Cold plate dismounting device

Abstract

This invention provides a cold plate disassembly device, relating to the field of server technology, for improving the disassembly efficiency of cold plate modules. The cold plate disassembly device is used to remove the chip motherboard from the cold plate motherboard. The device includes a snap-fit ​​structure and a moving component. The snap-fit ​​structure includes a support member and a snap-fit ​​member, the support member having a guide end. The snap-fit ​​member is connected to the support member and configured to snap-fit ​​with the cold plate motherboard. The moving component includes a hinged rotating member and a sliding member, the sliding member being configured to abut against the chip motherboard. The rotating member and the sliding member can slide relative to the support member in a first direction. The rotating member is rotatable relative to the support member, and when it rotates relative to the support member to abut against the guide end, the rotating member, guided by the guide end, drives the sliding member to slide towards the chip motherboard, thereby separating the chip motherboard from the cold plate motherboard, resulting in high separation efficiency between the cold plate motherboard and the chip motherboard.

Description

Technical Field

[0001] This invention relates to the field of server technology, and in particular to a cold plate disassembly device. Background Technology

[0002] With the rapid development of information technology and the expansion of data center operations, the number and power density of electronic components inside servers have steadily increased, resulting in a significant increase in server heat generation. Effective heat removal from inside the server ensures efficient operation and extends its lifespan.

[0003] In related technologies, a server includes a chassis, motherboard, chip bracket, chips, and a cold plate module. The motherboard, chip bracket, chips, and cold plate module are housed within the chassis. The chip bracket is fixed to the motherboard, the chips are housed within the chip bracket, and the cold plate module is mounted on the chips. The cold plate module includes a cold plate, an inlet pipe, an outlet pipe, and spring screws. The cold plate is fixed to the chip bracket by the spring screws. A thermally conductive material is placed between the cold plate and the chips. The inlet and outlet pipes are respectively mounted on the cold plate. Cooling water flows into the cold plate through the inlet pipe. Heat is conducted between the cold plate and the chips through the thermally conductive material. The cooling water in the cold plate carries away the heat generated by the chips during operation and then flows out through the outlet pipe.

[0004] The cold plate and the chip are bonded together by a thermally conductive material, resulting in a tight interface. Moreover, the thermally conductive material usually displaces the air between the cold plate and the chip surface under pressure, creating a local vacuum between the cold plate and the chip, making the disassembly of the cold plate module quite difficult. Summary of the Invention

[0005] This invention provides a cold plate disassembly device, which can efficiently separate the cold plate motherboard from the chip motherboard by cooperating with the pre-set disassembly holes on the cold plate motherboard, that is, the disassembly efficiency of the cold plate module is high.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] In a first aspect, the present invention provides a cold plate removal device for removing a chip motherboard from a cold plate motherboard. The cold plate removal device includes a snap-fit ​​structure and a movable component. The snap-fit ​​structure includes a support component and a snap-fit ​​component. The support component has a guide end. The snap-fit ​​component is connected to the support component and is configured to snap-fit ​​with the cold plate motherboard. The movable component includes a rotating component and a sliding component hinged together. The sliding component is configured to abut against the chip motherboard. The rotating component and the sliding component are slidable relative to the support component along a first direction.

[0008] The rotating member is rotatable relative to the support member, and when the rotating member rotates relative to the support member to abut against the guide end, the rotating member drives the sliding member to slide toward the chip motherboard under the guidance of the guide end, so that the chip motherboard and the cold plate motherboard are separated from each other.

[0009] In one possible implementation, the support includes a support block and a hook, the hook being connected to a first side of the support block and used to engage with the cold plate motherboard.

[0010] In one possible implementation, the second side of the support block is provided with a groove, the rotating member and the sliding member are slidably connected to the groove, the groove has a guide wall located at one end of the groove near the rotating member to form the guide end.

[0011] In one possible implementation, the guide wall is a guide slope inclined toward the slider, and the angle between the guide slope and the bottom surface of the groove is an obtuse angle.

[0012] In one possible implementation, the first sidewall of the support block is provided with a receiving groove, and the hook is hinged to the sidewall of the receiving groove so that the engaging end of the hook can rotate to extend into or out of the receiving groove.

[0013] In one possible implementation, the hook includes a force-applying section, a connecting portion, and a locking section connected in sequence. The force-applying section and the locking section are hinged to the side wall of the receiving groove through the connecting portion. The side wall of the receiving groove is provided with a clearance opening, which is provided corresponding to at least a portion of the force-applying section, so that an external force acts on the force-applying section through the clearance opening to adjust the rotation angle of the hook.

[0014] In one possible implementation, the cold plate disassembly device further includes a first elastic element, the hook being connected to the support block via the first elastic element, the elastic force of the first elastic element pointing towards the support block, so that the hook is retracted into the receiving groove.

[0015] In one possible implementation, the first elastic element includes a first spring, the snap-fit ​​segment has a protrusion located on the side of the snap-fit ​​segment facing the receiving groove, the bottom wall of the receiving groove is provided with a slot, and the first spring is connected between the protrusion and the slot.

[0016] In one possible implementation, the cold plate disassembly device further includes a second elastic element connected between the sliding element and the support block, the elastic force of the second elastic element pointing towards the guide end.

[0017] In one possible implementation, the bottom wall of the slide is provided with a boss, the boss is provided with a through hole, the first side wall of the sliding member is provided with a groove, the boss extends into the groove, the groove wall is provided with a support, the support is connected vertically between two opposite groove walls of the groove and passes through the through hole, and the second elastic member is connected between the support and the boss.

[0018] The cold plate disassembly device provided in this embodiment of the invention has at least the following beneficial effects:

[0019] A disassembly hole is provided on the cold plate. The cold plate disassembly device is held by one hand and inserted into the disassembly hole through the snap-fit ​​structure to snap into the cold plate motherboard. The moving part slides relative to the snap-fit ​​structure toward the chip motherboard. The moving part is resisted by the chip motherboard, which drives the snap-fit ​​structure to separate the cold plate motherboard from the chip motherboard. This cold plate disassembly structure is simple in design and easy to operate. It avoids setting up a complex disassembly mechanism on the cold plate, and the cost is controllable, which is conducive to promotion. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram illustrating the structure of the cold plate module and chip module provided in the embodiments of the present invention;

[0022] Figure 2 This is a schematic diagram illustrating the structure of the cold plate disassembly device provided in this embodiment of the invention for the disassembly process of the cold plate mainboard;

[0023] Figure 3 This is a schematic diagram of the cold plate disassembly device provided in an embodiment of the present invention;

[0024] Figure 4 for Figure 3 Schematic diagram of the middle support block;

[0025] Figure 5 for Figure 3 Schematic diagram of the middle hook structure;

[0026] Figure 6 for Figure 3 Schematic diagram of the moving parts of the intercooler plate disassembly device before and after movement;

[0027] Figure 7 for Figure 2A schematic diagram showing the structure of the intercooler plate disassembly device before and after the hook rotates and engages with the main plate after it extends into the disassembly hole.

[0028] Explanation of reference numerals in the attached figures:

[0029] 100-Cold Plate Module;

[0030] 110 - Cold plate mainboard; 111 - Removal hole;

[0031] 200-chip module;

[0032] 210-chip motherboard;

[0033] 300-Cold plate dismantling device;

[0034] 310 - Moving parts;

[0035] 311-Rotating component; 312-Sliding component; 3121-Groove; 3122-Support column;

[0036] 320-Snap-fit ​​Structure;

[0037] 321-Support Block;

[0038] 3211-Slide groove; 3212-Guide wall; 3213-Boss;

[0039] 3214 - Receiving groove; 3215 - Clearance opening; 3216 - Card slot;

[0040] 322-Hook;

[0041] 3221 - Force-applying section; 3222 - Connecting part; 3223 - Snap-fit ​​section; 3224 - Protrusion; 323 - First elastic element;

[0042] 330 - Second elastic element. Detailed Implementation

[0043] As described in the background section, with the increasing use of servers, efficient internal heat dissipation plays a crucial role in their high-performance operation. In related technologies, a server includes a chassis, motherboard, chip bracket, chips, and a cold plate module. The motherboard, chip bracket, chips, and cold plate module are housed within the chassis. The chip bracket is fixed to the motherboard, the chips are housed within the chip bracket, and the cold plate module is mounted on the chips. The cold plate module includes a cold plate, an inlet pipe, an outlet pipe, and spring screws. The cold plate is fixed to the chip bracket by the spring screws. A thermally conductive material is placed between the cold plate and the chips. The inlet and outlet pipes are respectively installed on the cold plate. Cooling water flows into the cold plate through the inlet pipe. Heat is conducted between the cold plate and the chips through the thermally conductive material. The cooling water in the cold plate carries away the heat generated by the chips during operation and flows out through the outlet pipe. The cold plate and chips are bonded together by the thermally conductive material, resulting in a tight interface. Furthermore, the thermally conductive material typically displaces air between the cold plate and chip surfaces under pressure, creating a partial vacuum between them, making disassembly of the cold plate module difficult.

[0044] The applicant's research revealed that the aforementioned problem stems from the following: Currently, the chips on the motherboard are made of multiple thermally conductive materials and phase-change materials. At room temperature, the chip materials are tightly connected to the cold plate, making cold plate removal extremely difficult. Specifically, the reasons for the difficulty in removing the cold plate include the following: Firstly, the space on the motherboard where the chips are installed is limited, leaving no extra space for a disassembly structure; secondly, when removing the cold plate, it is necessary to ensure the stability of the chip and avoid damaging its structure; furthermore, during the disassembly process, the cold plate is generally connected to the motherboard containing the chips via spring screws, with a connection force of hundreds of pounds between them. The thermally conductive materials between them are under pressure, and at room temperature, the thermally conductive materials create adhesive force between the cold plate and the chip. When it is necessary to separate the cold plate and the chip, after removing the spring screws, it is necessary to further overcome the adhesive force of the thermally conductive materials to disassemble the cold plate.

[0045] To address the aforementioned technical problems, this invention provides a cold plate disassembly device. A disassembly hole is provided on the cold plate. After the cold plate module and chip module are unlocked, the cold plate disassembly device is held in one hand and inserted into the disassembly hole via a snap-fit ​​structure to snap into the cold plate motherboard. A movable component slides relative to the snap-fit ​​structure toward the chip motherboard. The movable component receives a resisting force from the chip motherboard, driving the snap-fit ​​structure to separate the cold plate motherboard from the chip motherboard. This lifts the cold plate by approximately 2-3 mm, loosening it relative to the chip motherboard, allowing for easy disassembly. This cold plate disassembly structure is simple in design, convenient to operate, avoids complex disassembly mechanisms on the cold plate, has controllable costs, and is easy to promote.

[0046] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0047] To make the above-mentioned objectives, features, and advantages of the embodiments of the present invention more apparent and understandable, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0048] Combination Figures 1-7 This invention provides a cold plate removal device for removing a chip motherboard 210 from a cold plate motherboard 110. The cold plate removal device 300 includes a snap-fit ​​structure 320 and a moving member 310. The snap-fit ​​structure 320 includes a support member and a snap-fit ​​member. The support member has a guide end. The snap-fit ​​member is connected to the support member and is configured to snap-fit ​​with the cold plate motherboard 110. The moving member 310 includes a hinged rotating member 311 and a sliding member 312. The sliding member 312 is configured to abut against the chip motherboard 210. The rotating member 311 and the sliding member 312 can slide relative to the support member in a first direction. The support member can be a support block 321.

[0049] The rotating member 311 is rotatable relative to the support member. When the rotating member 311 rotates relative to the support member to the position where it abuts against the guide end, the rotating member 311 drives the sliding member 312 to slide toward the chip motherboard 210 under the guidance of the guide end, so that the chip motherboard 210 and the cold plate motherboard 110 are separated from each other.

[0050] In other words, the cold plate module 100 includes a cold plate motherboard 110, and the chip module 200 includes a chip motherboard 210. The cold plate motherboard 110 and the chip motherboard 210 are fitted together with a clearance. The cold plate motherboard 110 is provided with a disassembly hole 111. The snap-fit ​​structure 320 is configured to extend into the disassembly hole 111 and snap-fit ​​with the cold plate motherboard 110. The moving part 310 abuts against the chip motherboard 210. When the moving part 310 slides relative to the snap-fit ​​structure 320 toward the chip motherboard 210, the moving part 310 is subjected to the abutment force from the chip motherboard 210, which drives the snap-fit ​​structure 320 to separate the cold plate motherboard 110 from the chip motherboard 210.

[0051] In this way, a disassembly hole 111 is provided on the cold plate. The cold plate disassembly device 300 is held by one hand and inserted into the disassembly hole 111 through the snap-fit ​​structure 320 to snap into the cold plate main board 110. The moving part 310 slides relative to the snap-fit ​​structure 320 toward the chip main board 210. The moving part 310 is resisted by the chip main board 210, which drives the snap-fit ​​structure 320 to separate the cold plate main board 110 from the chip main board 210. This cold plate disassembly structure is simple in design and easy to operate. It avoids setting up a complex disassembly mechanism on the cold plate, and the cost is controllable, which is conducive to promotion.

[0052] Based on the above embodiments, an improvement can be made by including a support block 321 and a hook 322 in the snap-fit ​​structure 320. The hook 322 is connected to the first side of the support block 321 and is used to snap-fit ​​with the cold plate motherboard.

[0053] The movable component 310 includes a rotating component 311 and a sliding component 312 hinged together. For example, the rotating component 311 and the sliding component 312 can be plates. Both the rotating component 311 and the sliding component 312 are movably connected to the second side of the support block 321. The rotating component 311 and the sliding component 312 can slide relative to the support block 321 in a first direction. The second side of the support block 321 is provided with a groove 3211. The rotating component 311 and the sliding component 312 are slidably connected to the groove 3211. The groove 3211 has a guide wall 3212, which is located at the end of the groove 3211 near the rotating component 311 to form a guide end. Figure 6 When the rotating component 311 rotates toward the support block 321 to the first position, that is, from Figure 6 When the rotating part 311 rotates from the state shown on the left to the state shown on the right, it abuts against the guide wall 3212, and under the force of the guide wall 3212, pushes the sliding part 312 to slide towards the chip motherboard 210, further engaging... Figure 2 After the bolts between the cold plate mainboard 110 and the chip mainboard 210 are unlocked, the rotating component 311 pushes the sliding component 312 to slide towards the chip mainboard 210 until the sliding component 312 abuts against the chip mainboard 210. The resulting reaction force is transmitted to the hook 322 and the cold plate mainboard 110 to achieve the separation of the cold plate mainboard 110 and the chip mainboard 210.

[0054] In one possible implementation, the first end of the rotating member 311 is hinged to the first end of the sliding member 312. The guide wall 3212 has a guide slope facing the sliding member 312 and inclined relative to the sliding member 312. The angle between the guide slope and the bottom surface of the groove 3211 is an obtuse angle, for example, 120 degrees, 150 degrees or 160 degrees. When the rotating member 311 rotates toward the support block 321 to the first position, the rotating member 311 abuts against the guide slope, so that the rotating member 311 pushes the sliding member 312 toward the chip motherboard 210.

[0055] refer to Figure 2 and Figure 4 The guide slope ensures that when the rotating part 311 rotates near the support block 321, its rotation angle around its first end is within the acute angle range. This causes the rotating part 311 to drive the sliding part 312 to move downward in the vertical direction, i.e., towards the chip motherboard 210, so that the chip motherboard 210 and the cold plate motherboard 110, which are bonded by thermally conductive material to form a gap fit, can be well separated, and the gap a between the two is expanded to the distance b after separation.

[0056] As one possible implementation method, refer to Figure 7 The cold plate disassembly device also includes a first elastic element 323. The hook 322 is connected to the support block 321 through the first elastic element 323. The elastic force of the first elastic element 323 points towards the support block 321, so that the hook 322 is put into the receiving groove 3214. In this way, before and after the cold plate disassembly work, the cold plate disassembly device 300 can flexibly enter and exit the disassembly hole 111 on the cold plate main board 110, and the hook 322 is efficiently put into the receiving groove, which is also conducive to its daily structural protection.

[0057] In other possible embodiments, the first elastic element 323 includes a first spring, the snap-fit ​​segment 3223 has a protrusion 3224 located on the side of the snap-fit ​​segment 3223 facing the receiving groove 3214, and the bottom wall of the receiving groove 3214 is provided with a slot 3216 for engagement. Figure 6 The bottom wall of the receiving groove 3214, that is, the inner wall of the receiving groove 3214 facing the hook 322 in the horizontal direction, is connected between the protrusion 3224 and the groove 3216. This arrangement improves the connection stability of the first spring in the vertical direction between the hook 322 and the inner wall of the receiving groove 3214, and ensures the stability of the hook 322 when rotating relative to the receiving groove 3214.

[0058] In another possible implementation, the cold plate disassembly device 300 further includes a second elastic member 330, which is connected between the sliding member 312 and the support block 321. The elastic force of the second elastic member 330 points towards the guide wall 3212. In this way, by setting the second elastic member 330, when the rotating member 311 is in the initial position and is not in contact with the guide wall 3212, the sliding member 312 is retracted into the groove 3211 of the support block 321 under the elastic force of the second elastic member 330.

[0059] In some embodiments, the bottom wall of the slide 3211 is provided with a boss 3213, which, in conjunction with Figure 3The bottom wall of the slide groove 3211 is the side wall of the slide groove 3211 that is opposite to the moving member 310 in the horizontal direction. The boss 3213 extends toward the sliding member 312 and has a through hole. The first side wall of the sliding member 312 has a groove 3121. The boss 3213 extends into the groove 3121. The groove wall of the groove 3121 has a support column 3122. The support column 3122 is connected in the vertical direction between the two opposite groove walls of the groove 3121 and passes through the through hole. The second elastic member 330 is connected between the support column 3122 and the boss 3213.

[0060] In this way, the elastic fit structure between the boss 3213 and the support column 3122 on the slider 312 is designed to achieve the support and return function of the slider 312, so that the slider 312 can be automatically stored in the slide groove 3211 during normal use, which plays a structural protection role for the slider 312.

[0061] In more embodiments, the second elastic member 330 includes a second spring, which is sleeved on the outer periphery of the support column 3122, and one end of the second spring is connected to the side wall of the boss 3213 facing the rotating member 311.

[0062] As an example, the first side wall of the support block 321 is provided with a receiving groove 3214, and the hook 322 is hinged to the side wall of the receiving groove 3214 so that the snap-fit ​​end of the hook 322 can rotate to extend into or out of the receiving groove 3214. In this way, by setting the receiving groove 3214, the first side of the support block 321 serves as a storage shell for the hook 322. When the cold plate disassembly device 300 is not in use, it can be hidden in the receiving groove 3214. When the cold plate disassembly operation is required, the hook 322 can be rotated out of the receiving groove 3214 to snap with the edge of the cold plate main board 110. This not only protects the outer peripheral structure of the hook 322, but also improves the structural utilization rate of the support block 321.

[0063] Based on the above embodiment, the hook 322 can be improved by including a force-applying section 3221, a connecting part 3222, and a locking section 3223 connected in sequence. The force-applying section 3221 and the locking section 3223 are hinged to the side wall of the receiving groove 3214 through the connecting part 3222. The side wall of the receiving groove 3214 is provided with a clearance opening 3215. The clearance opening 3215 is provided corresponding to at least a part of the force-applying section 3221 so that external force acts on the force-applying section 3221 through the clearance opening 3215 to adjust the rotation angle of the hook 322.

[0064] In many other implementations, combined Figure 6Along the direction perpendicular to the paper, the groove 3211 of the support block 321 has limiting holes on both sides of the groove wall. The sliding member 312 has a protrusion corresponding to the limiting hole. The protrusion is engaged with the limiting hole. The limiting hole has a certain length in the vertical direction, so that a moving channel is formed in the limiting hole for the sliding member 312 to slide vertically and drive the protrusion to move in the limiting hole, which further improves the stability of the sliding member 312 relative to the groove 3211 of the support block 321.

[0065] Specifically, when using the cold plate disassembly device 300 to separate the cold plate mainboard 110 and the chip mainboard 210, a person can hold the cold plate disassembly device 300 with one hand and insert it into the pre-set disassembly hole 111 of the cold plate mainboard 110. By squeezing the force application section 3221 of the hook 322 through the clearance opening 3215, it rotates counterclockwise, causing the locking section 3223 to engage with the edge of the cold plate mainboard 110. Squeezing the rotating part 311 causes it to rotate towards the support block 321, thus contacting the guide slope of the guide wall 3212 on the upper part of the slide groove 3211 of the support block 321. The guide slope provides a reaction force, causing the rotating part 311 to drive the sliding part 312 to move downwards until it abuts against the chip mainboard 210. The reverse abutment force generated by the chip mainboard 210 is transmitted to the hook 322 and the locking part of the cold plate mainboard 110, causing the cold plate mainboard 110 and the chip mainboard 210 to separate. See details... Figure 2 and 3 .

[0066] Understandably, when the rotating part 311 is not under force, the sliding part 312 will be pulled back into the slide groove 3211 under the action of the second elastic part 330; moreover, the arrangement of the first elastic part 323 between the hook 322 and the receiving groove 3214 allows the hook end of the hook 322 to retract into the receiving groove 3214 under the abutment force of the wall of the disassembly hole 111 when one end of the cold plate disassembly device 300 is inserted into the disassembly hole 111 of the cold plate main board 110. After the hook end has completely passed through the disassembly hole 111, it can be rebounded and engaged with the edge of the cold plate main board 110. Alternatively, personnel can manually apply force to the force application section 3221 through the clearance opening 3215 to rotate the hook 322 and engage the cold plate main board 110.

[0067] In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0068] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0069] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0070] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0071] The various embodiments or implementation methods described in this specification are presented in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other.

[0072] It should be noted that the embodiments referred to in the specification, such as "one embodiment," "embodiment," "exemplary embodiment," and "some embodiments," may include specific features, structures, or characteristics, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. Moreover, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments, whether explicitly described or not, is within the knowledge scope of those skilled in the art.

[0073] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A cold plate disassembly device, characterized in that, For removing a chip motherboard from a cold plate motherboard, the cold plate removal device includes a snap-fit ​​structure and a moving part. The snap-fit ​​structure includes a support member and a snap-fit ​​member. The support member has a guide end. The snap-fit ​​member is connected to the support member and is configured to snap-fit ​​with the cold plate motherboard. The moving part includes a hinged rotating member and a sliding member. The sliding member is configured to abut against the chip motherboard. The rotating member and the sliding member can slide relative to the support member in a first direction. The rotating member is rotatable relative to the support member, and when the rotating member rotates relative to the support member to abut against the guide end, the rotating member drives the sliding member to slide toward the chip motherboard under the guidance of the guide end, so that the chip motherboard and the cold plate motherboard are separated from each other. The support member includes a support block, and the snap-fit ​​member includes a snap hook. The snap hook is connected to a first side of the support block and is used to snap-fit ​​with the cold plate mainboard. The second side of the support block is provided with a sliding groove, the rotating member and the sliding member are slidably connected to the sliding groove, the sliding groove has a guide wall, the guide wall is located at one end of the sliding groove near the rotating member, so as to form the guide end; The guide wall is a guide slope that is inclined toward the slider, and the angle between the guide slope and the bottom surface of the groove is an obtuse angle.

2. The cold plate disassembly device according to claim 1, characterized in that, The first side wall of the support block is provided with a receiving groove, and the hook is hinged to the side wall of the receiving groove so that the hooking end can rotate to extend into or out of the receiving groove.

3. The cold plate disassembly device according to claim 2, characterized in that, The hook includes a force-applying section, a connecting part, and a locking section connected in sequence. The force-applying section and the locking section are hinged to the side wall of the receiving groove through the connecting part. The side wall of the receiving groove is provided with a clearance opening, which is provided corresponding to at least part of the force-applying section so that external force is applied to the force-applying section through the clearance opening to adjust the rotation angle of the hook.

4. The cold plate disassembly device according to claim 3, characterized in that, The cold plate disassembly device further includes a first elastic element, and the hook is connected to the support block through the first elastic element. The elastic force of the first elastic element points towards the support block so that the hook is retracted into the receiving groove.

5. The cold plate disassembly device according to claim 4, characterized in that, The first elastic element includes a first spring, the snap-fit ​​section has a protrusion located on the side of the snap-fit ​​section facing the receiving groove, the bottom wall of the receiving groove is provided with a slot, and the first spring is connected between the protrusion and the slot.

6. The cold plate dismantling device according to any one of claims 1-5, characterized in that, The cold plate disassembly device further includes a second elastic element, which is connected between the sliding element and the support block, and the elastic force of the second elastic element points towards the guide end.

7. The cold plate disassembly device according to claim 6, characterized in that, The bottom wall of the slide is provided with a boss, the boss is provided with a through hole, the first side wall of the sliding member is provided with a groove, the boss extends into the groove, the groove wall is provided with a support, the support is connected vertically between two opposite groove walls of the groove and passes through the through hole, and the second elastic member is connected between the support and the boss.

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