A board surface cleaning device and method for intelligent processing of a circuit board

Abstract

The application relates to the field of circuit board processing, in particular to a board surface cleaning device and method for intelligent circuit board processing, which comprises a base, a controller is fixed on the base, and a fixed plate is also fixed on the base, characterized in that the board surface cleaning device and method for intelligent circuit board processing further comprise: a clamping mechanism arranged on the fixed plate, the clamping mechanism comprising a clamping assembly and symmetrically arranged clamping plates; a driving mechanism arranged on the fixed plate and connected with the clamping assembly, a spraying mechanism for washing the circuit board is further arranged on the fixed plate and connected with the clamping assembly, the spraying mechanism comprising a spraying assembly and a spray head, and symmetrically arranged limiting wheels are further fixed on the spraying assembly; an intermittent transmission assembly arranged on the fixed plate and connected with the driving mechanism and the spraying assembly, and a giving-way mechanism connected with the spraying assembly and the clamping assembly is arranged on the base.

Description

Technical Field

[0001] This invention relates to the field of circuit board processing, specifically to a board surface cleaning device and method for intelligent circuit board processing. Background Technology

[0002] The assembly of general electronic product PCBAs involves SMT+THT processes, including wave soldering, reflow soldering, manual soldering, and other soldering methods. Regardless of the soldering method, the assembly (electronic assembly) process is the main source of assembly contamination. Cleaning is a process of dissolving and removing soldering residues. The purpose of cleaning is to extend the product's lifespan by ensuring good surface resistance and preventing leakage.

[0003] There are several existing methods for cleaning circuit boards, including: water-based cleaning processes, semi-water-based cleaning processes, solvent cleaning processes, and no-clean processes.

[0004] In terms of water-based cleaning processes, water is used as the cleaning medium. To improve the cleaning effect, a small amount of surfactants, detergents, corrosion inhibitors, and other chemicals can be added to the water to remove contaminants from the board surface. After water-based cleaning, the water remaining on the board surface needs to be removed using an air gun. Some water will still remain in the gaps between electronic components after the cleaning process, so the board needs to be dried in an oven. However, during the cleaning process, the nozzle usually only rinses the board from a single angle, making it difficult to remove some contaminants remaining in the gaps. Furthermore, during the heating process, as the temperature rises, the remaining water will react with the flux to generate white residue, which may lead to short circuits on the board. Summary of the Invention

[0005] The purpose of this invention is to provide a board surface cleaning device and method for intelligent processing of circuit boards, so as to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] A board surface cleaning device for intelligent circuit board processing includes a base, a controller for controlling the working state of the device is fixed on the base, and symmetrically arranged fixing plates are also fixed on the base. The device further comprises:

[0008] A clamping mechanism is disposed on the fixed plate and arranged symmetrically. The clamping mechanism includes a clamping component and a symmetrically arranged clamping plate. The clamping component can fix the circuit board through the clamping plate.

[0009] A driving mechanism is disposed on the fixed plate and connected to the clamping assembly. The fixed plate is also provided with a spraying mechanism connected to the clamping assembly and used for rinsing the circuit board. The spraying mechanism includes a spraying assembly and a nozzle. The driving mechanism can drive the clamping plate to swing intermittently through the clamping assembly. The driving mechanism can also drive the spraying assembly to swing back and forth through the clamping assembly so that the nozzle swings in the opposite direction to the clamping plate. The spraying assembly is also fixed with symmetrically arranged limiting wheels.

[0010] An intermittent transmission assembly is disposed on the fixed plate and connected to the drive mechanism and the spray assembly. The drive mechanism can drive the spray assembly to move intermittently through the intermittent transmission assembly. A clearance mechanism is disposed on the base and connected to the spray assembly and the clamping assembly. The spray assembly drives the clearance mechanism to move through the limiting wheel, so as to drive the two clamping plates to move in a direction away from each other through the clamping assembly.

[0011] As a further embodiment of the present invention: the clamping assembly includes a first rotating rod rotatably mounted on the fixed plate, an inclined plate fixedly mounted on the first rotating rod, a support plate fixedly mounted on the inclined plate, a through groove connected to the spraying assembly on the support plate, an elastic support structure connected to the inclined plate on the fixed plate, the elastic support structure being fixedly connected to the clamping plate, and the first rotating rod being connected to the driving mechanism and the clearance mechanism.

[0012] As a further embodiment of the present invention: the elastic support structure includes a first sliding groove formed on the inclined plate and arranged symmetrically, a first sliding block is slidably installed in the first sliding groove, a spring is fixed in the first through groove and abuts against the first sliding block, the first sliding block is fixedly connected to the card plate and connected to the clearance mechanism.

[0013] As a further embodiment of the present invention: the driving mechanism includes a transmission rod rotatably mounted on the fixed plate, a turntable fixedly mounted on the transmission rod, and a meshing assembly disposed on the fixed plate and connected to the first rotating rod. A movable plate is fixed on the meshing assembly, and a slot is provided on the movable plate. A protrusion that engages with the slot is fixed on the turntable. The transmission rod is connected to the intermittent transmission assembly.

[0014] As a further embodiment of the present invention: the meshing assembly includes a guide rod fixedly mounted on the fixed plate, a guide sleeve movably mounted on the guide rod, and a rack plate fixedly mounted on the movable plate. A gear meshing with the rack plate is fixed on the first rotating rod. A first limiting rod is fixed on the guide sleeve and fixedly connected to the movable plate. A first limiting groove is provided on the guide sleeve to engage with the first limiting rod.

[0015] As a further embodiment of the present invention: the spray assembly includes a fixed rod fixedly mounted on the fixed plate, a limiting sleeve movably mounted on the fixed rod, a swing plate movably mounted on the limiting sleeve, a hollow rod fixedly mounted on the swing plate, the hollow rod being fixedly connected to the nozzle and engaging with the through groove, the limiting sleeve being fixedly connected to the limiting wheel and connected to the intermittent transmission assembly, a second limiting rod fixedly mounted on the fixed rod, and a second limiting groove being provided on the limiting sleeve to engage with the second limiting rod.

[0016] As a further embodiment of the present invention: the intermittent transmission assembly includes a driving wheel fixedly mounted on the transmission rod, a support rod rotatably mounted on the fixed plate, and a driven wheel fixedly mounted on the support rod and cooperating with the driving wheel. A guide groove is provided on the support rod, and a rhomboid block that engages with the guide groove is rotatably mounted on the limiting sleeve.

[0017] As a further embodiment of the present invention: the clearance mechanism includes a support sleeve movably mounted on the first rotating rod, a connecting rod hinged to the support sleeve and hinged to the first sliding block, and a movable sleeve movably mounted on the support sleeve. The fixed plate is provided with a limiting component connected to the fixed rod and symmetrically arranged. The limiting component is hinged with a hinge rod hinged to the movable sleeve. The limiting component cooperates with the limiting wheel.

[0018] As a further embodiment of the present invention: the limiting component includes a support plate fixedly installed on the fixed rod and arranged symmetrically, the support plate having a second sliding groove, a second sliding block being slidably installed in the second sliding groove, a limiting plate cooperating with the limiting wheel being fixed on the second sliding block, and the second sliding block being hinged to the hinge rod.

[0019] A method for using a board surface cleaning device for intelligent circuit board processing includes the following steps:

[0020] Step 1: Place the circuit board to be cleaned between the clamping plates and fix it in place with the help of the clamping components;

[0021] Step 2: The spray assembly is connected to the tank containing cleaning fluid through a conduit, and the cleaning fluid is continuously supplied into the spray assembly, thereby spraying it onto the circuit board through the nozzle;

[0022] Step 3: The drive mechanism works and drives the clamping component to swing back and forth. The clamping component also drives the spraying component to swing, thereby controlling the spray head to swing in the opposite direction to the clamping plate, so that the spraying angle of the spray head is constantly changed, so as to make the cleaning effect of the circuit board better.

[0023] Step 4: The drive mechanism will also drive the spray assembly to move intermittently along the length of the circuit board through the intermittent transmission component to thoroughly clean the circuit board. When the limit wheel and the clearance mechanism cooperate, the clearance mechanism will drive the two clamping plates to move in a direction away from each other through the clamping component, so that the side of the circuit board can also be cleaned.

[0024] Compared with the prior art, the beneficial effects of the present invention are as follows: The present application can continuously rinse the circuit board with cleaning fluid to achieve the effect of cleaning the circuit board. Before cleaning, the circuit board is placed between the clamping plates and fixed by the clamping component. At this time, the drive mechanism works and controls the circuit board to swing back and forth continuously through the clamping component. At the same time, the clamping component will also control the nozzle to swing continuously through the spraying component, and the swinging direction is opposite to that of the circuit board, thereby continuously changing the rinsing direction of the circuit board, so as to achieve a better cleaning effect. The drive mechanism will also control the spraying component to move intermittently through the intermittent transmission component, so that the nozzle moves intermittently along the length of the circuit board to ensure that the entire board surface is cleaned. When the limiting wheel moves to the position of cooperating with the clearance mechanism, the nozzle is located at the side end of the circuit board. The clearance mechanism moves and drives the clamping plate to move away from each other through the clamping component to ensure that the clamping part of the circuit board can also be cleaned. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of one embodiment of a board surface cleaning device for intelligent circuit board processing.

[0026] Figure 2 This is a schematic diagram of the first angle of one embodiment of a board surface cleaning device for intelligent processing of circuit boards.

[0027] Figure 3 This is a schematic diagram of the second angle of one embodiment of a board surface cleaning device for intelligent circuit board processing.

[0028] Figure 4 for Figure 3 A magnified schematic diagram of the structure at point A in the middle.

[0029] Figure 5 This is a schematic diagram of the clamping mechanism in one embodiment of a board surface cleaning device for intelligent circuit board processing.

[0030] Figure 6 This is a schematic diagram showing the connection relationship between the drive mechanism and the clamping mechanism in one embodiment of a board surface cleaning device for intelligent circuit board processing.

[0031] Figure 7 This is a schematic diagram showing the connection relationship between a portion of the clearance mechanism and the spraying mechanism in one embodiment of a board surface cleaning device for intelligent circuit board processing.

[0032] Figure 8 This is an exploded structural diagram of the spray mechanism and the rhomboid block in one embodiment of a board surface cleaning device for intelligent circuit board processing.

[0033] Figure 9 This is a schematic diagram showing the connection relationship between the clamping mechanism and the clearance mechanism in one embodiment of a board surface cleaning device for intelligent circuit board processing.

[0034] Figure 10 This is a partial exploded structural diagram of one embodiment of a board surface cleaning device for intelligent circuit board processing.

[0035] In the diagram: 1. Base; 2. Controller; 3. Fixed plate; 4. Transmission rod; 5. Turntable; 6. Movable plate; 7. Guide sleeve; 8. Guide rod; 9. Rack plate; 10. Gear; 11. Rotating rod No. 1; 12. Inclined plate; 13. Slide groove No. 1; 14. Sliding block No. 1; 15. Spring No. 1; 16. Clamping plate; 17. Support sleeve; 18. Connecting rod; 19. Movable sleeve; 20. Hinge rod; 21. Fixed rod; 22. Receiving plate; 23. Slide groove No. 2; 24. Sliding block No. 2; 25. Limiting plate; 26. Limiting sleeve; 27. Limiting wheel; 28. Swinging plate; 29. ​​Hollow rod; 30. Nozzle; 31. Rhomboid block; 32. Support plate; 33. Driving wheel; 34. Driven wheel; 35. Support rod; 36. Guide groove. Detailed Implementation

[0036] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0037] Furthermore, elements in this invention are referred to as being "fixed to" or "set on" another element, which may be directly on the other element or may also include an intervening element. When an element is considered to be "connected" to another element, it may be directly connected to the other element or may also include an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementations.

[0038] Please see Figures 1-10 In this embodiment of the invention, a board surface cleaning device for intelligent circuit board processing includes a base 1, on which a controller 2 for controlling the working state of the device is fixed, and symmetrically arranged fixing plates 3 are also fixed on the base 1. The device further includes:

[0039] A clamping mechanism is symmetrically arranged on the fixed plate 3. The clamping mechanism includes a clamping assembly and symmetrically arranged clamping plates 16. The clamping assembly can fix the circuit board via the clamping plates 16. The clamping assembly includes a first rotating rod 11 rotatably mounted on the fixed plate 3. An inclined plate 12 is fixedly mounted on the first rotating rod 11. A support plate 32 is fixed on the inclined plate 12. The support plate 32 has a through groove for connecting to the spray assembly. The fixed plate 3 is provided with a groove for connecting to the inclined plate 12. The elastic support structure is fixedly connected to the locking plate 16. The first rotating rod 11 is connected to the driving mechanism and the yielding mechanism. The elastic support structure includes a first sliding groove 13 symmetrically arranged on the inclined plate 12. A first sliding block 14 is slidably installed in the first sliding groove 13. A spring 15 is fixed in the first sliding groove 13 and abuts against the first sliding block 14. The first sliding block 14 is fixedly connected to the locking plate 16 and connected to the yielding mechanism.

[0040] Please see Figure 1-6 , Figure 9-10It should be noted that during the manufacturing process of circuit boards, solder paste, solder wire, etc., are used for soldering. The flux used in this process leaves residues on the circuit board surface, causing contamination, which is one of the main pollutants. To prevent corrosion, short circuits, open circuits, and other failures caused by these pollutants, the circuit board surface needs to be cleaned after soldering. Two sets of clamping plates 16 are provided, located on both sides of the base 1, and each set includes two symmetrical clamping plates 16. The ends of the inclined plates 12 are inclined, and the inclined portions of the two inclined plates 12 are inclined away from each other. The first slide groove 13 is formed on the inclined portion of the inclined plate 12. Initially... In this state, spring 15 is compressed, causing the first sliding block 14 to be at the end of its stroke in the direction of approaching each other. When the circuit board needs to be cleaned, the two clamping plates 16 are manually driven to move in the direction of moving away from each other, so that spring 15 continues to be compressed. When the distance between the clamping plates 16 is greater than the thickness of the circuit board, the force applied to the clamping plates 16 is removed, spring 15 is released elastically, and the clamping plates 16 are brought closer to each other until the clamping plates 16 abut against the surface of the circuit board, thereby fixing the circuit board. When cleaning the surface of the circuit board, under the action of spring 15, the clamping force applied by the clamping plates 16 to the circuit board is greater than the impact force of the water flow, ensuring that the circuit board will not shift during the cleaning process.

[0041] Preferably, during the cleaning process, the clamping part of the circuit board also needs to be cleaned. In order to ensure that the clamping plate 16 does not interfere with the cleaning of the circuit board, the clamping plate 16 needs to be separated from the circuit board and moved to a position where it is misaligned with the circuit board. When the cleaning fluid is rinsed to one side of the circuit board, the first sliding block 14 in the inclined plate 12 at this position will move in a direction away from each other and move along the length of the first sliding groove 13, so that the spring 15 is compressed, thereby driving the clamping plate 16 to move. Since the first sliding groove 13 is inclined, the two clamping plates 16 move in a direction away from the circuit board when they move away from each other, so as to ensure that the clamping plate 16 is misaligned with the circuit board. At this time, the circuit board is still fixed by another set of clamping plates 16 to ensure that the circuit board will not fall off onto the base 1.

[0042] A driving mechanism is mounted on the fixed plate 3 and connected to the clamping assembly. The driving mechanism includes a transmission rod 4 rotatably mounted on the fixed plate 3, a turntable 5 fixedly mounted on the transmission rod 4, and a gear engagement assembly mounted on the fixed plate 3 and connected to the first rotating rod 11. A movable plate 6 is fixed on the gear engagement assembly, and a slot is provided on the movable plate 6. A protrusion that engages with the slot is fixed on the turntable 5. The transmission rod 4 is connected to the intermittent transmission assembly. The gear engagement assembly includes a guide rod 8 fixedly mounted on the fixed plate 3, a guide sleeve 7 movably mounted on the guide rod 8, and a rack plate 9 fixedly mounted on the movable plate 6. A gear 10 that meshes with the rack plate 9 is fixed on the first rotating rod 11. A first limiting rod is fixedly mounted on the guide sleeve 7 and fixedly connected to the movable plate 6. A first limiting groove that engages with the first limiting rod is provided on the guide sleeve 7.

[0043] Please see Figure 1-3 , Figure 6 Furthermore, since contaminants remain on the surface of the circuit board after soldering, and the circuit board has many pins, the unevenness of the pins and the gaps in some places make it difficult to clean the contaminants. Therefore, it is necessary to continuously change the rinsing angle of the cleaning fluid. This can be achieved by reciprocating the rotation of the circuit board. At this time, the transmission rod 4 rotates, driving the turntable 5 to rotate. Due to the engagement of the through groove and the protrusion on the movable plate 6, the movable plate 6 reciprocates under the action of the turntable 5, thereby driving the guide sleeve 7 to move along the length direction of the guide rod 8. Since the first limiting groove engages with the first limiting rod, it ensures that the guide sleeve 7 will not deviate during movement, so as to ensure that the movable plate 6 moves along the length direction of the guide rod 8. The movable plate 6 will also drive the rack plate 9 to reciprocate, thereby driving the gear 10 to reciprocate, so that the first rotating rod 11 reciprocates. At this time, the circuit board fixed between the clamping plates 16 will continuously swing back and forth, thereby continuously changing the rinsing direction of the cleaning fluid.

[0044] Preferably, as the circuit board continues to oscillate, the time that the cleaning fluid remains on the circuit board will also decrease, ensuring that the cleaning fluid quickly separates from the circuit board after removing contaminants, thereby preventing contaminants dissolved in the cleaning fluid from remaining on the circuit board again. The transmission rod 4 can be driven by a motor, which is an application of the prior art and is not limited in this application.

[0045] The fixed plate 3 is also provided with a spray mechanism connected to the clamping assembly and used for rinsing the circuit board. The spray mechanism includes a spray assembly and a nozzle 30. The driving mechanism can drive the clamping plate 16 to swing intermittently through the clamping assembly. The driving mechanism can also drive the spray assembly to swing back and forth through the clamping assembly, so that the nozzle 30 swings in the opposite direction to the clamping plate 16. The spray assembly is also fixed with symmetrically arranged limiting wheels 27. The spray assembly includes components fixedly mounted on the fixed plate 3. A fixed rod 21 is mounted on the fixed plate 3. A limiting sleeve 26 is movably mounted on the fixed rod 21. A swing plate 28 is movably mounted on the limiting sleeve 26. A hollow rod 29 is fixed on the swing plate 28. The hollow rod 29 is fixedly connected to the nozzle 30 and engages with the through groove. The limiting sleeve 26 is fixedly connected to the limiting wheel 27 and connected to the intermittent transmission assembly. A second limiting rod is fixed on the fixed rod 21. A second limiting groove is opened on the limiting sleeve 26 to engage with the second limiting rod.

[0046] Please see Figure 1-3 , Figure 7-8 Furthermore, the hollow rod 29 is designed to be conductive and connected to the nozzle 30, and it has a conduit connected to the tank containing the cleaning fluid. In the initial state, under the action of the intermittent transmission component, the limiting sleeve 26 is located at the end of its stroke on one side of the fixed rod 21, and the nozzle 30 is located at the upper middle position of the side end of the circuit board. At this time, the limiting wheel 27 cooperates with the clearance mechanism to separate the clamping plate 16 from the circuit board at this position, and it will not interfere with the nozzle 30. When cleaning is required, the cleaning fluid in the tank will enter the hollow rod 29 through the conduit and be quickly delivered to the surface of the circuit board through the nozzle 30. The cleaning fluid will apply a certain impact force to the circuit board, thereby enhancing the cleaning power of the circuit board. During the cleaning process, the inclined plate 12 will continuously move towards the circuit board. The repeated oscillation causes the support plate 32 to oscillate back and forth around the first rotating rod 11. The through groove engages with the hollow rod 29, causing the hollow rod 29 to oscillate and drive the oscillating plate 28 to oscillate back and forth around the limiting sleeve 26. Under the action of the through groove and the hollow rod 29, the oscillation direction of the oscillating plate 28 is opposite to the oscillation direction of the inclined plate 12, so that the oscillation direction of the nozzle 30 is opposite to that of the circuit board. The cleaning liquid sprayed by the nozzle 30 will first act on the circuit board in a direction perpendicular to the circuit board. As the nozzle 30 and the circuit board oscillate, the angle between the impact direction and the circuit board becomes smaller and smaller, thereby continuously adjusting the impact angle and making the cleaning effect better. As the nozzle 30 and the circuit board oscillate continuously, it can be ensured that the cleaning liquid quickly separates from the circuit board after acting on it.

[0047] Preferably, under the action of the intermittent transmission component, the limiting sleeve 26 is driven to move intermittently along the length direction of the fixed rod 21, thereby driving the nozzle 30 to move intermittently along the length direction of the circuit board to ensure that the entire board surface is cleaned. Since the second limiting groove is engaged with the second limiting rod, it is ensured that the limiting sleeve 26 will not deviate during movement.

[0048] An intermittent transmission assembly is disposed on the fixed plate 3 and connected to the drive mechanism and the spray assembly. The drive mechanism can drive the spray assembly to move intermittently through the intermittent transmission assembly. The intermittent transmission assembly includes a drive wheel 33 fixedly mounted on the transmission rod 4, a support rod 35 rotatably mounted on the fixed plate 3, and a driven wheel 34 fixedly mounted on the support rod 35 and cooperating with the drive wheel 33. A guide groove 36 is provided on the support rod 35, and a rhomboid block 31 that engages with the guide groove 36 is rotatably mounted on the limiting sleeve 26.

[0049] Please see Figure 1-3 Furthermore, the guide groove 36 can be divided into four sections: the first section is a first semi-annular groove; the second section is a first spiral groove connected to the first semi-annular groove; the third section is a second semi-annular groove connected to the first spiral groove; and the fourth section is a second spiral groove connected to both the first and second semi-annular grooves. The first and second spiral grooves are arranged in a crisscross pattern. To ensure thorough cleaning of the circuit board, the nozzle 30 needs to be driven to move to another position on the circuit board after swinging once. Initially, the rhombus block 31 is located in the first semi-annular groove. At this time, the transmission rod 4 rotates, driving the drive wheel 33 to rotate. The drive wheel 33 and the driven wheel 34... The assembly is a Maltese cross mechanism. Under the action of the drive wheel 33, the driven wheel 34 is driven to rotate intermittently, which in turn drives the support rod 35 to rotate intermittently. This causes the guide groove 36 to move, so that the diamond block 31 disengages from the first semi-annular groove and enters the first spiral groove. This causes the limiting sleeve 26 to move intermittently along the length of the fixed rod 21. At this time, the nozzle 30 moves to the next position of the circuit board. As the transmission rod 4 continues to rotate, the diamond block 31 will move to the second semi-annular groove. At this time, the limiting sleeve 26 moves to the end of the stroke on the other side of the fixed rod 21, and the nozzle 30 moves to the other end of the circuit board to perform a thorough cleaning of the circuit board.

[0050] Preferably, to ensure the circuit board cleaning effect meets the requirements, the circuit board can be cleaned again. The rhombus-shaped block 31 will enter the second spiral groove and drive the limiting sleeve 26 to move towards the initial position. When the rhombus-shaped block 31 returns to the first semi-annular groove, the nozzle 30 resets. The above steps are repeated until the circuit board is clean. The rhombus-shaped block 31 is designed in a rhombus shape to ensure that it will not leave its original track and enter the working track during its movement. After cleaning, the conduit is connected to a tank containing pure water or deionized water, and the circuit board is rinsed again to remove the residual cleaning solution from the surface of the circuit board. Since pure water is expensive, it can be replaced with deionized water with a conductivity of 5 μm·cm, which is cheaper, for rinsing. Finally, a high-purity deionized water with a conductivity of 18 μm·cm can also be used for rinsing to achieve a good cleaning effect. After rinsing, some water will still remain in the gaps of the circuit board, so the circuit board needs to be dried. Simple blowing or drying is not enough to completely remove the water remaining in the gaps. Before drying, a conduit can be connected to a container containing anhydrous ethanol, and the residual water can be removed by rinsing with anhydrous ethanol to ensure a better drying effect for the circuit board.

[0051] The base 1 is provided with a clearance mechanism connected to the spray assembly and the clamping assembly. The spray assembly drives the clearance mechanism to move via the limiting wheel 27, so as to drive the two clamping plates 16 to move away from each other via the clamping assembly. The clearance mechanism includes a support sleeve 17 movably mounted on the first rotating rod 11, a connecting rod 18 hinged to the support sleeve 17 and hinged to the first sliding block 14, and a movable sleeve 19 movably mounted on the support sleeve 17. The fixing plate 3 is provided with a connection to the fixing rod 2. A limiting assembly is connected and symmetrically arranged. The limiting assembly has a hinge rod 20 hinged to the movable sleeve 19. The limiting assembly cooperates with the limiting wheel 27. The limiting assembly includes a receiving plate 22 fixedly installed on the fixed rod 21 and symmetrically arranged. The receiving plate 22 has a second sliding groove 23. A second sliding block 24 is slidably installed in the second sliding groove 23. A limiting plate 25 cooperating with the limiting wheel 27 is fixed on the second sliding block 24. The second sliding block 24 is hinged to the hinge rod 20.

[0052] Please see Figure 1-3 , Figure 6-7 , Figure 9Finally, in the initial state, the locking plate 16 is engaged with the circuit board. Under the action of the first sliding block 14, the supporting sleeve 17 is fixed by the connecting rod 18. Thus, under the action of the movable sleeve 19, the second sliding block 24 is kept fixed by the hinge rod 20. The limiting plate 25 is inclined towards the side of the limiting wheel 27. When the limiting wheel 27 moves to the position of abutting the inclined surface of the limiting plate 25, it drives the limiting plate 25 to slide in the second sliding groove 23 and move away from the inclined plate 12, thereby driving the hinge rod 20 to move, and through the movable sleeve 19... The moving support sleeve 17 moves toward the inclined plate 12. The support sleeve 17 also drives the connecting rod 18 to move, and drives the two first sliding blocks 14 to move away from each other, so that the spring 15 is compressed, so that the clamping plate 16 is separated from the circuit board and moves to a position that is misaligned with the circuit board. Under the action of the limiting wheel 27 and the limiting plate 25, it is ensured that when the nozzle 30 moves to the side of the circuit board, the clamping plate 16 will not interfere with the nozzle 30. When the limiting wheel 27 separates from the limiting plate 25, the spring 15 is released elastically, and the first sliding block 14 drives the clamping plate 16 to engage with the circuit board again.

[0053] A method for using a board surface cleaning device for intelligent circuit board processing includes the following steps:

[0054] Step 1: Place the circuit board to be cleaned between the clamping plates 16 and fix the circuit board in place with the help of the clamping components;

[0055] Step 2: The spray assembly is connected to the tank containing cleaning fluid through a conduit, and the cleaning fluid is continuously delivered into the spray assembly, thereby spraying it onto the circuit board through the nozzle 30.

[0056] Step 3: The drive mechanism works and drives the clamping component to swing the card plate 16 back and forth. The clamping component also drives the spraying component to swing, thereby controlling the spray head 30 to swing in the opposite direction to the card plate 16, so that the spraying angle of the spray head 20 changes continuously, so as to make the cleaning effect of the circuit board better.

[0057] Step 4: The drive mechanism will also drive the spray assembly to move intermittently along the length of the circuit board through the intermittent transmission component to thoroughly clean the circuit board. When the limit wheel cooperates with the clearance mechanism, the clearance mechanism will drive the two clamping plates 20 to move away from each other through the clamping component, so that the side of the circuit board can also be cleaned.

[0058] Taking the embodiment combining all the features described in this application as an example, in order to prevent the presence of contaminants from causing circuit board corrosion, short circuits, open circuits, and other failures, the circuit board surface needs to be cleaned after soldering. Initially, spring 15 is compressed, causing the first sliding block 14 to be at the end of its stroke in the direction of approach. When cleaning the circuit board is required, the two clamping plates 16 are manually driven to move in a direction of distance, causing spring 15 to continue to be compressed. When the distance between the clamping plates 16 is greater than the thickness of the circuit board, the force applied to the clamping plates 16 is removed, spring 15 is elastically released, and the clamping plates 16 are brought closer together until they abut against the circuit board surface, thereby fixing the circuit board. Due to the unevenness of the pins... The surface is flat, and some areas have gaps, making it difficult to clean contaminants. Therefore, it is necessary to constantly change the rinsing angle of the cleaning fluid. The hollow rod 29 is designed for conduction and is connected to the nozzle 30. It also has a conduit connected to the tank containing the cleaning fluid. At this time, the transmission rod 4 rotates, driving the turntable 5 to rotate. Because the through groove and protrusion on the movable plate 6 engage, the movable plate 6 reciprocates under the action of the turntable 5, thereby driving the guide sleeve 7 to move along the length direction of the guide rod 8. Because the first limiting groove engages with the first limiting rod, it ensures that the guide sleeve 7 will not deviate during movement, thus ensuring that the movable plate 6 moves along the length direction of the guide rod 8. The movable plate 6 also drives the rack plate 9 to reciprocate, thereby driving the gear 10 to rotate reciprocally. The first rotating rod 11 is rotated back and forth, causing the circuit board fixed between the clamping plates 16 to swing back and forth continuously. The tilting plate 12 also drives the support plate 32 to swing back and forth around the first rotating rod 11. The through groove engages with the hollow rod 29, causing the hollow rod 29 to swing and drive the swinging plate 28 to swing back and forth around the limiting sleeve 26. Under the action of the through groove and the hollow rod 29, the swinging direction of the swinging plate 28 is opposite to the swinging direction of the tilting plate 12, so that the swinging direction of the nozzle 30 is opposite to that of the circuit board. The cleaning fluid sprayed through the nozzle 30 will first act on the circuit board in a direction perpendicular to the circuit board, and as the nozzle 30 and the circuit board swing, the angle between the impact direction and the circuit board will continuously decrease, thereby continuously adjusting the impact angle. This process enhances the cleaning effect. The transmission rod 4 rotates, driving the drive wheel 33 to rotate. Under the action of the drive wheel 33, the driven wheel 34 rotates intermittently, thereby driving the support rod 35 to rotate intermittently. This causes the guide groove 36 to move, allowing the rhombus block 31 to disengage from the first semi-annular groove and enter the first spiral groove. This, in turn, causes the limiting sleeve 26 to move intermittently along the length of the fixed rod 21. At this time, the nozzle 30 moves to the next position on the circuit board. As the transmission rod 4 continues to rotate, the rhombus block 31 will move into the second semi-annular groove. At this point, the limiting sleeve 26 moves to the end of its stroke on the other side of the fixed rod 21, and the nozzle 30 moves to the other end of the circuit board for thorough cleaning. The limiting sleeve 26 also drives the limiting wheel 27 to move.When the limiting wheel 27 moves to the position abutting the inclined surface of the limiting plate 25, it drives the limiting plate 25 to slide within the second slide groove 23 and move away from the inclined plate 12. This drives the hinge rod 20 to move, and through the movable sleeve 19, it drives the support sleeve 17 to move towards the inclined plate 12. The support sleeve 17 also drives the connecting rod 18 to move, and drives the two first sliding blocks 14 to move away from each other, compressing the spring 15 so that the locking plate 16 separates from the circuit board and moves to a position misaligned with the circuit board. Under the action of the limiting wheel 27 and the limiting plate 25, it is ensured that when the nozzle 30 moves to the side of the circuit board, the locking plate 16 will not interfere with the nozzle 30. When the limiting wheel 27 separates from the limiting plate 25, the spring 15 is released elastically, and through the first sliding block 14, it drives the locking plate 16 to engage with the circuit board again.

[0059] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0060] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A board surface cleaning device for intelligent processing of circuit boards, comprising a base (1), a controller (2) for controlling the working state of the device fixed on the base (1), and fixed plates (3) arranged symmetrically on the base (1), characterized in that, The circuit board surface cleaning device for intelligent processing also includes: A clamping mechanism is provided on the fixed plate (3) and is arranged symmetrically. The clamping mechanism includes a clamping component and a symmetrically arranged card plate (16). The clamping component can fix the circuit board through the card plate (16). A driving mechanism is provided on the fixed plate (3) and connected to the clamping assembly. The fixed plate (3) is also provided with a spraying mechanism connected to the clamping assembly and used for rinsing the circuit board. The spraying mechanism includes a spraying assembly and a nozzle (30). The driving mechanism can drive the clamping plate (16) to swing intermittently through the clamping assembly. The driving mechanism can also drive the spraying assembly to swing back and forth through the clamping assembly so that the nozzle (30) swings in the opposite direction to the clamping plate (16). The spraying assembly is also fixed with symmetrically arranged limiting wheels (27). An intermittent transmission assembly is provided on the fixed plate (3) and connected to the drive mechanism and the spray assembly. The drive mechanism can drive the spray assembly to move intermittently through the intermittent transmission assembly. A clearance mechanism is provided on the base (1) and connected to the spray assembly and the clamping assembly. The spray assembly drives the clearance mechanism to move through the limiting wheel (27) so as to drive the two clamping plates (16) to move away from each other through the clamping assembly. The clamping assembly includes a first rotating rod (11) rotatably mounted on the fixed plate (3), an inclined plate (12) fixedly mounted on the first rotating rod (11), a support plate (32) fixedly mounted on the inclined plate (12), a through groove connected to the spray assembly on the support plate (32), an elastic support structure connected to the inclined plate (12) on the fixed plate (3), the elastic support structure being fixedly connected to the clamping plate (16), and the first rotating rod (11) being connected to the driving mechanism and the yielding mechanism. The elastic support structure includes a first sliding groove (13) symmetrically arranged on the inclined plate (12), a first sliding block (14) slidably mounted in the first sliding groove (13), a spring (15) abutting against the first sliding block (14) fixed in the first sliding groove (13), and the first sliding block (14) being fixedly connected to the clamping plate (16) and connected to the yielding mechanism.

2. The circuit board surface cleaning device for intelligent processing of circuit boards according to claim 1, characterized in that, The driving mechanism includes a transmission rod (4) rotatably mounted on the fixed plate (3), a turntable (5) fixedly mounted on the transmission rod (4), and a meshing assembly disposed on the fixed plate (3) and connected to the first rotating rod (11). A movable plate (6) is fixed on the meshing assembly. A slot is provided on the movable plate (6). A protrusion that engages with the slot is fixed on the turntable (5). The transmission rod (4) is connected to the intermittent transmission assembly.

3. The circuit board surface cleaning device for intelligent processing of circuit boards according to claim 2, characterized in that, The meshing assembly includes a guide rod (8) fixedly mounted on the fixed plate (3), a guide sleeve (7) movably mounted on the guide rod (8), and a rack plate (9) fixedly mounted on the movable plate (6). A gear (10) meshing with the rack plate (9) is fixed on the first rotating rod (11). A first limiting rod is fixed on the guide sleeve (7) and fixedly connected to the movable plate (6). A first limiting groove is opened on the guide sleeve (7) to engage with the first limiting rod.

4. The circuit board surface cleaning device for intelligent processing of circuit boards according to claim 2, characterized in that, The spray assembly includes a fixed rod (21) fixedly installed on the fixed plate (3), a limiting sleeve (26) movably installed on the fixed rod (21), a swing plate (28) movably installed on the limiting sleeve (26), a hollow rod (29) fixed on the swing plate (28), the hollow rod (29) being fixedly connected to the nozzle (30) and engaging with the through groove, the limiting sleeve (26) being fixedly connected to the limiting wheel (27) and connected to the intermittent transmission assembly, a second limiting rod being fixedly installed on the fixed rod (21), and a second limiting groove being provided on the limiting sleeve (26) engaging with the second limiting rod.

5. The circuit board surface cleaning device for intelligent processing of circuit boards according to claim 4, characterized in that, The intermittent transmission assembly includes a drive wheel (33) fixedly mounted on the transmission rod (4), a support rod (35) rotatably mounted on the fixed plate (3), and a driven wheel (34) fixedly mounted on the support rod (35) and cooperating with the drive wheel (33). A guide groove (36) is provided on the support rod (35), and a rhomboid block (31) that engages with the guide groove (36) is rotatably mounted on the limiting sleeve (26).

6. The circuit board surface cleaning device for intelligent processing of circuit boards according to claim 4, characterized in that, The yielding mechanism includes a support sleeve (17) movably mounted on the first rotating rod (11), a connecting rod (18) hinged to the support sleeve (17) and hinged to the first sliding block (14), and a movable sleeve (19) movably mounted on the support sleeve (17). The fixed plate (3) is provided with a limiting component connected to the fixed rod (21) and arranged symmetrically. The limiting component is hinged with a hinge rod (20) hinged to the movable sleeve (19). The limiting component cooperates with the limiting wheel (27).

7. The board surface cleaning device for intelligent processing of circuit boards according to claim 6, characterized in that, The limiting component includes a receiving plate (22) fixedly installed on the fixed rod (21) and arranged symmetrically. The receiving plate (22) has a second sliding groove (23). A second sliding block (24) is slidably installed in the second sliding groove (23). A limiting plate (25) that cooperates with the limiting wheel (27) is fixed on the second sliding block (24). The second sliding block (24) is hinged to the hinge rod (20).

Images