A bristle tuft structure adhesive gasket and apparatus and method for making same

Abstract

The application discloses a bristle bundle structure adhesive pad and a manufacturing device and a preparation method thereof, relates to the field of bionic dry adhesion technology, and comprises a micro-wedge-shaped adhesive layer, a sparse adaptive structure layer and a back adhesive layer which are arranged in sequence along the thickness direction and can all deform to adapt to the surface of an object. One side of the micro-wedge-shaped adhesive layer is densely covered with micro-wedge-shaped structures, and the other side is attached to the sparse adaptive structure layer. One side of the back adhesive layer is attached to the surface of the sparse adaptive structure layer away from the micro-wedge-shaped adhesive layer, and the other side of the back adhesive layer is attached to an actuator mechanism, so that reversible adhesion and detachment can be realized on different materials and different surfaces, and the adhesive effect on rough surfaces can be realized. When the product is picked up, the object can be ensured not to be damaged, and lossless picking or carrying is achieved.

Description

Technical Field

[0001] This invention relates to the field of biomimetic dry adhesion technology, and in particular to a bristle bundle structure adhesive pad, its manufacturing apparatus, and its preparation method. Background Technology

[0002] The inspiration for creating wedge-shaped dry adhesion with an adaptive hierarchical structure comes from biomimicry of animals like geckos. Geckos' ability to climb walls freely is due to their feet, which are covered with tens of thousands of bristles. During climbing, these bristles adhere to various surfaces using adhesive forces. The process of gecko feet adhering to and detaching is essentially the same process of bristles adhering to and detaching from the surface. Gecko toes are composed of skin flaps with bristles at the ends. These skin flaps are adaptable to inclined or curved surfaces. The combination of the adaptability of the skin flaps and the adhesive properties of the bristles allows geckos to move flexibly on surfaces of different angles and materials.

[0003] Currently, the main methods for preparing biomimetic gecko bristles include: vacuum casting with photolithography molds to prepare micron-sized columnar bristle arrays, where polymer materials are poured into a template and then the biomimetic adhesive bristles are peeled off; and vapor phase growth technology, primarily using chemical vapor deposition (CVD) to prepare carbon nanotube arrays to obtain biomimetic adhesive bristles. For the preparation of layered fiber arrays, methods include combining two alumina molds and then dissolving the template to obtain the desired columnar bristle hierarchical structure; and melting a double-layered PP (polypropylene) film to fill the gaps, followed by etching the film to obtain a double-layered bristle structure. These techniques often use single-use molds that cannot be reused, resulting in high costs and demanding processing conditions. Summary of the Invention

[0004] The purpose of this invention is to provide a bristle bundle structure adhesive pad, its manufacturing apparatus, and its preparation method to solve the problems existing in the prior art, so as to achieve reversible adhesion and detachment to different materials and different surfaces, while having an adhesion adaptability effect to rough surfaces; and to ensure that the object is not damaged when picking up the product, thus achieving non-destructive picking or handling.

[0005] To achieve the above objectives, the present invention provides the following solution: The present invention provides a bristle bundle structure adhesive pad, comprising a micro-wedge adhesive layer, a sparse adaptation structure layer, and a back adhesive layer arranged sequentially along the thickness direction and capable of adapting to the deformation of an object surface. One side of the micro-wedge adhesive layer is densely covered with micro-wedge structures, and the other side is attached to the sparse adaptation structure layer. One side of the back adhesive layer is attached to the surface of the sparse adaptation structure layer opposite to the micro-wedge adhesive layer, and the other side of the back adhesive layer is used to connect to an actuator mechanism.

[0006] Preferably, the sparse adaptive structure layer includes two buffer layers arranged along its thickness direction. One buffer layer has a plurality of through-hole structures that penetrate the buffer layer in a first direction, and the other buffer layer has a plurality of through-hole structures that penetrate the buffer layer in a second direction, wherein the first direction and the second direction have an included angle.

[0007] A fabrication apparatus for a bristle bundle structure adhesive pad is also provided, including a micro-wedge adhesive layer preparation mold and a pair of adaptive structure layer preparation molds. The micro-wedge adhesive layer preparation mold includes a mold body, a forming groove is provided on the top surface of the mold body, a wax model is provided in the forming groove, the top surface of the wax model is flush with the opening of the forming groove, and is densely covered with wedge-shaped cavities for forming the micro-wedge structure. The mold for preparing the adaptive structural layer includes a positioning area and an adaptive structural layer forming area. The positioning area is installed at the outer peripheral edge of the forming groove opening. Multiple forming strips are densely distributed in both adaptive structural layer forming areas, arranged at equal intervals in the horizontal direction. The two adaptive structural layer forming areas are arranged in sequence above the forming groove opening in the vertical direction, and the forming strips in the two adaptive structural layer forming areas are vertically distributed. The two adaptive structural layer forming areas are filled with casting material for forming the bristle bundle structure adhesive pad. The bottom surface of the casting material is in contact with the top surface of the wax model. A cover plate that can be separated from the casting material is pressed on the top surface of the casting material. The cover plate is detachably installed on the mold body and has a gap between it and the mold body to accommodate the mold for preparing the adaptive structural layer.

[0008] Preferably, the castable is equipped with a demolding mold, and the top surface of the demolding mold has a receiving groove that fits into the castable. The cover plate is detachably installed at the opening of the receiving groove and has a gap between it and the opening of the receiving groove to allow the mold for preparing the adaptive structural layer to detach.

[0009] Preferably, the cover plate is used to press the surface of the castable material, on which a flexible base tape is bonded, and the flexible base tape is detachably bonded to the castable material.

[0010] Preferably, the wax mold includes a fixed wax formed at the bottom of the molding groove and a molding wax formed above the fixed wax. The top surface of the molding wax is flush with the opening of the molding groove and is densely covered with the wedge-shaped cavities. Horizontally extending support bolts are provided in the molding groove at the positions corresponding to the fixed wax and the molding wax, and the support bolts at the two locations are vertically distributed.

[0011] Preferably, the top surface of the molding wax is provided with a molding part located at its middle position, the molding part is densely covered with the wedge-shaped cavities, and the molding part is provided with overflow grooves on both sides along its horizontal direction.

[0012] Preferably, an annular baffle is surrounding the opening of the forming groove, and the bottom edge of the annular baffle is sealed to the top surface of the mold body.

[0013] Preferably, each of the molding strips is coated with a release agent.

[0014] A method for preparing a bristle bundle structure adhesive gasket is also provided, which utilizes an apparatus for fabricating bristle bundle structure adhesive gaskets and includes the following steps: Mold blank making: Prepare the mold body and install support bolts in its forming groove, and install an annular baffle at the opening of the forming groove. Add the appropriate amount of casting wax particles to the forming groove, melt and solidify the casting wax particles, form and fix wax at the bottom of the forming groove, and add a well-mixed solution of different paraffin waxes on the top layer of the forming wax, and solidify it into forming wax. Preparation of micro-wedge array structure: Disassemble the annular baffle, perform machine tool processing on molding wax, use a milling cutter to process the surface of molding wax flat and mill out overflow grooves, and use a wedge-shaped tool to process a wedge-shaped cavity array; Casting and molding: Position and assemble the mold for preparing the structural layer into the groove of the molding groove, and cast silicone at the mold for preparing the structural layer, and cover the top of the casting material with a cover plate with flexible base tape until the casting material cures at room temperature to form an adhesive gasket. Demolding of the adhesive gasket: Separate the mold body, transfer the part other than the mold body to the demolding mold, separate the adaptive structure layer preparation mold from the side of the adhesive gasket, and finally remove the adhesive gasket.

[0015] The present invention achieves the following technical effects compared to the prior art: The entire bristle bundle structure adhesive pad exhibits excellent adhesion. The added adaptive structural layer allows the final fabricated bristle bundle structure adhesive pad to adapt to the surface of small, curved objects through deformation of the adaptive structural layer. This results in more thorough contact between the wedge-shaped adhesive surface of the bristle bundle structure adhesive pad and the object surface, generating greater adhesive force. This wedge-shaped adhesive surface enables reversible adhesion and anisotropy, and can replace traditional mechanical clamping, vacuum adsorption, and electrostatic adsorption for non-destructive gripping, handling, and releasing of heavy objects. Furthermore, the use of a mold body integrated with a waxy material ensures both the fabrication and shaping of the micro-wedge cavity and the accuracy of using the mold body's plane as a reference plane, further guaranteeing the feasibility of mold positioning, installation, and separation. While ensuring the complete acquisition of the wedge-shaped microstructure, the overall thickness of the adhesive pad remains uniform. The overall fabrication process also offers advantages such as low material cost, stable processing technology, repeatable sample preparation, and high efficiency. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the structure of the mold body of the present invention; Figure 2 This is a plan view of the mold for preparing the structural layer according to the present invention; Figure 3 This is a three-dimensional exploded view of each mold used for casting; Figure 4 It is the process of molding waxy materials into a single piece inside the mold body and machining them on a machine tool; Figure 5 This is a tool setting process to ensure that the machining plane is parallel to the reference plane; Figure 6 This is a schematic diagram of the machining process for a wedge-shaped cavity using a cutting tool; Figure 7 This is a schematic diagram of the coating process for wax molds; Figure 8 It is a process flow for preparing bristle bundle structure adhesive pads using silicone. Figure 9 This is a schematic diagram of the overall structure of the bristle bundle structure adhesive pad of the present invention; Among them, 1-back adhesive layer, 2-sparse adaptive structure layer, 3-micro-wedge adhesive layer, 4-mold body, 5-forming groove, 6-positioning area, 7-adaptive structure layer forming area, 8-cover plate, 9-support pad, 10-adaptive structure layer preparation mold, 11-thickness pad, 12-support bolt, 13-fixing wax, 14-forming wax, 15-overflow groove, 16-reference plane, 17-wedge cavity, 18-processing tool, 19-stainless steel feeler gauge, 20-steel strip. Detailed Implementation

[0018] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0019] The purpose of this invention is to provide a bristle bundle structure adhesive pad, its manufacturing apparatus, and its preparation method to solve the problems existing in the prior art, so as to achieve reversible adhesion and detachment to different materials and different surfaces, and to have an adhesion effect on rough surfaces; and to ensure that the object is not damaged when picking up the product, thus achieving non-destructive picking or handling.

[0020] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0021] like Figures 1 to 9 As shown, this embodiment provides a bristle bundle structure adhesive pad, including a micro-wedge adhesive layer 3, a sparse adaptation structure layer 2, and a back adhesive layer 1 arranged sequentially along the thickness direction and capable of adapting to the deformation of the object surface. One side of the micro-wedge adhesive layer 3 is densely covered with micro-wedge structures, and the other side is attached to the sparse adaptation structure layer 2. One side of the back adhesive layer 1 is attached to the surface of the sparse adaptation structure layer 2 away from the micro-wedge adhesive layer 3, and the other side of the back adhesive layer 1 is used to connect to the actuator mechanism. Preferably, in use, the back adhesive layer 1 is bonded to the actuator mechanism.

[0022] The sparse adaptive structure layer 2 includes two buffer layers arranged along their thickness direction. Multiple through-hole structures are permeated within each buffer layer. One buffer layer has multiple through-hole structures uniformly arranged in a first direction, and the other buffer layer has multiple through-hole structures uniformly arranged in a second direction, wherein the first and second directions form an angle. Preferably, the through-hole structures in one buffer layer extend along the length of the buffer layer and are evenly spaced along the width of the buffer layer, while the through-hole structures in the other buffer layer are all permeated along the width of the buffer layer and are evenly spaced along the length of the buffer layer.

[0023] Furthermore, a manufacturing apparatus is also provided, the entire manufacturing apparatus is mainly for the molding of micro-wedge adhesive layer 3 and sparse adaptive structure layer 2, including micro-wedge adhesive layer 3 preparation mold and paired adaptive structure layer preparation mold 10; like Figure 1 As shown, the mold for preparing the micro-wedge adhesive layer 3 includes a mold body 4. Specifically, during processing, the mold body 4 can be detachably mounted on a machine tool. For example, the installation of the mold body 4 can be completed by the engagement of bolts and bolt holes. Preferably, the mold body 4 is obtained through precision machining under computer digital control, and a threaded through hole for connection to the machine tool is provided on the mold body 4. The top surface of the mold body 4 serves as the reference plane 16 for the entire bristle bundle structure adhesive pad, and a molding groove 5 is provided on it. A wax model is placed inside the molding groove 5, and the top surface of the wax model is flush with the opening of the molding groove 5, and is densely covered with wedge-shaped cavities 17 for molding the micro-wedge structure. Figure 4 As shown, the preparation of the micro-wedge cavity mainly involves first solidifying and connecting the wax model and the molding groove 5 into a single unit, and then processing the top surface of the wax model.

[0024] like Figure 2 As shown, the adaptive structural layer preparation mold 10 includes a positioning area 6 and an adaptive structural layer forming area 7. The positioning area 6 is installed at the outer peripheral edge of the forming groove 5. Specifically, positioning pin holes for assembly with the positioning area 6 are opened at the outer peripheral edge of the forming groove 5. Multiple forming strips are densely distributed in both adaptive structural layer forming areas 7, arranged at equal intervals along the horizontal direction. The forming strips are preferably made of steel strips 20, which are obtained by metal etching. Preferably, each forming strip is coated with a release agent to facilitate subsequent demolding. The two adaptive structural layer forming areas 7 are arranged vertically above the opening of the forming groove 5, and the forming strips of the two adaptive structural layer forming areas 7 are vertically distributed. The positioning area 6 of the adaptive structural layer preparation mold 10 is positioned and installed with the mold body 4 of the micro-wedge adhesive layer 3 preparation mold. Multiple positioning pin holes are opened on the positioning area 6, which correspond one-to-one with the positioning pin holes on the mold body 4 to ensure the installation position and positioning accuracy of the adaptive structural layer preparation mold 10.

[0025] Preferably, a thickness pad 11 is provided at the position of the mold body 4 corresponding to the outer peripheral edge of the forming groove 5. The thickness pad 11 is supported between the mold 10 for preparing the adaptive structure layer and the groove opening of the forming groove 5 to form the connection part between the micro-wedge adhesive layer 3 and the sparse adaptive structure layer 2. The connection strength between the micro-wedge adhesive layer 3 and the sparse adaptive structure layer 2 is ensured through this connection part. The thickness pad 11 has a ring structure and is coaxially wrapped around the outer peripheral side of the groove opening of the forming groove 5.

[0026] Furthermore, both adaptive structural layer preparation molds 10 are equipped with support pads 9 in a semi-frame structure. The support pads 9 surround the entire adaptive structural layer preparation mold 10. The unclosed side of the support pads 9 allows the adaptive structural layer preparation mold 10 to be removed and demolded. Moreover, the support pads 9 are of the same thickness as the entire adaptive structural layer preparation mold 10. The support pads 9 are used to support the position of the adaptive structural layer preparation mold 10. Specifically, during the installation process, the thickness pads 11 are installed at the opening of the molding groove 5. The support pads 9 that are matched with one set of adaptive structural layer preparation molds 10 are installed on the thickness pads 11. The positioning area 6 of this adaptive structural layer preparation mold 10 is located inside this support pad 9 and is installed on the thickness pads 11 simultaneously. The support pads 9 that are matched with the other set of adaptive structural layer preparation molds 10 are installed on the top of the previous support pad 9. The positioning area 6 of the other set of adaptive structural layer preparation molds 10 is installed on the top of the previous support pad 9 simultaneously.

[0027] In this process, refractory material for forming the bristle bundle structure adhesive pads is poured into the two adaptive structural layer forming areas 7. The bottom surface of the refractory material contacts the top surface of the wax model, and a separable cover plate 8 is pressed onto the top surface of the refractory material. The cover plate 8 is detachably installed on the mold body 4 and has a gap between it and the mold body 4 to accommodate the adaptive structural layer preparation mold 10. Furthermore, a thick pad 11 is also provided between the cover plate 8 and the corresponding support pad 9 to form the connection between the sparse adaptive structural layer 2 and the back adhesive layer 1, and this connection ensures the connection strength between the sparse adaptive structural layer 2 and the back adhesive layer 1.

[0028] Furthermore, the castable is equipped with a demolding mold, and the top surface of the demolding mold has a receiving groove that fits into the castable. The cover plate 8 is detachably installed at the opening of the receiving groove, and there is a gap between the cover plate 8 and the opening of the receiving groove to allow the mold 10 for the adaptation structure layer to detach.

[0029] Preferably, a flexible base tape is bonded to the surface of the cover plate 8 used to press the castable. Preferably, the flexible base tape is a polyimide tape, and the flexible base tape is detachably bonded to the cover plate 8.

[0030] Preferably, the wax model includes a fixed wax 13 formed at the bottom of the molding groove 5 and a molding wax 14 formed above the fixed wax 13. The fixed wax 13 is formed by melting and solidifying high-viscosity casting wax solid particles in the molding groove 5. The molding wax 14 is formed by melting and solidifying various paraffin wax solid particles in the molding groove 5 according to the required mass ratio. The top surface of the molding wax 14 is flush with the opening of the molding groove 5 and is densely covered with wedge-shaped cavities 17. Horizontally extending support bolts 12 are provided at positions corresponding to the fixed wax 13 and the molding wax 14 in the molding groove 5. The support bolts 12 are vertically distributed, and multiple integrally formed support mounting holes are provided in the molding groove 5. Each support bolt 12 is connected between two corresponding support mounting holes. Figure 4 As shown, by providing two sets of vertically distributed support bolts 12 in the molding groove 5, the connection strength between the fixing wax 13 and the molding wax 14 and the molding groove 5 is strengthened respectively, preventing the position of the fixing wax 13 and the molding wax 14 from slipping later. Preferably, multiple support bolts 12 are provided at both locations, and they are arranged in an array along the horizontal direction.

[0031] Furthermore, the top surface of the molding wax 14 is provided with a molding part located in the middle position. The molding part is densely covered with wedge-shaped cavities 17. Both sides of the molding part along its horizontal direction are provided with overflow grooves 15 to ensure that excess silicone overflows into the overflow grooves 15, thereby avoiding excess silicone from flowing to the reference surface and causing thickness changes, so as to ensure that the silicone molding thickness is uniform.

[0032] Furthermore, an annular baffle is surrounding the opening of the molding groove 5. The bottom edge of the annular baffle is sealed to the top surface of the mold body 4 to ensure that the top surface of the molding wax 14 is at least higher than the top surface of the mold body 4, i.e. the reference surface, during subsequent machine tool processing. This facilitates the processing of the wedge-shaped cavity 17 on the top surface of the molding wax 14. Preferably, the annular baffle is detachably connected to the mold body 4 so that the annular baffle can be removed after molding.

[0033] As a preferred embodiment of the present invention, a preparation method is also provided, comprising the following steps: Mold blank preparation: Prepare mold body 4 and install support bolts 12 in its forming groove 5, and install an annular baffle at the groove opening of the forming groove 5. Add the appropriate amount of casting wax particles to the forming groove 5, melt and solidify the casting wax particles, form and fix wax 13 at the bottom of the forming groove 5, and add a mixed solution of different paraffin waxes in proportion to the upper layer of the forming wax 14, and solidify it into forming wax 14. Preparation of micro-wedge array structure: Disassemble the annular baffle, perform machine tool processing on molding wax 14, use a milling cutter to process the surface of molding wax 14 flat, and mill out overflow groove 15, and use a wedge cutter to process the wedge cavity 17 array; It should be noted that the two preparation steps, "creation of the mold blank" and "preparation of the micro-wedge array structure," are as follows: Figure 4 As shown, the specific preparation process is as follows: S1. Preparation stage: Prepare a mold for preparing micro-wedge adhesive layer 3, install support bolts 12 in the forming groove 5 of the mold body 4 of the mold for preparing micro-wedge adhesive layer 3, and install an annular baffle at the groove opening of the forming groove 5. S2. Preparation of fixing wax 13: High-viscosity casting wax solid particles are placed in molding tank 5. The casting wax solid particles are melted and cooled to form a solidified product using a heating platform and hot air gun. It should be noted that the height of the solidified wax 13 after molding is higher than the lower support bolt 12 and lower than the upper support bolt 12. After solidification, the solidified wax 13 forms a tight connection with the molding tank 5. S3. Making molding wax 14: Mix different solid paraffin particles that can be processed into wedge cavities according to the required mass ratio, and put them into a beaker and melt them in a 120° constant temperature box. After they are completely melted, pour the paraffin mixture into the molding tank 5, and place it above the fixed wax 13 to obtain a mold blank with wax and metal connected as one piece. S4. Overflow groove 15 machining: Install and fix the mold blank on the machine tool, install the milling cutter on the machine tool machining axis and input the required machining program. After setting the origin of the milling cutter, start milling the groove. Use the milling cutter to mill an overflow groove 15 with a width of about 5mm in the contact area between the outer periphery of the molding wax 14 area and the mold body 4. S5. Machining of wedge-shaped cavity 17: The machine tool machining axis is mounted with a fixture, and a machining tool 18 is mounted on the fixture. A wedge-shaped cavity machining plane is machined at the molding part on the top surface of the molding wax 14. The wedge-shaped cavity machining plane is flush with the reference plane 16 (top surface of the mold body 4). The required micro-structure wedge-shaped cavity 17 is further machined on the machining plane. S6. Cleaning of the mold: After obtaining the molding wax 14 with the microstructured wedge-shaped cavity 17, the finished manufacturing device is taken out of the machine tool and subjected to preliminary cleaning treatment. Preferably, the excess impurities on the manufacturing device are rinsed off with flowing pure water. Then, the manufacturing device is placed in a sealed container, and a certain amount of desiccant is added to the container to dry and seal the residual water after rinsing, so as to prevent dust from entering the interior of the microstructured wedge-shaped cavity 17.

[0034] It should be noted that the entire manufacturing process includes tool setting and precision machining of the microstructured wedge-shaped cavity 17; among which, tool setting includes... Figure 5As shown: Due to installation errors during mold and tool installation on the machine tool, and the need to ensure uniform overall thickness of the prepared bristle bundle structure adhesive pad, it is necessary to correct the angle of the machining tool 18 and adjust the minute angle of the mold installation during machine processing. The adjustment process is as follows: First, use a stainless steel feeler gauge 19 to measure the distance between the two ends of the tool and the reference plane 16 (top surface of the mold body 4). The left and right heights are D1 and D2, respectively, with D1 being approximately 50µm and D2 approximately 10µm. After recording the data, make a minute angle adjustment of the tool and measure the heights D1 and D2 on both sides. Repeat the operation multiple times until the distances on both sides are very close (the difference is less than or equal to 10µm), then stop the tool adjustment, at which point the tool is parallel to the Y-direction of the machining plane. Further, use a manual adjustment crank to control the machine tool to move the tool, and measure the heights H1 and H2 of the machine tool's running trajectory and the reference plane 16 (top surface of the mold body 4). After recording, subtract the smaller data from the larger data to obtain the height difference. Insert a stainless steel feeler gauge (19) with a thickness corresponding to the height difference into the bottom of the larger data area to ensure the two heights are close, until the difference is less than or equal to 10µm. Since the first step of tool setting has already ensured the tool edge is parallel to the Y-direction of the machining plane, the second step further adjusts the parallelism of the tool path to the X-direction of the machining plane. Geometrically, it is known that the plane traversed by the entire tool path will now be parallel to the reference plane (16). Figure 4 In step 5, this ensures that the machined wedge-shaped cavity plane on the top surface of the molded die is parallel to the reference plane 16. Subsequent control of the Z-direction displacement of the machined plane controls the fixed height of the wedge-shaped cavity plane relative to the reference plane 16, ensuring uniform thickness of the bonded gasket.

[0035] Furthermore, the relationship between the tool tip entry angle and the micro-wedge groove during the machining of the microstructured wedge cavity 17 is as follows: Figure 6 As shown: When the entry angle is less than the flank angle of the tool, the included angle ε between the flank and the sidewall of the groove is greater than 0. At this time, there is no contact between the flank and the molding wax 14, thus no friction occurs, which helps improve the flatness of the groove sidewall. When the included angle ε < 0, the flank will compress the sidewall of the micro-wedge groove when the tool tip cuts the wax. This phenomenon will compress the already machined micro-wedge groove, affecting the shape consistency of the micro-wedge groove. Therefore, machining is performed with an included angle ε > 0 between the flank and the sidewall of the micro-wedge groove. Machining the wedge cavity 17 involves entering the tool at a fixed angle θ. The tool stops moving when the distance between the tool tip and the top surface of the molding wax 14 is H. The tool retracts along the original path to the tool setting position, forming an inclined wedge groove in the molding portion on the top surface of the molding wax 14. Here, θ is the angle between the tool centerline and the top surface of the molding wax 14. The tool is then moved forward a preset distance D, and the steps are repeated. During the processing, the processing area is sprayed with the required lubricant until all processing areas are completed.

[0036] Casting and Molding: The mold 10 for preparing the structural layer is positioned and assembled into the groove of the molding tank 5, and silicone is cast into the mold 10. A cover plate 8 with a flexible base tape is placed on top of the casting material until the casting material cures at room temperature to form an adhesive gasket. Preferably, the flexible base tape is first bonded to the metal cover plate 8, sanded, and then a primer is applied evenly for half an hour. Liquid silicone components A and B are mixed and stirred evenly in a certain proportion and vacuumed to remove internal air. After the mold 10 for preparing the structural layer is positioned and assembled into the groove of the molding tank 5, the silicone is evenly poured onto the wedge-shaped cavity 17 and completely covers the mold 10 for preparing the structural layer. Vacuuming is performed again. The cover plate 8 with the flexible base tape is assembled with the mold body 4 and allowed to cure at room temperature for 48 hours.

[0037] Simultaneously, by using this process, while ensuring that the basic parameters of the wedge-shaped cavity 17 remain unchanged, the mold 10 for preparing different adaptive structural layers can be universally replaced, and the different structural parameters of the adaptive structural layer of the adhesive gasket can be changed, thus realizing the adjustable function of the adaptive structural layer parameters of the prepared sample.

[0038] Demolding of the adhesive gasket: Separate the mold body 4, transfer the parts other than the mold body 4 to the demolding mold, and separate the adaptive structure layer preparation mold 10 from the side of the adhesive gasket. Finally, remove the adhesive gasket to obtain a bristle bundle structure adhesive gasket with an adaptive structure layer. Preferably, this step specifically includes: separating the cover plate 8 from the mold body 4, separating the cover plate 8 and the bristle bundle structure adhesive gasket together with the molding wax 14, and then assembling them into the demolding mold before performing a side demolding process on the adaptive structure layer preparation mold 10. Remove the adaptive structure layer preparation mold 10 from the molded bristle bundle structure adhesive gasket; further disassemble the various parts of the mold, and peel off the flexible base tape from the cover plate 8 to obtain a complete bristle bundle structure adhesive gasket with an adaptive structure layer.

[0039] In the specific implementation of the "casting and molding" and "attaching gaskets for demolding" steps, such as Figure 8 As shown, the process includes the following: S1. Mix liquid silica gel components A and B at a mass ratio of 10:1, stir evenly for three minutes, and then vacuum until no bubbles are generated; the selected liquid silica gel is a two-component AB silica gel, so it needs to be mixed according to the ratio A:B. S2, The installation of the mold 10 and the mold body 4 for the adaptive structural layer preparation is as follows: Figure 7As shown in step 2: Clean the mold 10 for preparing the adaptive structure layer. After cleaning, spray a layer of release agent evenly on the surface of the mold 10 for preparing the adaptive structure layer. Then, use the positioning holes to assemble the mold 10 for preparing the adaptive structure layer with the mold body 4. S3. The vacuum-treated silicone is evenly poured onto the top surface of the molding wax 14 and completely covers the mold 10 for adapting the structural layer. Further vacuum treatment is carried out to ensure that the silicone completely fills the microstructure wedge cavity 17 until no air bubbles are generated. S4. Adhere the flexible base tape to the surface of the cover plate 8. During this process, ensure that there are no air bubbles on the bonding surface. Use sandpaper to sand the flexible base tape and apply primer evenly. Wait half an hour, then assemble the cover plate 8 and the mold body 4 that has been poured with silicone and wait for it to cure at room temperature for 48 hours. S5. Remove the silicone part of the cover plate 8 and the mold 10 after the structure layer is formed from the overall mold body 4. Use a clean and sharp blade to cut off the protrusion formed in the overflow groove 15 to ensure that the overall silicone part is a relatively complete flat surface. S6. Install the adaptable structure layer preparation mold 10 and the cover plate 8 together onto the demolding mold, and then demold the adaptable structure layer preparation mold 10 from the side to avoid generating friction on the wedge-shaped cavity 17 at the top of the molding wax 14 and damaging the wedge-shaped cavity 17 during demolding from the side of the mold body 4. S7. Further separate the cover plate 8 from the demolding mold, remove the thickness gasket 11, etc., to obtain the bristle bundle structure adhesive gasket bonded to the cover plate 8. Separate the flexible base tape from the cover plate 8 and the thickness gasket 11 to obtain a bristle bundle structure adhesive gasket with an adaptive structural layer and a back that can be bonded. S8. Further cut the obtained bristle bundle structure adhesive pad with a blade to obtain a bristle bundle structure adhesive pad of the required shape and size.

[0040] The bristle bundle structure adhesive pad uses a flexible base tape as its backing, which has adhesive properties and can be attached to different actuator mechanisms. Simultaneously, tool and fixture adjustments and tool setting during machining ensure that the wedge-shaped cavity 17 is parallel to the reference surface, and the milled overflow groove 15 ensures that excess silicone overflows within the overflow groove 15, thus preventing excess silicone from flowing onto the reference surface and causing thickness variations. This modification ensures a more uniform thickness of the final formed bristle bundle structure adhesive pad, maximizing contact during adhesion. The added adaptive structural layer allows the final bristle bundle structure adhesive pad to adapt to the surface of slightly warped objects through deformation, resulting in more complete contact between the wedge-shaped adhesive surface of the bristle bundle structure adhesive pad and the object surface, thereby generating greater adhesive force. This wedge-shaped adhesive surface enables reversible adhesion and anisotropy, and can replace traditional mechanical clamping, vacuum adsorption, and electrostatic adsorption for non-destructive gripping, handling, and releasing of heavy objects.

[0041] Any adaptive changes made according to actual needs are within the scope of protection of this invention.

[0042] It should be noted that, for those skilled in the art, it is obvious that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0043] Specific examples have been used to illustrate the principles and implementation methods of this invention. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of this invention. Furthermore, those skilled in the art will recognize that, based on the ideas of this invention, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this invention.

Claims

1. A bristle bundle structure adhesive pad, characterized in that, It includes a micro-wedge adhesive layer, a sparse adaptation structure layer, and a back adhesive layer, which are arranged sequentially along the thickness direction and can adapt to the deformation of the object surface. One side of the micro-wedge adhesive layer is densely covered with micro-wedge structures, and the other side is attached to the sparse adaptation structure layer. One side of the back adhesive layer is attached to the surface of the sparse adaptation structure layer away from the micro-wedge adhesive layer, and the other side of the back adhesive layer is used to connect to the actuator mechanism. The sparse adaptive structure layer includes two buffer layers arranged along its thickness direction. One buffer layer has a plurality of through-hole structures that penetrate the buffer layer in a first direction, and the other buffer layer has a plurality of through-hole structures that penetrate the buffer layer in a second direction. The first direction and the second direction have an included angle.

2. An apparatus for manufacturing a bristle bundle structure adhesive pad as described in claim 1, characterized in that, This includes molds for preparing micro-wedge adhesive layers and molds for preparing paired adaptive structural layers; The micro-wedge adhesive layer preparation mold includes a mold body, a forming groove is provided on the top surface of the mold body, a wax model is provided in the forming groove, the top surface of the wax model is flush with the opening of the forming groove, and is densely covered with wedge-shaped cavities for forming the micro-wedge structure. The mold for preparing the adaptive structural layer includes a positioning area and an adaptive structural layer forming area. The positioning area is installed at the outer peripheral edge of the forming groove opening. Multiple forming strips are densely distributed in both adaptive structural layer forming areas, arranged at equal intervals in the horizontal direction. The two adaptive structural layer forming areas are arranged in sequence above the forming groove opening in the vertical direction, and the forming strips in the two adaptive structural layer forming areas are vertically distributed. The two adaptive structural layer forming areas are filled with casting material for forming the bristle bundle structure adhesive pad. The bottom surface of the casting material is in contact with the top surface of the wax model. A cover plate that can be separated from the casting material is pressed on the top surface of the casting material. The cover plate is detachably installed on the mold body and has a gap between it and the mold body to accommodate the mold for preparing the adaptive structural layer.

3. The apparatus for manufacturing a bristle bundle structure adhesive pad according to claim 2, characterized in that, The castable is equipped with a demolding mold. The top surface of the demolding mold has a receiving groove that fits into the castable. The cover plate is detachably installed at the opening of the receiving groove and has a gap between it and the opening of the receiving groove to allow the mold for preparing the adaptive structural layer to detach.

4. The apparatus for manufacturing a bristle bundle structure adhesive pad according to claim 3, characterized in that, The cover plate is used to press the surface of the castable material, and a flexible base tape is bonded to it. The flexible base tape is detachably bonded to the cover plate.

5. The apparatus for manufacturing a bristle bundle structure adhesive pad according to claim 4, characterized in that, The wax model includes a fixed wax formed at the bottom of the molding groove and a molding wax formed above the fixed wax. The top surface of the molding wax is flush with the opening of the molding groove and is densely covered with the wedge-shaped cavities. Horizontally extending support bolts are provided in the molding groove at the positions corresponding to the fixed wax and the molding wax, and the support bolts at the two locations are vertically distributed.

6. The apparatus for manufacturing a bristle bundle structure adhesive pad according to claim 5, characterized in that, The top surface of the molding wax is provided with a molding part located at its middle position. The molding part is densely covered with the wedge-shaped cavities, and overflow grooves are provided on both sides of the molding part along its horizontal direction.

7. The apparatus for manufacturing a bristle bundle structure adhesive pad according to claim 6, characterized in that, An annular baffle is surrounding the opening of the forming groove, and the bottom edge of the annular baffle is sealed to the top surface of the mold body.

8. The apparatus for manufacturing a bristle bundle structure adhesive pad according to claim 7, characterized in that, Each of the molding strips is coated with a release agent.

9. A method for preparing the bristle bundle structure adhesive pad as described in claim 1, characterized in that, The apparatus for fabricating a bristle bundle structure adhesive pad as described in any one of claims 2 to 8 includes the following steps: Mold blank making: Prepare the mold body and install support bolts in its forming groove, and install an annular baffle at the opening of the forming groove. Add the appropriate amount of casting wax particles to the forming groove, melt and solidify the casting wax particles, form and fix wax at the bottom of the forming groove, and add a well-proportioned mixed solution of different paraffin waxes on the top layer of the forming wax, and solidify it into forming wax. Preparation of micro-wedge array structure: Disassemble the annular baffle, perform machine tool processing on molding wax, use a milling cutter to process the surface of molding wax flat and mill out overflow grooves, and use a wedge-shaped tool to process a wedge-shaped cavity array; Casting and molding: Position and assemble the mold for preparing the structural layer into the groove of the molding groove, and cast silicone at the mold for preparing the structural layer, and cover the top of the casting material with a cover plate with flexible base tape until the casting material cures at room temperature to form an adhesive gasket. Demolding of the adhesive gasket: Separate the mold body, transfer the part other than the mold body to the demolding mold, separate the adaptive structure layer preparation mold from the side of the adhesive gasket, and finally remove the adhesive gasket.

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