A thin high-density hybrid packaging structure

Abstract

The present invention belongs to the field of integrated circuit assembly and manufacturing, and particularly relates to a thin, high-density hybrid packaging structure, in which multiple signal shielding cavities are arranged in a one-layer structure, each signal shielding cavity encapsulates an electronic component, different potting glue is injected into each signal shielding cavity, and devices using the same potting glue are encapsulated in the same signal shielding cavity. A printed circuit board fence is prepared on the surface of the packaging substrate to divide the packaging area into multiple separate cavities, each cavity is isolated by providing a shielding signal hole in the printed circuit board fence, and a metal shielding layer is provided on the surface of the printed circuit board fence, so that each separate cavity serves as a signal shielding cavity. While realizing a high-density, thin hybrid packaging body, the present invention uses a partitioned filling technology to achieve good thermal matching between packaging material systems. The presence of the printed circuit board frame makes the overall structural rigidity of the packaging structure good, avoiding warping and deformation of the packaging body. The manufacturing process of the packaging structure is simple and has strong reliability.

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