Method for adjusting flatness

Abstract

The present disclosure relates to a method for adjusting flatness of a plane. The method comprises the steps of: providing a pick-and-place mechanism, wherein the pick-and-place mechanism comprises a distance sensor and a pick-and-place surface; measuring a first distance between the pick-and-place mechanism and a reference surface in a first direction using the distance sensor; measuring a second distance between the pick-and-place mechanism and the reference surface in an opposite direction of the first direction using the distance sensor; calculating a first compensation angle using the first distance and the second distance; and adjusting flatness between the pick-and-place surface and the reference surface by the first compensation angle.

Description

Technical Field

[0001] This disclosure relates to a technique for adjusting the flatness of a plane. Background Technology

[0002] Currently, automated manufacturing equipment is widely used in the processes of electronic products, such as using pick-and-place mechanisms to assemble display panels to form electronic products. When different components of an electronic product are stacked and assembled, if the flatness of the components is inconsistent, gaps will appear between the stacked components, thus affecting the quality of the final product. Currently, adjusting the flatness of the pick-and-place mechanism often relies on the operator's experience and visual inspection, which requires a considerable amount of time to adjust the flatness and / or results in a high error rate.

[0003] Therefore, a method for adjusting the flatness of the plane is needed to improve the above problems. Summary of the Invention

[0004] This disclosure provides a method for adjusting the flatness of a plane. The method includes the steps of: providing a pick-and-place mechanism, wherein the pick-and-place mechanism includes a distance sensor and a pick-and-place surface; measuring a first distance between the pick-and-place mechanism and a reference surface in a first direction using the distance sensor; measuring a second distance between the pick-and-place mechanism and the reference surface in the opposite direction of the first direction using the distance sensor; calculating a first compensation angle using the first distance and the second distance; and adjusting the flatness between the pick-and-place surface and the reference surface using the first compensation angle. Attached Figure Description

[0005] Figure 1 This is a schematic diagram of an assembly device according to an embodiment of the present disclosure.

[0006] Figure 2 This is a partial schematic diagram of an assembly apparatus according to an embodiment of the present disclosure.

[0007] Figure 3 This is a schematic diagram of a distance sensor according to an embodiment of the present disclosure measuring in different directions.

[0008] Figure 4A This is a schematic diagram of the offset angle of the pick-and-place mechanism according to an embodiment of the present disclosure.

[0009] Figure 4B This is a schematic diagram illustrating the calculation method of the offset angle according to an embodiment of the present disclosure.

[0010] Figure 5 This is a schematic diagram of a first coordinate system and a second coordinate system according to an embodiment of this disclosure.

[0011] Figure 6 This is a flowchart of the steps of the planar flatness adjustment method according to the first embodiment of this disclosure.

[0012] Figure 7 This is a flowchart of the steps of the planar flatness adjustment method according to the second embodiment of the present disclosure.

[0013] Explanation of reference numerals in the attached figures

[0014] 1 Assembly device

[0015] 10. Picking and placing mechanism

[0016] 11. Take and place the noodles

[0017] 12 Second Surface

[0018] 20 Distance Sensors

[0019] 21 Sensing Units

[0020] 30 Reference plane

[0021] 40 robotic arms

[0022] 41 Rotating part

[0023] 42 base

[0024] 43 Connecting parts

[0025] 50 processing units

[0026] C1 Center of the pick-and-place mechanism

[0027] C2 Sensing Unit Center

[0028] S1 First Distance

[0029] S2 Second Distance

[0030] D Spacing

[0031] θ1 First compensation angle

[0032] X1, Y1, Z1 are axes of the first coordinate system.

[0033] X2, Y2, Z2 axes of the second coordinate system Detailed Implementation

[0034] The exemplary embodiments of this disclosure will now be described in detail with reference to the accompanying drawings. Wherever possible, the same element symbols are used in the drawings and description to denote the same or similar parts.

[0035] Certain terms are used in this disclosure and in the claims to refer to specific components. Those skilled in the art will understand that electronic device manufacturers may use different names to refer to the same components. This document is not intended to distinguish between components that have the same function but different names. In the following text, words such as “containing,” “comprising,” and “including” are open-ended terms and should therefore be interpreted as “containing but not limited to…”.

[0036] The directional terms used herein, such as "up," "down," "front," "back," "left," and "right," are for reference only when referring to the accompanying drawings. Therefore, the directional terms used are for illustrative purposes and not for limiting this disclosure. In the accompanying drawings, the figures illustrate general features of the methods, structures, and / or materials used in specific embodiments. However, these drawings should not be construed as defining or limiting the scope or nature covered by these embodiments. For example, for clarity, the relative dimensions, thicknesses, and positions of various films, regions, and / or structures may be reduced or enlarged.

[0037] In this disclosure, a structure (or layer, component, substrate) located on / above another structure (or layer, component, substrate) can refer to the two structures being adjacent and directly connected, or to the two structures being adjacent but not directly connected. Indirect connection means that there is at least one intermediate structure (or intermediate layer, intermediate component, intermediate substrate, intermediate spacer) between the two structures, with the lower surface of one structure adjacent to or directly connected to the upper surface of the intermediate structure, and the upper surface of the other structure adjacent to or directly connected to the lower surface of the intermediate structure. The intermediate structure can be composed of a single or multiple solid or non-solid structure, without limitation. In this disclosure, when a structure is positioned "on" another structure, it may mean that the structure is "directly" on the other structure, or that the structure is "indirectly" on the other structure, meaning that at least one structure is sandwiched between the structure and the other structure.

[0038] The terms “approximately,” “equal to,” “same,” “substantially,” or “roughly” are generally interpreted as being within 20% of a given value or range, or as being within 10%, 5%, 3%, 2%, 1%, or 0.5% of a given value or range.

[0039] Furthermore, any two values ​​or directions used for comparison may have a certain degree of error. If the first value equals the second value, it implies an error of about 10% between the two values; if the first direction is perpendicular to or "approximately" perpendicular to the second direction, the angle between the first and second directions may be between 80 and 100 degrees; if the first direction is parallel to or "approximately" parallel to the second direction, the angle between the first and second directions may be between 0 and 10 degrees.

[0040] The ordinal numbers used in the specification and claims, such as "first" and "second," to modify elements do not inherently imply any prior ordinal number for that element (or those elements), nor do they represent the order of one element with another, or the order of manufacturing processes. The use of these ordinal numbers is solely to clearly distinguish one named element from another with the same name. The claims and specification may not use the same terminology; therefore, a first element in the specification may be a second element in the claims.

[0041] In addition, the terms "given range is from the first value to the second value" and "given range falls within the range of the first value to the second value" indicate that the given range includes the first value, the second value, and other values ​​in between.

[0042] Furthermore, the assembly apparatus disclosed herein can be used to assemble at least two electronic components or modules to manufacture an electronic device, which may include a display device, a backlight device, an antenna device, a sensing device, a splicing device, a touch display device, a curved display device, or a free-shape display device, but is not limited thereto. The assembly apparatus can assemble at least some of the electronic components via a pick-and-place mechanism, but is not limited thereto. The electronic device may include, for example, liquid crystal, light-emitting diode, fluorescence, phosphorescence, other suitable display media, or combinations thereof, but is not limited thereto. The display device may be a non-self-emissive display device or a self-emissive display device. The electronic device may include electronic components. Electronic components may include passive and active components, such as capacitors, resistors, inductors, diodes, transistors, etc. Diodes may include light-emitting diodes (LEDs) or photodiodes. Light-emitting diodes (LEDs) may include, for example, organic light-emitting diodes (OLEDs), miniLEDs, microLEDs, or quantum dot LEDs, but are not limited thereto. Antenna devices may be liquid crystal or non-liquid crystal antenna devices, and sensing devices may be sensing devices for capacitance, light, heat, or ultrasound, but are not limited thereto. Splicing devices may be, for example, display splicing devices or antenna splicing devices, but are not limited thereto. It should be noted that electronic devices may be any combination of the aforementioned, but are not limited thereto. Furthermore, electronic devices may be bendable or flexible. It should be noted that electronic devices may be any combination of the aforementioned, but are not limited thereto. Furthermore, the shape of the electronic device may be rectangular, circular, polygonal, with curved edges, or other suitable shapes. The electronic device may have peripheral systems such as a drive system, control system, light source system, shelf system, etc., to support the display device, antenna device, or splicing device.

[0043] It should be understood that, according to embodiments of this disclosure, the depth, thickness, width, or height of each element, or the spacing or distance between elements, can be measured using an optical microscope (OM), a scanning electron microscope (SEM), an alpha-step thickness gauge, an ellipsometry, or other suitable methods. According to some embodiments, a scanning electron microscope can be used to obtain a cross-sectional image including the element to be measured, and to measure the depth, thickness, width, or height of each element, or the spacing or distance between elements.

[0044] It should be understood that the features described below can be replaced, recombined, or mixed in several different embodiments to complete other embodiments without departing from the spirit of this disclosure. Features between embodiments can be arbitrarily mixed and combined as long as they do not violate the spirit of the invention or conflict with it.

[0045] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It is understood that such terms, for example, as defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the relevant art and the background or context of this disclosure, and should not be interpreted in an idealized or overly formal manner, unless specifically defined in embodiments of this disclosure.

[0046] Furthermore, the word "adjacent" in the specification and claims is used to describe mutual proximity and does not necessarily mean mutual contact.

[0047] Furthermore, descriptions such as "when..." or "...when" in this disclosure indicate situations such as "at present, before, or after," and are not limited to simultaneous occurrences; this is stated in advance. Descriptions such as "set on..." in this disclosure indicate the corresponding positional relationship between two elements, and do not limit whether the two elements are in contact, unless specifically limited; this is stated in advance. Moreover, when this disclosure describes multiple functions, the use of the word "or" between functions indicates that the functions can exist independently, but does not preclude the possibility of multiple functions existing simultaneously.

[0048] In some embodiments of this disclosure, terms such as "connection" and "interconnection," unless specifically defined, may refer to two structures being in direct contact, or to two structures not being in direct contact, with other structures disposed between them. Furthermore, these terms may also include cases where both structures are movable or both structures are fixed. Additionally, the term "coupled" includes any direct or indirect electrical connection means.

[0049] For ease of explanation, the following description will use an electronic device as the display device, but this disclosure is not limited thereto.

[0050] Figure 1 This is a schematic diagram of an assembly device 1 according to an embodiment of the present disclosure. The assembly device 1 can be used to stack a first object (not shown) onto a second object (not shown), wherein the first object can be flatly and closely fitted with the second object, and the second object can be placed on a reference surface 30. The reference surface 30 is, for example, the surface of an optical table, but is not limited thereto. The assembly device 1 is described below with the aid of a first coordinate system and a second coordinate system. The first coordinate system includes an X1 axis, a Y1 axis, and a Z1 axis, wherein the X1 axis and Y1 axis can be parallel to the reference surface 30, and the Z1 axis can be parallel to a normal direction of the reference surface 30. The second coordinate system includes an X2 axis, Y2 axis, and Z2 axis, wherein the X2 axis is defined as parallel to the X1 axis, and the Z2 axis can be parallel to a normal on a pick-and-place surface 11 of the pick-and-place mechanism 10 of the assembly device 1. In one embodiment, the directions of the X1 axis, Y1 axis, and Z1 axis in the first coordinate system can be perpendicular to each other, but are not limited thereto. In one embodiment, the directions of the X2 axis, Y2 axis and Z2 axis in the second coordinate system may be perpendicular to each other, but are not limited thereto.

[0051] like Figure 1As shown, the assembly device 1 may include a pick-and-place mechanism 10 and a robotic arm 40, wherein the pick-and-place mechanism 10 is fixed to the robotic arm 40. In one embodiment, the pick-and-place mechanism 10 can extract a first object (not shown) by vacuum suction, but is not limited thereto. The pick-and-place mechanism 10 may have a pick-and-place surface 11, which is a plane and can be connected to the first object. A reference surface 30 may be a plane for placing a second object, and the reference surface 30 may be larger than the pick-and-place surface 11 of the pick-and-place mechanism 10. In one embodiment, the robotic arm 40 may include a rotating part 41, a base 42, and at least one connecting part 43, wherein the connecting part 43 connects the base 42 and the rotating part 41, but is not limited thereto. The rotating part 41 may be connected to the pick-and-place mechanism 10. The base 42 of the robotic arm 40 can be disposed on and fixed to the reference surface 30, or the base 42 can be disposed on a horizontal plane, wherein the horizontal plane can be parallel to the reference surface 30, but has a different height from the reference surface 30 (e.g., corresponding to different positions on the Z1 axis). Therefore, the X1 axis and Y1 axis of the first coordinate system can be parallel to the base 42. The pick-and-place mechanism 10 can perform horizontal and / or vertical displacement by means of the rotating part 41 and the connecting part 43 of the robotic arm 40, thereby achieving, for example, picking up or placing a first object. In one embodiment, the base 42 can rotate about the Z1 axis of the first coordinate system, or when the rotating part 41 rotates, since the rotating part 41 is connected to the pick-and-place mechanism 10, the pick-and-place surface 11 can rotate about the Z2 axis of the second coordinate system, but is not limited thereto. In one embodiment, the origin of the first coordinate system can be, for example, the bottom of the base 42, but is not limited thereto. In one embodiment, the origin of the second coordinate system may be, for example, the center of the pick-and-place mechanism 10 (or the center of the pick-and-place surface 11), but is not limited thereto. In one embodiment, the center of an object may be the intersection of the two diagonals of a minimum rectangle encompassing the object.

[0052] The following example uses a display device comprising a panel module and a backlight module. The first object can be the panel module, and the second object can be the backlight module, but this is not a limitation. Because the flatness between the pick-up / placement surface 11 of the pick-up / placement mechanism 10 and the reference surface 30 may be inconsistent, for example, they may be located on different horizontal planes, this can easily cause gaps when the pick-up / placement mechanism 10 attaches the panel module to the backlight module, leading to light leakage and a decrease in product quality.

[0053] Therefore, the flatness between the pick-up / placement surface 11 of the pick-up / placement mechanism 10 and the reference surface 30 must be adjusted.

[0054] Figure 2 This is a partial schematic diagram of the assembly device 1 according to an embodiment of the present disclosure, and please also refer to... Figure 1The assembly device 1 can perform a method for adjusting the flatness of the plane. By adjusting the angle of the pick-up and place mechanism 10, the flatness between the pick-up and place surface 11 of the pick-up and place mechanism 10 and the reference surface 30 is made nearly consistent. In other words, the pick-up and place surface 11 of the pick-up and place mechanism 10 is adjusted to be substantially parallel to the reference surface 30.

[0055] like Figure 2 As shown, the pick-and-place mechanism 10 also includes a distance sensor 20. A portion of the distance sensor 20 may be disposed on a second surface 12 of the pick-and-place mechanism 10, wherein the second surface 12 is opposite to the pick-and-place surface 11, and another portion of the distance sensor 20 may protrude outside the second surface 12. The distance sensor 20 may include a sensing unit 21, wherein the sensing unit 21 may protrude outside the second surface 12 and face the reference surface 30. In one embodiment, the sensing unit 21 may be, for example, an optical sensing element, an ultrasonic sensing element, a laser sensing element, or other element capable of measuring the linear distance between two objects, and is not limited thereto. The sensing unit 21 of the distance sensor 20 can measure the distance between the pick-and-place mechanism 10 and the reference surface 30 in the normal direction (e.g., the Z1 axis) of the reference surface 30 (hereinafter referred to as the distance between the pick-and-place mechanism 10 and the reference surface 30).

[0056] The pick-and-place mechanism 10 can rotate clockwise or counterclockwise around the Z2 axis of the second coordinate system by the rotation unit 41. The distance sensor 20 can measure the distance between the pick-and-place mechanism 10 and the reference surface 30 at multiple positions (or corresponding to different directions of the rotation unit 41) as the pick-and-place mechanism 10 rotates. Furthermore, if the flatness between the pick-and-place surface 11 and the reference surface 30 is inconsistent, the distance between the pick-and-place mechanism 10 and the reference surface 30 measured by the distance sensor 20 in different directions will also be inconsistent. This will be discussed in subsequent paragraphs. Figure 3 and Figure 4A Please provide a detailed explanation.

[0057] Furthermore, the assembly device 1 may also include a processing unit 50. The processing unit 50 can calculate the adjustment angle (i.e., adjustment angle) of the pick-and-place mechanism 10 based on at least two distances between the pick-and-place mechanism 10 and the reference surface 30 measured by the distance sensor 20, and can adjust the pick-and-place mechanism 10 according to the calculated adjustment angle, so that the pick-and-place surface 11 is parallel to the reference surface 30. In one embodiment, the processing unit 50 may be, for example, a processor or a computer, and can perform its function by executing computer programs or instructions in a non-transitory computer-readable medium, such as calculating the adjustment angle of the pick-and-place mechanism 10. In one embodiment, the processing unit 50 may be disposed in an external device coupled to the distance sensor 20 and the robotic arm 40, the external device being, for example, but not limited to, a computer. In another embodiment, the processing unit 50 may also be disposed in the robotic arm 40 and coupled to the distance sensor 20, and is not limited thereto. In yet another embodiment, the processing unit 50 may also be disposed in the distance sensor 20 and coupled to the robotic arm 40, and is not limited thereto.

[0058] Next Figures 3 to 4B This section explains the operation of the distance sensor 20 and the processing unit 50, and please also refer to... Figure 1 and Figure 2 . Figure 3 This is a schematic diagram of a distance sensor 20 according to an embodiment of the present disclosure measuring in different directions, presented in a top view. Figure 4A yes Figure 2 The cross-sectional view corresponding to the AA' section line is used to show the offset angle of the pick-and-place mechanism 10. Figure 4B This is a schematic diagram illustrating the calculation method of the offset angle according to an embodiment of the present disclosure.

[0059] like Figure 3 As shown, the pick-and-place mechanism 10 rotates 360 degrees clockwise or counterclockwise around the Z2 axis of the second coordinate system. The movement trajectory of the distance sensor 20 can be projected onto a horizontal plane formed by the X1 and Y1 axes of the first coordinate system, that is... Figure 3 This can be viewed as the projection of the movement trajectory of the distance sensor 20 onto the horizontal plane formed by the X1 and Y1 axes. Figure 3 In the first coordinate system, the Y1 axis corresponds to 0 degrees, and the X1 axis corresponds to 270 degrees, but this is not the only example. Furthermore, the projection of the Y2 axis of the second coordinate system onto the horizontal plane formed by the X1 and Y1 axes also corresponds to 0 degrees, and the X2 axis corresponds to 270 degrees. The distance sensor 20 can be configured to measure at fixed angular intervals. For example, Figure 3The embodiment uses a fixed interval angle of 30 degrees as an example. Therefore, the distance sensor 20 can measure the distance between the pick-and-place mechanism 10 and the reference plane 30 corresponding to the Z1 axis in 12 directions, namely 0 degrees, 30 degrees, 60 degrees, 90 degrees, 120 degrees, 150 degrees, 180 degrees, 210 degrees, 240 degrees, 270 degrees, 300 degrees, and 330 degrees (that is, the distance is parallel to the Z1 axis). In one embodiment, the fixed interval angle may be, for example, but not limited to, between 0.1 degrees and 45 degrees (that is, 0.1 degrees ≤ fixed interval angle ≤ 45 degrees). Therefore, the fixed interval angle may be, for example, 45 degrees, 40 degrees, 30 degrees, 20 degrees, 10 degrees, 5 degrees, 1 degree, 0.5 degrees, or 0.1 degrees, and is not limited thereto.

[0060] For example Figure 3 and 4A As shown, after the distance sensor 20 measures in the aforementioned different directions, the processing unit 50 can set the maximum distance among all the measured distances corresponding to the Z1 axis as a first distance S1, and set the direction corresponding to the first distance S1 as a first direction. Furthermore, the processing unit 50 can set the distance measured in the opposite direction of the first direction as a second distance S2, where the first distance S1 is greater than or equal to the second distance S2 (i.e., S2 ≤ S1). Figure 3 Taking an example, suppose the distance measured by the distance sensor 20 in the 180-degree direction is a first distance S1 (i.e., the maximum distance). Therefore, the 180-degree direction can be set as the first direction, and the distance measured in the opposite direction (e.g., the 0-degree direction) can be set as the second distance S2. Furthermore, as... Figure 4A As shown, the processing unit 50 can obtain a distance D between the center of the distance sensor 20 and the center of the pick-and-place mechanism 10, wherein the distance D can be defined as the distance between the center C2 of the sensing unit 21 of the distance sensor 20 and the center C1 (or the center of the rotating part 41) of the pick-and-place mechanism 10 in the horizontal direction of the pick-and-place surface 11. In one embodiment, the distance D can be a preset value or a known value, and is pre-input into the processing unit 50, but is not limited thereto.

[0061] Please refer to the following at the same time Figures 2 to 4A . Figure 4A The cross-section can be generated. Figure 4A The cross-section can correspond to Figure 2 The A-A' section line, where Figure 2 The A-A' section line in the middle can be, for example, Figure 3 The extension of the line connecting a certain direction (e.g., the direction corresponding to the first distance S1) on the movement trajectory of the mid-range sensor 20 and the opposite direction of that direction, for example... Figure 3The extension of the line connecting the 180-degree direction and the 0-degree direction, that is, the extension of the line connecting the orientation of the first distance S1 to the orientation of the second distance S2, and not limited thereto. Furthermore, such as Figure 4A As shown, the take-up surface 11 has a tangent projection t1 and a normal projection n1 on the cross section.

[0062] In one embodiment, after the processing unit 50 determines the orientation of the first distance S1 and the second distance S2, the processing unit 50 can generate... Figure 4A The cross-section is then transformed to a second coordinate system. This transformation can be achieved by setting the normal of the cross-section to the X2 axis of the second coordinate system, oriented the cross-section towards the X2 axis, setting the tangent projection t1 of the pick-and-place surface 11 in the cross-section to the Y2 axis of the second coordinate system, and setting the normal projection n1 of the pick-and-place surface 11 in the cross-section to the Z2 axis of the second coordinate system. In this case, the Z2 axis of the second coordinate system may have an offset angle with the Z1 axis of the first coordinate system, the Y2 axis of the second coordinate system may have an offset angle with the Y1 axis of the first coordinate system, and the offset angle between the Z2 axis and the Z1 axis may be equivalent to the offset angle between the Y2 axis and the Y1 axis. The offset angle is, for example, a first compensation angle θ1. It should be noted that when the angle corresponding to the first distance S1 is 180 degrees, the normal of the cross-section itself can be considered as the X2 axis, thus no further coordinate system transformation is needed. However, when the angle corresponding to the first distance S1 is not 180 degrees (e.g., ...), ... Figure 3 (e.g., 90 degrees in the coordinate system), the normal of the section formed in this orientation is not parallel to the X2 axis, so the processing unit 50 must transfer the section to the second coordinate system, and so on.

[0063] Then, as... Figure 4A and Figure 4B As shown, the processing unit 50 can calculate a first compensation angle θ1 of the pick-and-place mechanism 10 based on the first distance S1, the second distance S2, and the spacing D. In one embodiment, the first distance S1, the second distance S2, the spacing D, and the first compensation angle θ1 conform to the following relationship:

[0064]

[0065] Where S1 is the first distance, S2 is the second distance, D is the spacing, and θ1 is the first compensation angle. Compared with the prior art, this disclosure can accurately obtain the compensation angle required by the pick-up and place mechanism 10, thereby improving the accuracy of the correction.

[0066] Subsequently, the processing unit 50 can control the robotic arm 40 to adjust the pick-and-place mechanism 10 according to the first compensation angle θ1 to adjust the flatness between the pick-and-place surface 11 and the reference surface 30. It should be noted that before adjustment, the pick-and-place surface 11 of the pick-and-place mechanism 10 and the reference surface 30 may not be parallel; that is, the pick-and-place surface 11 and the reference surface 30 may correspond to different coordinate systems. Therefore, the robotic arm 40 can adjust the angle of the pick-and-place mechanism 10 according to the first compensation angle θ1, causing the pick-and-place mechanism 10 to rotate around the X2 axis (i.e., the X1 axis), with the rotation angle being, for example, the first compensation angle θ1, thereby adjusting the flatness between the pick-and-place surface 11 and the reference surface 30. In one embodiment, "adjusting flatness" may, for example, involve adjusting the normal projection n1 (e.g., the Z2 axis of the second coordinate system) of the pick-up / placement surface 11 on the cross section to be parallel to the Z1 axis of the first coordinate system, and adjusting the tangent projection t1 (e.g., the Y2 axis of the second coordinate system) of the pick-up / placement surface 11 on the cross section to be parallel to the Y1 axis of the first coordinate system. Similarly, other methods for adjusting flatness in other directions can be derived.

[0067] Next, please refer to the following: Figure 3 and Figure 5 ,in Figure 5 This is a schematic diagram of a first coordinate system and a second coordinate system according to an embodiment of this disclosure, and please refer to it. Figure 1 , Figure 2 , Figure 4A and Figure 4B As an auxiliary function.

[0068] like Figure 3 and 5 As shown, the trajectory of the distance sensor 20 when it rotates 360 degrees around the Z2 axis is projected onto the first coordinate system. Therefore, the coordinate system used when calculating the first compensation angle θ1 can be the first coordinate system. Furthermore, the coordinate system used by the robotic arm 40 when adjusting the pick-and-place mechanism 10 according to the first compensation angle θ1 can be the second coordinate system.

[0069] Next, the details of the method for adjusting the flatness of the plane performed by the assembly device 1 will be explained.

[0070] First, the method for adjusting the flatness of the plane in the first embodiment will be explained. Please refer again. Figures 3 to 4B In one embodiment, after the robotic arm 40 adjusts the orientation of the pick-and-place mechanism 10 in the first direction according to the first compensation angle θ1, that is, after adjusting the flatness in the first direction corresponding to the maximum distance between the pick-and-place surface 11 and the reference surface 30, the processing unit 50 can find another maximum distance (e.g., the second largest distance smaller than the maximum distance in the first direction) among the distances measured in other directions, and proceed in the manner described above (e.g., Figure 4A and Figure 4B(As explained in the instructions) The compensation angle corresponding to the direction of the second largest distance is calculated, and then the robotic arm 40 adjusts the flatness of the pick-and-place mechanism 10 according to the compensation angle corresponding to the second largest distance. This process is repeated until the correction in all directions is completed.

[0071] By utilizing the features of the aforementioned components, the assembly device 1 can perform the planar flatness adjustment method of the first embodiment. Figure 6 This is a flowchart of the steps of the planar flatness adjustment method according to the first embodiment of this disclosure, and please also refer to... Figures 1 to 5 .

[0072] like Figure 6 As shown, firstly, step S61 is executed, providing a pick-and-place mechanism 10, which includes a distance sensor 20. Next, step S62 is executed, using the distance sensor 20 to measure a first distance S1 between the pick-and-place mechanism 10 and the reference surface 30 in a first direction. The distance sensor 20 can measure multiple distances in multiple directions, setting the direction of the largest measured distance as the first direction, and setting this largest distance as the first distance S1. Next, step S63 is executed, using the distance sensor 20 to measure a second distance S2 between the pick-and-place mechanism 10 and the reference surface 30 in the opposite direction to the first direction. Next, step S64 is executed, calculating a first compensation angle θ1 using the first distance S1 and the second distance S2. Next, step S65 is executed, adjusting the flatness between the pick-and-place surface 11 and the reference surface 30 using the first compensation angle θ1. Next, step S66 is executed to adjust the flatness in other directions. For example, based on the measurement results of the distance sensor 20 in other directions, steps S62 to S65 can be re-executed until the flatness adjustment is completed in all measured directions.

[0073] Therefore, the method for adjusting the flatness of the plane in the first embodiment can be understood.

[0074] Next, the method for adjusting the flatness of the plane according to the second embodiment will be described. Please refer again. Figures 3 to 4BIn another embodiment, after the robotic arm 40 adjusts the angle of the pick-and-place mechanism 10 according to the first compensation angle θ1, that is, after completing the adjustment of the first direction corresponding to the maximum distance, the processing unit 50 can obtain a third distance in a second direction perpendicular to the first direction, and a fourth distance in the opposite direction of the second direction, wherein the third distance is greater than or equal to the fourth distance. In other words, when the first direction is 180 degrees, the second direction is 270 degrees or 90 degrees, and the third distance is the distance between the pick-and-place mechanism 10 and the reference surface 30 corresponding to the Z1 axis as measured by the distance sensor 20 in the second direction, and the fourth distance is the distance between the pick-and-place mechanism 10 and the reference surface 30 corresponding to the Z1 axis as measured by the distance sensor 20 in the opposite direction of the second direction. In one embodiment, the difference (S1-S2) between the first distance S1 and the second distance S2 is greater than or equal to the difference between the third distance and the fourth distance, but is not limited thereto. It should be noted that those skilled in the art will understand from this... Figures 3 to 4B The examples can be used to infer the situations of the third distance, the fourth distance, and the second compensation angle, so the third distance, the fourth distance, and the second compensation angle will not be shown in the attached figures.

[0075] Next, the processing unit 50 calculates a second compensation angle based on the third distance, the fourth distance, and the spacing D. In one embodiment, the third distance, the fourth distance, the spacing, and the second compensation angle conform to the following relationship:

[0076]

[0077] Subsequently, the robotic arm 40 adjusts the flatness of the pick-up and place-up surface 11 of the pick-up and place-up mechanism 10 in the second direction relative to the reference surface 30 according to the second compensation angle.

[0078] In addition, in one embodiment, the processing unit 50 may first calculate the first compensation angle θ1 and the second compensation angle, and then simultaneously adjust the flatness of the pick-up and place-up surface 11 of the pick-up and place-up mechanism 10 between the reference surface 30 in the first direction and the second direction.

[0079] By utilizing the features of the aforementioned components, the assembly device 1 can perform the planar flatness adjustment method of the second embodiment. Figure 7 This is a flowchart of the steps of the planar flatness adjustment method according to the second embodiment of this disclosure, and please also refer to... Figures 1 to 5 .

[0080] like Figure 7As shown, firstly, step S71 is executed, providing a pick-and-place mechanism 10, which includes a distance sensor 20. Next, step S72 is executed, using the distance sensor 20 to measure a first distance S1 between the pick-and-place mechanism 10 and the reference surface 30 in a first direction. The distance sensor 20 can measure multiple distances in multiple directions, setting the direction of the largest distance among these measured distances as the first direction, and setting this largest distance as the first distance S1. Next, step S73 is executed, using the distance sensor 20 to measure a second distance S2 between the pick-and-place mechanism 10 and the reference surface 30 in the opposite direction to the first direction. Next, step S74 is executed, using the first distance S1 and the second distance S2 to calculate a first compensation angle θ1. Next, step S75 is executed, adjusting the flatness between the pick-and-place surface 11 and the reference surface 30 using the first compensation angle θ1. Next, step S76 is executed, using the distance sensor 20 to measure a third distance between the pick-and-place mechanism 10 and the reference surface 30 in a second direction perpendicular to the first direction. Next, step S77 is executed, using distance sensor 20 to measure a fourth distance between the pick-and-place mechanism 10 and the reference surface 30 in the opposite direction to the second direction, wherein the third distance is greater than or equal to the fourth distance. Next, step S78 is executed, using the third distance and the fourth distance to calculate a second compensation angle. Next, step S79 is executed, adjusting the flatness between the pick-and-place surface 11 and the reference surface 30 by the second compensation angle θ2.

[0081] By adjusting the flatness between the pick-up / placement surface 11 and the reference surface 30 using the first compensation angle θ1 and the second compensation angle, the flatness between the pick-up / placement surface 11 and the reference surface 30 can be made nearly uniform. Therefore, the second embodiment can also improve the problems of the prior art and increase efficiency.

[0082] Furthermore, although in the planar flatness adjustment method of the second embodiment, the calculation of the second compensation angle and the flatness adjustment (e.g., steps S76 to S77) will only begin after the flatness adjustment based on the first compensation angle θ1 is completed (e.g., after steps S74 to S75), in another embodiment, it can be changed to first calculating the first compensation angle θ1 and the second compensation angle in sequence, and then calculating a third direction and a third compensation angle using the first direction, the first compensation angle, the second direction, and the second compensation angle, and then performing a one-time angle adjustment, thereby saving more adjustment time.

[0083] In one embodiment, this disclosure can at least compare the assembly device 1 with an object by means of mechanical observation, for example, by using the presence or absence of elements and / or the arrangement of elements as evidence of whether the object falls within the scope of protection of this disclosure, and is not limited thereto.

[0084] Therefore, the assembly device 1 of this disclosure can perform the planar flatness adjustment method of the first embodiment, and can automatically detect whether the pick-up / placement surface 11 of the pick-up / placement mechanism 10 and the reference surface 30 have the same flatness. Alternatively, this disclosure can perform the adjustment automatically. Therefore, it can greatly improve the shortcomings of the prior art that relies on manual observation and adjustment.

[0085] Details or features of the various embodiments disclosed herein may be freely combined and used as long as they do not violate the spirit of the invention or conflict with it.

[0086] The above embodiments are merely illustrative examples for ease of explanation. The scope of the rights claimed in this disclosure should be determined by the claims in the patent application, and not limited to the above embodiments.

Claims

1. A method for adjusting the flatness of a plane, characterized in that, Including the following steps: A pick-and-place mechanism is provided, wherein the pick-and-place mechanism includes a distance sensor and a pick-and-place surface; The distance sensor is used to measure a first distance between the pick-and-place mechanism and a reference surface in a first direction; The distance sensor is used to measure a second distance between the pick-and-place mechanism and the reference surface in the opposite direction to the first direction; A first compensation angle is calculated using the first distance and the second distance; and The flatness between the pick-up / placement surface and the reference surface is adjusted by the first compensation angle.

2. The method as described in claim 1, characterized in that, There is a distance between the distance sensor and a center of the pick-and-place mechanism, and the first distance is greater than or equal to the second distance, wherein the first distance, the second distance, the distance, and the first compensation angle are related as follows: Where S1 is the first distance, S2 is the second distance, D is the spacing, and θ1 is the first compensation angle.

3. The method as described in claim 2, characterized in that, The pick-and-place mechanism is mounted on a robotic arm.

4. The method as described in claim 3, characterized in that, The robotic arm is fixed to the reference surface.

5. The method as described in claim 4, characterized in that, The first compensation angle corresponds to a coordinate system of the robotic arm.

6. The method as described in claim 2, characterized in that, It also includes the following steps: The distance sensor is used to obtain a third distance in a second direction perpendicular to the first direction, and a fourth distance in a direction opposite to the second direction; and A second compensation angle is calculated using the third distance and the fourth distance.

7. The method as described in claim 6, characterized in that, The third distance is greater than or equal to the fourth distance, and the third distance, the fourth distance, and the second compensation angle satisfy the following relationship:

8. The method as described in claim 6, characterized in that, The difference between the first distance and the second distance is greater than or equal to the difference between the third distance and the fourth distance.

9. The method as described in claim 1, characterized in that, The pick-and-place mechanism is used to pick up and place a panel, and the reference surface is used to place a backlight module.

10. The method as described in claim 1, characterized in that, The first distance is the maximum distance among multiple distances between the pick-and-place mechanism and the reference surface measured by the distance sensor in multiple directions.

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