A high-density two-dimensional phased array piezoelectric micromechanical ultrasonic transducer

Abstract

This invention discloses a high-density two-dimensional phased array piezoelectric micromechanical ultrasonic transducer, which is divided into multiple sub-array modules, each containing multiple array elements. Each sub-array module includes a substrate, a piezoelectric layer, and at least three electrode layers. Multiple cavities are arranged in a lattice on the substrate. Each electrode layer includes multiple electrodes arranged along the lattice of the cavities, with the electrode overlaps of each electrode layer corresponding to the positions directly above each cavity, thus forming an array element above each cavity. Each sub-array module also has a corresponding number of connection ports for connecting to each electrode. All connection ports are arranged along the thickness direction of the sub-array module, and the bottom of all connection ports is connected to the bottom surface of the substrate, enabling wiring on the back side of the sub-array module. This invention allows for individual addressing of all array elements in a large piezoelectric micromechanical ultrasonic transducer array.

Description

Technical Field

[0001] This invention belongs to the field of ultrasonic sensor technology, specifically a high-density two-dimensional phased array piezoelectric micromechanical ultrasonic transducer. Background Technology

[0002] Piezoelectric micromechanical ultrasonic transducers utilize the direct and inverse piezoelectric effects of piezoelectric materials to vibrate a piezoelectric thin film, thereby emitting or receiving ultrasonic signals. These transducers can function as actuators to emit sound waves or as sensors to receive them. They show promising applications in ultrasonic ranging, ultrasonic imaging, ultrasonic non-destructive testing, ultrasonic fingerprint recognition, ultrasonic flow detection, and ultrasonic mechanical feedback. For example, they are used in specific products and scenarios such as ultrasonic imagers, ultrasonic radar, sonar detection, robotic vacuum cleaners, ultrasonic smoke detectors, and ultrasonic flow meters.

[0003] A piezoelectric micromechanical ultrasonic transducer typically consists of a bottom electrode, a piezoelectric layer, a top electrode, a support layer, a substrate, and a cavity. The diaphragm above the cavity vibrates in a bending manner during operation, thereby emitting and receiving ultrasonic waves.

[0004] Two-dimensional phased arrays of piezoelectric micromechanical ultrasonic transducers can achieve focusing on specific areas during imaging by controlling the transmission and reception of certain array elements. To achieve higher resolution imaging with piezoelectric micromechanical ultrasonic transducers, individual addressing of certain array elements is required. Existing piezoelectric micromechanical ultrasonic transducer arrays offer the following solutions for addressing individual array elements:

[0005] Option 1: When designing a phased array piezoelectric micromechanical ultrasonic transducer, many circuit interfaces are reserved, and each array element is equipped with a separate CMOS switch for control. Each element has its own electrode, and the on / off state of the CMOS is controlled by an external control circuit to achieve control of each individual array element.

[0006] Option 2: Figure 1 As shown, in designing a phased array piezoelectric micromechanical ultrasonic transducer, each row and column is considered as a whole, with electrodes led out for connection. Control of each row and column is achieved through an external control circuit. When a specific element needs to operate independently, its corresponding row and column are excited, thus enabling addressing of that element.

[0007] Scheme 1 has too many circuit switches, requiring a separate switch for each array element. This necessitates considering a huge number of circuits when designing the interface circuit, which is clearly impractical for the equipment interface of existing test and control systems.

[0008] Although Option 2 reduces the number of circuit interfaces, each line needs to span the entire array, resulting in excessively long wires and high resistance in the circuit, which affects transducer performance and has a significant impact on imaging results.

[0009] Therefore, a new high-density two-dimensional phased array piezoelectric micromechanical ultrasonic transducer structure design is needed to reduce the number of circuit interfaces, maintain an effective ground plane and appropriate signal transmission when transmitting and receiving signals through cables, realize addressing of individual array elements, and achieve good two-dimensional imaging. Summary of the Invention

[0010] The purpose of this invention is to overcome the shortcomings of the prior art and provide a high-density two-dimensional phased array piezoelectric micromechanical ultrasonic transducer.

[0011] This invention is achieved through the following technical solution:

[0012] A high-density two-dimensional phased array piezoelectric micromechanical ultrasonic transducer is divided into multiple sub-array modules, each of which contains multiple array elements.

[0013] The subarray module includes a substrate, a piezoelectric layer, and at least three electrode layers. Multiple cavities are arranged in a dot matrix on the substrate. Each electrode layer includes multiple electrodes arranged along the dot matrix of the cavities. The electrode overlap of each electrode layer corresponds to the position directly above each cavity, so that an array element is formed above each cavity.

[0014] Each subarray module is also provided with a corresponding number of wiring ports, which are used to connect to each electrode respectively; each wiring port is arranged along the thickness direction of the subarray module, and the bottom of all wiring ports is connected to the bottom surface of the substrate, thereby realizing wiring on the back of the subarray module.

[0015] In the above technical solution, the piezoelectric layer portion corresponding to each cavity is either convex and bent upwards, or concave and bent downwards, or is planar.

[0016] In the above technical solution, the diameter of the curved portion is smaller than the diameter of its corresponding cavity.

[0017] In the above technical solution, 4*4 cavities are arranged in a dot matrix on the substrate, that is, 4*4 array elements are arranged in a dot matrix on the substrate. Correspondingly, each electrode layer includes 4 electrodes.

[0018] In the above technical solution, the subarray module is provided with three electrode layers: two signal electrodes and one ground electrode. The two signal electrodes are located on the bottom and top surfaces of the piezoelectric layer, respectively, and the ground electrode layer is located inside the piezoelectric layer, thus forming a piezoelectric structure of signal electrode-piezoelectric layer-ground electrode-piezoelectric layer-signal electrode.

[0019] In the above technical solution, the subarray module is provided with four electrode layers: two signal electrodes and two ground electrodes, as well as an insulating layer. The insulating layer is located inside the piezoelectric layer. The two ground electrodes are located on the bottom and top surfaces of the piezoelectric layer, respectively, and the two signal electrodes are located on the bottom and top surfaces of the insulating layer, respectively, thus forming a piezoelectric structure of ground electrode-piezoelectric layer-signal electrode-insulating layer-signal electrode-piezoelectric layer-ground electrode.

[0020] In the above technical solution, the subarray module is provided with four electrode layers: two signal electrodes and two ground electrodes, as well as an insulating layer. The insulating layer is located inside the piezoelectric layer. The two ground electrodes are located on the bottom surface of the piezoelectric layer and the top surface of the insulating layer, respectively. The two signal electrodes are located on the top surface of the piezoelectric layer and the bottom surface of the insulating layer, respectively, thus forming a piezoelectric structure of ground electrode-piezoelectric layer-signal electrode-insulating layer-ground electrode-piezoelectric layer-signal electrode.

[0021] In the above technical solution, the sub-array module is equipped with three or four layers of signal electrodes. In this mode, the signal electrode potentials are opposite, forming a loop; the ground electrode is on the PCB board of the ultrasonic transducer.

[0022] In the above technical solution, the subarray module is provided with multiple first wiring ports, multiple second wiring ports, and multiple third wiring ports. The first wiring ports are arranged on the right side of the subarray module, and the number of the first wiring ports is consistent with the number of electrodes in the first layer of signal electrodes, used to connect the electrodes in the first layer of signal electrodes. The second wiring ports are arranged on the left side of the subarray module, and the number of the second wiring ports is consistent with the number of electrodes in the second layer of signal electrodes, used to connect the electrodes in the second layer of signal electrodes. The third wiring ports are arranged on the lower side of the subarray module, and the number of the third wiring ports is consistent with the number of electrodes in the ground electrode layer, used to connect the electrodes in the ground electrode layer.

[0023] In the above technical solution, the subarray module is provided with multiple first wiring ports, multiple second wiring ports, multiple third wiring ports, and multiple fourth wiring ports. The first wiring ports are arranged on the right side of the subarray module, and the number of first wiring ports matches the number of electrodes in the first layer of grounding electrodes, used for wiring each electrode in the first layer of grounding electrodes. The second wiring ports are arranged on the left side of the subarray module, and the number of second wiring ports matches the number of electrodes in the second layer of grounding electrodes, used for wiring each electrode in the second layer of grounding electrodes. The third wiring ports are arranged on the lower side of the subarray module, and the number of third wiring ports matches the number of electrodes in the first layer of signal electrodes, used for wiring each electrode in the first layer of signal electrodes. The fourth wiring ports are arranged on the upper side of the subarray module, and the number of fourth wiring ports matches the number of electrodes in the second layer of signal electrodes, used for wiring each electrode in the second layer of signal electrodes.

[0024] Electronic devices formed using the above-mentioned high-density two-dimensional phased array piezoelectric micromechanical ultrasonic transducer include at least one of the following: ultrasonic imager, ultrasonic rangefinder, ultrasonic fingerprint sensor, non-destructive testing instrument, flow meter, force feedback device, and smoke alarm.

[0025] The advantages and beneficial effects of this invention are as follows:

[0026] This invention enables individual addressing of all elements in a large piezoelectric micromechanical ultrasonic transducer array, which is a significant advantage in two-dimensional phased arrays. During imaging, focusing on specific areas can be achieved by controlling the transmission and reception of certain elements.

[0027] This invention divides a large piezoelectric micromechanical ultrasonic transducer array into multiple sub-array modules. These sub-array modules can be the same or different, and the specific design can be flexibly adjusted according to imaging requirements.

[0028] Each subarray module has its circuit connections led out from the back of its substrate, leaving ample space for circuit design.

[0029] During addressing, you can address only one array element or address multiple array elements simultaneously (in which case the multiple array elements are connected in parallel). By addressing multiple array elements, you can obtain a larger transmitted sound pressure level to meet the high sound pressure requirements under specific imaging conditions.

[0030] The piezoelectric layer portion above the cavity of each array element is curved upwards or concave downwards; the diameter of the curved portion is smaller than the diameter of its corresponding cavity. This curved structure enhances the response performance of each array element. Attached Figure Description

[0031] Figure 1This is a schematic diagram of the design scheme for a phased array piezoelectric micromechanical ultrasonic transducer mentioned in the background technology.

[0032] Figure 2 This is a schematic diagram of the phased array piezoelectric micromechanical ultrasonic transducer designed according to the present invention.

[0033] Figure 3 This is a top view of a single subarray module according to Embodiment 1 of the present invention.

[0034] Figure 4 This is a cross-sectional schematic diagram of a single subarray module in the AA direction according to Embodiment 1 of the present invention.

[0035] Figure 5 This is a cross-sectional schematic diagram of a single subarray module in the BB direction according to Embodiment 1 of the present invention.

[0036] Figure 6 This is a cross-sectional schematic diagram of a single subarray module in the CC direction according to Embodiment 1 of the present invention.

[0037] Figure 7 This is a top view of a single subarray module according to Embodiment 2 of the present invention.

[0038] Figure 8 This is a cross-sectional schematic diagram of a single subarray module in the AA direction according to Embodiment 2 of the present invention.

[0039] Figure 9 This is a cross-sectional schematic diagram of a single subarray module in the BB direction according to Embodiment 2 of the present invention.

[0040] Figure 10 This is a top view of a single subarray module according to Embodiment 3 of the present invention.

[0041] Figure 11 This is a cross-sectional schematic diagram of a single subarray module in the AA direction according to Embodiment 3 of the present invention.

[0042] Figure 12 This is a cross-sectional schematic diagram of a single subarray module in the BB direction according to Embodiment 3 of the present invention.

[0043] For those skilled in the art, other related figures can be obtained from the above figures without any creative effort. Detailed Implementation

[0044] To enable those skilled in the art to better understand the present invention, the technical solution of the present invention will be further described below with reference to specific embodiments.

[0045] Example 1

[0046] A high-density two-dimensional phased array piezoelectric micromechanical ultrasonic transducer, see appendix. Figure 2 The entire array is divided into 12 sub-array modules a. These sub-array modules may contain the same or different array elements. In this embodiment, each sub-array module includes 4*4 array elements. The structure is described in detail below.

[0047] See appendix Figure 3 - Appendix Figure 6 The subarray module includes a substrate 100 and a piezoelectric layer 200 located on the substrate 100. A 4*4 matrix of cavities is arranged on the substrate 100. Along the 4*4 cavity matrix, four first signal electrodes 300 are correspondingly arranged on the bottom surface of the piezoelectric layer 200, and four second signal electrodes 300' are correspondingly arranged on the top surface of the piezoelectric layer 200. Four ground electrodes 400 are correspondingly arranged inside the piezoelectric layer 200 (specifically, the piezoelectric layer 200 is divided into upper and lower sub-piezoelectric layers, and the ground electrodes 400 are located between these upper and lower sub-piezoelectric layers), thereby forming a piezoelectric structure of signal electrode-piezoelectric layer-ground electrode-piezoelectric layer-signal electrode on the substrate. The second signal electrode 300' and the first signal electrode 300 are arranged laterally along the sub-array module, and the ground electrode 400 is arranged longitudinally along the sub-array module (i.e., the ground electrode 400 is perpendicular to the second signal electrode 300' and the first signal electrode 300). The overlapping points of each ground electrode and each signal electrode correspond to the position directly above each cavity, so that each cavity is respectively formed with an array element above it (i.e., the sub-array module has 4*4 array elements).

[0048] Furthermore, the piezoelectric layer portion above each cavity can be bent upwards or downwards; even further, the diameter of the bent portion is smaller than the diameter of its corresponding cavity. This bent structure can enhance the response performance of each array element.

[0049] Each subarray module is further provided with four first connection ports 510, four second connection ports 520, and four third connection ports 530. The four first connection ports 510 are arranged on the right side of the subarray module, each corresponding to one of the four first signal electrodes 300, for wiring to these electrodes. Specifically, the top of each first connection port 510 extends to the first signal electrode 300, and the bottom of the first connection port communicates with the bottom surface of the substrate, thus enabling wiring on the back side of the subarray module to connect to each first signal electrode 300. The four second connection ports 520 are arranged on the left side of the subarray module, each corresponding to one of the four second signal electrodes 300'. The four third terminals 520 are arranged on the lower side of the subarray module and correspond to the four ground electrodes 400 respectively. Specifically, the top of the second terminal 520 extends to the second signal electrode 300', and the bottom of the second terminal is connected to the bottom surface of the substrate, thus enabling wiring on the back of the subarray module to each second signal electrode 300'.

[0050] Example 2

[0051] See appendix Figure 7 - Appendix Figure 9 This embodiment provides another design structure for a subarray module, which includes a substrate 100 and a piezoelectric layer 200 located on the substrate 100. A 4*4 cavities are arranged in a matrix on the substrate 100. Along the 4*4 cavity matrix, four first ground electrodes 400 are correspondingly arranged on the bottom surface of the piezoelectric layer 200, and four second ground electrodes 400' are correspondingly arranged on the top surface of the piezoelectric layer 200. An insulating layer 600 is disposed inside the piezoelectric layer 200. Four first signal electrodes 300 are correspondingly arranged on the lower layer of the insulating layer 600, and four second signal electrodes 300' are correspondingly arranged on the upper layer of the insulating layer 600, thereby forming a piezoelectric structure on the substrate consisting of a ground electrode-piezoelectric layer-signal electrode-insulating layer-signal electrode-piezoelectric layer-ground electrode. The first ground electrode 400 and the second ground electrode 400' are arranged laterally along the subarray module, and the first signal electrode 300 and the second signal electrode 300' are arranged longitudinally along the subarray module. The overlapping points of each ground electrode and each signal electrode correspond to the positions directly above each cavity, so that each cavity is respectively formed above an array element.

[0052] Furthermore, the piezoelectric layer portion above each cavity can be bent upwards or downwards; even further, the diameter of the bent portion is smaller than the diameter of its corresponding cavity. This bent structure can enhance the response performance of each array element.

[0053] Each subarray module is provided with four first wiring ports 510, four second wiring ports 520, four third wiring ports 530, and four fourth wiring ports 540. The four first wiring ports 510 are arranged on the right side of the subarray module, corresponding to the four first ground electrodes 400 respectively, for wiring to the four first ground electrodes 400. Specifically, the top of the first wiring port 510 extends to the first ground electrode 400, and the bottom of the first wiring port communicates with the bottom surface of the substrate, thus enabling wiring on the back of the subarray module to connect to each first ground electrode 400. The four second wiring ports 520 are arranged on the left side of the subarray module, corresponding to the four second ground electrodes 400' respectively, for wiring to the four second ground electrodes 400'. Specifically, the top of the second wiring port 520 extends to the second ground electrode 400', and the bottom of the second wiring port communicates with the bottom surface of the substrate. This allows for wiring on the back of the subarray module, connecting to each second ground electrode 400'. The four third wiring ports 530 are arranged on the lower side of the subarray module, corresponding to the four first signal electrodes 300 respectively, for wiring to the four first signal electrodes 300. Specifically, the top of the third wiring port extends to the first signal electrode 300, and the bottom of the third wiring port communicates with the bottom surface of the substrate, thus enabling wiring on the back of the subarray module, connecting to each first signal electrode 300. The four fourth wiring ports 540 are arranged on the upper side of the subarray module, corresponding to the four second signal electrodes 300' respectively, for wiring to the four second signal electrodes 300'. Specifically, the top of the fourth wiring port extends to the second signal electrode 300', and the bottom of the fourth wiring port communicates with the bottom surface of the substrate, thus enabling wiring on the back of the subarray module, connecting to each second signal electrode 300'.

[0054] Example 3

[0055] See appendix Figure 10 - Appendix Figure 12This embodiment provides another design structure for a subarray module, which includes a substrate 100 and a piezoelectric layer 200 located on the substrate 100. A 4*4 cavities are arranged in a matrix on the substrate 100. An insulating layer 600 is disposed within the piezoelectric layer 200. Along the 4*4 cavity matrix, four first ground electrodes 400 are disposed on the bottom surface of the piezoelectric layer 200, four first signal electrodes 300 are disposed on the bottom surface of the insulating layer 600, four second ground electrodes 400' are disposed on the top surface of the insulating layer 600, and four second signal electrodes 300' are disposed on the top surface of the piezoelectric layer 200, thereby forming a structure of ground electrode-piezoelectric layer-signal electrode-insulating layer-ground electrode-piezoelectric layer-signal electrode on the substrate. The first ground electrode 400 and the second ground electrode 400' are arranged along the longitudinal direction of the sub-array module, and the first signal electrode 300 and the second signal electrode 300' are arranged along the transverse direction of the sub-array module. The overlapping points of each ground electrode and each signal electrode correspond to the positions directly above each cavity, so that each cavity is respectively formed with an array element above it.

[0056] Furthermore, the piezoelectric layer portion above each cavity can be bent upwards or downwards; even further, the diameter of the bent portion is smaller than the diameter of its corresponding cavity. This bent structure can enhance the response performance of each array element.

[0057] Each subarray module is provided with four first connection ports 510, four second connection ports 520, four third connection ports 530, and four fourth connection ports 540. The four first connection ports 510 are arranged on the left side of the subarray module, each corresponding to one of the four first signal electrodes 300, for wiring to these electrodes. Specifically, the top of each first connection port 510 extends to the first signal electrode 300, and the bottom of the first connection port communicates with the bottom surface of the substrate, thus enabling wiring from the back of the subarray module to each first signal electrode 300. The four second connection ports 520 are arranged on the right side of the subarray module, each corresponding to one of the four second signal electrodes 300', for wiring to these electrodes. Specifically, the top of each second connection port 520 extends to the second signal electrode 300', and the bottom of the second connection port communicates with the bottom surface of the substrate. This allows for wiring on the back of the subarray module, connecting to each second signal electrode 300'. The four third wiring ports 530 are arranged on the lower side of the subarray module, corresponding to the four first ground electrodes 400 respectively, for wiring to the four first ground electrodes 400. Specifically, the top of the third wiring port extends to the first ground electrode 400, and the bottom of the third wiring port communicates with the bottom surface of the substrate, thus enabling wiring on the back of the subarray module, connecting to each first ground electrode 400. The four fourth wiring ports 540 are arranged on the upper side of the subarray module, corresponding to the four second ground electrodes 400' respectively, for wiring to the four second ground electrodes 400'. Specifically, the top of the fourth wiring port extends to the second ground electrode 400', and the bottom of the fourth wiring port communicates with the bottom surface of the substrate, thus enabling wiring on the back of the subarray module, connecting to each second ground electrode 400'.

[0058] Example 4

[0059] Furthermore, the subarray module is equipped with three or four layers of signal electrodes. In this mode, the signal electrode potentials are opposite, forming a loop; the ground electrode is on the PCB board of the ultrasonic transducer.

[0060] The present invention has been described above by way of example. It should be noted that any simple modifications, alterations or other equivalent substitutions that can be made by those skilled in the art without creative effort without departing from the core of the present invention fall within the protection scope of the present invention.

Claims

1. A high-density two-dimensional phased array piezoelectric micromechanical ultrasonic transducer, which is divided into multiple sub-array modules, each sub-array module containing multiple array elements; The subarray module includes a substrate, a piezoelectric layer, and at least three electrode layers. Multiple cavities are arranged in a dot matrix on the substrate. Each electrode layer includes multiple electrodes arranged along the dot matrix of the cavities. The electrode overlap of each electrode layer corresponds to the position directly above each cavity, so that an array element is formed above each cavity. Each subarray module is also provided with a corresponding number of wiring ports, which are used to connect to each electrode respectively; each wiring port is arranged along the thickness direction of the subarray module, and the bottom of all wiring ports is connected to the bottom surface of the substrate, thereby realizing wiring on the back of the subarray module. The piezoelectric layer portion above each cavity may be convex and curved upwards, or concave and curved downwards, or be planar.

2. The high-density two-dimensional phased array piezoelectric micromechanical ultrasonic transducer according to claim 1, characterized in that: Four cavities are arranged in a lattice pattern on the substrate, that is, four array elements are arranged in a lattice pattern on the substrate. Correspondingly, each electrode layer includes four electrodes.

3. The high-density two-dimensional phased array piezoelectric micromechanical ultrasonic transducer according to claim 1, characterized in that: The subarray module has three electrode layers: two signal electrodes and one ground electrode. The two signal electrodes are located on the bottom and top surfaces of the piezoelectric layer, respectively, and the ground electrode layer is located inside the piezoelectric layer, thus forming a piezoelectric structure of signal electrode-piezoelectric layer-ground electrode-piezoelectric layer-signal electrode.

4. The high-density two-dimensional phased array piezoelectric micromechanical ultrasonic transducer according to claim 1, characterized in that: The subarray module has four electrode layers: two signal electrodes and two ground electrodes, as well as an insulating layer. The insulating layer is located inside the piezoelectric layer. The two ground electrodes are located on the bottom and top surfaces of the piezoelectric layer, respectively, and the two signal electrodes are located on the bottom and top surfaces of the insulating layer, respectively, thus forming a piezoelectric structure of ground electrode-piezoelectric layer-signal electrode-insulating layer-signal electrode-piezoelectric layer-ground electrode.

5. The high-density two-dimensional phased array piezoelectric micromechanical ultrasonic transducer according to claim 1, characterized in that: The subarray module has four electrode layers: two signal electrodes and two ground electrodes, as well as an insulating layer. The insulating layer is located inside the piezoelectric layer. The two ground electrodes are located on the bottom surface of the piezoelectric layer and the top surface of the insulating layer, respectively. The two signal electrodes are located on the top surface of the piezoelectric layer and the bottom surface of the insulating layer, respectively. This forms a piezoelectric structure of ground electrode-piezoelectric layer-signal electrode-insulating layer-ground electrode-piezoelectric layer-signal electrode.

6. The high-density two-dimensional phased array piezoelectric micromechanical ultrasonic transducer according to claim 1, characterized in that: The subarray module is equipped with three or four layers of signal electrodes. In this mode, the signal electrode potentials are opposite, forming a loop; the ground electrode is on the PCB board of the ultrasonic transducer.

7. The high-density two-dimensional phased array piezoelectric micromechanical ultrasonic transducer according to claim 3, characterized in that: The subarray module is provided with multiple first wiring ports, multiple second wiring ports, and multiple third wiring ports. The first wiring ports are arranged on the right side of the subarray module, and the number of first wiring ports is the same as the number of electrodes in the first layer of signal electrodes, used to connect the electrodes in the first layer of signal electrodes. The second wiring ports are arranged on the left side of the subarray module, and the number of second wiring ports is the same as the number of electrodes in the second layer of signal electrodes, used to connect the electrodes in the second layer of signal electrodes. The third wiring ports are arranged on the bottom side of the subarray module, and the number of third wiring ports is the same as the number of electrodes in the ground electrode layer, used to connect the electrodes in the ground electrode layer.

8. The high-density two-dimensional phased array piezoelectric micromechanical ultrasonic transducer according to claim 4 or 5, characterized in that: The subarray module is provided with multiple first wiring ports, multiple second wiring ports, multiple third wiring ports, and multiple fourth wiring ports. The first wiring ports are located on the right side of the subarray module, with the number of first wiring ports matching the number of electrodes in the first layer of grounding electrodes, and are used to connect the electrodes in the first layer of grounding electrodes. The second wiring ports are located on the left side of the subarray module, with the number of second wiring ports matching the number of electrodes in the second layer of grounding electrodes, and are used to connect the electrodes in the second layer of grounding electrodes. The third wiring ports are located on the lower side of the subarray module, with the number of third wiring ports matching the number of electrodes in the first layer of signal electrodes, and are used to connect the electrodes in the first layer of signal electrodes. The fourth wiring ports are located on the upper side of the subarray module, with the number of fourth wiring ports matching the number of electrodes in the second layer of signal electrodes, and are used to connect the electrodes in the second layer of signal electrodes.

9. An electronic device, characterized in that: The device includes a high-density two-dimensional phased array piezoelectric micromechanical ultrasonic transducer as described in any one of claims 1-8; the electronic device includes at least one of the following: an ultrasonic imager, an ultrasonic rangefinder, an ultrasonic fingerprint sensor, a non-destructive testing instrument, a flow meter, a force feedback device, and a smoke alarm.

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