Semi-automatic gluing apparatus and gluing method

Abstract

This invention discloses a semi-automatic adhesive bonding equipment and method, relating to the field of adhesive product manufacturing technology. It includes: a conveying mechanism capable of conveying release paper on which adhesive strips are evenly spaced; an adsorption mechanism capable of conveying the adhesive strips to an adsorption station, where the adsorption mechanism adsorbs the adhesive strips upwards; an adhesive platform capable of placing the adhesive strips onto a substrate after the adsorption mechanism moves to the adsorption station; and a rolling mechanism with rollers that roll the upper surface of the adhesive strips as the adsorption mechanism moves from the adsorption station to the adsorption station. The adhesive strips are adsorbed and transferred using a negative pressure adsorption method with a blower. The adhesive strips are pressed onto the substrate with appropriate pressure using rollers, resulting in a uniform and bubble-free bond between the substrate and the adhesive strips after rolling.

Description

Technical Field

[0001] This invention relates to the field of adhesive product manufacturing technology, and in particular to a semi-automatic adhesive bonding equipment and adhesive bonding method. Background Technology

[0002] Adhesive products consist of a substrate at the bottom and an adhesive strip at the top. Traditional adhesive bonding methods involve manual pasting, which suffers from problems such as inaccurate positioning, large errors, and uneven adhesion. To solve these problems, existing technologies use automatic adhesive bonding machines to bond the adhesive strips, employing positioning mechanisms to reduce bonding errors and improve adhesion uniformity. However, air bubbles can still appear between the adhesive strip and the substrate after bonding, affecting the quality of the final product.

[0003] Therefore, how to provide an adhesive bonding device that can improve the uniformity of adhesive bonding and avoid the generation of air bubbles is a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0004] The purpose of this invention is to provide a semi-automatic adhesive bonding device and method to solve the problems existing in the prior art.

[0005] To achieve the above objectives, the present invention provides the following solution: The present invention provides a semi-automatic adhesive bonding device, comprising: A conveying mechanism capable of conveying release paper, wherein adhesive strips are evenly spaced on the release paper; An adsorption mechanism is slidably mounted on a first slide rail and can slide horizontally between an adsorption station and an adhesive station. A conveying mechanism can convey the adhesive strip to the adsorption station, and the adsorption mechanism can adsorb the adhesive strip upward at the adsorption station. An adhesive bonding platform is provided adjacent to the conveying mechanism. A substrate is arranged on the adhesive bonding platform corresponding to the adhesive bonding station. When the adsorption mechanism adsorbs the adhesive strip and moves it to the adhesive bonding station, the adsorption mechanism can place the adhesive strip on the substrate. A rolling mechanism is provided on the adsorption mechanism and located near the front end of the adsorption mechanism. The rolling mechanism has rollers, and when the adsorption mechanism moves from the adhesive station to the adsorption station, the rollers can roll the upper surface of the adhesive strip.

[0006] Furthermore, the conveying mechanism includes: Output wheel, with one end of the isolation paper wound around the output wheel; The conveyor rollers are multiple, and the other end of the release paper is sequentially wound around the multiple conveyor rollers. The adsorption station is located between two adjacent conveyor rollers. A collection wheel, with the other end of the release paper wrapped around it.

[0007] Furthermore, the adsorption mechanism includes: An adsorption plate, wherein a plurality of air inlet holes are evenly provided on the lower surface of the adsorption plate, and the upper end of the air inlet holes is connected to an exhaust fan; A cylinder, with its output end facing downwards and fixedly connected to the adsorption plate, is fixedly connected to a sliding connector, which is slidably connected to the first slide rail. A slide rail track is provided on the first slide rail, and the slide rail track can drive the cylinder and the adsorption plate to slide horizontally between the adsorption station and the adhesive station through the sliding connector.

[0008] Furthermore, the rolling mechanism includes: Mounting plate, which is vertically mounted on the upper surface of the adsorption plate and positioned near the front end of the adsorption plate; A horizontal plate, which is fixedly disposed on the outer side of the mounting plate; A telescopic motor, the output end of which is fixedly connected to the lower surface of the horizontal plate, the outer shell of which is fixedly mounted on the base plate, the roller is mounted on the lower surface of the base plate, and both the base plate and the roller are located outside the adsorption plate and close to the front end of the adsorption plate. A pressure sensor is disposed between the roller and the base plate, and the pressure sensor is capable of sensing the downward pressure of the roller on the rubber strip.

[0009] Furthermore, it also includes: An infrared locator is disposed between the conveying mechanism and the adhesive platform. The infrared locator and the slide rail track are both electrically connected to the controller. When the front or rear end of the adsorption plate moves directly above the infrared locator, the infrared locator sends a signal to the controller, and the controller can control the slide rail track to stop. A camera is located above the adhesive platform and is slidably connected to a second slide rail. The camera is communicatively connected to the controller and is capable of detecting whether a substrate is arranged on the adhesive platform.

[0010] The present invention also provides a semi-automatic adhesive bonding method, which, using the semi-automatic adhesive bonding equipment, includes the following steps: S1: Determine the output distance of the cylinder and the output distance of the telescopic motor during adhesive bonding based on the preset roller pressure; S2: The conveyor rollers deliver the adhesive strips to the adsorption station. The adsorption plate moves down to adsorb the adhesive strips and then moves up to reset. The operator places the substrate at the adhesive station on the adhesive platform. S3: The slide rail track drives the adsorption plate from the adsorption station to the adhesive station. When the front end of the adsorption plate reaches the sensing point of the infrared sensor, the infrared sensor sends a signal to the controller. The controller controls the slide rail track to stop and at the same time controls the camera to start and slide back and forth along the second slide rail once to confirm whether there is a substrate at the adhesive station. S4: When the camera confirms that there is a substrate at the adhesive bonding station, the camera sends a signal to the controller, and the controller controls the slide rail to start, and the slide rail to move the adsorption plate to the adhesive bonding station. S5: The cylinder outputs according to the output distance determined by S1 and drives the adsorption plate to move down. The rubber strip comes into contact with the substrate, the blower is turned off, the rubber strip separates from the adsorption plate and is laid flat on the substrate accordingly. S6: The telescopic motor outputs the output distance confirmed in S1 and drives the base plate and rollers to move down. The slide rail track drives the adsorption plate and rollers to move from the adhesive station to the adsorption station. During the movement, the rollers roll from one end of the adhesive strip to the other end with a preset roller pressure. When the rear end of the adsorption plate moves to the sensing point of the infrared sensor, the infrared sensor sends a signal to the controller. The controller controls the slide rail track to stop. At this time, the rollers separate from the adhesive strip, the adhesive strip is bonded to the substrate, and the cylinder and telescopic motor are reset. S7: After 0.5s, the controller starts the slide rail track, which drives the adsorption plate to the adsorption station.

[0011] Further, step S1 specifically involves using an adsorption plate to adsorb the adhesive strip sample and moving it to the adhesive bonding station via a sliding track. A substrate sample is placed on the adhesive bonding platform corresponding to the adhesive bonding station. A cylinder drives the adsorption plate downwards until the adhesive strip sample contacts the substrate sample, and the cylinder's output distance is recorded. The sliding track moves the adsorption plate towards the adsorption station and moves the roller to any point above the adhesive strip sample. A telescopic motor drives the adsorption plate downwards until the roller presses down on the adhesive strip sample and the pressure value detected by the pressure sensor reaches the preset roller pressure. The telescopic motor's output distance is recorded. The cylinder and telescopic motor are reset, the substrate sample is removed, and the sliding track moves the adsorption plate to the adsorption station.

[0012] Preferably, the preset roller pressure is 0.15MPa-0.35MPa.

[0013] Furthermore, in step S3, when the camera confirms that there is no substrate at the adhesive bonding station, the camera sends a signal to the controller. An alarm is installed at the adhesive bonding platform. The controller sends a signal through the alarm and controls the camera to start and slide back and forth along the second slide rail once again after 5 seconds to confirm whether there is a substrate at the adhesive bonding station.

[0014] Furthermore, the camera is a CCD camera.

[0015] The present invention discloses the following technical effects: 1. This application uses a negative pressure adsorption method with an induced draft fan to adsorb and transfer the adhesive strip, and uses an infrared sensor for assisted positioning. This allows the adhesive strip to be accurately moved above and placed on the substrate with high precision and small error. At the same time, the adhesive strip and the substrate are pressed together by rollers, which can press the adhesive strip onto the substrate with appropriate pressure. After pressing, the substrate and the adhesive strip are evenly bonded without air bubbles.

[0016] 2. The adhesive strip uses release paper as a carrier. One end of the release paper is wrapped around the output wheel, and the other end is wrapped around the collection wheel, which allows the release paper to be reused.

[0017] 3. Since the substrate is fed manually, this application uses a camera to detect whether there is a substrate on the adhesive platform before bonding. This improves safety and prevents the adhesive strip from being applied without proper bonding, thus avoiding material waste.

[0018] 4. This application can determine the output distance of the cylinder and the output distance of the telescopic motor during adhesive bonding based on the preset roller pressure, and roll the adhesive strip with the preset roller pressure to achieve the technical effect of uniform adhesion and no air bubbles after the adhesive strip is bonded to the substrate. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the structure of the release paper and adhesive strip; Figure 3 This is a schematic diagram of the roller pressing mechanism. The components include: 1. release paper; 2. adhesive strip; 3. first slide rail; 4. adhesive platform; 5. substrate; 6. roller; 7. output wheel; 8. conveyor roller; 9. collecting wheel; 10. adsorption plate; 11. cylinder; 12. slide rail track; 13. mounting plate; 14. cross plate; 15. telescopic motor; 16. pressure sensor; 17. infrared sensor; 18. camera; 19. second slide rail; and 20. base plate. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0023] Example 1 Reference Figures 1-3 This invention provides a semi-automatic adhesive bonding device. The conveying mechanism transports release paper 1, which is a material used to protect adhesive strips 2. It typically functions to prevent adhesion, protect the surface of the adhesive strips 2, and maintain cleanliness. In this embodiment, a transparent, smooth strip-shaped plastic sheet is used as the release paper 1. Adhesive strips 2 are evenly spaced on the release paper 1. Figure 2 As shown.

[0024] The adsorption mechanism includes: an adsorption plate 10, with multiple air inlets evenly distributed on the lower surface of the adsorption plate 10, the upper end of which is connected to a blower; a cylinder 11, the output end of which faces downward and is fixedly connected to the adsorption plate 10, the cylinder 11 being fixedly connected to a sliding connector, the sliding connector being slidably connected to a first slide rail 3, the first slide rail 3 having an upper slot and a lower slot, the sliding connector having a locking element that can be locked into the upper and lower slots from both the upper and lower directions respectively; and a slide rail track 12 provided on the first slide rail 3, the slide rail track 12 being able to drive the cylinder 11 and the adsorption plate 10 to slide horizontally between the adsorption station and the adhesive station through the sliding connector.

[0025] like Figure 1 As shown, the conveying mechanism includes: an output wheel 7, with one end of the isolation paper 1 wound around the output wheel 7; three conveying rollers 8 arranged in an L-shape, with the isolation paper 1 taut and wound around the three conveying rollers 8 in sequence, and the adsorption station located between two conveying rollers 8 on the same horizontal plane; and a collection wheel 9, with the other end of the isolation paper 1 wound around the collection wheel 9, which enables the isolation paper 1 to be reused.

[0026] The adhesive platform 4 is arranged adjacent to the conveying mechanism, with the conveying mechanism on the left and the adhesive platform 4 on the right, and the conveying mechanism and the adhesive platform 4 are roughly on the same straight line to facilitate the arrangement of the adsorption station and the adhesive station in a straight line. A substrate 5 is arranged on the adhesive platform 4 corresponding to the adhesive station. A positioning area can be set on the adhesive platform 4. The operator only needs to place the substrate 5 in the positioning area. When the adsorption mechanism adsorbs the adhesive strip 2 and moves it to the adhesive station, the adsorption mechanism can place the adhesive strip 2 on the substrate 5 accordingly. A roller pressing mechanism is mounted on the adsorption mechanism and positioned near its front end. The roller pressing mechanism includes a roller 6, which presses the upper surface of the adhesive strip 2 as the adsorption mechanism moves from the adhesive application station to the adsorption station. The roller pressing mechanism comprises: a mounting plate 13, vertically mounted on the upper surface of the adsorption plate 10 and positioned near its front end; a horizontal plate 14, fixedly mounted on the outer side of the mounting plate 13; a telescopic motor 15, whose output end is fixedly connected to the lower surface of the horizontal plate 14, and whose housing is fixedly mounted on a base plate 20; the roller 6 is mounted on the lower surface of the base plate 20; both the base plate 20 and the roller 6 are located outside the adsorption plate 10 and near its front end; and a pressure sensor 16, positioned between the roller 6 and the base plate 20, capable of sensing the downward pressure exerted by the roller 6 on the adhesive strip 2.

[0027] like Figure 1 As shown, this embodiment also includes: an infrared positioner, which is disposed between the conveying mechanism and the adhesive platform 4. Both the infrared positioner and the slide rail track 12 are electrically connected to the controller. When the front or rear end of the adsorption plate 10 moves directly above the infrared positioner, the infrared positioner sends a signal to the controller, which can then control the slide rail track 12 to stop; and a camera 18, which is a CCD camera. The CCD camera 18 is a camera that uses a CCD sensor. Its main function is to convert optical signals into analog current signals, which are then amplified and converted from analog to digital to achieve image acquisition, storage, transmission, processing, and reproduction. The CCD camera 18 features small size, light weight, low power consumption, low operating voltage, shock and vibration resistance, stable performance, long lifespan, high sensitivity, low noise, large dynamic range, fast response speed, self-scanning function, small image distortion, and no image retention. The camera 18 is located above the adhesive platform 4 and is slidably connected to the second slide rail 19. The camera 18 is connected to the controller and can detect whether the substrate 5 is arranged on the adhesive platform 4.

[0028] The following describes a semi-automatic adhesive bonding method using the aforementioned adhesive bonding equipment, including the following steps: S1: Determine the output distance of cylinder 11 and telescopic motor 15 during adhesive bonding based on the preset roller pressure. In this embodiment, the preset roller pressure is 0.15 MPa. Use adsorption plate 10 to adsorb the adhesive strip 2 sample and move it to the adhesive bonding station via slide rail 12. Place the substrate 5 sample on the adhesive bonding platform 4 corresponding to the adhesive bonding station. Cylinder 11 drives adsorption plate 10 to move down until the adhesive strip 2 sample contacts the substrate 5 sample. Record the output distance of cylinder 11. Slide rail 12 drives adsorption plate 10 to move towards the adsorption station and moves roller 6 to any point above the adhesive strip 2 sample. Telescopic motor 15 drives adsorption plate 10 to move down until roller 6 presses down on the adhesive strip 2 sample and the pressure value detected by pressure sensor 16 reaches the preset roller pressure. Record the output distance of telescopic motor 15. Cylinder 11 and telescopic motor 15 reset, remove the substrate 5 sample, and slide rail 12 drives adsorption plate 10 to move to the adsorption station.

[0029] S2: The conveyor roller 8 conveys the adhesive strip 2 to the adsorption station. The adsorption plate 10 moves down and generates negative pressure through the blower to adsorb the adhesive strip 2. After adsorbing the adhesive strip 2, the adsorption plate 10 moves up and resets. The substrate 5 is placed manually at the adhesive station of the adhesive platform 4. S3: The slide rail track 12 drives the adsorption plate 10 from the adsorption station to the adhesive station. When the front end of the adsorption plate 10 reaches the sensing point of the infrared sensor 17, the infrared sensor 17 sends a signal to the controller. The controller controls the slide rail track 12 to stop and simultaneously controls the camera 18 to start and slide back and forth along the second slide rail 19 once to confirm whether there is a substrate 5 at the adhesive station. When the camera 18 confirms that there is no substrate 5 at the adhesive station, the camera 18 sends a signal to the controller. An alarm is set at the adhesive platform 4. The controller sends a signal through the alarm and controls the camera 18 to start and slide back and forth along the second slide rail 19 once again after 5 seconds to confirm whether there is a substrate 5 at the adhesive station.

[0030] S4: When camera 18 confirms the presence of substrate 5 at the adhesive bonding station, camera 18 sends a signal to the controller. The controller then controls the slide rail 12 to start, which moves the adsorption plate 10 to the adhesive bonding station. During this movement, when the rear end of the adsorption plate 10 reaches the sensing point of the infrared sensor 17, the infrared sensor 17 sends a signal to the controller. The controller then controls the slide rail 12 to stop briefly (approximately 0.2 seconds). At this time, the distance between the rear end of the adsorption plate 10 and the adhesive bonding station is fixed and can be pre-input into the controller. After the slide rail 12 restarts, the controller controls it to move along a fixed distance to precisely move the adhesive strip 2 above the substrate 5. The reason for not using the front end of the adsorption plate 10 as a reference point is that the front end of the adsorption plate 10 requires a roller pressing mechanism, and the corresponding wiring and other structures may affect the sensing accuracy of the infrared sensor 17. The rear end of the adsorption plate 10, however, has no other structures, and its flat rear surface allows the infrared sensor 17 to accurately sense the substrate, thus ensuring the docking accuracy between the adhesive strip 2 and the substrate 5. S5: When the adsorption plate 10 moves above the adhesive station, the cylinder 11 outputs according to the output distance determined by S1 and drives the adsorption plate 10 to move down. The adhesive strip 2 comes into contact with the substrate 5, the blower is turned off, the adhesive strip 2 separates from the adsorption plate 10 and is laid flat on the substrate 5 accordingly. S6: The telescopic motor 15 outputs the distance confirmed in S1 and drives the base plate 20 and roller 6 to move downwards. The slide rail track 12 drives the adsorption plate 10 and roller 6 to move from the adhesive station to the adsorption station. It should be noted that the adhesive strip 2 has adhesive force at its bottom. Therefore, after the adhesive strip 2 separates from the adsorption plate 10, the adhesive strip 2 can pre-bond with the substrate 5 by its own adhesive force. The lower surface of the adsorption plate 10 is smooth, and its adsorption force on the adhesive strip 2 comes from negative pressure. Therefore, during the movement, the lower surface of the adsorption plate 10 will not drive the adhesive strip 2 to move, nor will it affect the bonding quality between the adhesive strip 2 and the substrate 5. During the movement, the roller 6 rolls the adhesive strip 2 from one end to the other with a preset roller pressure. Figure 1 (From right to left) When the rear end of the adsorption plate 10 moves to the sensing point of the infrared sensor, the roller has completed the rolling operation of the adhesive strip 2 and the substrate 5 and separated from the adhesive strip 2. The distance between the infrared sensor and the adhesive station can be flexibly set according to the length of the adhesive strip 2. The infrared sensor 17 sends a signal to the controller, and the controller controls the slide rail track 12 to stop, and the cylinder 11 and the telescopic motor 15 to reset upwards. S8: After 0.5s, the controller starts the slide rail track 12, which drives the adsorption plate 10 to the adsorption station to prepare for the next adsorption operation of the adhesive strip 2.

[0031] Example 2 The difference between this embodiment and Embodiment 1 is that the preset roller pressure is 0.2 MPa.

[0032] Example 3 The difference between this embodiment and Embodiment 1 is that the preset roller pressure is 0.25 MPa.

[0033] Example 4 The difference between this embodiment and Embodiment 1 is that the preset roller pressure is 0.3 MPa.

[0034] Example 5 The difference between this embodiment and Embodiment 1 is that the preset roller pressure is 0.35 MPa.

[0035] Comparative Example 1 The difference between Comparative Example 1 and Example 1 is that the preset roller pressure is 0.13 MPa.

[0036] Comparative Example 2 The difference between Comparative Example 2 and Example 1 is that the preset roller pressure is 0.37 MPa.

[0037] The adhesive methods disclosed in Examples 1-5, Comparative Examples 1 and 2 were used to bond 100 sets of adhesive strips 2 and substrates 5. The air bubbles after the adhesive strips 2 and substrates 5 were observed and recorded. The results are shown in the table below.

[0038] The results in the table above show that, in Examples 1-5, the bonding effect between the adhesive strip 2 and the substrate 5 is best when the preset roller pressure is 0.25 MPa, resulting in uniform bonding and 100% bubble-free adhesion. When the preset roller pressure is below 0.15 MPa, a large number of products with bubble problems and uneven bonding appear after the adhesive strip 2 is bonded to the substrate 5. When the preset roller pressure is above 0.35 MPa, there are no bubbles after the adhesive strip 2 is bonded to the substrate 5, but the bonding of the substrate 5 is uneven, and the thickness varies in different areas after bonding. When the preset roller pressure is between 0.15 MPa and 0.35 MPa, it can be ensured that the number of products with bubble problems does not exceed 5%, and the number of bubbles does not exceed 2.

[0039] In the description of this invention, it should be understood that the terms "longitudinal", "lateral", "up", "down", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this invention, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0040] The embodiments described above are merely preferred embodiments of the present invention and are not intended to limit the scope of the present invention. Various modifications and improvements made by those skilled in the art to the technical solutions of the present invention without departing from the spirit of the present invention should fall within the protection scope defined by the claims of the present invention.

Claims

1. A semi-automatic gluing apparatus, characterized in that, include: A conveying mechanism capable of conveying a release paper (1), wherein adhesive strips (2) are evenly spaced on the release paper (1). The adsorption mechanism is slidably disposed on the first slide rail (3) and can slide horizontally between the adsorption station and the adhesive station. The conveying mechanism can convey the adhesive strip (2) to the adsorption station. The adsorption mechanism can adsorb the adhesive strip (2) upward at the adsorption station. The adhesive platform (4) is arranged adjacent to the conveying mechanism. A substrate (5) is arranged on the adhesive platform (4) corresponding to the adhesive station. When the adsorption mechanism adsorbs the adhesive strip (2) and moves it to the adhesive station, the adsorption mechanism can place the adhesive strip (2) on the substrate (5). A roller pressing mechanism is provided on the adsorption mechanism and is located near the front end of the adsorption mechanism. The roller pressing mechanism has a roller (6). When the adsorption mechanism moves from the adhesive station to the adsorption station, the roller (6) can press the upper surface of the adhesive strip (2). The conveying mechanism includes: Output wheel (7), one end of the isolation paper (1) is wrapped around the output wheel (7); The conveyor rollers (8) are multiple, and the other end of the release paper (1) is sequentially wound around the multiple conveyor rollers (8). The adsorption station is located between two adjacent conveyor rollers (8). The other end of the isolation paper (1) is wrapped around the collection wheel (9); The adsorption mechanism includes: The adsorption plate (10) has a plurality of air inlet holes evenly provided on its lower surface, and the upper end of the air inlet holes is connected to the blower. A cylinder (11) is provided with its output end facing downward and fixedly connected to the adsorption plate (10). The cylinder (11) is fixedly connected to a sliding connector, which is slidably connected to the first slide rail (3). A slide rail track (12) is provided on the first slide rail (3). The slide rail track (12) can drive the cylinder (11) and the adsorption plate (10) to slide horizontally between the adsorption station and the adhesive station through the sliding connector. The roller pressing mechanism includes: Mounting plate (13), which is vertically disposed on the upper surface of the adsorption plate (10) and close to the front end of the adsorption plate (10); A horizontal plate (14) is fixedly disposed on the outer side of the mounting plate (13); Telescopic motor (15), the output end of the telescopic motor (15) is fixedly connected to the lower surface of the horizontal plate (14), the outer shell of the telescopic motor (15) is fixedly set on the base plate (20), the roller (6) is installed on the lower surface of the base plate (20), the base plate (20) and the roller (6) are both located outside the adsorption plate (10) and close to the front end of the adsorption plate (10); Pressure sensor (16) is disposed between the roller (6) and the base plate (20). The pressure sensor (16) can sense the downward pressure of the roller (6) on the rubber strip (2). Also includes: An infrared locator is disposed between the conveying mechanism and the adhesive platform (4). The infrared locator and the slide rail track (12) are electrically connected to the controller. When the front end or rear end of the adsorption plate (10) moves directly above the infrared locator, the infrared locator sends a signal to the controller, and the controller can control the slide rail track (12) to stop. The camera (18) is located above the adhesive platform (4) and is slidably connected to the second slide rail (19). The camera (18) is communicatively connected to the controller. The camera (18) can detect whether a substrate (5) is arranged on the adhesive platform (4).

2. A semi-automatic gluing method, characterized in that, The application of the semi-automatic adhesive device according to claim 1 includes the following steps: S1: Determine the output distance of the cylinder (11) and the output distance of the telescopic motor (15) during adhesive bonding based on the preset roller pressure; S2: The conveyor roller (8) delivers the adhesive strip (2) to the adsorption station. The adsorption plate (10) moves down to adsorb the adhesive strip (2). After adsorbing the adhesive strip (2), it moves up to reset. The person places the substrate (5) at the adhesive station on the adhesive platform (4). S3: The slide rail track (12) drives the adsorption plate (10) to move from the adsorption station to the adhesive station. When the front end of the adsorption plate (10) reaches the sensing point of the infrared sensor (17), the infrared sensor (17) sends a signal to the controller. The controller controls the slide rail track (12) to stop and simultaneously controls the camera (18) to start and slide back and forth along the second slide rail (19) once to confirm whether there is a substrate (5) at the adhesive station. S4: When the camera (18) confirms that there is a substrate (5) at the adhesive bonding station, the camera (18) sends a signal to the controller, and the controller controls the slide rail track (12) to start, and the slide rail track (12) drives the adsorption plate (10) to move to the adhesive bonding station. S5: The cylinder (11) outputs according to the output distance determined by S1 and drives the adsorption plate (10) to move down. The rubber strip (2) comes into contact with the substrate (5). The blower is turned off. The rubber strip (2) separates from the adsorption plate (10) and is laid flat on the substrate (5). S6: The telescopic motor (15) outputs according to the output distance confirmed in S1 and drives the base plate (20) and roller (6) to move down. The slide rail track (12) drives the adsorption plate (10) and roller (6) to move from the adhesive station to the adsorption station. During the movement, the roller (6) rolls from one end of the adhesive strip (2) to the other end with a preset roller pressure. When the rear end of the adsorption plate (10) moves to the sensing point of the infrared sensor, the infrared sensor (17) sends a signal to the controller. The controller controls the slide rail track (12) to stop. At this time, the roller (6) separates from the adhesive strip (2), the adhesive strip (2) is bonded to the substrate (5), and the cylinder (11) and telescopic motor (15) are reset. S7: After 0.5s, the controller controls the slide rail track (12) to start, and the slide rail track (12) drives the adsorption plate (10) to move to the adsorption station.

3. A semi-automatic gluing method according to claim 2, characterized in that Step S1 is specifically as follows: the adsorption plate (10) adsorbs the adhesive strip (2) sample and moves it to the adhesive station via the slide rail track (12). The substrate (5) sample is placed on the adhesive platform (4) corresponding to the adhesive station. The cylinder (11) drives the adsorption plate (10) to move down until the adhesive strip (2) sample contacts the substrate (5) sample. The output distance of the cylinder (11) is recorded. The slide rail track (12) drives the adsorption plate (10) to move towards the adsorption station and moves the roller (6) to any point above the adhesive strip (2) sample. The telescopic motor (15) drives the adsorption plate (10) to move down until the roller (6) presses down on the adhesive strip (2) sample and the pressure value detected by the pressure sensor (16) reaches the preset roller pressure. The output distance of the telescopic motor (15) is recorded. The cylinder (11) and the telescopic motor (15) are reset. The substrate (5) sample is removed. The slide rail track (12) drives the adsorption plate (10) to move to the adsorption station.

4. A semi-automatic gluing method according to claim 3, characterized in that The preset roller pressure is 0.15MPa-0.35MPa.

5. A semi-automatic gluing method according to claim 3, characterized in that, In step S3, when the camera (18) confirms that there is no substrate (5) at the adhesive bonding station, the camera (18) sends a signal to the controller. An alarm is set at the adhesive bonding platform (4). The controller sends a signal through the alarm and controls the camera (18) to start and slide back and forth along the second slide rail (19) once again after 5 seconds to confirm whether there is a substrate (5) at the adhesive bonding station.

6. A semi-automatic gluing method according to claim 3, characterized in that, The camera (18) is a CCD camera (18).

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