Electroplating cleaning machine for circuit board manufacturing

Abstract

This invention discloses an electroplating cleaning machine for circuit board manufacturing, relating to the field of circuit board manufacturing technology. It includes a housing, a spray module on one side of the housing, a collection mechanism on the other side of the housing, a power mechanism on one side of the collection mechanism, and an impeller module mounted on the power mechanism. The circuit board body is clamped inside the impeller module. The spray module sprays cleaning fluid into the housing, the power mechanism rotates the impeller module, and the impeller module secures the circuit board body. This invention, through the arrangement of the housing, spray module, power mechanism, and impeller module, improves the cleaning effect on the circuit board body, ensuring uniform contact of the cleaning agent with the surface of the circuit board body. Simultaneously, centrifugal force accelerates the rotation of the circuit board body, preventing residual liquid from affecting the subsequent addition of different cleaning agents, thus improving the working efficiency of the device.

Description

Technical Field

[0001] This invention relates to the field of circuit board manufacturing technology, specifically to an electroplating cleaning machine used in circuit board manufacturing. Background Technology

[0002] During the circuit board manufacturing process, electroplating is performed on the surface of the circuit board to deposit metal ions onto the surface, forming a conductive layer or protective layer to enhance the conductivity or provide protection of the circuit board.

[0003] During the electroplating process, the circuit board needs to be immersed in the electroplating solution. After electroplating, the surface of the circuit board is prone to adhesion of the electroplating solution or other substances, which affects the circuit connectivity and the cleanliness of the circuit board. Therefore, the circuit board needs to be cleaned after electroplating.

[0004] Existing equipment for cleaning circuit boards involves immersing them sequentially in alkaline and acidic cleaning solutions to remove organic and inorganic impurities. Repeatedly lifting and lowering the circuit boards into the cleaning solutions causes them to sway, which can easily damage them. Furthermore, after immersion in the alkaline cleaning solution, alkaline liquid can drip into the subsequent acidic cleaning solution, reducing the cleaning capacity of the acidic cleaning solution immersion tank and decreasing the effectiveness of the equipment in cleaning the circuit boards. Therefore, an electroplating cleaning machine for circuit board manufacturing has been developed. Summary of the Invention

[0005] The purpose of this invention is to provide an electroplating cleaning machine for circuit board manufacturing, so as to solve the problems mentioned in the background art.

[0006] To solve the above-mentioned technical problems, the present invention provides the following technical solution:

[0007] An electroplating cleaning machine for circuit board manufacturing includes a housing, a spray module on one side of the housing, a collection mechanism on the other side of the housing, a power mechanism on one side of the collection mechanism, an impeller module on the power mechanism, and a circuit board body clamped inside the impeller module.

[0008] The spray module is used to spray cleaning fluid into the housing, the power mechanism is used to rotate the impeller module, and the impeller module is used to fasten the circuit board body.

[0009] The power mechanism includes a power motor, which is connected to the housing. The output shaft of the power motor is fixedly connected to a rotating shaft, and an impeller module is mounted on the rotating shaft.

[0010] The impeller module includes a positioning sleeve, one side of which is fixedly connected to a rotating shaft. A clamping module is provided on one side of the positioning sleeve and is connected to the circuit board body. A sponge strip is provided on the top of the clamping module and bevel teeth are provided on the bottom of the clamping module. A ring tooth is engaged on one side of the bevel teeth and is engaged with the inner wall of the positioning sleeve. A central control motor is provided on one side of the ring tooth, and the output shaft of the central control motor engages with the ring tooth through a gear.

[0011] The enclosure includes a processing tank with a hinged top cover, legs mounted on the front, protrusions on the inner wall, a base, a filter on the right side, and a mesh plate connected to the inner wall of the tank. Activated carbon is filled between the mesh plate and the filter. External air passes through the filter and comes into contact with the activated carbon, then passes through the mesh plate before entering the processing tank. This prevents airborne pollutants from corroding the circuit board and ensures a clean internal environment for the circuit board.

[0012] The spray module is equipped with nozzles connected to one side of a mesh panel. Several nozzles are arranged in a ring-shaped, equidistant distribution around the center point of the mesh panel. Two mesh panels are arranged symmetrically about the horizontal center line of the processing tank. The spray module is connected to a pressurizing device. Cleaning agent is poured into the pressurizing device, pressurized, and then sprayed from the nozzles. The nozzles in the spray module atomize the cleaning agent, ensuring even contact with the surface of the circuit board, avoiding cleaning dead zones and improving the cleaning effect.

[0013] The clamping module includes a bottom slide groove, the bottom of which is connected to bevel gears. A bidirectional threaded rod is installed inside the bottom slide groove, and a side clamping plate is mounted on the bottom slide groove via the bidirectional threaded rod. A fastening rotating rod is threaded to one side of the side clamping plate. The inner wall of the side clamping plate engages with the circuit board body, and a top slide groove engages with the top of the side clamping plate. The top of the top slide groove is connected to a sponge strip via a bearing. When clamping the circuit board body, the bidirectional threaded rods inside the bottom and top slide grooves are rotated according to the width of the circuit board body to adjust the distance between the two side clamping plates on the bottom and top slide grooves. The circuit board body is then placed into the groove on the inner side of the side clamping plate. The fastening rotating rod on one side of the side clamping plate is rotated to fix the circuit board body. The power motor is started to drive the impeller module to rotate, fixing the next circuit board body, thus improving the clamping efficiency of this device.

[0014] Several clamping modules are provided, equidistantly distributed in a ring around the outer wall of the positioning sleeve. The collection mechanism is connected to the housing. After clamping the circuit board body, the clamping modules form a fan structure in a ring around the outer wall of the positioning sleeve. Then, by activating the power motor in the power mechanism, the power motor drives the rotating shaft to rotate, causing the circuit board body to rotate. At the same time, the spraying module sprays cleaning agent into the processing tank. The rotation of the circuit board body ensures that the cleaning agent fully contacts the surface of the circuit board body. The cleaned liquid is thrown to the inner wall of the processing tank by the centrifugal force of rotation, and flows through the through hole at the bottom of the processing tank to the bottom box for centralized treatment.

[0015] Several protrusions are provided, equidistantly distributed in an arc shape around the bottom of the inner wall of the processing tank. Vertical through holes are formed between the protrusions, and the sides of each protrusion are rounded. One side of the sponge strip is attached to the inner wall of the processing tank. A power mechanism drives the impeller module to rotate, while the sponge strip rotates along the inner wall of the processing tank. The sponge strip absorbs and collects the cleaning agent adhering to the inner wall of the processing tank. When the sponge strip rotates to the bottom of the inner wall of the processing tank, the protrusions squeeze the sponge strip, squeezing out the absorbed liquid, which then flows into the bottom box through the through holes between the protrusions. This avoids losses caused by different acidic or alkaline cleaning agents when multiple cleaning solutions are needed for cleaning the circuit board body, ensuring the cleanliness of the inside of the processing tank and improving the self-cleaning capability of the device.

[0016] The collection mechanism includes a side cover connected to the left side of the processing tank. A mesh is installed inside the side cover, and an exhaust pipe is installed on top of the side cover. After being sprayed into the processing tank by the spray module, some of the cleaning agent vapor flows from the right side of the tank to the left. The side cover and mesh block the cleaning agent vapor, while the mesh filters impurities, reducing impurities in the flowing gas. The exhaust pipe guides the flowing air, directing the gas generated during the cleaning process to avoid harm to the user's safety. It also accelerates airflow on the circuit board after spraying the cleaning agent, speeding up the flow of the cleaning agent to the surface of the circuit board and improving the cleaning efficiency of the device.

[0017] A drain pipe is installed at the bottom of the base tank, and one side of the base tank is connected to the bottom of the side cover via a conduit. After the cleaning agent is sprayed into the processing tank, the cleaning agent vapor liquefies upon contact with the inner wall of the side cover. The collected liquid flows down the bottom of the side cover into the base tank, where it is centrally treated through the drain outlet at the bottom of the base tank. This improves the environmental friendliness of the device, avoids liquid leakage that could damage the environment, and also prevents the safety threats posed by acidic or alkaline cleaning agents to users.

[0018] Compared with the prior art, the beneficial effects achieved by the present invention are:

[0019] 1. By configuring the housing, spray module, power mechanism, and impeller module, the cleaning effect of this device on the circuit board body is improved. The spray module sprays the cleaning agent into the processing tank under pressure through the nozzle. The power mechanism drives the circuit board body arranged in a ring to rotate, so that the cleaning agent is evenly contacted with the surface of the circuit board body, avoiding the problem of cleaning dead corners on the surface of the circuit board body. At the same time, the rotation of the circuit board body promotes the air flow in the processing tank, accelerating the rapid coverage of the cleaning agent on the surface of the circuit board body. At the same time, the centrifugal force is used to accelerate the rotation of the circuit board body, throwing out residual liquid, avoiding the impact of residual liquid on the subsequent addition of different cleaning agents, thus improving the working efficiency of this device.

[0020] 2. By designing the housing, power mechanism, and impeller module, the utilization rate of the cleaning agent is improved. After the cleaning agent is atomized and sprayed into the processing tank, the power mechanism drives the circuit board body to rotate, accelerating the airflow inside the processing tank. At the same time, the impeller module is linearly and equidistantly distributed along the outer wall of the rotating shaft. After the cleaning agent reacts with the organic and inorganic impurities on the circuit board body, the large mass of liquid is thrown onto the inner wall of the processing tank by centrifugal force. Some of the cleaning agent does not come into contact with the circuit board body distributed in the rightmost ring on the rotating shaft, allowing the cleaning agent to flow along the airflow direction inside the processing tank to the next circuit board body, reducing the waste of cleaning agent and improving the environmental friendliness of the device.

[0021] 3. The design of the housing, power mechanism, impeller module, and collection mechanism prevents the leakage of cleaning agents and gases during the cleaning of the circuit board body, thus improving the safety of the device. As the impeller module rotates, it drives the sponge strips to rotate along the inner wall of the processing tank. The sponge strips scrape and clean the inner wall of the processing tank, improving the self-cleaning ability of the device. As the sponge strips pass over the protrusions, the collected liquid is squeezed out and collected through the bottom box. The collection mechanism guides the flow of gases generated during processing, preventing direct gas discharge from harming the user. After self-cleaning the processing tank, the device facilitates the use of acidic and alkaline cleaning agents, avoiding the impact of residual cleaning agents on subsequent cleaning. Attached Figure Description

[0022] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used together with the embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings:

[0023] Figure 1 This is a schematic diagram of the structure of the present invention;

[0024] Figure 2 This is a front view structural diagram of the present invention;

[0025] Figure 3 This is a side view cross-sectional structural schematic diagram of the present invention;

[0026] Figure 4 This is a frontal cross-sectional structural diagram of the present invention;

[0027] Figure 5 This is a schematic diagram of the connection structure between the processing tank and the protrusion of the present invention;

[0028] Figure 6 This is a schematic diagram of the left side view structure of the present invention;

[0029] Figure 7 This is a schematic diagram of the right-side side view structure of the present invention;

[0030] Figure 8 This is a schematic diagram of the connection structure between the impeller module and the circuit board body of the present invention;

[0031] Figure 9 This is a schematic diagram of the connection structure between the positioning sleeve and the circuit board body of the present invention;

[0032] Figure 10 This is a schematic diagram of the connection structure between the clamping module and the circuit board body of the present invention.

[0033] In the picture:

[0034] 1. Box body; 101. Processing tank; 102. Top cover; 103. Legs; 104. Protrusion; 105. Bottom box; 106. Filter screen; 107. Mesh plate;

[0035] 2. Spraying module;

[0036] 3. Power mechanism; 301. Power motor; 302. Rotating shaft;

[0037] 4. Impeller module; 401. Positioning sleeve; 402. Clamping module; 4021. Bottom slide groove; 4022. Side clamping plate; 4023. Fastening rotating rod; 4024. Top slide groove; 403. Sponge strip; 404. Bevel teeth; 405. Ring teeth;

[0038] 5. Circuit board body;

[0039] 6. Collection mechanism; 601. Side cover; 602. Grid; 603. Exhaust top pipe. Detailed Implementation

[0040] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0041] Please see Figures 1-10 The present invention provides the following technical solution:

[0042] An electroplating cleaning machine for circuit board manufacturing includes a housing 1, a spray module 2 on one side of the housing 1, a collection mechanism 6 on the other side of the housing 1, a power mechanism 3 on one side of the collection mechanism 6, an impeller module 4 on the power mechanism 3, and a circuit board body 5 clamped inside the impeller module 4.

[0043] The spray module 2 is used to spray cleaning fluid into the housing 1, the power mechanism 3 is used to rotate the impeller module 4, and the impeller module 4 is used to fasten the circuit board body 5.

[0044] The power mechanism 3 includes a power motor 301, which is connected to the housing 1. The output shaft of the power motor 301 is fixedly connected to a rotating shaft 302, and an impeller module 4 is mounted on the rotating shaft 302.

[0045] The impeller module 4 includes a positioning sleeve 401. One side of the positioning sleeve 401 is fixedly connected to the rotating shaft 302. A clamping module 402 is provided on one side of the positioning sleeve 401. The clamping module 402 is connected to the circuit board body 5. A sponge strip 403 is provided on the top of the clamping module 402. A bevel tooth 404 is provided on the bottom of the clamping module 402. A ring tooth 405 is engaged on one side of the bevel tooth 404. The ring tooth 405 is engaged with the inner wall of the positioning sleeve 401. A central control motor is provided on one side of the ring tooth 405. The output shaft of the central control motor is engaged with the ring tooth 405 through a gear.

[0046] The housing 1 includes a processing tank 101, with a top cover 102 hinged to the top of the processing tank 101. A stand 103 is mounted on the front of the processing tank 101. Protrusions 104 are provided on the inner wall of the processing tank 101. A base box 105 is provided at the bottom of the processing tank 101. A filter screen 106 is provided on the right side of the processing tank 101, and a mesh plate 107 is provided on one side of the filter screen 106, connected to the inner wall of the processing tank 101. Activated carbon is filled between the mesh plate 107 and the filter screen 106. External air passes through the filter screen 106 and comes into contact with the activated carbon inside. The air purified by the activated carbon passes through the mesh plate 107 and enters the interior of the processing tank 101, preventing airborne pollutants from corroding the circuit board body 5 and ensuring the cleanliness of the internal environment of the circuit board body 5.

[0047] The spray module 2 is equipped with spray nozzles connected to one side of the mesh plate 107. Several spray nozzles are arranged in a ring-shaped, equidistant distribution around the center point of the mesh plate 107. There are two mesh plates 107, symmetrically distributed about the horizontal centerline of the processing tank 101. The spray module 2 is connected to a pressurizing device. Cleaning agent is poured into the pressurizing device, pressurized, and then sprayed from the spray nozzles. The spray nozzles in the spray module 2 atomize the cleaning agent, ensuring even contact with the surface of the circuit board body 5, avoiding cleaning dead zones and improving the cleaning effect on the circuit board body 5.

[0048] Several clamping modules 402 are provided, and the clamping modules 402 are equidistantly distributed in a ring around the outer wall of the positioning sleeve 401. The collection mechanism 6 is connected to the box 1. After clamping the circuit board body 5, the clamping modules 402 form a fan structure in a ring around the outer wall of the positioning sleeve 401. Then, by starting the power motor 301 in the power mechanism 3, the power motor 301 drives the rotating shaft 302 to rotate, which in turn drives the circuit board body 5 to rotate. At the same time, the spraying module 2 sprays cleaning agent into the processing tank 101. The circuit board body 5 rotates, so that the cleaning agent comes into full contact with the surface of the circuit board body 5. The cleaned liquid is thrown to the inner wall of the processing tank 101 by the centrifugal force of rotation, and flows through the through hole at the bottom of the processing tank 101 to the bottom box 105 for centralized processing.

[0049] Several protrusions 104 are provided, and the protrusions 104 are equidistantly distributed in an arc shape around the bottom of the inner wall of the processing tank 101. Vertical through holes are formed between the protrusions 104, and the two sides of the protrusions 104 are rounded. One side of the sponge strip 403 is in contact with the inner wall of the processing tank 101. The impeller module 4 is driven to rotate by the power mechanism 3, and the sponge strip 403 rotates along the inner wall of the processing tank 101. The sponge strip 403 absorbs and collects the cleaning agent adhering to the inner wall of the processing tank 101. When the sponge strip 403 rotates to the bottom of the inner wall of the processing tank 101, the protrusions 104 squeeze the sponge strip 403, squeezing out the cleaning agent absorbed by the sponge strip 403. This then flows into the bottom box 105 through the through holes between the protrusions 104. When multiple cleaning solutions are needed to clean the circuit board body 5, this avoids losses caused by different acidic or alkaline cleaning agents, ensures the cleanliness of the inside of the processing tank 101, and improves the self-cleaning ability of the device.

[0050] The clamping module 402 includes a bottom slide groove 4021, the bottom of which is connected to a bevel tooth 404. A bidirectional threaded rod is provided inside the bottom slide groove 4021. A side clamping plate 4022 is installed on the bottom slide groove 4021 through the bidirectional threaded rod. A fastening rotating rod 4023 is threadedly connected to one side of the side clamping plate 4022. The inner wall of the side clamping plate 4022 is engaged with the circuit board body 5. A top slide groove 4024 is engaged with the top of the side clamping plate 4022. The top of the top slide groove 4024 is connected to the sponge strip plate 403 through a bearing. When clamping the circuit board body 5, according to the width of the circuit board body 5, rotate the bidirectional threaded rod inside the bottom slide groove 4021 and the top slide groove 4024 to adjust the distance between the two side clamps 4022 on the bottom slide groove 4021 and the top slide groove 4024, and put the circuit board body 5 into the groove opened on the inner side of the side clamp 4022. Rotate the fastening rotating rod 4023 on one side of the side clamp 4022 to fix the circuit board body 5. Start the power motor 301 to drive the impeller module 4 to rotate and fix the next circuit board body 5, thereby improving the clamping efficiency of this device.

[0051] The collection mechanism 6 includes a side cover 601, which is connected to the left side of the processing tank 101. A grid 602 is installed inside the side cover 601, and an exhaust pipe 603 is installed on the top of the side cover 601. After being sprayed into the processing tank 101 by the spray module 2, some of the cleaning agent vapor flows from the right side of the processing tank 101 to the left side. The side cover 601 and the grid 602 block the cleaning agent vapor, while the grid 602 filters impurities, reducing impurities in the flowing gas. The exhaust pipe 603 guides the flowing air, directing the gas generated during the cleaning process to avoid harm to the user's safety. It also accelerates the airflow on the circuit board body 5 after the cleaning agent is sprayed, speeding up the flow of the cleaning agent to the surface of the circuit board body 5 and improving the cleaning efficiency of the device.

[0052] A drain pipe is installed at the bottom of the base tank 105, and one side of the base tank 105 is connected to the bottom of the side cover 601 via a conduit. After the cleaning agent is sprayed into the processing tank 101, the cleaning agent vapor liquefies upon contact with the inner wall of the side cover 601. The collected liquid flows down the bottom of the side cover 601 into the base tank 105, where it is centrally treated through the drain outlet at the bottom of the base tank 105. This improves the environmental friendliness of the device, avoids liquid leakage that could damage the environment, and also prevents the safety threats posed by acidic or alkaline cleaning agents to users.

[0053] Working principle of the invention:

[0054] Open the top cover 102 of the processing tank 101, then fix the circuit board body 5 on the clamping module 402. According to the width of the circuit board body 5, rotate the bidirectional threaded rod inside the bottom slide 4021 and the top slide 4024 to adjust the distance between the two side clamps 4022 on the bottom slide 4021 and the top slide 4024. Place the circuit board body 5 into the groove opened on the inner side of the side clamp 4022. Rotate the fastening rod 4023 on one side of the side clamp 4022 to fix the circuit board body 5. Start the power motor 301 to drive the impeller module 4 to rotate and fix the next circuit board body 5.

[0055] While fixing the circuit board body 5, the sponge strip 403 is connected to the top slide groove 4024 through a bearing. The sponge strip 403 is rotated by the bearing to avoid the sponge strip 403 obstructing the clamping of the circuit board body 5. At the same time, the central control motor on one side of the ring tooth 405 is started, and the ring tooth 405 is rotated to drive the meshing bevel tooth 404 to rotate, so that the clamping module 402 connected to the bevel tooth 404 is deflected, and the angle of the clamping module 402 is adjusted so as to fix the circuit board body 5.

[0056] After the circuit board body 5 is fixed, the top cover 102 is closed, and then the central control motor on one side of the ring tooth 405 is started again. The angle of the circuit board body 5 distributed in a ring around the outer wall of the positioning sleeve 401 is adjusted so that the circuit board body 5 arranged in a ring at equal intervals forms a fan structure. This causes the circuit board body 5 to rotate while driving the air to flow. The air is blown from the right side of the processing tank 101 to the left side, enters the processing tank 101 through the filter screen 106, and is then discharged through the exhaust top pipe 603.

[0057] The cleaning agent is sprayed into the processing tank 101 through the nozzle in the spray module 2. At the same time, the power mechanism 3 is started. The power motor 301 drives the rotating shaft 302 to rotate. The rotating shaft 302 drives three impeller modules 4 that are linearly and equidistantly distributed along the outer wall of the rotating shaft 302 to rotate. Through the annular arrangement of the circuit board body 5, the air flow inside the processing tank 101 is accelerated. The air is filtered and purified by the activated carbon between the filter screen 106 on the right side of the processing tank 101 and the mesh plate 107. The purified air flows into the processing tank 101, pushing the cleaning agent moisture to flow onto the circuit board body 5. The centrifugal force generated by the air flow and the rotation of the circuit board body 5 makes the cleaning agent fully contact the surface of the circuit board body 5.

[0058] After the cleaning agent decomposes the impurities on the surface of the circuit board body 5, the mixture after decomposing the impurities has a large mass. During the rotation of the circuit board body 5, the mixture splashes onto the inner wall of the processing tank 101 through centrifugal force. Some of the cleaning agent water vapor that does not come into contact with the circuit board body 5 flows to the subsequent circuit board bodies 5 to act, reducing the loss of cleaning agent.

[0059] While the cleaning agent is sprayed into the impeller module 4 through the spray module 2, the rotation of the ring tooth 405 and the bevel tooth 404 is controlled, the annular arrangement angle of the circuit board body 5 on the clamping module 402 is adjusted, and the impact angle between the cleaning agent water vapor and the surface of the circuit board body 5 is controlled to ensure that the cleaning agent and the circuit board body 5 are in full contact.

[0060] While controlling the angle deflection of the circuit board body 5, the contact amount between the circuit board body 5 and the cleaning agent on the three linearly distributed impeller modules is controlled. After the circuit board body 5 on the first impeller module 4 on the right side of the rotating shaft 302 is deflected to a horizontal angle, the absorption of cleaning agent moisture is reduced, and the amount of cleaning agent moisture on the subsequently arranged circuit board bodies 5 is increased, ensuring that the circuit board bodies 5 on the rotating shaft 302 are fully cleaned and improving the automation level of this device.

[0061] As the impeller module 4 rotates, it drives the sponge strip 403 to rotate. The sponge strip 403 rotates along the inner wall of the processing tank 101, and collects the liquid on the inner wall of the processing tank 101. When the sponge strip 403 rotates to the bottom of the inner wall of the processing tank 101, the protrusion 104 squeezes the sponge strip 403 and squeezes out the liquid absorbed in the sponge strip 403. Then, the liquid flows into the bottom box 105 through the through holes opened between the protrusions 104, reducing the liquid residue on the inner wall of the processing tank 101 and ensuring the cleanliness of the inner wall of the processing tank 101.

[0062] After the cleaning agent is sprayed into the processing tank 101 and passes through the circuit board body 5, the cleaning agent moisture comes into contact with the inner wall of the side cover 601 and liquefies. The collected liquid flows down the bottom of the side cover 601 into the bottom tank 105. The collected liquid is then centrally treated through the drain outlet at the bottom of the bottom tank 105, which improves the environmental friendliness of this device.

[0063] Acidic and alkaline cleaning agents are injected into the tank 1 sequentially through the spray module 2 to clean the inorganic and organic impurities on the circuit board body 5 respectively. The power mechanism 3 drives the circuit board body 5 to rotate, accelerating the liquid flow on the circuit board body 5. At the same time, the sponge strip 403 is used to clean the inner wall of the processing tank 101, avoiding the impact of cleaning agent residue on subsequent cleaning liquid and improving the cleaning efficiency of this device.

[0064] After cleaning the impurities on the circuit board body 5, water is sprayed into the surface of the circuit board body 5 through the spray module 2 to rinse the surface of the circuit board body 5 and reduce the residue of impurities. After rinsing, the rotation of the rotating shaft 302 is accelerated to spin dry the water on the circuit board body 5. The top cover 102 is opened to take out the cleaned and dried circuit board body 5.

[0065] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0066] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An electroplating cleaning machine for circuit board manufacturing, characterized in that: Includes a housing (1), a spray module (2) is provided on one side of the housing (1), a collection mechanism (6) is installed on the other side of the housing (1), a power mechanism (3) is installed on one side of the collection mechanism (6), an impeller module (4) is installed on the power mechanism (3), and a circuit board body (5) is clamped inside the impeller module (4). The spray module (2) is used to spray cleaning fluid into the housing (1), the power mechanism (3) is used to rotate the impeller module (4), and the impeller module (4) is used to fasten the circuit board body (5). The power mechanism (3) includes a power motor (301), which is connected to the housing (1). The output shaft of the power motor (301) is fixedly connected to a rotating shaft (302), and an impeller module (4) is installed on the rotating shaft (302). The impeller module (4) includes a positioning sleeve (401), one side of which is fixedly connected to the rotating shaft (302). A clamping module (402) is provided on one side of the positioning sleeve (401). The clamping module (402) is connected to the circuit board body (5). A sponge strip (403) is provided on the top of the clamping module (402). A bevel tooth (404) is provided on the bottom of the clamping module (402). A ring tooth (405) is engaged on one side of the bevel tooth (404). The ring tooth (405) is engaged with the inner wall of the positioning sleeve (401). A central control motor is provided on one side of the ring tooth (405). The output shaft of the central control motor is engaged with the ring tooth (405) through a gear.

2. The electroplating cleaning machine for circuit board manufacturing according to claim 1, characterized in that: The housing (1) includes a processing tank (101), a top cover (102) is hinged to the top of the processing tank (101), a stand (103) is installed on the front of the processing tank (101), a protrusion (104) is provided on the inner wall of the processing tank (101), a bottom box (105) is provided at the bottom of the processing tank (101), a filter screen (106) is provided on the right side of the processing tank (101), a mesh plate (107) is provided on one side of the filter screen (106), and the mesh plate (107) is connected to the inner wall of the processing tank (101).

3. The electroplating cleaning machine for circuit board manufacturing according to claim 2, characterized in that: The spray module (2) is equipped with a nozzle, which is connected to one side of the mesh plate (107). There are several nozzles, which are distributed equidistantly in a ring about the center point of the mesh plate (107). There are two mesh plates (107), which are symmetrically distributed about the horizontal center line of the processing tank (101).

4. The electroplating cleaning machine for circuit board manufacturing according to claim 1, characterized in that: The clamping module (402) includes a bottom slide groove (4021), the bottom of which is connected to a bevel tooth (404). A bidirectional threaded rod is provided inside the bottom slide groove (4021). A side clamping plate (4022) is installed on the bottom slide groove (4021) through the bidirectional threaded rod. A fastening rotating rod (4023) is threadedly connected to one side of the side clamping plate (4022). The inner wall of the side clamping plate (4022) is engaged with the circuit board body (5). A top slide groove (4024) is engaged with the top of the side clamping plate (4022). The top of the top slide groove (4024) is connected to the sponge strip plate (403) through a bearing.

5. The electroplating cleaning machine for circuit board manufacturing according to claim 4, characterized in that: Several clamping modules (402) are provided, and the clamping modules (402) are distributed equidistantly in a ring around the outer wall of the positioning sleeve (401). The collecting mechanism (6) is connected to the box (1).

6. The electroplating cleaning machine for circuit board manufacturing according to claim 2, characterized in that: The protrusions (104) are provided in a plurality of manner, and the protrusions (104) are distributed equidistantly in an arc shape about the bottom of the inner wall of the processing tank (101). There are through holes vertically opened between the protrusions (104). The two sides of the protrusions (104) are rounded. One side of the sponge strip (403) is attached to the inner wall of the processing tank (101).

7. The electroplating cleaning machine for circuit board manufacturing according to claim 1, characterized in that: The collecting mechanism (6) includes a side cover (601) connected to the left side of the processing tank (101), a grid (602) is provided inside the side cover (601), and an exhaust pipe (603) is installed on the top of the side cover (601).

8. The electroplating cleaning machine for circuit board manufacturing according to claim 2, characterized in that: The bottom of the base box (105) is provided with a drain pipe, and one side of the base box (105) is connected to the bottom of the side cover (601) through a conduit.

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