Laser 3d conformal heating method and system, vacuum conformal lower chamber device, and vacuum conformal apparatus

Abstract

The application provides a laser 3D fitting heating method and system, a vacuum fitting lower cavity device and a vacuum fitting equipment. Bonding products will show different degrees of absorption to light of different wavelengths. First, the absorption spectrum of the bonding product is measured in the laboratory to obtain the peak absorption wavelength, and then the corresponding peak frequency is calculated. The frequency parameter of the laser generator is set to the peak frequency, and then the laser generator is irradiated to the DOE component. The DOE optical element converts the energy of the laser beam into uniform distribution, and then uniformly heats the bonding product on the fitting surface. After heating, vacuum shaping is started for the next step of 3D fitting shaping. The application is accurate and uniform in heating, has higher thermal efficiency, achieves the effect of large-area heating, and has less influence on the thermal environment temperature of other components in the vacuum cavity, thereby causing lower thermal disturbance and thermal uniformity.

Description

Technical Field

[0001] This invention relates to the field of VR bonding technology, specifically to a laser 3D bonding heating method and system, a vacuum bonding lower cavity device, and a vacuum bonding equipment. Background Technology

[0002] In recent years, VR (Virtual Reality) technology has been developing and progressing. This technology actually involves the integration of various technologies such as display devices, optical paths, eye tracking, infrared sensing, gravity acceleration sensors, posture and position sensors, attention perception, and spatial perception. Among them, the optical path technology is an important component that provides 'immersion' and occupies a very important proportion. Currently, the best optical path technology in terms of overall weight, imaging contrast, and visual resolution is the folded optical path (commonly known as the pancake) solution. It achieves thin and long-distance virtual image imaging by combining lenses with semi-transparent and semi-reflective films and linear polarization / reflective polarization / quarter-wave plates.

[0003] To achieve this structure, the planar linear polarizing / reflective polarizing / quarter-wave plate needs to be seamlessly bonded to the lens. Furthermore, due to the stress effect of the polarizing plate, the stress on the polarizing plate must be as uniform as possible when it is stretched from a plane to become a 3D structure that adapts to the curvature of the lens.

[0004] The typical technical approach for this uniform deformation process involves first heating the planar thin film, then performing 3D molding and attachment once the optical film reaches its thermoplastic deformation temperature. The heating process requires precise temperature control, keeping the film temperature above the thermoplastic deformation temperature and below the yellowing temperature, while ensuring uniform temperature distribution to minimize stress effects.

[0005] Currently, the process of heating optical films is usually carried out using IR lamps. High-power infrared heating tubes are used to project a large amount of infrared radiation onto the optical film to be stretched, thereby raising its temperature.

[0006] Due to the low thermal efficiency of IR lamps, this device consumes a lot of energy (heating a single thin film requires 6-10 kilowatts of IR lamps). In addition, the heat overflow effect of IR lamps results in less than ideal heating uniformity. Furthermore, during continuous operation, the overflowing heat will disrupt the thermal environment temperature balance of the vacuum chamber, affecting the time and space uniformity of the product heating process. In turn, it will affect the final effect of the entire optical path. Summary of the Invention

[0007] To address the aforementioned shortcomings, this invention provides a laser 3D bonding heating method and system, a vacuum bonding lower cavity device, and a vacuum bonding equipment. It uses a combination of laser and DOE devices as a preheating method for optical thin films, which is more precise and uniform than the range heating method of infrared lamps, has higher thermal efficiency, and achieves a large-area heating effect.

[0008] In a first aspect, the present invention provides a laser 3D bonding heating method, which includes the following steps:

[0009] 1) Measure the absorption spectrum of the bonded product to obtain the absorption wavelength of the peak value, and then calculate the corresponding peak frequency;

[0010] 2) Set the frequency parameter of the laser generator to the peak frequency, and then irradiate the DOE component with the laser generator. The DOE optical element converts the energy of the laser beam into a uniform distribution, thereby uniformly heating the entire bonding surface of the product. After heating, vacuum shaping begins for the next step of 3D bonding shaping.

[0011] In one embodiment of the present invention, the DOE optical element is selected from one of a flat-top beam generator, a beam homogenizer, a ring generator, and a diffraction beam splitter.

[0012] In one embodiment of the present invention, in step 1), the process of measuring the absorption spectrum of the bonded product is as follows: the continuous light emitted by the tungsten lamp passes through the entrance slit, then enters the collimating lens, and then is split by the grating. The separated monochromatic light passes through the collimating lens, then enters the exit slit, and then passes through the semi-transparent mirror to split the light into two beams. One beam enters the photodetector directly, and the other beam enters the contrast photodetector after passing through the bonded product. By moving the position of the exit slit and recording the position of the exit slit and the ratio of the two photodetectors, the absorption spectrum of the bonded product is obtained.

[0013] In one embodiment of the present invention, in step 2), the peak frequency consists of one or more frequencies.

[0014] Secondly, the present invention provides a laser 3D bonding heating system, comprising: a laser emitting element for emitting a high-energy laser beam to laser heat the bonded product; a DOE optical element for converting the energy of the laser beam generated by the laser emitting element into a uniform distribution; and a fixture for supporting and adjusting the bonded product so that the surface of the bonded product faces the laser beam.

[0015] In one embodiment of the present invention, the laser emitting element is selected from single-mode laser or multi-mode laser, and the emission band of the laser emitting element is the maximum absorption peak of the adhesive product or a combination of multiple peak values.

[0016] In one embodiment of the present invention, the DOE optical element is selected from one of a flat-top beam generator, a beam homogenizer, a ring generator, and a diffraction beam splitter.

[0017] Thirdly, the present invention provides a vacuum bonding lower cavity device, which includes a lower cavity fixture assembly. The lower cavity fixture assembly includes a lower cavity fixture base plate, a lower cavity heating mounting plate, and a lower fixture. The lower cavity heating mounting plate is disposed on the upper side of the lower cavity fixture base plate. A first hollow structure is disposed in the middle of the lower cavity heating mounting plate. A laser 3D bonding heating system as described above is disposed inside the first hollow structure. A lower fixture is disposed on the upper side of the lower cavity heating plate. A second hollow structure matching the first hollow structure is disposed in the middle of the lower fixture. The first hollow structure and the second hollow structure form a space for laser heating.

[0018] In one embodiment of the present invention, the vacuum bonding lower cavity device further includes a plurality of temperature measuring devices, which are disposed on the lower fixture to monitor the temperature at different positions of the bonded product.

[0019] Fourthly, the present invention provides a vacuum bonding device, which includes the vacuum bonding lower cavity device as described above.

[0020] In summary, this invention provides a laser 3D bonding heating method and system, a vacuum bonding lower cavity device, and a vacuum bonding equipment. The beneficial effects of this invention are as follows:

[0021] This invention measures the absorption spectrum of the bonded product to obtain the peak absorption wavelength, and then calculates the corresponding peak frequency. It then uses a combination of laser and DOE devices as a preheating method for the optical thin film, which is more precise and uniform than the area heating method of infrared lamps, resulting in higher thermal efficiency and achieving a large-area heating effect. Simultaneously, it has minimal impact on the thermal environment temperature of other components within the vacuum chamber, making it a more efficient and precise heating method. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of a laser 3D bonding heating system provided in an embodiment of the present invention.

[0023] Figure 2 This is a schematic diagram of a laser 3D bonding heating system provided in an embodiment of the present invention.

[0024] Figure 3 This is a schematic diagram of a laser 3D bonding heating system provided in an embodiment of the present invention.

[0025] Figure 4 This is a schematic diagram of a laser 3D bonding heating system provided in an embodiment of the present invention.

[0026] Figure 5 This is a schematic diagram of the structure of a vacuum bonding lower cavity device provided in an embodiment of the present invention.

[0027] Figure 6This is a schematic diagram of the structure of a vacuum bonding lower cavity device provided in an embodiment of the present invention.

[0028] Explanation of main element symbols: 101, mounting base plate; 102, UVW platform; 103, adapter plate; 104, lower cavity shell; 105, lower cavity fixture base plate; 106, lower cavity heating mounting plate; 107, lower fixture; 108, column support; 109, lower cavity corrugated pipe; 110, vacuum extraction pipe; 111, temperature measuring device; 201, laser emitting element; 202, DOE optical element; 3, bonded products. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to represent selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] Example 1

[0031] An embodiment provides a laser 3D bonding heating system, which includes: a laser emitting element 201, a photodetector, a DOE optical element 202, and a fixture.

[0032] The laser emitting element 201 is used to emit a high-energy laser beam to laser heat the bonded product 3. Further, the laser emitting element 201 is selected from single-mode lasers or multimode lasers. The emission wavelength of the laser emitting element 201 is the maximum absorption peak or a combination of multiple peak values ​​of the bonded product.

[0033] The DOE optical element 202 is used to convert the energy of the laser beam generated by the laser emitting element 201 into a uniform distribution. Further, the DOE optical element 202 is selected from one of a flat-top beam generator, a beam homogenizer, a ring generator, and a diffraction beam splitter.

[0034] Furthermore, diffractive optical elements (DOEs) are typically constructed using micro- and nano-etching processes to form two-dimensionally distributed diffraction units. Each diffraction unit can have a specific morphology, refractive index, etc., allowing for precise control of the laser wavefront phase distribution. After the laser passes through each diffraction unit, it undergoes diffraction and interference occurs at a certain distance, forming a specific light intensity distribution.

[0035] The fixture is used to support and adjust the adhesive product 3 so that the surface of the adhesive product 3 faces the laser beam.

[0036] Furthermore, the laser emitting element 201 described above can be combined with the DOE element in the following ways:

[0037] (1) As Figure 1 As shown, the laser emitting element 201 and the DOE optical element 202 employ a combination of a single-mode transverse laser and a flat-top beam generator. The flat-top beam generator can transform the single transverse-mode laser (Gaussian distribution, M² < 1.3) into a uniformly intense, clearly defined distribution such as a circle, square, or elongated shape. In this configuration, the deformed area of ​​the thin film can be heated by the uniformly energetic laser, with concentrated light energy, clear edges, and minimal energy leakage, thus avoiding environmental heating issues.

[0038] (2) Figure 2 As shown, the laser emitting element 201 and the DOE optical element 202 employ a combination of multimode laser and beam homogenizer. The beam homogenizer homogenizes the non-uniform, irregularly distributed light spot, and is particularly suitable for laser sources with combined wavelengths (especially suitable for use when the optical film and protective film have different absorption peaks, requiring the use of multiple wavelength lasers).

[0039] (3) Figure 3 As shown, the laser emitting element 201 and the DOE optical element 202 employ a combination of a single-mode laser and a ring generator. The ring generator produces a light spot with a ring-shaped intensity distribution. After passing through the ring generator, the single-mode laser is deformed into multiple concentric ring structures, which heat a series of unequally spaced concentric rings on the optical film. The precisely calculated concentric ring structure is suitable for the spherical stretching deformation of the optical thin film.

[0040] (4) The laser emitting element 201 and the DOE optical element 202 are combined using a high-power laser and a diffraction beam splitter. For example... Figure 4 As shown, a diffraction beam splitter divides a collimated beam into multiple beams arranged in two dimensions. Each beam retains its original characteristics and exits at a different angle. A diffraction beam splitter is essentially a grating structure, and its exit angles satisfy the grating equations. Energy distribution among the outputs can be achieved through binary or multi-element diffraction unit structures.

[0041] The laser 3D bonding heating method includes the following steps:

[0042] S1. Measure the absorption spectrum of the adhesive product 3 in the laboratory to obtain the absorption wavelength of the peak value, and then calculate the corresponding peak frequency.

[0043] In step S1, the process of measuring the absorption spectrum of the bonded product 3 is as follows: the continuous light emitted by the tungsten lamp passes through the entrance slit, then enters the collimating lens, and then is split by the grating. The separated monochromatic light passes through the collimating lens, then enters the exit slit, and then passes through the semi-transparent mirror to split the light into two beams. One beam enters the photodetector directly, and the other beam enters the contrast photodetector after passing through the bonded product 3. By moving the position of the exit slit and recording the position of the exit slit and the ratio of the two photodetectors, the absorption spectrum of the bonded product 3 is obtained.

[0044] S2. Set the frequency parameter of the laser generator to the peak frequency, and then irradiate the DOE component with the laser generator. The DOE optical element 202 converts the energy of the laser beam into a uniform distribution, thereby uniformly heating the entire bonding surface of the adhesive product 3. After heating, vacuum shaping begins for the next step of 3D bonding shaping.

[0045] In step S2, since the absorption spectrum of the adhesive product may have one or more peaks, the peak frequency is set according to the number of peaks. Determining whether the peak frequency consists of one frequency or multiple frequencies based on the absorption spectrum improves the heating effect.

[0046] Example 2

[0047] like Figure 5 As shown, a vacuum bonding lower cavity device includes a mounting base plate 101, a UVW platform 102, an adapter plate 103, lower fixture connecting columns, a lower cavity shell 104, and a lower cavity fixture assembly. The UVW platform 102 is disposed on the upper side of the mounting base plate 101, and the adapter plate 103 is disposed on the upper side of the UVW platform 102. The adapter plate 103 is connected to the lower cavity fixture assembly through the lower cavity shell 104 via four lower fixture connecting columns. The height of the lower cavity fixture assembly is adjusted by raising and lowering the UVW platform 102.

[0048] Furthermore, a lower cavity bellows 109 is provided on the outer periphery of the lower fixture connecting column. Sealing rings are provided on the upper and lower sides of the lower cavity bellows 109, and a sealing ring is provided on the upper side of the lower cavity shell 104, which serves as a sealing function.

[0049] Next, the lower cavity fixture assembly includes a lower cavity fixture base plate 105, a lower cavity heating mounting plate 106, and a lower fixture 107. The lower cavity fixture base plate 105 is provided with the lower cavity heating mounting plate 106 on its upper side. The lower cavity heating mounting plate 106 has a first hollow structure in the middle. The first hollow structure is provided with the laser 3D bonding heating system as described in Embodiment 1. The lower cavity heating plate is provided with the lower fixture 107 on its upper side. The lower fixture 107 has a second hollow structure in the middle that matches the first hollow structure. The first hollow structure and the second hollow structure form a space for laser heating.

[0050] Furthermore, the lower fixture 107 is provided with vacuum adsorption holes, which are connected to a vacuum generator through pipes to realize the vacuum adsorption of the bonded product 3 by the lower fixture.

[0051] In this embodiment, the vacuum bonding lower cavity device further includes a temperature measuring device 111, which is disposed on the lower fixture 107 near the second hollow structure to monitor the temperature of the bonded product 3. Further, the temperature measuring device is a high-temperature sensor.

[0052] In other embodiments, the vacuum bonding lower cavity device includes a plurality of temperature measuring devices 111, which are evenly distributed on the lower fixture 107 near the second hollow structure to monitor the temperature at different locations of the bonded product 3 to ensure its temperature rise uniformity.

[0053] A column support 108 is provided between the mounting base plate 101 and the lower cavity shell 104. An air suction hole is provided in the middle of the lower cavity shell 104. The lower cavity shell 104 is connected to a vacuum generating device through a vacuum extraction pipe 110 to achieve vacuuming of the entire cavity.

[0054] Applying the aforementioned vacuum bonding lower chamber device to vacuum bonding equipment makes the heating of the vacuum bonding equipment more precise and uniform, with higher thermal efficiency, achieving a large-area heating effect.

[0055] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention can have various modifications and variations. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A vacuum lower cavity device for vacuum bonding, characterized in that, It includes a lower cavity fixture assembly, which includes a lower cavity fixture base plate, a lower cavity heating mounting plate, and a lower fixture. The lower cavity heating mounting plate is disposed on the upper side of the lower cavity fixture base plate. A first hollow structure is disposed in the middle of the lower cavity heating mounting plate. A laser 3D bonding heating system is disposed inside the first hollow structure. The lower fixture is disposed on the upper side of the lower cavity heating mounting plate. A second hollow structure matching the first hollow structure is disposed in the middle of the lower fixture. The first hollow structure and the second hollow structure form a space for laser heating. The laser 3D bonding heating system includes: Laser emitting element, used to emit a high-energy laser beam to laser heat the bonded product; DOE optical elements, selected from one of flat-top beam generators, beam homogenizers, ring generators, and diffraction beam splitters, are used to convert the energy of a laser beam generated by a laser emitting element into a uniform distribution of a circle, square, strip, concentric ring, or two-dimensional dot matrix. The laser 3D bonding heating method using the laser 3D bonding heating system includes the following steps: 1) Measuring the absorption spectrum of the bonded product to obtain the absorption wavelength of the peak value, and then calculating the corresponding peak frequency; 2) Setting the frequency parameter of the laser generator to the peak frequency, and then irradiating the DOE component with the laser generator. The DOE optical element converts the energy of the laser beam into a uniform distribution, thereby uniformly heating the entire bonding surface of the bonded product. After heating, vacuum shaping begins for the next step of 3D bonding shaping. The process of measuring the absorption spectrum of the bonded product is as follows: The continuous light emitted by the tungsten lamp passes through the entrance slit, then enters the collimating lens, and then is split by the grating. The separated monochromatic light passes through the collimating lens, then enters the exit slit, and then passes through the semi-transparent mirror to split the light into two beams. One beam directly enters the photodetector, and the other beam enters the contrast photodetector after passing through the bonded product. The position of the exit slit is moved, and the position of the exit slit and the ratio of the two photodetectors are recorded to obtain the absorption spectrum of the bonded product. The lower fixture is equipped with multiple temperature measuring devices to monitor the temperature at different locations of the bonded product.

2. The vacuum lower cavity device for vacuum bonding according to claim 1, characterized in that, The emission band of the laser emitting element is the maximum absorption peak or a combination of multiple peak values ​​of the adhesive product.

3. The vacuum lower cavity device for vacuum bonding according to claim 1, characterized in that, The peak frequency consists of one or more frequencies.

4. The vacuum lower cavity device for vacuum bonding according to claim 1, characterized in that, It also includes a mounting base plate, a UVW platform, an adapter plate, lower fixture connecting columns, and a lower cavity shell. The UVW platform is located on the upper side of the mounting base plate, and an adapter plate is located on the upper side of the UVW platform. The adapter plate is connected to the lower cavity fixture assembly through four lower fixture connecting columns passing through the lower cavity shell.

5. A vacuum bonding device, characterized in that, It includes a vacuum lower chamber device for vacuum bonding as described in any one of claims 1 to 4.

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