电路板及其制造方法
By embedding electronic components within an insulating substrate and utilizing a phase change material and an outer circuit layer for thermal conductivity, the problem of insufficient heat dissipation in embedded circuit boards is solved, achieving efficient vertical heat conduction and heat dissipation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- QING DING PRECISION ELECTRONICS HUAIAN CO LTD
- Filing Date
- 2022-12-12
- Publication Date
- 2026-07-17
AI Technical Summary
Existing embedded circuit boards cannot meet the increased heat dissipation requirements after a large number of electronic components are embedded, resulting in reduced reliability of electronic components.
Electronic components are embedded in an insulating substrate, and thermal conductivity is achieved between the first phase change material and the first outer circuit layer. The second phase change material and the grooves of the second outer circuit layer are arranged to form a heat dissipation zone, thereby improving the longitudinal thermal conductivity.
It improves the longitudinal thermal conductivity and heat dissipation area of electronic components, ensuring the normal operating temperature of electronic components within the insulating substrate and enhancing reliability.
Smart Images
Figure CN118201239B_ABST