plate, a pressure plate at the top of the slide plate, and a locking bolt that penetrates into the pressure plate. The fixing mechanism includes a crossbeam fixedly installed on the hydraulic sub-rod inside the hydraulic rod, a suspension bracket at the bottom of the crossbeam, a positioning ring rail fixedly installed at the bottom of the suspension bracket, and a clamping rod movably installed inside the positioning ring rail. The solder cleaning mechanism includes a base movably installed outside the limiting vertical rod, a protective outer tube installed inside the base, a heat-insulating end installed at the bottom of the protective outer tube, a core rod movably installed inside the protective outer tube, a pad at the top of the core rod, a positioning bolt penetrating into the pad, and two guide rods connected to both sides of the pad. The solder removal mechanism includes a heat-conducting sleeve installed inside the heat-insulating end, a heat insulation chamber tube fixedly installed outside the heat-conducting sleeve, a heating resistance wire wound around the outer wall of the heat-conducting sleeve, and a sealing gasket installed at the bottom of the heat insulation chamber tube.

[0008] In a preferred embodiment, the present invention can be further configured such that: a rectangular outer cover is fixedly installed in the middle of the outer frame, and the interior of the rectangular outer cover is provided with a transverse hole adapted to clamp the middle shaft of the transmission wheel, and two sets of clamps are installed on the load-bearing slide rod that passes through the rectangular outer cover.

[0009] By adopting the above technical solution, the shaft in the middle of the transmission wheel is inserted into the inside of the rectangular outer cover of the outer frame, and the cross-shaped end of one end of the shaft is engaged with the gear disk. When the operator controls the rocker arm to rotate, the transmission wheel driven by the transmission can drive the gear disk to provide kinetic energy for the lifting and lowering of the load-bearing slide. After the load-bearing slide is initially lifted by the force, the lifted desoldering mechanism can provide a channel for the rapid disassembly and assembly of the subsequent display chip and IC (dust collection circuit).

[0010] In a preferred embodiment, the present invention may be further configured such that: scales are provided on both sides of the top of the slide plate, and both the slide plate and the slider are made of stainless steel, while the top of the slider is provided with a threaded hole adapted to the locking bolt.

[0011] By adopting the above technical solution, the operator needs to adjust the loosening of the locking bolts according to the matrix pins of different types of display chips, and then adjust the slider along the bottom track of the slide plate for fine adjustment until the bottom end of the suspended heat-conducting sleeve is symmetrically adapted to the pins of different types of display chips.

[0012] In a preferred embodiment, the present invention may be further configured such that a semi-circular clamping rod is fixedly installed at the bottom end of the support frame.

[0013] By adopting the above technical solution, the column heads at both ends of the support frame are fixed in the two guide rods respectively. After the display chip and IC (dust collection circuit) are detinned and separated by the heat-conducting sleeve, the base lifted by the hydraulic sub-rod inside the hydraulic rod can drive the protective outer tube to be lifted upward. At this time, the two guide rods can remain stationary under the action of the support frame, and the column head at the bottom of the core rod can detinn the continuously rising heat-conducting sleeve.

[0014] In a preferred embodiment, the present invention may be further configured such that: the base is made of ceramic material, and both ends of the base are provided with transverse holes adapted to be clamped to the clamping rod.

[0015] By adopting the above technical solution, utilizing the insulation and heat insulation purpose of the base, and in conjunction with the direct exposure of the base to the external environment, when the base is raised and lowered stably, the limiting vertical rod installed at the bottom of the slider can provide secondary protection for the raising and lowering of the base. Once the heat-conducting sleeve is under pressure or loses its force, the base can provide sufficient compressive strength for the entire desoldering mechanism.

[0016] In a preferred embodiment, the present invention can be further configured such that: vertical grooves adapted to guide the lifting and lowering of the guide rod are provided on both sides of the outer side of the protective outer tube; a column head is fixedly installed at the bottom end of the core rod; and the column head at the bottom of the core rod is adapted to penetrate into the inner cavity of the heat-conducting sleeve.

[0017] By adopting the above technical solution, two guide rods are fixed in the threaded holes on both sides of the pad block, and the vertical grooves on both sides of the protective outer tube provide precise guidance for the two guide rods. As the protective outer tube is raised and lowered by traction force, the two guide rods fixed by the support frame can provide sufficient pressure resistance for the core rod.

[0018] In a preferred embodiment, the present invention may be further configured such that: a raised pad is installed on the outside of the heat insulation compartment, and two poles at the top of the heating resistance wire are adapted to extend through the outside of the raised pad.

[0019] By adopting the above technical solution, the two poles at the top of the heating resistance wire are passed through to the outside of the raised pad at the top of the heat insulation tube, and the external wires are connected to the poles of multiple heating resistance wires respectively. When the external wires are energized, the multiple heating resistance wires can continuously heat up the multiple heat-conducting sleeves until the heat-conducting sleeves are hot and pressed down on the pins of the display chip. At this time, the port at the bottom of the heat-conducting sleeve will be pushed along the pins of the display chip and the solder holes of the IC (dust collection circuit).

[0020] By adopting the above technical solution, the beneficial effects achieved by the present invention are as follows:

[0021] 1. This invention involves energizing a heating resistance wire until it continuously heats a thermally conductive sleeve. At this point, the port at the bottom of the thermally conductive sleeve can engage with the pins of the display chip. Simultaneously, the port at the bottom of the thermally conductive sleeve is located in a pre-reserved solder hole within the IC (dust collection circuit). As the high-temperature thermally conductive sleeve is pressed and extends downwards along the pins, the solder between the pins and the solder hole can be removed. At this point, the inverted display chip and IC (dust collection circuit) can be quickly separated under the stable pressure of this device.

[0022] 2. By lifting the heat-conducting sleeve upward from the reserved solder hole of the IC (dust collection circuit), the molten solder accumulated in the hole at the bottom of the heat-conducting sleeve can be pushed outward by the core rod under reverse pressure. At this time, the molten solder accumulated in the hole at the bottom of the heat-conducting sleeve can be completely removed, thereby avoiding damage to the subsequent separation of the display chip and IC (dust collection circuit) caused by the device.

[0023] 3. The present invention installs a locking bolt on the top of the slider. When the locking bolt is pre-loosened and the slider is adjusted to drive the limiting vertical rod, support frame and solder cleaning mechanism to move laterally, the heat-conducting sleeve located at the bottom can be adapted to the matrix pins on the display chip. At this time, the device can ensure that it can adapt to the pins with different spacing on various types of display chips. Attached Figure Description

[0024] Figure 1 This is a schematic diagram illustrating the use of the present invention;

[0025] Figure 2 This is a schematic diagram of the distribution of the support mechanism of the present invention;

[0026] Figure 3 For the present invention Figure 2 Enlarged view of point A in the middle;

[0027] Figure 4 This is a schematic diagram of the pin spacing adjustment mechanism of the present invention.

[0028] Figure 5 For the present invention Figure 4Enlarged view of point B in the middle;

[0029] Figure 6 For the present invention Figure 4 Enlarged view of point C in the middle;

[0030] Figure 7 This is a schematic diagram of the fixed mechanism of the present invention.

[0031] Figure 8 This is a schematic diagram showing the separation of the tin cleaning mechanism and the tin removal mechanism of the present invention;

[0032] Figure 9 This is a schematic diagram of the internal dispersion of the tin removal mechanism of the present invention;

[0033] Figure 10 This is a schematic diagram of the tin cleaning mechanism of the present invention.

[0034] Figure 11 For the present invention Figure 10 Enlarged diagram of point D in the middle.

[0035] Figure label:

[0036] 100. Support mechanism; 110. Base plate; 120. Sleeve; 130. External frame; 140. Transmission wheel; 150. Rocker arm; 160. Gear disc; 170. Load-bearing slide bar; 180. Hydraulic rod;

[0037] 200. Pin spacing adjustment mechanism; 210. Slide plate; 220. Shim; 230. Slider; 240. Support frame; 250. Limiting vertical rod; 260. Locking bolt; 270. Pressure plate;

[0038] 300. Fixing mechanism; 310. Crossbeam; 320. Suspension bracket; 330. Beam positioning ring rail; 340. Clamping rod;

[0039] 400. Solder cleaning mechanism; 410. Base; 420. Protective outer tube; 430. Heat-insulating end; 440. Core rod; 450. Spacer block; 460. Positioning bolt; 470. Guide rod;

[0040] 500. Desoldering mechanism; 510. Heat-conducting sleeve; 520. Insulating chamber; 530. Heating resistance wire; 540. Sealing gasket. Detailed Implementation

[0041] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to specific embodiments and accompanying drawings. It should be noted that, unless otherwise specified, the embodiments and features described herein can be combined with each other.

[0042] It should be understood that these descriptions are merely exemplary and are not intended to limit the scope of the invention.

[0043] The following describes, with reference to the accompanying drawings, some embodiments of the present invention, providing an automatic separation device for display chips and ICs.

[0044] Example 1:

[0045] Combination Figures 1-11 As shown, the present invention provides an automatic separation device for display chips and ICs, including a support mechanism 100, a fixing mechanism 300 mounted on the support mechanism 100, a pin spacing adjustment mechanism 200 mounted on the support mechanism 100, a solder cleaning mechanism 400 mounted on the fixing mechanism 300, and a solder removal mechanism 500 mounted on the solder cleaning mechanism 400.

[0046] The support mechanism 100 includes a base plate 110, a sleeve 120, an outer frame 130, a transmission wheel 140, a rocker arm 150, a gear disk 160, a load-bearing slide bar 170, and a hydraulic rod 180. The pin spacing adjustment mechanism 200 includes a slide plate 210, a gasket 220, a slider 230, a support frame 240, a limiting vertical rod 250, a locking bolt 260, and a pressure plate 270. The fixing mechanism 300 includes a crossbeam 310, a suspension bracket 320, a positioning ring rail 330, and a clamping rod 340. The solder cleaning mechanism 400 includes a base 410, a protective outer tube 420, a heat-insulating end 430, a core rod 440, a pad 450, a positioning bolt 460, and a guide rod 470. The solder removal mechanism 500 includes a heat-conducting sleeve 510, a heat-insulating chamber 520, a heating resistance wire 530, and a sealing gasket 540.

[0047] Specifically, the sleeve 120 is installed on one side of the top of the base plate 110, the outer frame 130 is fixedly installed on the top of the base plate 110, the transmission wheel 140 is movably installed inside the outer frame 130, the gear disc 160 is movably installed outside the transmission wheel 140, the rocker arm 150 is movably installed on the end plate outside the transmission wheel 140, the load-bearing slide bar 170 meshing with the outside of the gear disc 160 is movably installed inside the outer frame 130, the hydraulic rod 180 is installed outside the load-bearing slide bar 170, the slider 230 is movably installed in the slide rail at the bottom of the slide plate 210, the support 240 is fixedly installed at one end of the bottom of the slider 230, the limiting vertical rod 250 is fixedly installed at the other end of the bottom of the slider 230, two sets of gaskets 220 are located on both sides of the slide plate 210, the pressure plate 270 is located at the top of the slide plate 210, the locking bolt 260 passes through the interior of the pressure plate 270, and the crossbeam 310 is fixedly installed on the hydraulic... On the hydraulic sub-rod within the rod 180, the suspension bracket 320 is located at the bottom of the crossbeam 310, the bend positioning ring rail 330 is fixedly installed at the bottom end of the suspension bracket 320, the clamping rod 340 is movably installed inside the bend positioning ring rail 330, the base 410 is movably installed outside the limiting vertical rod 250, the protective outer tube 420 is installed inside the base 410, the heat-insulating end 430 is installed at the bottom end of the protective outer tube 420, the core rod 440 is movably installed inside the protective outer tube 420, the pad 450 is located at the top of the core rod 440, the positioning bolt 460 passes through the pad 450, the two guide rods 470 are connected to both sides of the pad 450, the heat-conducting sleeve 510 is installed inside the heat-insulating end 430, the heat insulation chamber tube 520 is fixedly installed outside the heat-conducting sleeve 510, the heating resistance wire 530 is wound around the outer wall of the heat-conducting sleeve 510, and the sealing gasket 540 is installed at the bottom of the heat insulation chamber tube 520.

[0048] A heat insulation tube 520 is fixedly installed on the outside of the heat-conducting sleeve 510, and a heating resistance wire 530 is wound around the outer wall of the heat-conducting sleeve 510. A sealing gasket 540 is installed at the bottom end of the heat insulation tube 520. The assembled heat-conducting sleeve 510 is then fixedly installed in the hole at the bottom of the heat-insulating end 430. When the base 410, together with the protective outer tube 420, presses down onto the inverted display chip and IC (dust collection circuit), the energized heating resistance wire 530 continuously heats the heat-conducting sleeve 510. At this time, the port at the bottom of the heat-conducting sleeve 510 can engage with the pins of the display chip. Simultaneously, the port at the bottom of the heat-conducting sleeve 510 is located in the solder hole reserved inside the IC (dust collection circuit). As the high-temperature heat-conducting sleeve 510 is pressed down along the pins, the solder between the pins and the solder hole is removed. At this point, the inverted display chip and... The IC (dust collection circuit) can be quickly separated under the uniform pressure of the device. As the heat-conducting sleeve 510 is lifted upward from the reserved solder hole of the IC (dust collection circuit), the molten solder accumulated in the bottom hole of the heat-conducting sleeve 510 can be pushed outward by the core rod 440 under reverse pressure. At this time, the molten solder accumulated in the bottom hole of the heat-conducting sleeve 510 can be completely removed. The slider 230 is movably installed in the slide rail at the bottom of the slide plate 210, and the locking bolt 260 is threaded on the top of the slider 230. When the locking bolt 260 is pre-loosened and the slider 230 is adjusted to drive the limit vertical rod 250, the support 240 and the solder cleaning mechanism 400 to move laterally, the heat-conducting sleeve 510 located at the bottom can be adapted to the matrix pins on the display chip, thereby ensuring that the device is highly matched to various display chips and ICs (dust collection circuits).

[0049] Example 2:

[0050] Combination Figures 2-11 As shown, based on Embodiment 1, a rectangular outer cover is fixedly installed in the middle of the outer frame 130, and a transverse hole adapted to be clamped in the middle shaft of the transmission wheel 140 is opened inside the rectangular outer cover. Two sets of clamps are installed on the load-bearing slide rod 170 that passes through the rectangular outer cover. A raised pad is installed on the outside of the heat insulation tube 520, and two poles at the top of the heating resistance wire 530 are adapted to pass through the outside of the raised pad.

[0051] By inserting the shaft in the middle of the transmission wheel 140 into the rectangular outer casing of the outer frame 130, and with the cross-shaped end of the shaft engaging with the gear disc 160, when the operator controls the rocker arm 150 to rotate, the transmission wheel 140, driven by the transmission, can drive the gear disc 160 to provide kinetic energy for raising and lowering the load-bearing slide bar 170. Furthermore, external wires are connected to the terminals of multiple heating resistance wires 530. When the external wires are energized, the multiple heating resistance wires 530 can continuously raise and lower the multiple heat-conducting sleeves 510. When the heat-conducting sleeve 510 reaches a high temperature and is pressed down on the pins of the display chip, the port at the bottom of the heat-conducting sleeve 510 will be pushed along the pins of the display chip and the solder holes of the IC (dust collection circuit), thereby enabling the display chip to be quickly separated after desoldering. As the load-bearing slide bar 170 is initially lifted by force, the raised desoldering mechanism 500 can provide a channel for the rapid disassembly and assembly of the display chip and IC (dust collection circuit), thereby ensuring the continuous operation of the display chip and IC (dust collection circuit).

[0052] Example 3:

[0053] Combination Figures 4-11 As shown, based on Embodiment 1, scales are provided on both sides of the top of the slide plate 210, and both the slide plate 210 and the slider 230 are made of stainless steel. The top of the slider 230 is provided with threaded holes that are adapted to the locking bolt 260, and a semi-circular clamp is fixedly installed at the bottom of the support frame 240.

[0054] Adjust the locking bolts 260 to loosen according to the matrix pins of different types of display chips. Then, adjust the slider 230 along the bottom track of the slide plate 210 for fine adjustment until the bottom end of the suspended heat-conducting sleeve 510 is symmetrically adapted to the pins of different types of display chips. At the same time, fix the pillars at both ends of the support 240 into the two guide rods 470 respectively. After the display chip and IC (dust collection circuit) are detinned and separated by the heat-conducting sleeve 510, they are lifted upward by the hydraulic sub-rod inside the hydraulic rod 180. The base 410 can lift the protective outer tube 420 upwards. At this time, the two guide rods 470 can remain stationary under the action of the support 240, and the column head at the bottom of the core rod 440 can remove the solder from the continuously rising heat-conducting sleeve 510, thereby avoiding interference from the residual solder on the inner wall of the heat-conducting sleeve 510 during the subsequent separation of the display chip and IC (dust collection circuit). At the same time, as the load-bearing slide rod 170 is pressed down, the bottom of the multiple heat-conducting sleeves 510 can quickly disassemble the pins of the display chip.

[0055] Example 4:

[0056] Combination Figures 4-11As shown, based on Embodiment 1, the base 410 is made of ceramic material, and the two ends of the base 410 are provided with horizontal holes adapted to be clamped to the body of the clamping rod 340. The two sides of the outer protective tube 420 are provided with vertical grooves adapted to guide the guide rod 470 to rise and fall. The bottom end of the core rod 440 is fixedly installed with a column head, and the column head at the bottom of the core rod 440 is adapted to penetrate into the inner cavity of the heat-conducting sleeve 510.

[0057] Utilizing the insulation and heat insulation of the base 410, and in conjunction with the direct exposure of the base 410 to the external environment, when the base 410 is raised and lowered stably, the limiting vertical rod 250 installed at the bottom of the slider 230 can provide secondary protection for the raising and lowering of the base 410. With the precise guidance of the two guide rods 470 by the vertical grooves on both sides of the protective outer tube 420, as the protective outer tube 420 is raised and lowered by traction force, the two guide rods 470 fixed by the support 240 can provide sufficient pressure resistance for the core rod 440, thereby ensuring that the molten solder accumulated on the inner wall of the heat-conducting sleeve 510 is quickly removed by the bottom column of the core rod 440. Once the heat-conducting sleeve 510 is under pressure or loses its force, the base 410 can provide sufficient pressure resistance for the entire desoldering mechanism 500, thereby enabling the display chip and IC (dust collection circuit) to be quickly separated.

[0058] The working principle and usage process of this invention are as follows: The heat-insulating end 430 is pre-fixed to the bottom end of the protective outer tube 420 using bolts. The core rod 440 is then inserted through the hole in the middle of the heat-insulating end 430 into the inner cavity of the protective outer tube 420. The pad 450 is fixed to the top end of the core rod 440 using positioning bolts 460. Next, two guide rods 470 are threaded into the two screw holes on both sides of the pad 450. Then, the base 410 is movably installed outside the protective outer tube 420, and multiple bolts are used to fix the base 410 to the protective outer tube 420. Finally, the top end of the heat-conducting sleeve 510 is fixedly installed in the recessed hole at the bottom end of the heat-insulating end 430, and the heating resistance wire 530 is wound around it. The heat-conducting sleeve 510 is wrapped around its outer wall. At this time, the two conductive electrode posts at the top of the heat-conducting sleeve 510 penetrate to the outside of the heat insulation chamber 520. The sealing gasket 540 is fixedly installed on the bottom port of the heat insulation chamber 520 by bolts. At this time, the column head at the bottom of the core rod 440 is adapted to penetrate into the inner cavity of the heat-conducting sleeve 510. Then, the clamping rod 340 is installed in the base 410, and the bend position ring rail 330 is movably installed on the outside of the rods of the two adjacent clamping rods 340. The bottom end of the suspension bracket 320 is fixed to the top of the bend position ring rail 330. At this time, the end plate at the top of the suspension bracket 320 is fixedly installed on the bottom of the crossbeam 310 by bolts, and one end of the crossbeam 310 is installed on the bottom end of the hydraulic sub-rod inside the hydraulic rod 180.

[0059] During use, the operator needs to pre-control the operation of the hydraulic rod 180. At this time, the hydraulic sub-rod inside the hydraulic rod 180 will drive the crossbeam 310 and multiple combined clamping rods 340 to lift upwards. The clamping rods 340 will lift the solder cleaning mechanism 400 and the solder removal mechanism 500 upwards until the IC (dust collection circuit) is placed on the top of the base plate 110, and the display chip installed on the IC (dust collection circuit) is placed on the top of the base plate 110, with the pins of the display chip pointing vertically upwards. At the same time, the operator needs to control the rocker arm 150 to drive the transmission wheel 140 to rotate. At this time, the transmission wheel 140 will cooperate with the gear disk 160 to drive the load-bearing slide bar 170. The load-bearing slide bar 170 can then drive the multiple combined slide plates 210 to lift upwards. Then, the multiple locking bolts 260 are pre-adjusted to loosen until each slide plate... 230 moves laterally along the slide rails at the bottom of multiple slide plates 210. When multiple sets of desoldering mechanisms 500 are aligned with the pins of the display chip, the locking bolt 260 can be locked. Then, the control lever 150 is rotated in the opposite direction until the load-bearing slide bar 170 drives multiple sets of desoldering mechanisms 500 to press down onto the pins of the display chip. The heating resistance wire 530, which is powered on and preheated, can continuously heat the heat-conducting sleeve 510. As the hydraulic sub-rod in the hydraulic rod 180 extends downward, the bottom end of the heat-conducting sleeve 510, which is in a high-temperature state, can be pressed down along the connection hole between the IC (dust collection circuit) and the pin until the solder on the pin is melted. The continuously pressed pin can be quickly separated from the IC (dust collection circuit) by the continuously pressing heat-conducting sleeve 510, thereby avoiding damage to the IC (dust collection circuit) during the disassembly of the display chip.

[0060] In this invention, the term "a plurality of" refers to two or more unless otherwise expressly defined. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items. The terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; "linking" can be a direct connection or an indirect connection via an intermediate medium. Those skilled in the art will understand the specific meaning of the above terms in this invention according to the specific circumstances.

Claims

1. An automatic separation device for display chips and ICs, comprising a support mechanism (100) and a fixing mechanism (300) mounted on the support mechanism (100), characterized in that, A pin spacing adjustment mechanism (200) mounted on a support mechanism (100), a solder cleaning mechanism (400) mounted on a fixing mechanism (300), and a solder removal mechanism (500) mounted on the solder cleaning mechanism (400). The support mechanism (100) includes a base plate (110) placed on the platform, a sleeve (120) installed on one side of the top of the base plate (110), an outer frame (130) fixedly installed on the top of the base plate (110), a transmission wheel (140) movably installed inside the outer frame (130), a gear disk (160) movably installed outside the transmission wheel (140), a rocker arm (150) movably installed on the outer end plate of the transmission wheel (140), a load-bearing slide bar (170) movably installed inside the outer frame (130) and meshing with the gear disk (160), and a hydraulic rod (180) installed outside the load-bearing slide bar (170). The pin adjustment mechanism (200) includes a slide plate (210), a slider (230) movably installed in the bottom track of the slide plate (210), a support (240) fixedly installed at one end of the bottom of the slider (230), and a limiting vertical rod (250) fixedly installed at the other end of the bottom of the slider (230). The load-bearing slide bar (170) drives the slide plate (210) to rise upward; The fixing mechanism (300) includes a crossbeam (310) fixedly installed on the hydraulic sub-rod inside the hydraulic rod (180), a suspension bracket (320) located at the bottom of the crossbeam (310), a bend position ring rail (330) fixedly installed at the bottom end of the suspension bracket (320), and a clamping rod (340) movably installed inside the bend position ring rail (330). The solder cleaning mechanism (400) includes a base (410) movably installed outside the limiting vertical rod (250), a protective outer tube (420) installed inside the base (410), a heat-insulating end (430) installed at the bottom of the protective outer tube (420), a core rod (440) movably installed inside the protective outer tube (420), a pad (450) located at the top of the core rod (440), a positioning bolt (460) penetrating into the pad (450), and two guide rods (470) connected to both sides of the pad (450). The bottom end of the support frame (240) is fixedly installed with a semi-circular clamp rod, and the column heads at both ends of the semi-circular clamp rod are respectively fixed inside two guide rods (470); The base (410) is made of ceramic material, and both ends of the base (410) are provided with transverse holes adapted to be clamped to the rod body of the clamping rod (340); The detinning mechanism (500) includes a heat-conducting sleeve (510) installed inside the heat-insulating end (430), a heat-insulating chamber (520) fixedly installed outside the heat-conducting sleeve (510), a heating resistance wire (530) wound around the outer wall of the heat-conducting sleeve (510), and a sealing gasket (540) installed at the bottom of the heat-insulating chamber (520).

2. The automatic separation device for display chips and ICs according to claim 1, characterized in that, A rectangular cover is fixedly installed in the middle of the outer frame (130), and a transverse hole is opened inside the rectangular cover to fit and clamp the middle shaft of the transmission wheel (140). Two sets of clamps are installed on the load-bearing slide rod (170) that passes through the rectangular cover.

3. The automatic separation device for display chips and ICs according to claim 1, characterized in that, The pin adjustment mechanism (200) also includes two sets of pads (220) on both sides of the slide plate (210), a pressure plate (270) on the top of the slide plate (210), and a locking bolt (260) extending into the pressure plate (270).

4. The automatic separation device for display chips and ICs according to claim 3, characterized in that, The top of the slide plate (210) is provided with scales on both sides, and both the slide plate (210) and the slider (230) are made of stainless steel. The top of the slider (230) is provided with threaded holes that are adapted to the locking bolt (260).

5. The automatic separation device for display chips and ICs according to claim 1, characterized in that, The outer protective tube (420) has vertical grooves on both sides for the guide rod (470) to rise and fall. The bottom end of the core rod (440) is fixedly installed with a column head, and the column head at the bottom of the core rod (440) is adapted to penetrate into the inner cavity of the heat-conducting sleeve (510).

6. The automatic separation device for display chips and ICs according to claim 1, characterized in that, The heat insulation tube (520) is equipped with a raised pad on the outside, and the two poles at the top of the heating resistance wire (530) are adapted to extend through the outside of the raised pad.

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