Wafer rotating mechanism, wafer post-processing device and method

Abstract

The embodiment of the application provides a wafer rotating mechanism, a wafer cleaning device and a wafer cleaning method. The wafer rotating mechanism comprises a rotating shaft, a rotating disc and a shielding piece. The rotating shaft is arranged perpendicularly to a horizontal plane and can rotate along the rotating shaft axis. The rotating disc is concentrically arranged to the upper end of the rotating shaft to support the wafer. The shielding piece is pivotally connected to the rotating disc to pivot between a first position and a second position. The shielding piece is located at the outer periphery of the wafer on the rotating disc. When the rotating shaft rotates, the shielding piece pivots from the second position to the first position, so that the top of the shielding piece is higher than the wafer. When the rotating shaft stops rotating, the shielding piece is located at the second position, so that the top of the shielding piece is lower than the wafer. According to the wafer rotating mechanism of the embodiment of the application, the shielding piece has a height that can be changed and can rotate synchronously with the rotating shaft. The shielding piece can shield the waste liquid thrown out by the wafer rotation, and can avoid hindering the interaction between the transmission mechanism and the wafer.

Description

Technical Field

[0001] This application relates to the field of wafer cleaning equipment technology, and in particular to a wafer rotation mechanism and a wafer post-processing device and method. Background Technology

[0002] Currently, wafer post-processing equipment typically places the wafer on a turntable of a wafer rotation mechanism and then sprays cleaning fluid or detergent onto the wafer surface. To prevent the cleaning fluid from splashing out and contaminating the surrounding environment during wafer rotation, a fixed shielding device is required. This shielding device is positioned on the outer periphery of the wafer, causing the chemical liquid or water on the wafer to be thrown onto the inner wall of the shielding device as the wafer rotates. The waste liquid then flows down the inner wall of the shielding device. However, the velocity of the splashed waste liquid is significantly different from the velocity of the stationary inner wall of the shielding device. Therefore, it is easy for the waste liquid to come into contact with the inner wall of the shielding device and then splash back onto the wafer surface. In other words, the already contaminated waste liquid that flowed out of the wafer returns to the wafer surface, thus contaminating the wafer.

[0003] Furthermore, at least one of the shielding components or turntables must be capable of lifting and lowering. This is because, in order to block the waste liquid ejected during wafer rotation, the shielding component must be higher than the wafer during the wafer cleaning process. When placing or removing the wafer from the wafer rotation mechanism using a transfer mechanism (e.g., a robotic arm), the wafer must be higher than the shielding component. In other words, the shielding component's height must be less than the wafer's height to prevent it from obstructing the wafer and hindering interaction between the transfer mechanism and the wafer. If the shielding component is lifted and lowered, its large size and span make lifting and lowering difficult, resulting in either a complex structure or potential wobbling. If the turntable is lifted and lowered, the turntable is prone to wobbling, affecting the process results. Summary of the Invention

[0004] In view of this, embodiments of this application provide a wafer rotation mechanism and a wafer post-processing apparatus and a wafer cleaning method having the same, which have a highly variable shielding member that can rotate synchronously with the rotating shaft to shield the waste liquid thrown out by the wafer rotation, and avoid hindering the interaction between the transfer mechanism and the wafer.

[0005] According to a first aspect of this application, a wafer rotation mechanism is provided, comprising: a rotating shaft, the rotating shaft being disposed perpendicular to a horizontal plane and capable of rotating along its rotation axis; a turntable concentrically disposed at the upper end of the rotating shaft to support a wafer; and a shielding member pivotally connected to the turntable to pivot between a first position and a second position, the shielding member being located on the outer periphery of the wafer on the turntable; when the rotating shaft rotates, the shielding member pivots from the second position to the first position, such that the top of the shielding member is higher than the wafer; when the rotating shaft stops rotating, the shielding member is located in the second position, such that the top of the shielding member is lower than the wafer.

[0006] Optionally, the shielding component includes: a connecting portion, which is pivotally connected to the turntable; and a shielding portion, which is disposed on the upper surface of the connecting portion, wherein the inner wall surface of the shielding portion is a surface with a certain curvature along the circumference of the wafer, and the width of the shielding portion is greater than the width of the connecting portion.

[0007] Optionally, the wafer rotation mechanism includes a plurality of shielding members, and when all of the plurality of shielding members are in the first position, the plurality of shielding parts are sequentially connected to form a closed ring.

[0008] Optionally, the wafer rotation mechanism further includes a fixing member disposed on the turntable, the fixing member being capable of fixing and releasing the wafer.

[0009] Optionally, the wafer rotation mechanism further includes a first limiting member disposed on the lower surface of the turntable, wherein when the blocking member is in the second position, the first limiting member abuts against the lower surface of the connecting portion.

[0010] Optionally, the first limiting member includes: a base disposed on the lower surface of the turntable; and a limiting protrusion disposed on the side wall of the base to abut against the lower surface of the connecting portion when the blocking member is in the second position.

[0011] Optionally, the wafer rotation mechanism further includes a second limiting member, which is disposed on the upper surface of the turntable. When the blocking member is in the first position, the second limiting member abuts against the upper surface of the connecting portion.

[0012] Optionally, the second limiting member is a limiting plate, the size of which is larger than the size of the turntable. The limiting plate is disposed on the upper surface of the turntable. When the blocking member is in the second position, the lower surface of the limiting plate abuts against the upper surface of the connecting part.

[0013] Optionally, the shielding member is made of a hydrophilic material.

[0014] According to a second aspect of this application, a wafer post-processing apparatus is provided, the wafer post-processing apparatus comprising: the wafer rotation mechanism described in the first aspect embodiment above; a transfer mechanism capable of transferring the wafer between multiple locations; and a post-processing mechanism disposed above the wafer rotation mechanism to perform post-processing processes on the rotating wafer.

[0015] According to a third aspect of this application, a wafer cleaning method is provided, which is applicable to the wafer post-processing apparatus of the second aspect embodiment described above. The method includes: placing the wafer onto a stopped wafer rotation mechanism via the transfer mechanism, wherein the shielding member of the wafer rotation mechanism is in a second position; activating the wafer post-processing apparatus, causing the wafer to rotate via the wafer rotation mechanism, and pivoting the shielding member from the second position to the first position via centrifugal motion; spraying a chemical liquid toward the wafer via the post-processing mechanism, and shielding the chemical liquid ejected by the rotating wafer via the shielding member in the first position; and when the wafer cleaning is completed, stopping the rotation of the wafer rotation mechanism, and pivoting the shielding member from the first position to the second position by gravity.

[0016] The wafer rotation mechanism provided according to the embodiments of this application has the following beneficial effects:

[0017] 1. The shielding component can rotate between a first position and a second position. This allows the shielding component to pivot from the second position to the first position, which is higher than the wafer height, during shaft rotation via centrifugal motion, effectively blocking waste liquid ejected from the wafer. When the shaft stops rotating, the shielding component pivots from the first position to the second position, which is lower than the wafer height, under the influence of gravity, preventing obstruction of monitoring operations between the transmission mechanism and the wafer.

[0018] 2. The shielding component is mounted on the rotating shaft and can rotate synchronously with it. Therefore, when the shielding component blocks the waste liquid ejected from the wafer, the velocity difference between the shielding component and the waste liquid is small, which can effectively reduce the splashing force when the waste liquid is ejected and comes into contact with the inner wall of the shielding component. This effectively prevents the waste liquid from splashing from the inner wall of the shielding component and then falling back onto the wafer surface, thus contaminating the wafer.

[0019] 3. The overall structure is simple, and there is no need for multiple power mechanisms to control the lifting and lowering of the shielding component and the turntable. This avoids the shaking of the shielding component or the turntable caused by the lifting and lowering of the turntable. The relative height between the shielding component and the wafer is controlled by gravity and centrifugal motion, which not only ensures the process effect but also saves costs and is easy to operate. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings.

[0021] Figure 1 A diagram showing the positional relationships of a wafer when using existing shielding devices;

[0022] Figure 2 This diagram shows the positional relationship of the wafer when the existing shielding device is not shielding it.

[0023] Figure 3 This is a schematic diagram showing the splashing of waste liquid onto the wafer when the existing shielding component comes into contact with the waste liquid.

[0024] Figure 4 This is a simplified structural diagram of a wafer rotation mechanism according to an embodiment of the first aspect of this application, where the shielding member is located in the second position.

[0025] Figure 5 This is a simplified structural diagram of a wafer rotation mechanism according to an embodiment of the first aspect of this application, wherein the shielding member is located in the first position;

[0026] Figure 6 This is a schematic diagram showing the positional relationship between the wafer rotation mechanism and the transmission mechanism according to the first aspect of this application;

[0027] Figure 7 This is a three-dimensional structural schematic diagram of the shielding member of the wafer rotation mechanism according to the first aspect of this application;

[0028] Figure 8 This is a three-dimensional structural diagram of the wafer rotation mechanism according to the first aspect of this application, where the shielding member is located in the second position.

[0029] Figure 9 This is a three-dimensional structural diagram of the wafer rotation mechanism according to the first aspect of this application from another angle, in which the shielding member is located in the second position;

[0030] Figure 10 This is a three-dimensional structural diagram of the wafer rotation mechanism according to the first aspect of this application from another angle, in which the shielding member is located in the second position;

[0031] Figure 11 This is a side cross-sectional view of the wafer rotation mechanism according to the first aspect of this application, where the shielding member is located in the second position;

[0032] Figure 12 This is a three-dimensional structural diagram of the wafer rotation mechanism according to the first aspect of this application, where the shielding member is located in the first position;

[0033] Figure 13 This is a side cross-sectional view of the wafer rotation mechanism according to the first aspect of this application, where the shielding member is located in the first position;

[0034] Figure 14 This is a three-dimensional structural diagram of the rotating shaft and the rotating disk of the wafer rotation mechanism according to the first aspect of this application;

[0035] Figure 15 This is a three-dimensional structural diagram of the rotating shaft and turntable of the wafer rotation mechanism according to the first aspect of this application from another angle;

[0036] Figure 16 This is a three-dimensional structural diagram of the second limiting member of the wafer rotation mechanism according to the first aspect of this application;

[0037] Figure 17 This is a flowchart of a wafer cleaning method according to a third aspect of this application.

[0038] Explanation of reference numerals in the attached figures:

[0039] Wafer rotation mechanism 100;

[0040] 10 rotating shafts; 20 turntables;

[0041] Shielding part 30; Connecting part 301; Shielding part 302; Fixing part 40;

[0042] First limiting component 50; base 501; limiting protrusion 502; second limiting component 60;

[0043] Transmission mechanism 200;

[0044] Wafer 2000. Detailed Implementation

[0045] To enable those skilled in the art to better understand the technical solutions in the embodiments of this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art should fall within the protection scope of the embodiments of this application.

[0046] As mentioned earlier, current wafer post-processing equipment typically places the wafer 2000 on the turntable 20 of the wafer rotation mechanism 100, and then sprays cleaning fluid or detergent onto the surface of the wafer 2000. Figure 1 and Figure 2As shown, to prevent the cleaning solution from splashing out and contaminating the surrounding environment when the wafer 2000 rotates, thus hindering subsequent cleaning, a fixed shielding member 30 is required. The shielding member 30 is positioned on the outer periphery of the wafer 2000, allowing the chemical solution or water on the wafer 2000 to be splashed onto the inner wall of the shielding member 30 as the wafer rotates, and then the waste liquid flows down the inner wall of the shielding member 30. For example... Figure 3 As shown, the velocity of the ejected waste liquid is significantly different from that of the stationary inner wall of the shield 30. Therefore, it is easy for the waste liquid to come into contact with the inner wall of the shield 30 and then splash back onto the surface of the wafer 2000. In other words, the already contaminated waste liquid flowing out of the wafer 2000 returns to the surface of the wafer 2000, thus contaminating it. Figure 3 The straight arrow in the diagram illustrates the direction of the waste liquid splashing backwards onto the wafer 2000 after contacting the inner wall of the shielding component 30. Figure 3 The arrow W1 in the middle indicates the direction of rotation of turntable 20.

[0047] Furthermore, at least one of the shielding component 30 or the turntable 20 must be capable of lifting and lowering. This is because, in order to block the waste liquid ejected from the rotating wafer 2000, the shielding component 30 needs to be higher than the wafer 2000 during the wafer cleaning process. When placing the wafer 2000 on the transfer mechanism 200 (e.g., a robotic arm) or removing the wafer 2000 from the wafer rotation mechanism 100, the wafer 2000 must be higher than the shielding component 30. That is, the height of the shielding component 30 must be less than the height of the wafer 2000 to prevent the shielding component 30 from obstructing the wafer 2000 and hindering the interaction between the transfer mechanism 200 and the wafer 2000. If the shielding component 30 is lifted and lowered, its large size and span make lifting and lowering difficult, resulting in either a complex structure or potential wobbling. If the turntable 20 is lifted and lowered, it is prone to wobbling, affecting the process results.

[0048] Therefore, the wafer rotation mechanism 100 of this embodiment of the invention has a shielding member 30 that is highly variable and can rotate synchronously with the rotating shaft 10, which shields the waste liquid thrown out by the rotating wafer 2000, and avoids hindering the interaction between the transmission mechanism 200 and the wafer 2000.

[0049] The following is in conjunction with the instruction manual appendix. Figures 4-16 The wafer rotation mechanism 100 of the present application embodiment is described in detail.

[0050] like Figures 4-11 As shown, a wafer rotation mechanism 100 according to an embodiment of the present invention includes a rotating shaft 10, a turntable 20, and a shielding member 30. For example... Figure 4 and Figure 5As shown, the rotating shaft 10 is set perpendicular to the horizontal plane, and the rotating shaft 10 can rotate along its rotation axis, which is as follows: Figure 4 and Figure 5 As shown by line L1 in the figure, the rotation direction of shaft 10 is along W2 in the figure. Figure 4 and Figure 5 As shown, the turntable 20 is concentrically positioned above the rotating shaft 10 to support the wafer 2000. Thus, the rotation of the rotating shaft 10 drives the wafer 2000 to rotate synchronously. A blocking member 30 is pivotally connected to the turntable 20, pivoting between a first position and a second position, and the blocking member 30 is located on the outer periphery of the wafer on the turntable 20. Therefore, the blocking member 30 can not only rotate synchronously with the rotating shaft 10, but also switch between the first and second positions. Figure 4 and Figures 8-11 As shown, the rotating shaft 10 stops rotating, and the blocking member 30 is in the second position. Figure 5 and Figures 12-13 As shown, the rotating shaft 10 rotates, and the blocking member 30 is in the first position.

[0051] Specifically, when the shaft 10 rotates, the shielding member 30, due to centrifugal motion, pivots from a lower second position to a higher first position, while the top of the shielding member 30 is higher than the wafer 2000. It should be noted that the top of the shielding member 30 can be understood as the portion above the center of the shielding member 30, or it can be the portion that extends above the wafer 2000. Figure 5 As shown in the diagram, the arrows indicate the direction of movement of the cleaning fluid after it is sprayed onto the surface of the wafer 2000 and flung outwards by the rotation of the wafer 2000, and then comes into contact with the shielding member 30. Therefore, the shielding member 30 can shield the outer periphery of the wafer 2000, and the waste fluid flung out by the rotation of the wafer 2000 can be blocked by the inner wall of the shielding member 30, preventing the waste fluid from causing environmental contamination. When the rotating shaft 10 stops, due to the disappearance of centrifugal motion, the shielding member 30 automatically rotates from a higher first position to a lower second position under the action of gravity, with the top of the shielding member 30 lower than the wafer 2000. At this time, the wafer 2000 can be exposed, facilitating interaction and operation between the transmission mechanism 200 and the wafer 2000, such as... Figure 6 The diagram shows the handover operation between the transfer mechanism 200 and the wafer 2000 when the shielding member 30 is in the second position (e.g., the transfer mechanism 200 picks up the wafer 2000, or the transfer mechanism 200 places a new wafer 2000 to be cleaned on the wafer rotation mechanism 100).

[0052] The wafer rotation mechanism 100 provided according to the embodiments of this application has the following beneficial effects:

[0053] 1. The shielding member 30 can rotate between a first position and a second position. Thus, when the rotating shaft 10 rotates, the shielding member 30, through centrifugal motion, pivots from the second position to the first position, which is higher than the height of the wafer 2000, effectively blocking waste liquid ejected from the wafer 2000. When the rotating shaft 10 stops rotating, the shielding member 30, under the action of gravity, pivots from the first position to the second position, which is lower than the height of the wafer 2000, preventing obstruction of the interaction between the transmission mechanism 200 and the wafer 2000.

[0054] 2. The shielding component 30 is mounted on the rotating shaft 10 and can rotate synchronously with the shaft 10. Therefore, when the shielding component 30 shields the waste liquid ejected from the wafer 2000, the speed difference between the shielding component 30 and the waste liquid is small, which can effectively reduce the splashing force when the waste liquid is ejected and comes into contact with the inner wall of the shielding component 30. This effectively prevents the waste liquid from splashing from the inner wall of the shielding component 30 and then falling back onto the surface of the wafer 2000, thus preventing the wafer 2000 from becoming contaminated.

[0055] 3. The overall structure is simple, and there is no need for multiple power mechanisms to control the lifting and lowering of the shielding component 30 and the turntable 20. This avoids the shaking of the shielding component 30 or the turntable 20 caused by the lifting and lowering of the turntable 20. The relative height between the shielding component 30 and the wafer 2000 is controlled by gravity and centrifugal motion, which not only ensures the process effect but also saves costs and is easy to operate.

[0056] In some embodiments of the present invention, such as Figure 7 As shown, the shielding member 30 includes a connecting portion 301 and a shielding portion 302. The connecting portion 301 is pivotally connected to the turntable 20, that is, the connecting portion 301 and the turntable 20 are pivotally connected. The shielding portion 302 is disposed on the upper surface of the connecting portion 301, and the inner wall surface of the shielding portion 302 is a surface with a certain curvature along the circumference of the wafer 2000. Those skilled in the art will understand that the wafer 2000 is disk-shaped, and the shielding portion 302 is set with a surface with a certain curvature. Since it can follow the circumference of the wafer 2000, when the waste liquid ejected from the wafer 2000 comes into contact with the inner wall of the shielding portion 302, the probability of it being splashed back onto the surface of the wafer 2000 can be effectively reduced.

[0057] The pivotal connection between the shielding member 30 and the turntable 20 can be achieved by opening a first through hole in the connecting part 301 and a corresponding second through hole in the turntable 20. This allows the first and second through holes to align, and then a pivotal connection can be achieved by passing a pin through them.

[0058] like Figure 7 As shown, the width of the blocking portion 302 is greater than the width of the connecting portion 301. This prevents the connecting portion 301 from being too wide. Figure 8As shown, when the wafer rotation mechanism 100 has multiple shielding members 30, during the process of multiple shielding members 30 descending from the first position to the second position, they cannot fall smoothly due to the mutual abutment of the large connecting parts 301.

[0059] Furthermore, such as Figures 8-13 As shown, the wafer rotation mechanism 100 includes a plurality of shielding members 30. For example... Figure 12 and Figure 13 As shown, when all the multiple shielding components 30 are in the first position, the multiple shielding portions 302 are sequentially connected to form a closed ring. This creates a ring-shaped shielding structure surrounding the outer periphery of the wafer 2000, thus completely shielding the outer periphery of the wafer 2000 and preventing the waste liquid ejected from the wafer 2000 from being completely contained. This improves the shielding effect of the waste liquid.

[0060] In some embodiments of the present invention, such as Figures 8-12 As shown, the turntable structure 100 includes four shielding members 30. When all four shielding members 30 are in the first position, the shielding portions 302 of the four shielding members 30 are connected in sequence to form a closed ring. This allows it to completely surround the outer periphery of the wafer 2000, ensuring that the waste liquid ejected from the wafer 2000 is blocked.

[0061] Furthermore, the number of blocking elements 30 in the turntable structure 100 can be designed according to actual needs, for example, there can be five blocking elements 30 or six blocking elements 30. When multiple blocking elements 30 are all in the first position, they form a closed ring.

[0062] like Figure 8 , Figure 10 , Figure 11 , Figure 13 and Figure 15 As shown, the wafer rotation mechanism 100 also includes a fixing member 40, which is disposed on the turntable 20. The fixing member 40 can fix and release the wafer 2000. The fixing member 40 can be a gripper, which can quickly grip or release the wafer 2000, facilitating cooperation with the transfer mechanism 200 for placing and removing the wafer 2000.

[0063] like Figure 9 , Figure 11 and Figure 13As shown, the wafer rotation mechanism 100 also includes a first limiting member 50, which is disposed on the lower surface of the turntable 20. When the blocking member 30 is in the second position, the first limiting member 50 abuts against the lower surface of the connecting portion 301. Thus, the first limiting member 50 restricts the angle at which the blocking member 30 rotates from the first position to the second position. It should be noted that the angle restriction can be set according to the needs of actual use, i.e., by adjusting the position of the first limiting member 50. This ensures the overall operational stability of the wafer rotation mechanism 100.

[0064] In some embodiments of the present invention, such as Figure 16 The diagram shows the structure of a first limiting member 50, which includes a base 501 and a limiting protrusion 502. The base 501 is disposed on the lower surface of the turntable 20. The limiting protrusion 502 is disposed on the side wall of the base 501 so as to abut against the lower surface of the connecting portion 301 when the blocking member 30 is in the second position.

[0065] Specifically, such as Figure 16 As shown, the first limiting member 50 has a main body portion, namely the base 501. (As indicated...) Figure 9 As shown, the base 501 can be disposed on the lower surface of the turntable 20. The side wall of the main body is provided with a protruding limiting part, namely the limiting protrusion 502. When the blocking member 30 rotates from the first position to the second position, the lower surface of the blocking part 302 of the blocking member 30 can abut against the limiting protrusion 502, thereby restricting the continued rotation of the blocking member 30.

[0066] In some embodiments of the present invention, such as Figure 13 , Figure 14 and Figure 15 As shown, the wafer rotation mechanism 100 also includes a second limiting member 60, which is disposed on the upper surface of the turntable 20. When the blocking member 30 is in the first position, the second limiting member 60 abuts against the upper surface of the connecting portion 301. This limits the angle at which the blocking member 30 rotates from the second position to the first position.

[0067] Furthermore, such as Figure 14 and Figure 15 As shown, the second limiting member 60 is a limiting plate, which can be a rectangular plate with dimensions larger than that of the turntable 20. The limiting plate is located on the upper surface of the turntable 20. Therefore, the limiting plate has a portion that extends beyond the turntable 20, forming a blocking flange above the turntable 20. When the blocking member 30 is in the second position, the lower surface of the limiting plate abuts against the upper surface of the connecting portion 301. This limits the rotation angle of the blocking member 30.

[0068] In some embodiments of the present invention, the shielding member 30 is made of a hydrophilic material. This allows the waste liquid ejected from the rotating wafer 2000 to better adhere to the inner wall of the shielding member 30 after contacting it, effectively preventing the waste liquid from splashing back onto the surface of the wafer 2000.

[0069] According to a second aspect embodiment of the present invention, the wafer post-processing apparatus includes a wafer rotation mechanism 100, a transfer mechanism 200, and a post-processing mechanism (not shown in the figures). The wafer rotation mechanism 100 is the same as the wafer rotation mechanism 100 of the first aspect embodiment. The transfer mechanism 200 is capable of transferring the wafer 2000 between multiple locations. Specifically, the transfer mechanism 200 can be a wafer clamping mechanism with a robotic arm. The transfer mechanism 200 is capable of clamping and placing the wafer in the wafer rotation mechanism 100. The post-processing mechanism can be a cleaning fluid spraying assembly disposed above the wafer to spray cleaning fluid or other chemical liquids toward the surface of the wafer 2000.

[0070] The wafer post-processing apparatus according to the second aspect embodiment of the present invention has the same beneficial effects as the wafer rotation mechanism 100 of the first aspect embodiment, since it has the wafer rotation mechanism 100 of the first aspect embodiment described above, and will not be described in detail here.

[0071] A wafer cleaning method according to a third aspect embodiment of the present invention, the wafer cleaning method being applicable to the wafer post-processing apparatus of a second aspect embodiment, the flowchart of which is shown below. Figure 17 As shown, the method includes:

[0072] Step S1: Place the wafer 2000 onto the stopped wafer rotation mechanism 100 via the transfer mechanism 200. At this time, the shielding member 30 of the wafer rotation mechanism 100 is in the second position.

[0073] Step S2: Start the wafer post-processing device, drive the wafer 2000 to rotate through the wafer rotation mechanism 100, and use centrifugal motion to pivot the shielding member 30 from the second position to the first position;

[0074] Step S3: Chemical liquid is sprayed toward the wafer 2000 through the post-processing mechanism, and the shielding member 30 located in the first position shields the chemical liquid thrown out by the rotating wafer 2000.

[0075] Step S4: After the wafer 2000 is cleaned, the wafer rotation mechanism 100 stops rotating, and the shielding member 30 pivots from the first position to the second position by gravity.

[0076] According to the wafer cleaning method of this embodiment, the rotating shaft 10 drives the turntable 20 to rotate, thereby using centrifugal motion to move the shielding member 30 from the second position to the first position, preventing waste liquid ejected from the wafer 2000 from splashing onto the outer periphery and contaminating the environment. When the rotating shaft 10 stops rotating, gravity causes the shielding member 30 to rotate from the first position to the second position, avoiding obstruction of the interaction between the transmission mechanism 200 and the wafer 2000.

[0077] The above embodiments are only used to illustrate the embodiments of this application, and are not intended to limit the embodiments of this application. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the embodiments of this application. Therefore, all equivalent technical solutions also fall within the scope of the embodiments of this application, and the patent protection scope of the embodiments of this application should be defined by the claims.

Claims

1. A wafer rotation mechanism, characterized in that, The wafer rotation mechanism includes: A rotating shaft, which is perpendicular to the horizontal plane and is capable of rotating along its axis of rotation; A turntable, concentrically positioned at the upper end of the rotating shaft, to support the wafer; A shielding member, the shielding member being pivotally connected to the turntable to pivot between a first position and a second position, and the shielding member being located on the outer periphery of the wafer on the turntable; When the shaft rotates, the shielding member pivots from the second position to the first position, such that the top of the shielding member is higher than the wafer; When the shaft stops rotating, the shield is in the second position, such that the top of the shield is lower than the wafer.

2. The wafer rotation mechanism according to claim 1, characterized in that, The shielding component includes: The connecting part is pivotally connected to the turntable; A shielding portion is disposed on the upper surface of the connecting portion. The inner wall surface of the shielding portion is a surface with a certain curvature along the circumference of the wafer. The width of the shielding portion is greater than the width of the connecting portion.

3. The wafer rotation mechanism according to claim 2, characterized in that, The wafer rotation mechanism includes a plurality of shielding members. When all the shielding members are in the first position, the plurality of shielding parts are sequentially connected to form a closed ring.

4. The wafer rotation mechanism according to claim 3, characterized in that, The wafer rotation mechanism further includes: A fixing element is disposed on the turntable, and the fixing element is capable of fixing and releasing the wafer.

5. The wafer rotation mechanism according to claim 2, characterized in that, The wafer rotation mechanism further includes: A first limiting member is disposed on the lower surface of the turntable. When the blocking member is in the second position, the first limiting member abuts against the lower surface of the connecting part.

6. The wafer rotation mechanism according to claim 5, characterized in that, The first limiting member includes: A base, the base being disposed on the lower surface of the turntable; A limiting protrusion is disposed on the side wall of the base so as to abut against the lower surface of the connecting portion when the blocking member is in the second position.

7. The wafer rotation mechanism according to claim 1, characterized in that, The wafer rotation mechanism further includes: The second limiting member is disposed on the upper surface of the turntable. When the blocking member is in the first position, the second limiting member abuts against the upper surface of the connecting part.

8. The wafer rotation mechanism according to claim 7, characterized in that, The second limiting member is a limiting plate, the size of which is larger than the size of the turntable. The limiting plate is disposed on the upper surface of the turntable. When the blocking member is in the second position, the lower surface of the limiting plate abuts against the upper surface of the connecting part.

9. The wafer rotation mechanism according to any one of claims 1-8, characterized in that, The shielding component is made of a hydrophilic material.

10. A wafer post-processing apparatus, characterized in that, include: The wafer rotation mechanism according to any one of claims 1-9 is used to drive the wafer to rotate; A transport mechanism capable of transporting the wafer between multiple locations; A post-processing mechanism is located above the wafer rotation mechanism to perform post-processing processes on the rotating wafer.

11. A wafer cleaning method, characterized in that, The wafer cleaning method is applicable to the wafer post-processing apparatus of claim 10, and the method includes: The wafer is placed into the stopped wafer rotation mechanism via the transfer mechanism, at which time the shielding member of the wafer rotation mechanism is in the second position; Start the wafer post-processing device, rotate the wafer through the wafer rotation mechanism, and use centrifugal motion to pivot the shielding member from the second position to the first position; The post-processing mechanism sprays chemical liquid toward the wafer, and the shielding member located at the first position shields the chemical liquid ejected by the rotating wafer. Once the wafer cleaning is complete, the wafer rotation mechanism stops rotating, and the shielding member pivots from the first position to the second position by gravity.

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