High-stable optical fiber active connector production curing furnace temperature control system
Patent Information
- Application Number
- CN202410391073.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-02
- Publication Date
- 2026-09-18
- Estimated Expiration
- 2044-04-02
AI Technical Summary
在这个过程,胶水的硬力无法释放,固化胶水硬力会导致光纤移动
[0018]In the actual curing process, due to the low initial temperature of the material and the high temperature of the oven during prolonged use, the oven and water tank are adjusted to the initial temperature regulation mode before the material comes into contact with the oven. This reduces the temperature difference between the material and the oven. The material is then heated to the curing temperature in the oven, and the oven and water tank are adjusted to the curing temperature regulation mode to cure the material. This avoids excessive temperature changes in the material after contact with the oven due to a large temperature difference, and also avoids directly curing the adhesive on the material surface at high temperatures. This helps prevent the adhesive on the material surface from failing to release its stress during the curing process, which could lead to fiber optic misalignment.
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Figure CN118192700B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of curing oven control technology, for example to a temperature control system for a curing oven used in the production of highly stable fiber optic active connectors. Background Technology
[0002] In the production of fiber optic connectors, the optical fiber and ceramic ferrule are bonded together using 353ND adhesive. After bonding, the 353ND adhesive needs to be cured in a heating oven. Existing ovens require rapidly raising the temperature to 110 degrees Celsius and maintaining this temperature for 20 minutes during the curing process. During this process, the adhesive's rigidity cannot be released, and this rigidity can cause the optical fiber to shift. Summary of the Invention
[0003] To provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. This summary is not intended as a general commentary, nor is it intended to identify key / important components or describe the scope of protection of these embodiments, but rather as a prelude to the detailed description that follows.
[0004] This disclosure provides a method, apparatus, air conditioner, and storage medium for controlling an air conditioner, so as to more accurately adjust the temperature of different areas and make the indoor temperature more consistent with the temperature set by the user.
[0005] A temperature control system for a curing oven used in the production of highly stable optical fiber active connectors, characterized in that it comprises:
[0006] An oven is used to heat materials.
[0007] The temperature measurement module, located in the oven, is used to measure the real-time temperature of the materials and the oven.
[0008] A water tank, connected to the oven, is used to supply water to the oven;
[0009] The temperature controller is electrically connected to the oven, temperature measurement module, and water tank. It adjusts the working mode of the oven and water tank to the initial temperature adjustment mode and the curing temperature adjustment mode according to the real-time temperature of the material and the oven, thereby regulating the oven temperature.
[0010] In one embodiment, adjusting the working mode of the oven and water tank to the initial temperature adjustment mode and the curing temperature adjustment mode based on the real-time temperature of the material and the oven includes: when the temperature difference between the material and the oven is less than or equal to the set temperature difference and the temperatures of both the material and the oven are greater than or equal to the set initial curing temperature, the temperature controller adjusts the working mode of the oven and water tank to the curing temperature adjustment mode, adjusting the oven temperature according to the change of the set temperature, thereby curing the material; otherwise, the temperature controller adjusts the working mode of the oven and water tank to the initial temperature working mode.
[0011] In one embodiment, when the oven and water tank are set to the initial temperature operating mode, the temperature difference between the material and the oven is first calculated. When the temperature difference between the material and the oven is greater than the set temperature, the temperature controller controls the oven and water tank to adjust the temperature of the oven and the material until the temperature difference between the material and the oven is less than or equal to the set temperature. When the temperature difference between the material and the oven is less than or equal to the set temperature, if the real-time temperature of the material and the oven is lower than the set initial curing temperature, the temperature controller controls the oven to heat the material until the temperature difference between the material and the oven is greater than or equal to the set initial curing temperature.
[0012] In one embodiment, the oven includes a heater and a baking plate. The baking plate is used to heat the material. The heater may or may not be in direct contact with the baking plate. When the temperature difference between the material and the oven is less than or equal to a set temperature and the real-time temperature of the material and the oven is less than a set initial curing temperature, if the real-time temperature of the material is less than a temperature threshold, the heater does not contact the baking plate. A water tank fills the oven with water until the water touches the baking plate. The heater is positioned in the water to heat the water, thereby heating the baking plate until the temperature of the material is greater than or equal to the temperature threshold. When the temperature difference between the material and the oven is less than or equal to a set temperature and the real-time temperature of the material and the oven is greater than or equal to a set initial curing temperature, the heater directly contacts the baking plate and heats the material until the material temperature is greater than or equal to the initial curing temperature.
[0013] In one embodiment, when the oven and water tank are in curing temperature regulation mode, the controller controls the oven and water tank to work together so that the oven temperature is maintained at the initial curing temperature and the maximum curing temperature for the set curing time.
[0014] In one embodiment, the initial curing temperature includes 80 degrees Celsius.
[0015] In one embodiment, the maximum curing temperature is 110 degrees Celsius.
[0016] In one embodiment, the set curing time includes 15 minutes.
[0017] The method, apparatus, air conditioner, and storage medium for controlling an air conditioner provided in this disclosure can achieve the following technical effects:
[0018] In the actual curing process, due to the low initial temperature of the material and the high temperature of the oven during prolonged use, the oven and water tank are adjusted to the initial temperature regulation mode before the material comes into contact with the oven. This reduces the temperature difference between the material and the oven. The material is then heated to the curing temperature in the oven, and the oven and water tank are adjusted to the curing temperature regulation mode to cure the material. This avoids excessive temperature changes in the material after contact with the oven due to a large temperature difference, and also avoids directly curing the adhesive on the material surface at high temperatures. This helps prevent the adhesive on the material surface from failing to release its stress during the curing process, which could lead to fiber optic misalignment.
[0019] The above general description and the description below are exemplary and illustrative only and are not intended to limit this application. Attached Figure Description
[0020] One or more embodiments are illustrated by way of example with reference to the accompanying drawings. These illustrations and drawings do not constitute a limitation on the embodiments. Elements having the same reference numerals in the drawings are shown as similar elements. The drawings are not to be scaled. And wherein:
[0021] Figure 1 This is a schematic diagram of a temperature control system for a curing oven used in the production of highly stable optical fiber active connectors, provided in an embodiment of this disclosure. Detailed Implementation
[0022] To provide a more detailed understanding of the features and technical content of the embodiments of this disclosure, the implementation of the embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. The accompanying drawings are for illustrative purposes only and are not intended to limit the embodiments of this disclosure. In the following technical description, for ease of explanation, several details are used to provide a full understanding of the disclosed embodiments. However, one or more embodiments may still be implemented without these details. In other cases, well-known structures and devices may be simplified in their depiction to simplify the drawings.
[0023] The terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this disclosure are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate for the embodiments of this disclosure described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.
[0024] Unless otherwise stated, the term "multiple" means two or more.
[0025] It should be noted that, unless otherwise specified, the embodiments and features described in the present disclosure can be combined with each other.
[0026] Reference Figure 1 A temperature control system for a curing oven used in the production of highly stable optical fiber active connectors, comprising:
[0027] Oven 01 is used to heat materials;
[0028] Temperature measurement module 02, located in oven 01, is used to measure the real-time temperature of the material and oven 01;
[0029] Water tank 03 is connected to oven 01 and is used to supply water to oven 01;
[0030] The temperature controller 04 is electrically connected to the oven 01, the temperature measurement module 02, and the water tank 03. It adjusts the working mode of the oven 01 and the water tank 03 to the initial temperature adjustment mode and the curing temperature adjustment mode according to the real-time temperature of the material and the oven 01, thereby regulating the temperature of the oven 01.
[0031] During the curing process, the oven heats the material to cure the adhesive on the surface of the material. At the same time, the temperature measurement module monitors the temperature of the oven in real time. If the temperature is too low, the temperature controller controls the oven to continue heating. If the temperature is too high, the temperature controller controls the water tank to supply water to the oven to cool it down, so that the oven temperature is always maintained at the curing temperature.
[0032] In the actual curing process, due to the low initial temperature of the material and the high temperature of the oven during prolonged use, the oven and water tank are adjusted to the initial temperature regulation mode before the material comes into contact with the oven. This reduces the temperature difference between the material and the oven. The material is then heated to the curing temperature in the oven, and the oven and water tank are adjusted to the curing temperature regulation mode to cure the material. This avoids excessive temperature changes in the material after contact with the oven due to a large temperature difference, and also avoids directly curing the adhesive on the material surface at high temperatures. This helps prevent the adhesive on the material surface from failing to release its stress during the curing process, which could lead to fiber optic misalignment.
[0033] In one embodiment, adjusting the working mode of the oven and water tank to the initial temperature adjustment mode and the curing temperature adjustment mode based on the real-time temperature of the material and the oven includes: when the temperature difference between the material and the oven is less than or equal to the set temperature difference and the temperatures of both the material and the oven are greater than or equal to the set initial curing temperature, the temperature controller adjusts the working mode of the oven and water tank to the curing temperature adjustment mode, adjusting the oven temperature according to the change of the set temperature, thereby curing the material; otherwise, the temperature controller adjusts the working mode of the oven and water tank to the initial temperature working mode.
[0034] In one embodiment, when the oven and water tank are in curing temperature regulation mode, the controller controls the oven and water tank to work together so that the oven temperature is maintained at the initial curing temperature and the maximum curing temperature for the set curing time.
[0035] In one embodiment, the initial curing temperature includes 80 degrees Celsius.
[0036] In one embodiment, the maximum curing temperature is 110 degrees Celsius.
[0037] In one embodiment, the set curing time includes 15 minutes.
[0038] When the temperature difference between the material and the oven is less than or equal to the set temperature difference, and the temperatures of both the material and the oven are greater than or equal to the set initial curing temperature, the surface material can be directly heated and cured. In this case, after maintaining the initial curing temperature for the set curing time, it is then heated to the highest curing temperature and maintained for the set curing time. For example, the material is heated to 80 degrees Celsius and cured for 15 minutes, then heated to 110 degrees Celsius and cured for another 15 minutes. This stepped heating and curing reduces the adhesive's stiffness, helping to prevent optical fiber migration.
[0039] In one embodiment, when the oven and water tank are set to the initial temperature operating mode, the temperature difference between the material and the oven is first calculated. When the temperature difference between the material and the oven is greater than the set temperature, the temperature controller controls the oven and water tank to adjust the temperature of the oven and the material until the temperature difference between the material and the oven is less than or equal to the set temperature. When the temperature difference between the material and the oven is less than or equal to the set temperature, if the real-time temperature of the material and the oven is lower than the set initial curing temperature, the temperature controller controls the oven to heat the material until the temperature difference between the material and the oven is greater than or equal to the set initial curing temperature.
[0040] By coordinating the water tank and the oven, when the temperature difference between the material and the oven exceeds the set temperature, if the oven temperature is high, water is supplied from the water tank to cool it down; if the material temperature is high, the oven temperature is increased by heating it. Once the temperature difference between the material and the oven is less than or equal to the set temperature, if the real-time temperature of both the material and the oven is lower than the set initial curing temperature, the oven is heated. This reduces the rate of temperature change in the material, resulting in less adhesive stiffness during heating, which helps prevent fiber optic migration.
[0041] In one embodiment, the oven includes a heater and a baking plate. The baking plate is used to heat the material. The heater may or may not be in direct contact with the baking plate. When the temperature difference between the material and the oven is less than or equal to a set temperature and the real-time temperature of the material and the oven is less than a set initial curing temperature, if the real-time temperature of the material is less than a temperature threshold, the heater does not contact the baking plate. A water tank fills the oven with water until the water touches the baking plate. The heater is positioned in the water to heat the water, thereby heating the baking plate until the temperature of the material is greater than or equal to the temperature threshold. When the temperature difference between the material and the oven is less than or equal to a set temperature and the real-time temperature of the material and the oven is greater than or equal to a set initial curing temperature, the heater directly contacts the baking plate and heats the material until the material temperature is greater than or equal to the initial curing temperature.
[0042] Considering that the initial temperature of the material may be too low, the heater does not contact the baking plate at this time. The baking plate is heated slowly by heating water and water bath heating, so that the temperature of the material slowly increases to the temperature threshold. When the temperature is greater than or equal to the temperature threshold, the heater is then used to directly contact the baking plate for heating. This prevents the material temperature from changing too suddenly and also helps to prevent the material temperature from changing too quickly, thereby reducing the hardness of the adhesive and helping to prevent optical fiber movement.
[0043] The foregoing description and accompanying drawings fully illustrate embodiments of this disclosure to enable those skilled in the art to practice them. Other embodiments may include structural, logical, electrical, procedural, and other changes. The embodiments represent only possible variations. Individual components and functions are optional unless explicitly required, and the order of operation may vary. Parts and features of some embodiments may be included in or replace parts and features of other embodiments. Moreover, the terminology used in this application is for describing embodiments only and is not intended to limit the claims. As used in the description of embodiments and claims, the singular forms “a,” “an,” and “the” are intended to equally include the plural forms unless the context clearly indicates otherwise. Similarly, the term “and / or” as used in this application means including one or more of the associated listed items and all possible combinations thereof. Additionally, when used in this application, the term "comprise" and its variations "comprises" and / or "comprising" refer to the presence of stated features, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof. Without further limitations, an element defined by the phrase "comprises a..." does not exclude the presence of other identical elements in the process, method, or apparatus that includes said element. In this document, each embodiment may focus on the differences from other embodiments, and similar or identical parts between embodiments can be referred to mutually. For methods, products, etc., disclosed in the embodiments, if they correspond to the method section disclosed in the embodiments, the relevant parts can be referred to the description of the method section.
[0044] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the embodiments of this disclosure. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.
Claims
1. A temperature control system for a curing oven used in the production of highly stable optical fiber active connectors, characterized in that, include: An oven is used to heat materials. The temperature measurement module, located in the oven, is used to measure the real-time temperature of the materials and the oven. A water tank, connected to the oven, is used to supply water to the oven; The thermostat, electrically connected to the oven, temperature measurement module, and water tank, adjusts the oven and water tank's operating modes to initial temperature adjustment mode and curing temperature adjustment mode based on the real-time temperatures of the material and the oven, thereby regulating the oven temperature. When the oven and water tank are in initial temperature mode, the temperature difference between the material and the oven is first calculated. If this temperature difference exceeds the set temperature, the thermostat controls the oven and water tank to adjust the oven and material temperatures until the temperature difference is less than or equal to the set temperature. If the real-time temperature of the material and oven is lower than the set curing initial temperature when the temperature difference is less than or equal to the set temperature, the thermostat controls the oven to heat the material until the real-time temperature of the material and oven is greater than or equal to the set curing initial temperature. The oven includes a heater and a baking plate. The baking plate is used to heat the material. The heater and baking plate may be in direct contact or not. When the temperature difference between the material and the oven is less than or equal to the set temperature and the real-time temperature of the material and oven is less than the set curing initial temperature, if the real-time temperature of the material is less than a temperature threshold, the heater and baking plate are not in contact. The process involves the water tank filling the oven with water until it touches the baking plate. A heater, positioned in the water, heats the water, thereby heating the baking plate until the material's temperature exceeds or equals a temperature threshold. When the temperature difference between the material and the oven is less than or equal to the set temperature, and the real-time temperature of both the material and the oven is greater than or equal to the set initial curing temperature, the heater directly contacts the baking plate and heats the material until its temperature exceeds or equals the initial curing temperature. When the temperature difference between the material and the oven exceeds the set temperature, if the oven temperature is high, water is supplied from the water tank to cool the oven; if the material temperature is high, the oven temperature is increased by heating the oven. The adjustment of the oven and water tank's operating mode to the initial temperature adjustment mode and the curing temperature adjustment mode based on the real-time temperature of the material and the oven includes: when the temperature difference between the material and the oven is less than or equal to the set temperature difference, and both the material and oven temperatures are greater than or equal to the set initial curing temperature, the temperature controller adjusts the oven and water tank's operating mode to the curing temperature adjustment mode, adjusting the oven temperature according to changes in the set temperature to cure the material; otherwise, the temperature controller adjusts the oven and water tank's operating mode to the initial temperature operating mode.
2. The system according to claim 1, characterized in that, When the oven and water tank are in curing temperature regulation mode, the controller controls the oven and water tank to maintain the oven temperature at the initial curing temperature and the maximum curing temperature for the set curing time.
3. The system according to claim 2, characterized in that, The initial curing temperature includes 80 degrees Celsius.
4. The system according to claim 3, characterized in that, The maximum curing temperature is 110 degrees Celsius.
5. The system according to claim 4, characterized in that, The set curing time includes 15 minutes.
Citation Information
Patent Citations
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