PCB chemical copper plating equipment and process

Abstract

The application discloses a PCB chemical copper plating device and process, which comprises a groove body loaded with copper plating reagent internally, and an annular clamp arranged outside the groove body, two opposite sides of the annular clamp are respectively an inlet direction and an outlet direction, each clamp of the annular clamp is composed of a chuck and guide columns located at two sides of the chuck, loading disc conveying wheels are arranged on the upper and lower sides of the inlet direction and the outlet direction, each loading disc conveying wheel is inserted between the top surfaces of the guide columns of the clamps on the upper and lower sides, and a PCB is located between the clamps on the two sides, a front horizontal roller and a rear horizontal roller are arranged on one side of the loading disc conveying wheel in the inlet direction and the outlet direction, a second roller for receiving counterclockwise incoming material of the loading disc conveying wheel on one side is arranged at the bottom of the groove body, and stirring paddles for fully and uniformly mixing the copper plating reagent are further arranged in the groove body. The application solves the problems of large space occupation, high use cost and influence on copper plating effect of the prior art.

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