Method for machining a timepiece component, and timepiece component

Abstract

A machining method of a timepiece component capable of forming the same pattern as a sandblasting machining by laser machining, and a timepiece component machined by the machining method. A machining method of a timepiece component characterized by forming a plurality of machining marks in a machining region of a base material of the timepiece component by irradiating the base material with a pulsed laser, setting a scanning speed of the pulsed laser as V mm / s, a frequency of the pulsed laser as fk Hz, and a length of a portion where the machining marks overlap as a μm, setting the scanning speed V and the frequency f in a manner satisfying a = R - V / f, 0 ≤ a < R, and randomly setting an irradiation-on time Ton during which the pulsed laser is irradiated and an irradiation-off time Toff during which the pulsed laser is not irradiated.

Description

Technical Field

[0001] This invention relates to a method for processing watch components and to watch components themselves. Background Technology

[0002] When creating matte patterns on various watch components such as dials, cases, back covers, and base plates, sandblasting is typically used. However, sandblasting involves varying the type of medium depending on the pattern, making it complex to manage. Therefore, as described in Patent Document 1, a method for creating matte patterns using laser processing has been proposed.

[0003] In Patent Document 1, a portion of the coating on the surface of a decorative item is irradiated with laser light to form matte patterns such as heart shapes. Therefore, in Patent Document 1, as long as the matte patterns processed by laser light can be separated from the mirror-like surface formed based on the coating, the irradiation conditions of the laser light are not specifically studied.

[0004] Patent Document 1: Japanese Patent Application Publication No. 2009-78494 Summary of the Invention

[0005] However, the inventors conducted in-depth research and found that it is difficult to achieve the same matte texture as sandblasting the entire dial simply by irradiating it with laser light. Therefore, they sought a method for processing watch parts that can form the same texture as sandblasting through laser processing, and a watch part processed by this method.

[0006] The watch component processing method disclosed herein is characterized in that multiple processing marks are formed in the processing area of ​​the substrate by irradiating the substrate with a pulsed laser. The spot diameter R of the pulsed laser is set in the range of 12.5 μm or more and 200 μm or less. The scanning speed V and frequency f are set to satisfy the conditions α = RV / f and 0 ≤ α < R, with the scanning speed V / s, the frequency f / kHz, and the overlapping length of the processing marks α μm. The irradiation time Ton and the non-irradiation time Toff of the pulsed laser are randomly set. The watch component of this disclosure is characterized in that multiple processing marks are formed in the processing area of ​​the substrate by irradiating the substrate with a pulsed laser. The processing marks are formed continuously in a first direction, which is the scanning direction of the pulsed laser. The length of the processing marks in the width direction perpendicular to the first direction is 12.5 μm or more and 200 μm or less, and the ratio of the length in the width direction to the length in the first direction is 1:1 to 50.

[0007] The watch component disclosed herein is characterized in that multiple processing marks are formed in the processing area of ​​the substrate by irradiating the substrate of the watch component with a pulsed laser. The spot diameter R of the pulsed laser is set in the range of 12.5 μm or more and 200 μm or less. When the scanning speed of the pulsed laser is set to V mm / s, the frequency of the pulsed laser is f kHz, and the length of the overlapping part of the processing marks is α μm, the scanning speed V and the frequency f are set to satisfy the conditions α = RV / f and 0 ≤ α < R. The length of the processing marks in the scanning direction and the length between each processing mark in the scanning direction are random. Attached Figure Description

[0008] Figure 1 This is a front view showing the clock according to the first embodiment.

[0009] Figure 2 This is a schematic cross-sectional view showing the laser irradiation apparatus of the first embodiment.

[0010] Figure 3 This is a schematic top view showing the scanning direction and machining marks of the pulsed laser in the first embodiment.

[0011] Figure 4 This is a schematic top view showing the pattern of the first embodiment.

[0012] Figure 5 These are schematic cross-sectional views showing the machining marks of the first embodiment. (A) is a machining example based on nanosecond laser, and (B) is a machining example based on femtosecond laser.

[0013] Figure 6 This is a diagram showing the processing area of ​​the first embodiment.

[0014] Figure 7 This is a schematic top view showing the pattern of the second embodiment.

[0015] Figure 8 This is a diagram showing the processing area of ​​the second embodiment.

[0016] Figure 9 This is a schematic top view showing a variation of the pattern.

[0017] Label Explanation

[0018] 1: Clock; 10: Dial; 10A: Substrate; 20: Laser irradiation device; 21: Laser irradiation part; 22: Laser light emission part; 23: Focusing optical system; 24: Pulsed laser; 26: Control device; 30: Processing area; 30A: Enlarged area; 30B: Enlarged area; 31: Processing mark. Detailed Implementation

[0019] [First Implementation Method]

[0020] Hereinafter, the clock 1 of the first embodiment of the present disclosure will be described with reference to the accompanying drawings.

[0021] Figure 1 This is a front view showing clock 1. In this embodiment, clock 1 is configured as a wristwatch worn on the user's wrist.

[0022] like Figure 1 As shown, the watch 1 has a metal outer casing 2. Inside the outer casing 2 are a circular dial 10, a second hand 3, a minute hand 4, an hour hand 5, a crown 7, a button A 8, and a button B 9. An hour marker 6 for indicating the time is provided on the dial 10. Furthermore, the movement (not shown) is located on the back side of the dial 10.

[0023] On the front of the dial 10 of the clock 1, the same pattern as that formed by sandblasting is formed by laser processing.

[0024] Reference Figure 2 and Figure 3 The laser processing method for the dial 10 will be described. Furthermore, the substrate 10A constituting the dial 10 is made of metallic materials such as brass, titanium, stainless steel, pure iron, zinc-copper alloy, duralumin, steel, and alloys containing one of these materials. However, the material of the substrate 10A is not limited to these; any material used in watch components that can be laser-processed is acceptable.

[0025] like Figure 2 As shown, the laser irradiation device 20 for irradiating the substrate 10A of the dial 10 with pulsed laser includes a laser irradiation unit 21, a moving mechanism (not shown), and a control device 26.

[0026] The laser irradiation unit 21 includes a laser emission unit 22 and a focusing optical system 23. The laser emission unit 22 irradiates a nanosecond laser with a pulse width on the order of nanoseconds as a pulsed laser 24.

[0027] The focusing optical system 23 focuses the pulsed laser 24 onto the focusing section 24A. The pulsed laser 24 has high energy in the focusing section 24A, thus removing metal particles from the surface of the substrate 10A. When the substrate 10A is irradiated with a single pulsed laser 24, such as... Figure 3 As shown, a recess, namely a processing mark 31, is formed in the processing area 30 on the surface of the substrate 10A, which is controlled by the focusing optical system 23.

[0028] In this embodiment, the laser irradiation unit 21 is set to a pulsed laser 24 with an irradiation frequency f = 160 kHz and a spot diameter R = 30 μm.

[0029] The moving mechanism is, for example, a mechanism that moves the worktable on which the substrate 10A is placed in the X-axis and Y-axis directions, as long as it can move the pulsed laser 24 irradiated from the laser irradiation unit 21 relative to the substrate 10A in the scanning direction. Figure 3 As shown, the moving mechanism of this embodiment repeatedly performs the following actions: after the laser irradiation unit 21 moves relative to the substrate 10A in the X1 direction, it moves a predetermined distance P in the Y1 direction, and then moves in the X2 direction and moves another distance P in the Y1 direction. Therefore, in this embodiment, the X-axis direction is the first direction.

[0030] In this embodiment, the control device 26 controls the moving device to move the laser irradiation unit 21 relative to the substrate 10A in the X1 and X2 directions at a scanning speed V of 1500 mm / s. The interval in the Y1 direction, i.e., the spacing P, is set to be in the range of 0.3 to 1.15 times the spot diameter R. If the spacing P is set to be less than 0.3 times the spot diameter R, the overlapping area of ​​adjacent processing marks 31 becomes larger, and the processing efficiency decreases. If the spacing P is greater than 1.15 times the spot diameter R, the unprocessed area increases, reducing the aesthetics of the watch component. Therefore, the spacing P is preferably set to be in the range of 0.3 to 1.15 times the spot diameter R. Furthermore, the spacing P is more preferably set to be in the range of 0.3 to 1 times the spot diameter R.

[0031] In the case where a machining mark 31 with a spot diameter R is continuously formed using a pulsed laser 24, such as Figure 3 As shown, the length α of the overlapping portion of each machining mark 31 in the scanning direction is α = RV / f. Here, V / f is the distance that the pulsed laser 24 travels in one cycle when continuously irradiated with a pulsed laser 24 of frequency f, that is, the distance traveled from the irradiation position of the pulsed laser 24 to the irradiation position of the next pulsed laser 24.

[0032] In this embodiment, the overlap of a portion of the continuous machining marks 31 in the scanning direction is defined as 0 ≤ α < R. In this embodiment, R = 30 μm, V = 1500 mm / s = 1500000 μm / s, f = 160 kHz = 160000 Hz, therefore α = 30 - 9.375 = 20.625 μm. Furthermore, the partial overlap of each machining mark 31 also includes the state of contact between the machining marks 31, where 0 = α represents this state. That is, partial overlap of each machining mark 31 means that the machining marks 31 are connected without gaps.

[0033] The control device 26 alternately sets the irradiation on-time Ton and irradiation off-time Toff of the pulsed laser 24, and controls each irradiation on-time Ton and irradiation off-time Toff to a random time. As a result, machining marks 31 formed by laser processing are irregularly formed on the surface of the substrate 10A, achieving a rough surface finish similar to sandblasting. In this embodiment, since the frequency f of the pulsed laser 24 is 160 kHz, the period T of the pulsed laser 24 is 6.25 μm. The control device 26 sets the irradiation on-time Ton = T × Ron and the irradiation off-time Toff = T × Roff. Here, Ron and Roff are random integers; in this embodiment, Ron is a random integer in the range of 0 to 8, and Roff is a random integer in the range of 0 to 6.

[0034] In addition, randomness means lacking regularity, being arbitrary and irregular.

[0035] exist Figure 4 The document describes an example of a pattern formed by laser processing of a processing mark 31. Figure 4 The pattern and Figure 3 Similarly, after the laser irradiation section 21 is moved relative to the substrate 10A in the X1 direction, it is moved a predetermined distance in the Y1 direction, and then moved in the X2 direction, and then moved a predetermined distance in the Y1 direction. This reciprocating processing pattern is repeated to form a processing mark 31 throughout the processing area.

[0036] During the movement of the laser irradiation unit 21 in the X1 and X2 directions, the control device 26 randomly sets the irradiation on-time Ton and the irradiation off-time Toff to control the irradiation of the pulsed laser 24. Furthermore, during the movement of the laser irradiation unit 21 in the Y1 direction, the control device 26 controls the irradiation of the pulsed laser 24 to be off. As a result, the machining marks 31 generated by the irradiation of the pulsed laser 24 are continuously formed in various lengths in the X1 and X2 directions, which are the scanning directions, and the length of the non-machined portion is also randomly set, thus enabling the formation of random machining marks 31 similar to those produced by sandblasting.

[0037] In addition, Figure 4The portion with an irradiation on-time Ton of 75.00 μs is, for example, a continuous portion consisting of an irradiation on-time Ton = 6.25 × 8 = 50 μs, an irradiation off-time Toff = 0 μs, and an irradiation on-time Ton = 6.25 × 4 = 25 μs. At an irradiation on-time Ton of 75.00 μs, 13 machining marks 31 are continuously formed, with a scanning direction length of 30 + 9.375 × 12 = 142.5 μm. The portion with an irradiation off-time Toff of 50.00 μs is, for example, a continuous portion consisting of an irradiation off-time Toff = 6.25 × 6 = 37.5 μs, an irradiation on-time Ton = 0 μs, and an irradiation off-time Toff = 6.25 × 2 = 12.5 μs. The scanning speed V of the pulsed laser 24 based on the moving mechanism is 1500 mm / s, and it travels 75 μm in 50 μs. Therefore, the interval between the machining mark 31 immediately in front of and immediately behind the irradiated machine mark 31 is 45 μm.

[0038] Based on the above processing conditions, the length of the processing mark 31 in this embodiment in the width direction, i.e., the Y-axis direction, which is perpendicular to the X-axis direction as the first direction, is the spot diameter R, i.e., 30 μm. In addition, the length of the processing mark 31 in the first direction, which is formed by connecting multiple processing marks 31 together in the first direction, is set to be in the range of 1 to 50 times the spot diameter R.

[0039] Figure 5 This is a schematic cross-section of the substrate 10A during laser processing. (A) shows the case of irradiation with a nanosecond laser, and (B) shows the case of irradiation with a femtosecond laser.

[0040] like Figure 5 As shown, compared to picosecond and femtosecond lasers, nanosecond lasers produce larger machining marks (31), approaching the size of sandblasting. Additionally, as... Figure 5 As shown by the double-dotted line, when the surface of the substrate 10A has a roughness 35 formed by cutting, if picosecond laser or femtosecond laser is used for processing, the surface will be roughened along the roughness 35 of the substrate 10A, thus leaving traces of cutting. On the other hand, when irradiated with a nanosecond laser, the influence of the roughness 35 of cutting can be reduced.

[0041] Next, the operating steps for laser processing the substrate 10A will be explained.

[0042] First, processing conditions are set in the control device 26. These processing conditions include the output level of the pulsed laser 24 irradiated from the laser irradiation unit 21, the spot diameter R, the frequency f, the scanning speed V, the processing area, the scanning path, the irradiation on-time Ton, and the irradiation off-time Toff. Furthermore, in the construction of the laser irradiation device 20, if the spot diameter R and frequency f cannot be changed, other conditions that can be changed are set.

[0043] The output level of the pulsed laser 24 can be set according to the material of the substrate 10A to be processed. In addition, the length α of the overlapping portion of the continuous processing marks 31 in the scanning direction is set together with the scanning speed V, the spot diameter R, and the frequency f, so it can be set simply by determining the degree to which the length α is set.

[0044] The processing area is set according to the type and size of the parts being processed. For example, if it is dial 10, it is set according to the size of the dial and the presence or absence of sub-dials, etc.

[0045] The scanning path is used to define the path along which the nanosecond laser irradiates within the processing area, setting the scanning direction, the spacing P between each path, etc. For example, in dial 10, the scanning direction can be set to be parallel to the direction connecting points 3 and 9, or parallel to the direction connecting points 12 and 6, or parallel to the direction connecting points 1.5 and 7.5, or the direction connecting points 4.5 and 10.5. Furthermore, the spacing P between the scanning paths affects the overlap of the processing marks 31, and therefore can be set according to processing efficiency or the design of the processing marks 31.

[0046] The irradiation on-time Ton and irradiation off-time Toff are used to set the size and spacing of the machining marks 31 along the scanning direction. In this embodiment, as described above, irregular, unpatterned machining marks 31 are formed by setting a multiple of the period of the pulsed laser 24 using a random number. Furthermore, by setting the upper limit of Ron for the irradiation on-time Ton to be greater than Roff for the irradiation off-time Toff, the spacing P between each scanning path is set to be less than or equal to the spot diameter R, thereby adjusting the area ratio of the machining marks 31 in the processing area 30 to 65% or more.

[0047] The control device 26 controls the laser irradiation device 20 according to the set processing conditions, and forms a processing mark 31 on the surface of the substrate 10A of the dial 10 through laser processing.

[0048] Figure 6 The diagram shows the processing area 30 where laser processing was performed and an enlarged area 30A that magnifies a portion of the processing area 30. Figure 6 In the magnified region 30A, the pulsed laser 24 along Figure 6The scanning is performed in the vertical direction, so the machining mark 31 is also formed in the vertical direction.

[0049] [Effects of the First Embodiment]

[0050] According to the first embodiment, the processing mark 31 is formed by using a processing method with a pulsed laser 24 under the above processing conditions. Therefore, when roughening the surface of the substrate 10A, the processing efficiency can be improved compared with sandblasting, and the productivity of watch parts can also be improved.

[0051] That is, by setting the spot diameter R of the pulsed laser 24 to a size similar to the particle size of the medium used in sandblasting, i.e., a range of 12.5 μm or more and 200 μm or less, i.e., 30 μm, the size of the processing mark 31 generated by the irradiation of the pulsed laser 24 can be the same as that of sandblasting, and the same pattern as sandblasting can be processed.

[0052] When the scanning speed of the pulsed laser 24 is set to V mm / s, and the frequency f kHz of the pulsed laser 24 is set to satisfy the conditions α = RV / f and 0 ≤ α < R, then when the pulsed laser 24 continuously forms the processing marks 31 along the first direction which is the scanning direction, the processing marks 31 can be formed in a connected manner. Furthermore, since the irradiation on-time Ton of the irradiation pulsed laser 24 and the irradiation off-time Toff of the non-irradiation pulsed laser 24 are randomly set, the length of the continuous processing marks 31 in the scanning direction and the length of the gap between each processing mark 31 can be randomly set, and the surface of the substrate 10A can be roughened using laser processing in the same way as sandblasting.

[0053] Since the substrate 10A is processed by irradiation with pulsed laser 24, various rough surface processes can be performed simply by changing the processing conditions during laser processing. Furthermore, since only the designated processing area needs to be irradiated with pulsed laser 24, no mask is required, thus reducing the workload during processing. Moreover, laser processing can be performed regardless of the hardness of the substrate 10A, and even high-hardness steels can be processed.

[0054] As described above, by using the pulsed laser 24 under the above processing conditions, the same rough surface processing as sandblasting can be performed, which can improve the aesthetics of the dial 10 as a watch component. Furthermore, since multiple media and masks are not required as in sandblasting, productivity can be improved.

[0055] By setting the ratio of the total area of ​​the machining marks 31 to the area of ​​the machining area 30 to 65% or more, the area of ​​the non-machining area where the machining marks 31 are not formed can be reduced, and a rough surface finish pattern closer to sandblasting can be formed. Furthermore, the ratio of the total area of ​​the machining marks 31 can be easily set by simply setting the random number Ron, the random number Roff, and the spacing P.

[0056] By setting the scanning path of the pulsed laser 24 to the X-axis, i.e., the X1 and X2 directions, as the first direction, and arranging the scanning paths in parallel, the entire processing area 30 can be processed efficiently. Moreover, the pulsed laser 24 performs scanning in the X1 and X2 directions alternately, so processing can be performed more efficiently, for example, compared to scanning the pulsed laser 24 only in the X1 direction.

[0057] By setting the spacing P between the parallel scanning paths to be less than or equal to the spot diameter R, the area of ​​the unprocessed surface can be reduced, thereby improving the aesthetics of the dial 10, which is a component of a watch.

[0058] Because a nanosecond laser is used as the pulsed laser 24, the surface of the substrate 10A can be roughened compared to picosecond or femtosecond lasers with shorter pulse widths, enabling the processing of a rough surface suitable for a watch dial 10 as a watch component. Furthermore, because a nanosecond laser is used, unevenness 35 formed on the surface of the substrate 10A by cutting processes prior to laser processing can be removed, mitigating the impact of cutting marks formed on the substrate 10A.

[0059] [Second Implementation]

[0060] like Figure 7 As shown, the difference between the second embodiment and the first embodiment is that the scanning direction of the pulsed laser 24 is set to two directions: a first direction and a second direction that intersects the first direction.

[0061] That is, in the second embodiment, after performing a first processing step on the substrate 10A in which the laser irradiation unit 21 reciprocates in a first direction along the Y-axis, a second processing step is performed in which the laser irradiation unit 21 reciprocates in a second direction intersecting the Y-axis at an angle of 45°. The processing conditions in the first and second processing steps, except for the scanning direction, can be set in the same way as in the first embodiment.

[0062] In the first processing step, a processing mark 31 connected in a first direction is formed. In the second processing step, a processing mark 31 connected in a second direction is formed.

[0063] Figure 8This shows an enlarged view of region 30B, a portion of the processing area where laser processing was performed according to the second embodiment. Figure 8 In the magnified region 30B, the pulsed laser 24 scans along two intersecting directions, so the machining mark 31 is also formed along two directions.

[0064] According to the second embodiment, the machining mark 31 can be formed along the intersecting first and second scanning paths. Therefore, compared with the first embodiment where the machining mark 31 is formed only through the first scanning path, the machining mark 31 can be formed more irregularly. Thus, the machining mark 31 of laser processing can be made to more closely resemble the machining mark of sandblasting.

[0065] [Variation Example]

[0066] The scanning path of the pulsed laser 24 is not limited to the above-described embodiments, such as... Figure 9 As shown, the direction can also be changed midway through the scanning path.

[0067] In addition, in the second embodiment, the intersection angle between the first scanning path and the second scanning path is 45°, but the intersection angle is not limited to 45°.

[0068] Furthermore, the scanning direction of the pulsed laser 24 is not limited to two directions, but can also be three or more directions. For example, if it is a watch dial, the pulsed laser 24 can be used to perform rough surface processing by scanning along a first direction connecting 12 o'clock and 6 o'clock, a second direction connecting 2 o'clock and 8 o'clock, and a third direction connecting 4 o'clock and 10 o'clock.

[0069] The spot diameter R of the pulsed laser 24 is not limited to 30 μm; it can be set to a range of 12.5 μm or more and 200 μm or less, and more preferably to a range of 20 μm or more and 80 μm or less. In the laser irradiation device 20, since multiple spot diameters R can be set, the setting can be made according to the type of watch part to be processed.

[0070] The processing conditions such as the output level, scanning speed V, frequency f, irradiation on time Ton, and irradiation off time Toff of the pulsed laser 24 are not limited to the above-described embodiments, and can be set according to the type and material of the watch part to be processed.

[0071] The ratio of the total area of ​​the machining marks 31 to the area of ​​the machining area 30 is not limited to 65% or more, and can also be less than 65%. However, if the ratio of the total area of ​​the machining marks 31 decreases, the non-machining area increases, and the aesthetics decrease. Therefore, it is preferable to be 65% or more. In addition, the ratio of the total area of ​​the machining marks 31 to the area of ​​the machining area 30 can be 100%. This upper limit can be set by considering the balance between processing efficiency and aesthetics.

[0072] The watch parts subjected to laser processing are not limited to the dial 10, but can also be various watch parts such as the case, back cover, base plate, pendulum, second plate, and wheel train plate. In addition, the processing area can be the entire surface of the watch part or a part thereof, and the scanning path can be set according to the processing area, design, etc.

[0073] [Summary of this disclosure]

[0074] The method for manufacturing watch components disclosed herein is characterized in that,

[0075] Multiple processing marks are formed in the processing area of ​​a watch component substrate by irradiating it with a pulsed laser. The spot diameter R of the pulsed laser is set within the range of 12.5 μm to 200 μm. The scanning speed V and frequency f are set to satisfy the conditions α = RV / f and 0 ≤ α < R, with the pulsed laser scanning speed V mm / s, the pulsed laser frequency f kHz, and the overlapping length of the processing marks α μm. The irradiation on time Ton and the irradiation off time Toff are randomly set.

[0076] By setting the pulsed laser spot diameter R within a range of 12.5 μm to 200 μm, which is similar to the particle size of the medium used in sandblasting, the size of the machining marks produced by pulsed laser irradiation can be made to be similar to that of sandblasting.

[0077] When the scanning speed of the pulsed laser is set to V mm / s and the frequency of the pulsed laser is f kHz, and the conditions α = RV / f and 0 ≤ α < R are met, it is possible to form continuous machining marks along the scanning direction using the pulsed laser, and to form each machining mark in a connected manner. Furthermore, since the irradiation on-time Ton of the pulsed laser and the irradiation off-time Toff of the non-pulsed laser are randomly set, the length of the continuous machining marks in the scanning direction and the length of the gap between each machining mark can be randomly set, and the surface of the substrate can be roughened using laser processing in the same way as sandblasting.

[0078] Since the substrate is processed by irradiation with a pulsed laser, even when performing various rough surface processing, it is not necessary to prepare multiple media as in sandblasting. Multiple rough surface processing can be performed simply by changing the processing conditions during laser processing.

[0079] In sandblasting, masks are needed in non-processed areas, but in laser processing, only the designated processing area can be processed without masks, thus reducing the workload during processing.

[0080] In sandblasting, if the hardness of the medium is not higher than that of the substrate, it cannot be processed. However, in laser processing, it is possible to process without relying on the hardness of the substrate, and it is also possible to process high-hardness steel, etc.

[0081] As described above, by using pulsed laser processing under the above processing conditions, the processing efficiency can be improved compared with sandblasting when roughening the substrate, and the productivity of watch parts can also be increased.

[0082] In the watch component processing method disclosed herein, it is preferable that the total area of ​​the processing marks is 65% or more relative to the processing area of ​​the substrate.

[0083] By making the total area of ​​machining marks relative to the area of ​​the machining area more than 65%, the area of ​​the non-machining area where no machining marks are formed is reduced, thus enabling the formation of a rough surface finish that more closely resembles sandblasting.

[0084] In the watch component processing method disclosed herein, it is preferable that the spot diameter R of the pulsed laser is set in the range of 20 μm or more and 80 μm or less.

[0085] By setting the pulsed laser spot diameter R to a range of 20μm or more and 80μm or less, it is possible to form machining marks of the same size as those previously achieved in sandblasting processes on watch parts, effectively reproducing patterns identical to those of the past.

[0086] In the watch component processing method disclosed herein, it is preferable that the scanning paths of the pulsed lasers are arranged in parallel.

[0087] By arranging the scanning paths in parallel, the entire processing area can be processed efficiently.

[0088] In the watch component processing method disclosed herein, it is preferred that the scanning path of the pulsed laser comprises: a first scanning path in which all scanning paths are arranged in parallel; and a second scanning path that intersects the first scanning path and in which all scanning paths are arranged in parallel.

[0089] Because machining marks can be formed along the intersecting first and second scanning paths, they can be formed more irregularly than those formed using only the first scanning path. Therefore, the machining marks from laser processing can be made more similar to those from sandblasting.

[0090] In the watch component processing method disclosed herein, it is preferable that the interval between the parallel scanning paths is set to be less than or equal to the spot diameter R of the pulsed laser.

[0091] If the interval between the parallel scanning paths is greater than the spot diameter R, the area of ​​the unprocessed surface without machining marks increases, reducing the aesthetics of the watch component. However, by making the interval less than or equal to the spot diameter R, the area of ​​the unprocessed surface can be reduced, thus improving the aesthetics.

[0092] In the watch component processing method disclosed herein, it is preferable that the pulsed laser is a nanosecond laser.

[0093] Nanosecond lasers, with pulse widths in the nanosecond range, can produce rougher surfaces compared to picosecond or femtosecond lasers with even shorter pulse widths, making them suitable for roughening watch components. Furthermore, nanosecond lasers can remove surface irregularities formed by pre-cutting processes, thus reducing the impact of cutting marks.

[0094] The watch component disclosed herein is characterized in that a plurality of processing marks are formed in a processing area of ​​the substrate by irradiating the substrate with a pulsed laser, the processing marks being formed in a connected manner in a first direction which is the scanning direction of the pulsed laser, the length of the processing marks in the width direction perpendicular to the first direction being 12.5 μm or more and 200 μm or less, and the ratio of the length of the processing marks in the width direction to the length in the first direction being 1:1 to 50.

[0095] The width of the machining mark is 12.5 μm or more and 200 μm or less, which is the same size as the particle size of the medium used in sandblasting. Therefore, the size of the machining mark produced by pulsed laser irradiation is the same as that of sandblasting.

[0096] When forming machining marks continuously along the scanning direction using a pulsed laser, by connecting each machining mark together, and setting the ratio of the length in the width direction of the machining mark to the length in the scanning direction to 1:1 to 50, the length of the continuous machining marks in the scanning direction can be randomly set within a range of 1 to 50 times the length in the width direction, and the substrate surface can be roughened using laser processing in the same way as sandblasting.

[0097] Because the substrate is processed by irradiation with a pulsed laser, it is not necessary to prepare multiple media as in sandblasting when performing various rough surface processing. Multiple rough surface processing can be performed simply by changing the processing conditions during laser processing.

[0098] In sandblasting, masks are needed in non-processed areas, but in laser processing, only the designated processing area can be processed without masks, thus reducing processing workload.

[0099] In sandblasting, if the hardness of the medium is not higher than that of the substrate, it cannot be processed. However, in laser processing, it is possible to process without relying on the hardness of the substrate, and it is also possible to process high-hardness steel, etc.

[0100] Therefore, compared with sandblasting, it can improve processing efficiency and increase the productivity of watch parts.

[0101] In the watch components disclosed herein, it is preferable that the total area of ​​the machining marks is 65% or more relative to the machining area of ​​the substrate.

[0102] By making the total area of ​​machining marks relative to the area of ​​the machining area more than 65%, the area of ​​the non-machining area where no machining marks are formed becomes smaller, thus enabling the formation of a rough surface finish that is close to that of sandblasting.

[0103] In the watch components disclosed herein, preferably, the machining marks have: machining marks formed in connection in the first direction; and machining marks formed in connection in a second direction intersecting the first direction.

[0104] Because the machining marks are formed in interconnected first and second directions, they can be formed more irregularly than those formed only in the first direction. Therefore, the machining marks from laser processing can be made to more closely resemble those from sandblasting.

[0105] The watch components disclosed herein are preferably any one of the following: dial, case, back cover, base plate, pendulum, second plate, and wheel train plate.

[0106] By applying a rough surface finish to these watch components, similar to sandblasting, design flexibility can be improved.

[0107] In the watch components disclosed herein, the substrate is preferably any one of brass, titanium, stainless steel, pure iron, zinc-copper alloy, duralumin, steel, and their alloys.

[0108] By using various metal materials as substrates and employing laser processing to achieve rough surface finishing, it is possible to provide watch components with a high-end feel. Furthermore, laser processing allows for easy processing by adjusting the output according to the type of substrate, and the processing area is also easy to set, thus improving productivity compared to sandblasting.

[0109] The watch component disclosed herein is characterized in that multiple processing marks are formed in the processing area of ​​the substrate by irradiating the substrate of the watch component with a pulsed laser. The spot diameter R of the pulsed laser is set in the range of 12.5 μm or more and 200 μm or less. When the scanning speed of the pulsed laser is V mm / s, the frequency of the pulsed laser is f kHz, and the length of the overlapping part of the processing marks is α μm, the scanning speed V and the frequency f are set to satisfy the conditions α = RV / f and 0 ≤ α < R. The length of the processing marks in the scanning direction and the length between each processing mark in the scanning direction are random.

[0110] The watch parts according to the present invention can improve processing efficiency and increase the productivity of watch parts compared with sandblasting.

Claims

1. A method for processing a watch component, characterized in that, The method for processing the watch component involves irradiating a substrate of the watch component with a pulsed laser to form multiple processing marks in the processing area of ​​the substrate. The spot diameter R of the pulsed laser is set within the range of 12.5 μm or more and 200 μm or less. Given that the scanning speed of the pulsed laser is V mm / s, the frequency of the pulsed laser is f kHz, and the length of the overlapping portion of the machining mark is α μm, the scanning speed V and the frequency f are set in a manner that satisfies the conditions α = RV / f and 0 ≤ α < R. The irradiation on-time Ton for irradiating the pulsed laser and the irradiation off-time Toff for not irradiating the pulsed laser are randomly set.

2. The method for processing watch components according to claim 1, characterized in that, The total area of ​​the machining marks is more than 65% of the machining area of ​​the substrate.

3. The method for processing watch components according to claim 1, characterized in that, The spot diameter R of the pulsed laser is set within the range of 20 μm or more and 80 μm or less.

4. The method for processing watch components according to claim 1, characterized in that, The scanning paths of the pulsed lasers are arranged in parallel.

5. The method for processing watch components according to claim 1, characterized in that, The scanning path of the pulsed laser has the following characteristics: The first scan path, with all scan paths arranged in parallel; and A second scan path that intersects the first scan path and is arranged in parallel with the other scan paths.

6. The method for processing a watch component according to claim 4 or 5, characterized in that, The interval between the parallel scanning paths is set to be less than or equal to the spot diameter R of the pulsed laser.

7. The method for processing a watch component according to claim 1, characterized in that, The pulsed laser is a nanosecond laser.

8. A watch component, characterized in that, The watch component has multiple machining marks formed in the machining area of ​​the substrate by irradiating the substrate with a pulsed laser. The spot diameter R of the pulsed laser is set within the range of 12.5 μm or more and 200 μm or less. When the scanning speed of the pulsed laser is V mm / s, the frequency of the pulsed laser is f kHz, and the length of the overlapping portion of the machining mark is α μm, the scanning speed V and the frequency f are set to satisfy the conditions α = RV / f and 0 ≤ α < R. The length of the machining mark in the scanning direction and the length between each machining mark in the scanning direction are both random.

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