Hall element precision welding fixture and method
Patent Information
- Application Number
- CN202410421978.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-09
- Publication Date
- 2026-09-25
- Estimated Expiration
- 2044-04-09
AI Technical Summary
[0004]1)生产效率低下,现有工艺需要2次焊接,一次是Top面的SMT焊接,另一次是Bottom面的手工焊接;
[0024]本发明所设计的霍尔元件精密焊接夹具及方法,通过第一夹具承载电路板并将霍尔引脚插入定位,第二夹具利用开口朝上的腔体遮覆并托住霍尔本体,第三夹具上的可调顶柱则能精准顶起霍尔元件至预定高度;利用这三种夹具对霍尔元件进行精准放置和高度控制后,对整体装配件进行一次性回流焊接,即可同步完成电路板上所有霍尔元件焊接。该方案不仅减少了人工焊接环节、大幅提高生产效率,焊接质量也得到保证一致达到IPC3级最高标准,确保只需一次焊接即完成所有焊接工序,提高了至少50%的生产效率,结合三种夹具的协同作用从根本上解决了传统工艺难以控制霍尔高度的问题。该套夹具装置结构设计合理、操作简单,可广泛应用于各类汽车电子产品的生产制造,完全解决了现有工艺的诸多痛点,实现了高精度、高效率、高品质的汽车电子产品生产,达到了有效提升汽车电子产品质量性能的目的,对整个汽车电子制造行业的发展具有积极推动作用。
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Abstract
Description
Technical Field
[0001] This invention relates to the field of automotive electronics manufacturing technology, and in particular to a precision welding fixture and method for Hall effect elements. Background Technology
[0002] In current technology, the application of various electronic devices and circuits is becoming increasingly widespread. Among them, Hall effect sensors, as one of the important sensors, are widely used in scenarios such as detecting automobile engine speed, measuring steering angle, and detecting anti-lock braking systems. The performance and reliability of Hall effect sensors are crucial to the normal operation of the entire vehicle's electronic system. Hall effect sensors typically consist of a body and multiple pins, which need to be inserted and soldered onto a circuit board. However, the soldering height of the Hall effect sensor has a significant impact on its performance. If the soldering height deviation is too large, it will cause fluctuations in the output signal of the Hall effect sensor, thereby affecting the stability and reliability of the entire vehicle's electronic system. Therefore, in automotive electronics manufacturing, there are extremely strict requirements for the soldering height tolerance of Hall effect sensors, which typically needs to be controlled within the range of ±0.2mm.
[0003] Currently, the industry commonly uses SMT (Surface Mount Technology) processes first, that is, ... Figure 1 As shown, the process involves first using SMT (Surface Mount Technology) to solder materials onto the top side (screen printing, surface mount, reflow soldering), then inserting the Hall effect sensor onto the bottom side, followed by placing the Hall effect sensor height control fixture, and finally rotating the fixture and board together 180 degrees before manual soldering with a soldering iron. This traditional process has the following drawbacks:
[0004] 1) Low production efficiency. The existing process requires two welding processes: one is SMT welding on the top side, and the other is manual welding on the bottom side.
[0005] 2) It is impossible to guarantee consistent welding quality, as it is difficult to control the precise and continuous distribution of heat to each weld point during manual welding;
[0006] 3) It is difficult to control the height accuracy of the Hall element. Manual operation can easily cause the element to shift or tilt, making it impossible to accurately control the height.
[0007] The aforementioned problems have led to low production efficiency and inconsistent product quality, necessitating new technological solutions. Summary of the Invention
[0008] To address the aforementioned issues, this invention provides a Hall element precision welding fixture and method that enables precise placement and height control of Hall elements, followed by one-time reflow soldering of the entire assembly, simultaneously completing the soldering of all Hall elements on the circuit board.
[0009] To achieve the above objectives, the present invention provides a precision welding fixture for Hall elements, wherein the Hall element includes an element body and pins, comprising:
[0010] A first clamp is used to support a circuit board, and the surface of the first clamp is provided with positioning grooves for positioning the portion of the pins that protrude from the surface of the circuit board.
[0011] The second clamp has a groove on its surface that can accommodate the component body. When the second clamp is upside down on the first clamp, the opening side of the groove is in close contact with one side of the circuit board so that the groove covers the component body.
[0012] The third clamp has a top post on its surface that can pass through the insertion hole at the bottom of the groove and lift the Hall element as a whole; wherein, the depth of the groove is less than the overall length of the Hall element, and the sum of the depth of the groove and the thickness of the circuit board is greater than the overall length of the Hall element; the top post passes through the insertion hole and abuts against the element body, so that the end of the pin protrudes from the other side of the circuit board and reaches a predetermined height.
[0013] To simplify the assembly process, the first, second, and third clamps are all plate-shaped structures. The first and third clamps have clamp positioning posts on their plate surfaces for mutual positioning, and the second clamp has clamp positioning holes on its plate surface that are adapted to the clamp positioning posts.
[0014] To reduce weight and improve operational flexibility, the first, second, and third clamps are all provided with weight-reducing holes or grooves on their plate-like structures.
[0015] To improve the positioning accuracy of the circuit board, both the first and second clamps are provided with protrusions for positioning and fixing the circuit board.
[0016] To solve the above-mentioned technical problems, one technical solution adopted by the present invention is: to provide a precision welding method for Hall elements, using the precision welding fixture for Hall elements described in the aforementioned solution, comprising the following steps:
[0017] S101. Place the circuit board with the back side facing up on the first fixture, and insert the pins through the circuit board and position them in the positioning groove;
[0018] S102. Invert the second clamp onto the first clamp so that the opening side of its groove is in close contact with the back of the circuit board, thereby completely covering the component body with the groove;
[0019] S103. Flip the circuit board assembled with the first clamp and the second clamp by 180 degrees so that the groove on the second clamp supports the main body and the pins that have detached from the circuit board but have not completely detached from the circuit board.
[0020] S104. Remove the first fixture and perform screen printing and component placement on the front side of the circuit board;
[0021] S105. Assemble the third fixture onto the second fixture, so that the top post on the third fixture lifts the component body through the insertion hole at the bottom of the groove;
[0022] S106. Perform reflow soldering on the entire assembly, and simultaneously complete the soldering of all Hall elements on the circuit board;
[0023] S107. Disassemble the third and second clamps and remove the soldered circuit board product.
[0024] This invention presents a precision welding fixture and method for Hall effect elements. A first fixture supports the circuit board and inserts and positions the Hall effect pins. A second fixture uses an upward-facing cavity to cover and support the Hall effect body. An adjustable top post on a third fixture precisely lifts the Hall effect element to a predetermined height. After precise placement and height control of the Hall effect element using these three fixtures, the entire assembly undergoes a one-time reflow soldering process, simultaneously completing the welding of all Hall effect elements on the circuit board. This solution not only reduces manual welding steps and significantly improves production efficiency, but also ensures consistent welding quality reaching the highest IPC3 standard. It guarantees that all welding processes can be completed in a single operation, increasing production efficiency by at least 50%. The synergistic effect of the three fixtures fundamentally solves the problem of controlling Hall effect height in traditional processes. This fixture device has a reasonable structural design and is easy to operate. It can be widely applied to the manufacturing of various automotive electronic products, completely solving many pain points of existing processes. It achieves high-precision, high-efficiency, and high-quality automotive electronic product production, effectively improving the quality and performance of automotive electronic products and playing a positive role in promoting the development of the entire automotive electronics manufacturing industry. Attached Figure Description
[0025] Figure 1 It is a welding method based on existing traditional techniques;
[0026] Figure 2 This is a schematic diagram of the planar structure of the first clamp in one embodiment of this application;
[0027] Figure 3 This is a schematic diagram of the planar structure of the second clamp in one embodiment of this application;
[0028] Figure 4 This is a schematic diagram of the planar structure of the third clamp in one embodiment of this application;
[0029] Figure 5 This is a schematic diagram of the Hall element welding process in one embodiment of this application. Figure 1 ;
[0030] Figure 6This is a schematic diagram of the Hall element welding process in one embodiment of this application. Figure 2 Among them: component body 100, pin 200, circuit board 300, through hole 301, first clamp 1, positioning groove 11, second clamp 2, groove 21, insertion hole 22, third clamp 3, top post 31, clamp positioning hole 4, weight reduction groove 5, protrusion 6, clamp positioning post 7. Detailed Implementation
[0031] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.
[0032] Example 1.
[0033] like Figure 2-6 As shown, this embodiment provides a precision welding fixture for Hall elements. The Hall element includes a component body 100 and pins 200. The fixture includes:
[0034] The first clamp 1 is used to support the circuit board 300, and the surface of the first clamp 1 is provided with a positioning groove 11 for positioning the portion of the pin 200 that extends out of the surface of the circuit board 300;
[0035] The second clamp 2 has a groove 21 on its surface that can accommodate the component body 100. When the second clamp 2 is upside down on the first clamp 1, the opening side of the groove 21 is in close contact with one side of the circuit board 300 so that the groove 21 covers the component body 100.
[0036] The third clamp 3 has a top post 31 on its surface that can pass through the bottom insertion hole 22 of the groove 21 and lift the Hall element as a whole;
[0037] The depth of the groove 21 is less than the overall length of the Hall element, and the sum of the depth of the groove 21 and the thickness of the circuit board 300 is greater than the overall length of the Hall element; the top post 31 passes through the socket and abuts against the element body 100, so that the end of the pin 200 protrudes from the other side of the circuit board 300 and reaches a predetermined height.
[0038] Figure 5 and Figure 6 The embodiment illustrates the Hall element soldering process, wherein the Hall element includes an element body 100 and pins 200, and the circuit board 300 has been designed with mounting positions and through holes 301 for the Hall element (100, 200).
[0039] In practice, firstly, the circuit board 300 is placed face down on the first fixture 1 for subsequent soldering operations. Then, the pins 200 of the Hall element are inserted into the through holes 301 on the circuit board 300 and extend through the through holes 301 into the positioning grooves 11 on the first fixture 1 to ensure accurate alignment of the pins 200.
[0040] Next, as Figure 5 As shown, the second clamp 2 is inverted onto the first clamp 1, so that the groove 21 fits tightly against the side (back) of the circuit board 300. The groove 21 is designed to accommodate the component body 100 of the Hall element, preventing it from shifting in subsequent processes. Under the protection of the second clamp 2, after removing the first clamp 1, pre-soldering work such as screen printing and surface mount can be performed on the front side of the circuit board 300. At this time, since the depth of the groove 21 is less than the overall length of the Hall element, and the sum of the depth of the groove 21 and the thickness of the circuit board 300 is greater than the overall length of the Hall element, after the component body 100 sinks into the groove 21, part of the pin 200 is still placed in the through hole 301 on the circuit board 300, thereby avoiding the exposure of the pin 200 from affecting the pre-soldering work such as screen printing and surface mount.
[0041] Then, as Figure 6 As shown, the third clamp 3 is installed, and its top post 31 passes through the insertion hole 22 at the bottom of the groove 21 of the second clamp 2, so that the end of the pin 200 is driven by the component body 100 to protrude from the other side of the circuit board 300 and reach a predetermined height.
[0042] In one example, assuming the length of the component body 100 is 4mm and the length of the pin 200 is 4mm, the overall length of the Hall element is 8mm; the thickness of the circuit board 300 is 1.5mm (i.e., the length of the through hole 301 is 1.5mm), and the depth of the groove 21 is 7mm, in this case, when the second clamp 2 is upside down on the first clamp 1, the component body 100 is completely sunk into the groove 21 under its own weight, while the pin 200 does not protrude from the surface of the circuit board 300, and there is still 1mm of part placed in the through hole 301. Then, after the pre-soldering work such as screen printing and surface mounting is completed on the front side of the circuit board 300, assuming the depth of the socket 22 is 2mm, and the design requirement for the Hall element to protrude from the surface of the circuit board 300 is 4.5mm ± 0.2mm, the height that the component body 100 needs to be raised is 2.5mm, that is, the height of the top post 31 is pre-designed to be 4.5mm, so as to achieve precise height control of the Hall element.
[0043] In this way, in the subsequent process flow, the assembled assembly (2, 3, 300) is sent into the reflow oven. During the reflow soldering process, the pin 200 protrudes from the other side of the circuit board 300 under the action of the top post 31, reaching a predetermined height (generally 2mm), thus forming a precise solder joint. After the reflow soldering is completed, the third clamp 3 and the second clamp 2 are removed, and the soldered circuit board 300 is taken out. At this time, the Hall element has been firmly soldered to the circuit board 300, and the soldering height fully meets the design requirements. In summary, this solution not only reduces manual soldering steps and significantly improves production efficiency, ensuring that all soldering processes are completed in a single soldering operation, but also guarantees consistent soldering quality that meets the highest IPC3 standard, and improves production efficiency by at least 50%.
[0044] In one possible implementation, such as Figure 2-4 As shown, in order to simplify the assembly process, the first clamp 1, the second clamp 2 and the third clamp 3 are all plate-shaped structures, and the plates of the first clamp 1 and the third clamp 3 are provided with clamp positioning posts 7 for mutual positioning, and the plate of the second clamp 2 is provided with clamp positioning holes 4 that are adapted to the clamp positioning posts 7.
[0045] In this embodiment, the first clamp 1, the second clamp 2, and the third clamp 3 are all designed as plate structures. On the one hand, the plate structure of the clamps (1,2,3) is easier to manufacture and assemble, as well as easier to store and transport, which effectively reduces manufacturing and transportation costs. On the other hand, the plate structure of the clamps is easy to position and install, and workers can more easily assemble and use the clamps, so the assembly process is faster and more efficient. The design of the clamp positioning hole 4 combined with the clamp positioning post 7 can ensure the precise alignment between the second clamp 2 and the first clamp 1 or the third clamp 3, avoid deviations and errors in the assembly process, and ensure the repeatability of the welding operation, which helps to improve product quality and stability.
[0046] In one possible implementation, in order to reduce weight and improve operational flexibility, the first clamp 1, the second clamp 2 and the third clamp 3 are all provided with weight-reducing holes or weight-reducing grooves 5 on their plate-like structures.
[0047] In this embodiment, as Figure 2-4 As shown, the use of weight-reducing holes or weight-reducing grooves 5 can reduce the amount of material used, thereby reducing the weight of the fixture. This makes the fixture lighter and more flexible to operate. Especially in mass production, this lightweight design can significantly improve the efficiency and comfort of operation.
[0048] In another example, the first fixture 1, the second fixture 2, and the third fixture 3 can also be connected and rotated by a multi-axis robot to automate the entire welding process. This reduction in fixture weight can also reduce the load on the robot arm, extend the service life of the equipment, and thus indirectly reduce production costs.
[0049] In one possible implementation, such as Figure 2 , Figure 3 and Figure 4 As shown, in order to improve the positioning accuracy of the circuit board 300, both the first clamp 1 and the second clamp 2 are provided with protrusions 6 for positioning and fixing the circuit board 300.
[0050] In this embodiment, the protrusion 6 can provide a reliable positioning method without increasing significant costs, ensuring that the position of the circuit board 300 is consistent in each assembly process. This helps to improve the repeatability of the assembly process and reduce the variability in the product manufacturing process.
[0051] On the other hand, this embodiment provides a precision welding method for Hall elements, using the precision welding fixture for Hall elements described in the foregoing solution, such as... Figure 5 and Figure 6 As shown, it includes the following steps:
[0052] S101. Place the circuit board 300 with its back side facing up on the first fixture 1, and insert the pin 200 through the circuit board 300 and position it in the positioning groove 11; this step ensures the precise alignment of the Hall element as a whole, laying the foundation for subsequent assembly work;
[0053] S102. The second clamp 2 is placed upside down on the first clamp 1, so that the opening side of the groove 21 on it is in close contact with the back of the circuit board 300, thereby completely covering the component body 100 by the groove 21 of the second clamp; this step protects the component body 100 and the pins 200 by the groove 21 of the second clamp, preventing the component from shifting or being damaged during flipping, subsequent screen printing, and surface mount processes.
[0054] S103. The circuit board 300 assembled with the first clamp 1 and the second clamp 2 is rotated 180 degrees so that the groove 21 on the second clamp 2 supports the main body and the pins 200 that have detached from the circuit board 300 but have not completely detached from the circuit board 300. This step avoids the pins 200 protruding from the surface of the circuit board 300, which may cause interference problems to subsequent screen printing and surface mount processes.
[0055] S104. Remove the first fixture 1 and perform screen printing and patch mounting on the front side of the circuit board 300; this step completes the pre-setting work on the front side of the circuit board 300, preparing it for subsequent soldering operations and improving production efficiency and quality.
[0056] S105. Assemble the third fixture 3 onto the second fixture 2, so that the top post 31 on the third fixture 3 lifts the component body 100 through the bottom insertion hole 22 of the groove 21; this step achieves precise control of the height of the Hall element, ensures the accuracy and consistency of the welding process, and improves the welding quality;
[0057] S106. Reflow soldering is performed on the overall assembly, and the soldering of all Hall elements on the circuit board 300 is completed simultaneously. The simultaneous completion of reflow soldering ensures the soldering quality of all Hall elements, improves production efficiency, and reduces errors and defects that may be introduced due to multiple soldering operations.
[0058] S107. Disassemble the third clamp 3 and the second clamp 2, and remove the soldered circuit board 300 finished product.
[0059] This embodiment provides a precision welding fixture and method for Hall effect elements. A first fixture supports the circuit board and inserts and positions the Hall effect pins. A second fixture uses an upward-facing cavity to cover and support the Hall effect body. An adjustable top post on the third fixture precisely lifts the Hall effect element to a predetermined height. After precisely placing and height-controlling the Hall effect element using these three fixtures, the entire assembly undergoes a one-time reflow soldering process, simultaneously completing the welding of all Hall effect elements on the circuit board. This solution not only reduces manual welding steps and significantly improves production efficiency, but also ensures consistent welding quality reaching the highest IPC3 standard. It ensures that all welding processes are completed in a single welding operation, improving production efficiency by at least 50%. The synergistic effect of the three fixtures fundamentally solves the problem of controlling Hall effect height in traditional processes. This fixture device has a reasonable structural design and is easy to operate. It can be widely used in the production and manufacturing of various automotive electronic products, completely solving many pain points of existing processes. It achieves high-precision, high-efficiency, and high-quality automotive electronic product production, effectively improving the quality and performance of automotive electronic products and playing a positive role in promoting the development of the entire automotive electronics manufacturing industry.
[0060] In the description of this invention, it should be noted that the terms "vertical," "upper," "lower," "horizontal," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.
[0061] In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.
[0062] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.
Claims
1. A method for precision welding of Hall elements, characterized in that, A precision welding fixture for a Hall element is used, wherein the Hall element includes an element body and leads, and the fixture includes: A first clamp is used to support a circuit board, and the surface of the first clamp is provided with positioning grooves for positioning the portion of the pins that protrude from the surface of the circuit board. The second clamp has a groove on its surface that can accommodate the component body. When the second clamp is upside down on the first clamp, the opening side of the groove is in close contact with one side of the circuit board so that the groove covers the component body. The third clamp has a top post on its surface that can pass through the insertion hole at the bottom of the groove and lift the Hall element as a whole; wherein, the depth of the groove is less than the overall length of the Hall element, and the sum of the depth of the groove and the thickness of the circuit board is greater than the overall length of the Hall element; the top post passes through the insertion hole and abuts against the element body, so that the end of the pin protrudes from the other side of the circuit board and reaches a predetermined height; The method includes the following steps: S101. Place the circuit board with the back side facing up on the first fixture, and insert the pins through the circuit board and position them in the positioning groove; S102. Invert the second clamp onto the first clamp so that the opening side of its groove is in close contact with the back of the circuit board, thereby completely covering the component body with the groove; S103. Flip the circuit board assembled with the first clamp and the second clamp by 180 degrees so that the groove on the second clamp supports the main body and the pins that have detached from the circuit board but have not completely detached from the circuit board. S104. Remove the first fixture and perform screen printing and component mounting on the front side of the circuit board; S105. Assemble the third fixture onto the second fixture, so that the top post on the third fixture lifts the component body through the insertion hole at the bottom of the groove; S106. Reflow soldering is performed on the entire assembly, and the soldering of all Hall elements on the circuit board is completed simultaneously; S107. Disassemble the third and second clamps and remove the soldered circuit board product.
2. The precision welding method for Hall elements according to claim 1, characterized in that, The first clamp, the second clamp, and the third clamp are all plate-shaped structures. The first clamp and the third clamp have clamp positioning posts on their plate surfaces for mutual positioning. The second clamp has clamp positioning holes on its plate surface that are adapted to the clamp positioning posts.
3. The precision welding method for Hall elements according to claim 2, characterized in that, The first, second, and third clamps are all provided with weight-reducing holes or weight-reducing grooves on their plate-like structures.
4. The precision welding method for Hall elements according to any one of claims 1 to 3, characterized in that, Both the first and second clamps are provided with protrusions for positioning and fixing the circuit board.
Citation Information
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Hall element welding device
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Circuit board assembling method of power adapter
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