Heating treatment device

Abstract

The present application provides a kind of heating treatment device that can inhibit the temperature distribution of workpiece in-plane deviation generation. The heating treatment device of embodiment includes: chamber;First heating part, is arranged in the inside of the chamber, and has at least one first heater;Second heating part, is arranged in the inside of the chamber, and has at least one second heater, and is opposite to the first heating part;Processing part, is box-like, and has the space of supporting workpiece in the inside, and is detachably arranged between the first heating part and the second heating part;Panel, is arranged at least any one of the first heating part side of the processing part outside and the second heating part side of the processing part outside;Nozzle, supplies temperature control gas between the panel and the processing part;And valve, is connected with the nozzle.

Description

[0001] This invention is a divisional application of the invention patent application filed on July 25, 2022, with application number 202210878151.1 and title "Heat Treatment Apparatus". Technical Field

[0002] Embodiments of the present invention relate to a heat treatment apparatus. Background Technology

[0003] There exists a heat treatment apparatus that heats a workpiece and forms a film or similar substance on the surface of the workpiece, or treats the surface of the workpiece.

[0004] For example, a heat treatment apparatus has been proposed to form an organic film on a substrate by heating a workpiece having a substrate and a solution coated on the surface of the substrate. (See, for example, Patent Document 1)

[0005] In this type of heat treatment apparatus, the internal space of the chamber is sometimes depressurized to below atmospheric pressure, and the workpiece is heated to a temperature of approximately 100°C to 600°C in a gas environment depressurized to below atmospheric pressure. Alternatively, by installing heaters on the surface side (upper side) and the back side (lower side) of the workpiece, heating can be performed from both sides, thereby shortening the processing time.

[0006] Here, if the temperature distribution within the surface of the workpiece deviates during heat treatment, the quality of the formed film or treated layer may deviate within the surface of the workpiece. Therefore, a technique has been proposed that involves providing a plate facing the surface of the workpiece and a plate facing the back surface of the workpiece, and applying heat equally to both the surface and the back surface of the workpiece. (See, for example, Patent Documents 1 and 2)

[0007] However, for example, because there is a cavity on the outside of the workpiece, heat in the peripheral area of ​​the workpiece is easily lost to the cavity. Therefore, even if a plate is provided facing the surface of the workpiece and a plate is provided facing the back of the workpiece, the temperature in the central area of ​​the workpiece is higher than the temperature in the peripheral area of ​​the workpiece, resulting in a deviation in the in-plane temperature distribution of the workpiece.

[0008] Therefore, it is desirable to develop a heat treatment device that can suppress deviations in the in-plane temperature distribution of a workpiece.

[0009] [Existing Technical Documents]

[0010] [Patent Literature]

[0011] [Patent Document 1] International Publication No. 2019 / 117250

[0012] [Patent Document 2] Japanese Patent Application Publication No. 06-310448 Summary of the Invention

[0013] [The problem the invention aims to solve]

[0014] The problem to be solved by the present invention is to provide a heat treatment device that can suppress the deviation of the in-plane temperature distribution of a workpiece.

[0015] [Technical means to solve the problem]

[0016] The heat treatment apparatus of the embodiment includes: a chamber; a first heating section disposed inside the chamber and having at least one first heater; a second heating section disposed inside the chamber and having at least one second heater, and facing the first heating section; a processing section, which is box-shaped and has a space for supporting a workpiece inside, and is detachably disposed between the first heating section and the second heating section; a panel disposed on at least one of the first heating section side and the second heating section side outside the processing section; a nozzle for supplying temperature control gas between the panel and the processing section; and a valve connected to the nozzle.

[0017] [The effects of the invention]

[0018] According to an embodiment of the present invention, a heat treatment apparatus is provided that can suppress deviations in the in-plane temperature distribution of a workpiece. Attached Figure Description

[0019] Figure 1 This is a schematic cross-sectional view used to illustrate the heat treatment apparatus of this embodiment.

[0020] Figure 2 This is a schematic perspective view used to illustrate the appearance of the processing unit.

[0021] Figure 3 yes Figure 1 A schematic plan view of the temperature control unit along the AA line.

[0022] Figure 4 It is a diagram used to illustrate the heating process of a workpiece.

[0023] Figure 5 It is a chart used to illustrate the temperature of the central area and the peripheral area of ​​a workpiece.

[0024] Figure 6 This is a schematic plan view illustrating a temperature control unit in another embodiment.

[0025] Figure 7 This is a schematic cross-sectional view used to illustrate a temperature control unit in another embodiment.

[0026] Figure 8 This is a schematic cross-sectional view used to illustrate a temperature control unit in another embodiment.

[0027] Figure 9 This is a schematic cross-sectional view used to illustrate a temperature control unit in another embodiment.

[0028] Figure 10 yes Figure 9 A schematic plan view of the BB line direction of the temperature control unit.

[0029] [Explanation of reference numerals in the attached figures]

[0030] 1: Heating treatment device

[0031] 10: Chamber

[0032] 11: Opening and closing doors

[0033] 12: Cover

[0034] 13: Cooling section

[0035] 14: Wiring

[0036] 14a: Connector

[0037] 15: Bridge section

[0038] 17: First exhaust port

[0039] 18: Second exhaust port

[0040] 20: Exhaust section

[0041] 21: First exhaust section

[0042] 21a: First exhaust pump

[0043] 21b: First Pressure Control Unit

[0044] 22: Second exhaust section

[0045] 22a: Second exhaust pump

[0046] 22b: Second pressure control unit

[0047] 30: Heating section

[0048] 31: First heating section

[0049] 32: Second heating section

[0050] 33: Heater

[0051] 40: Cooling section

[0052] 41: Nozzle

[0053] 42: Gas source

[0054] 43: Gas Control Department

[0055] 50: Processing Department

[0056] 51: Framework

[0057] 52: Upper heat spreader

[0058] 53: Lower heat spreader

[0059] 54: Side heat spreader

[0060] 55: Side heat spreader

[0061] 56: Support section

[0062] 57: Temperature sensor

[0063] 57a: Wiring

[0064] 57b: Connector

[0065] 58: Maintaining Department

[0066] 60, 60a, 60b, 60c, 60d: Temperature control unit

[0067] 61, 61a: Panel

[0068] 62, 62a: Nozzle

[0069] 63: Valve

[0070] 64: Flow Adjustment Department

[0071] 65: Gas Source

[0072] 66: Connector

[0073] 70: Controller

[0074] 100: Workpiece

[0075] T1, T2: Poor

[0076] X, Y, Z: Direction Detailed Implementation

[0077] Hereinafter, embodiments will be illustrated with reference to the accompanying drawings. Furthermore, in each drawing, the same reference numerals are used to denote the same constituent elements, and detailed descriptions are appropriately omitted.

[0078] The following is an example of a heat treatment apparatus that forms an organic film on the surface of a workpiece by heating it in a gas environment depressurized to below atmospheric pressure. However, the present invention is not limited thereto. For example, the present invention can also be applied to heat treatment apparatuses that heat workpieces and form inorganic films or treat the surface of workpieces.

[0079] Alternatively, the workpiece before heating may have a substrate and a solution coated on the surface of the substrate, or it may only have a substrate. Hereinafter, as an example, we will describe the case where the workpiece before heating has a substrate and a solution coated on the surface of the substrate. Furthermore, the solution also includes solutions that have been temporarily calcined to a semi-hardened state (a non-flowing state).

[0080] Figure 1 This is a schematic cross-sectional view used to illustrate the heat treatment apparatus 1 of this embodiment.

[0081] also, Figure 1 The X, Y, and Z directions represent three mutually orthogonal directions. The up / down direction in this specification can be set as the Z direction.

[0082] Figure 2 This is a schematic perspective view used to illustrate the appearance of the processing unit 50.

[0083] Figure 3 yes Figure 1 A schematic plan view of the AA line direction of the temperature control unit 60.

[0084] The workpiece 100 before heating has a substrate and a solution coated on the surface of the substrate.

[0085] The substrate may be, for example, a glass substrate or a semiconductor wafer. However, the substrate is not limited to the examples.

[0086] The solution may contain, for example, an organic material and a solvent. There are no particular limitations on the organic material, as long as it can be dissolved by the solvent. The solution may, for example, be a varnish containing polyamic acid. However, the solution is not limited to this example.

[0087] like Figure 1 As shown, the heating treatment apparatus 1 includes, for example, a chamber 10, an exhaust section 20, a heating section 30, a cooling section 40, a processing section 50, a temperature control section 60, and a controller 70.

[0088] The controller 70 includes, for example, an arithmetic unit such as a central processing unit (CPU) and a storage unit such as a memory. The controller 70 is, for example, a computer. The controller 70 controls the operation of each component installed in the heat treatment apparatus 1 based on the control program stored in the storage unit.

[0089] The chamber 10 is box-shaped. The chamber 10 has an airtight structure capable of maintaining a gas environment depressurized to below atmospheric pressure. The external shape of the chamber 10 is not particularly limited. For example, the external shape of the chamber 10 can be a cuboid or a cylinder. The chamber 10 can be formed of a metal such as stainless steel.

[0090] For example, an opening / closing door 11 may be provided at one end of the chamber 10 in the Y direction. When the opening / closing door 11 is closed, the opening of the chamber 10 is sealed in an airtight manner by a sealing material such as an O-ring. When the opening / closing door 11 is opened, the workpiece 100 can be moved in or out through the opening of the chamber 10.

[0091] For example, a cover 12 may be provided at the other end of the chamber 10 in the Y direction. The cover 12 may be detachably provided at the other end of the chamber 10 using fastening members such as screws. When the cover 12 is installed, the opening of the chamber 10 is sealed in an airtight manner by a sealing material such as an O-ring. The provision of a detachable cover 12 facilitates maintenance of the heat treatment apparatus 1. Furthermore, during maintenance of the heat treatment apparatus 1, the processing unit 50 can be moved in or out.

[0092] A cooling section 13 may be provided on the outer wall of the chamber 10. A cooling water supply section (not shown) is connected to the cooling section 13. The cooling section 13 may be, for example, a water jacket. If the cooling section 13 is provided, the temperature of the outer wall of the chamber 10 can be prevented from exceeding a predetermined temperature.

[0093] The exhaust section 20 exhausts air into the interior of the chamber 10. The exhaust section 20 has a first exhaust section 21 and a second exhaust section 22.

[0094] The first exhaust section 21 is connected to the first exhaust port 17, which is located on the bottom surface of the chamber 10.

[0095] The first exhaust section 21 includes a first exhaust pump 21a and a first pressure control section 21b.

[0096] The first exhaust pump 21a can be configured as an exhaust pump that performs rough evacuation from atmospheric pressure to a specified pressure. Therefore, the first exhaust pump 21a has a larger exhaust volume compared to the second exhaust pump 22a, which will be described later. The first exhaust pump 21a can be, for example, a dry vacuum pump.

[0097] The first pressure control unit 21b is disposed between the first exhaust port 17 and the first exhaust pump 21a. The first pressure control unit 21b controls the pressure of the chamber 10 to a predetermined pressure based on the output of a vacuum gauge (not shown) or similar device that detects the internal pressure of the chamber 10. The first pressure control unit 21b may be, for example, an automatic pressure controller (APC).

[0098] The second exhaust section 22 is connected to the second exhaust port 18, which is located on the bottom surface of the chamber 10.

[0099] The second exhaust section 22 includes a second exhaust pump 22a and a second pressure control section 22b.

[0100] After the first exhaust pump 21a performs rough venting, the second exhaust pump 22a vents to a lower specified pressure. The second exhaust pump 22a, for example, has the venting capability to vent to a high vacuum molecular flow region. For example, the second exhaust pump 22a can be a turbomolecular pump (TMP).

[0101] The second pressure control unit 22b is disposed between the second exhaust port 18 and the second exhaust pump 22a. The second pressure control unit 22b controls the pressure of the chamber 10 to a predetermined pressure based on the output of a vacuum gauge (not shown) or similar device that detects the internal pressure of the chamber 10. The second pressure control unit 22b may be, for example, an APC (Automatic Pressure Controller).

[0102] The first exhaust port 17 and the second exhaust port 18 are disposed on the bottom surface of the chamber 10. Therefore, a downflow airflow is formed inside the chamber 10 toward the bottom surface of the chamber 10. With the formation of the downflow airflow, sublimation products containing organic materials generated when heating the workpiece 100 are discharged to the outside of the chamber 10 along with the downflow airflow. Therefore, it is possible to suppress the adhesion of foreign matter such as sublimation products to the inner wall of the chamber 10.

[0103] Furthermore, the above example illustrates the case where the first exhaust port 17 and the second exhaust port 18 are located on the bottom surface of the chamber 10. However, the first exhaust port 17 and the second exhaust port 18 may also be located on the top surface or side surface of the chamber 10. If the first exhaust port 17 and the second exhaust port 18 are located on the bottom surface or the top surface of the chamber 10, an airflow towards the bottom surface or the top surface of the chamber 10 can be formed inside the chamber 10.

[0104] By reducing the pressure inside chamber 10, heat release to the outside of chamber 10 can be suppressed. This improves heating and heat storage efficiency, thereby reducing the power required to power heater 33. Reducing the power required to power heater 33 prevents its temperature from exceeding a predetermined level, thus extending its lifespan.

[0105] The heating unit 30 has, for example, a first heating unit 31 and a second heating unit 32. The first heating unit 31 and the second heating unit 32 are disposed inside the chamber 10.

[0106] A first heating element 31 is disposed above the processing unit 50. A second heating element 32 is disposed below the processing unit 50. The second heating element 32 faces the first heating element 31. As described later, a workpiece 100 is supported inside the processing unit 50. Therefore, the first heating element 31 heats the surface (upper surface) of the workpiece 100 supported inside the processing unit 50. The second heating element 32 heats the back surface (lower surface) of the workpiece 100 supported inside the processing unit 50.

[0107] For example, such as Figure 1 As shown, there are multiple processing units 50 arranged vertically (Z-direction) inside the chamber 10. In this case, the second heating unit 32 provided below the upper processing unit 50 can be replaced by the first heating unit 31 provided above the lower processing unit 50. That is, either the first heating unit 31 or the second heating unit 32 provided between processing units 50 can be used.

[0108] In this configuration, the back surface (lower surface) of the workpiece 100 inside the upper processing section 50 is heated by either the shared first heating section 31 or the second heating section 32. The surface (upper surface) of the workpiece 100 inside the lower processing section 50 is heated by either the shared first heating section 31 or the second heating section 32. This reduces the number of first heating sections 31 or second heating sections 32, thus reducing power consumption, manufacturing costs, and space requirements.

[0109] The first heating section 31 has at least one heater 33 (an example of the first heater). The second heating section 32 has at least one heater 33 (an example of the first heater). The heater 33 is held, for example, by a retainer (not shown) disposed inside the chamber 10. The terminal end of the heater 33 protrudes to the outside of the cover 12 of the chamber 10. In this way, maintenance of the heater 33 becomes easy.

[0110] Figure 1The first heating section 31 and the second heating section 32, as illustrated, each have multiple heaters 33. These heaters 33 can be arranged, for example, along the X direction. They can also be arranged, for example, along the Y direction. Furthermore, the heaters 33 can be arranged at equal intervals. The specifications, quantity, and spacing of the heaters 33 installed in the second heating section 32 can be the same as, or different from, those of the heaters 33 installed in the first heating section 31. The specifications, quantity, and spacing of the heaters 33 can be appropriately varied according to the composition of the solution to be heated (the heating temperature of the solution), the size of the workpiece 100, etc. The specifications, quantity, and spacing of the heaters 33 can be appropriately determined through simulation or experimentation.

[0111] Heater 33 can be, for example, a sheathed heater, a far-infrared heater, a far-infrared lamp, a ceramic heater, a cartridge heater, etc. Alternatively, various heaters can be covered by a quartz cover.

[0112] Alternatively, the heater 33 can be configured as a rod-shaped heater extending in one direction. When multiple heaters 33 are provided, for example, the multiple heaters 33 can be configured as rod-shaped heaters extending in a direction orthogonal to the arrangement direction. Furthermore, in this specification, the term "rod-shaped heater" also includes various heaters covered by a quartz cover. Additionally, the external shape of "rod-shaped" is not limited; for example, it can be cylindrical or prismatic.

[0113] Furthermore, the heater 33 is not limited to the conditions described above, as long as it can heat the workpiece 100 in a gas environment with reduced pressure to below atmospheric pressure. That is, the heater 33 can simply utilize the heat energy obtained from radiation.

[0114] Cooling unit 40 supplies cooling gas to the interior of chamber 10. Cooling unit 40 may also supply cooling gas to the interior of processing unit 50 via a hole (not shown) provided in processing unit 50. Cooling unit 40 cools processing unit 50 using cooling gas. By cooling processing unit 50, workpiece 100, which is at a high temperature, is indirectly cooled. Furthermore, by cooling processing unit 50, heat transfer from processing unit 50 to workpiece 100 can be suppressed. When cooling gas is supplied to the interior of processing unit 50, workpiece 100, which is at a high temperature, is directly cooled by the cooling gas.

[0115] Furthermore, the cooling unit 40 is not necessarily necessary and can be omitted. However, if the cooling unit 40 is provided, the cooling time of the workpiece 100 can be shortened. In addition, when cooling the workpiece 100, the heat from the processing unit 50 can suppress deviations in the in-plane temperature distribution of the workpiece 100.

[0116] The cooling unit 40 includes, for example, a nozzle 41, a gas source 42, and a gas control unit 43.

[0117] The nozzle 41 may be disposed, for example, on the wall of the chamber 10. Furthermore, the number or arrangement of the nozzles 41 may be appropriately changed.

[0118] Gas source 42 supplies cooling gas to nozzle 41. Gas source 42 can be, for example, a high-pressure gas cylinder, a factory piping, etc. In addition, multiple gas sources 42 can be provided.

[0119] The cooling gas can be a gas that does not readily react with the heated workpiece 100. Examples of cooling gases include nitrogen, carbon dioxide (CO2), and rare gases. Rare gases may include argon or helium. The temperature of the cooling gas can be set to, for example, below room temperature (e.g., 25°C).

[0120] A gas control unit 43 is disposed between the nozzle 41 and the gas source 42. The gas control unit 43 can, for example, control at least one of the following: supply of cooling gas, cessation of supply, flow rate of cooling gas, and flow volume.

[0121] The processing unit 50 is detachably disposed between the first heating unit 31 and the second heating unit 32. For example, during maintenance, the processing unit 50 is moved into the interior of the chamber 10 through the opening on the side of the chamber 10 where the cover 12 is provided. For example, during maintenance, the processing unit 50 is moved out of the chamber 10 through the opening on the side of the chamber 10 where the cover 12 is provided.

[0122] At least one processing unit 50 shall be provided. Figure 1 The example shown is a case with two processing units 50, but the number of processing units 50 can be one or more.

[0123] like Figure 1 and Figure 2 As shown, the processing unit 50 is box-shaped and has an internal space for supporting the workpiece 100. The external shape of the processing unit 50 can be, for example, a cuboid.

[0124] The processing unit 50 includes, for example, a frame 51, an upper heat spreader 52, a lower heat spreader 53, a side heat spreader 54, a side heat spreader 55, a support 56, a temperature sensor 57, and a holding part 58.

[0125] The frame 51 may be, for example, a skeleton structure made of slender plates or steel sections, or a frame formed by processing metal plates. The frame 51 may be formed of metal such as stainless steel.

[0126] The upper heat spreader 52 is plate-shaped and is disposed on the upper part of the frame 51. The upper heat spreader 52 is detachably mounted on the upper part of the frame 51. At least one upper heat spreader 52 may be provided. Figure 2The processing unit 50, as illustrated, is equipped with fifteen upper heat spreaders 52. The planar shape of the upper heat spreaders 52 can be, for example, quadrilateral. The number and planar shape of the upper heat spreaders 52 can be appropriately changed according to the size and shape of the upper part of the frame 51.

[0127] The lower heat spreader 53 is plate-shaped and is disposed at the lower part of the frame 51. The lower heat spreader 53 is detachably disposed at the lower part of the frame 51. The lower heat spreader 53 faces the upper heat spreader 52. At least one lower heat spreader 53 may be provided. The number and planar shape of the lower heat spreaders 53 may be the same as or different from the number and planar shape of the upper heat spreaders 52.

[0128] The side heat spreaders 54 are plate-shaped and are disposed on opposite sides of the frame 51. The frame 51 has side openings for the side heat spreaders 54. Workpieces 100 are moved into or out of the processing unit 50 through these side openings. Therefore, at least one of the pair of side heat spreaders 54 can be freely opened and closed or easily detached from the side of the frame 51. For example, at least one of the pair of side heat spreaders 54 can be disposed on the door 11.

[0129] A pair of side heat spreaders 55 are provided inside the frame 51. The pair of side heat spreaders 55 face each other and extend between a pair of side heat spreaders 54. One of the pair of side heat spreaders 55 is located near one side of the frame 51 where the retaining part 58 is provided. The other pair of side heat spreaders 55 is located near the other side of the frame 51 where the retaining part 58 is provided.

[0130] The space surrounded by the upper heat spreader 52, the lower heat spreader 53, the side heat spreader 54, and the side heat spreader 55 forms a processing space for heating the workpiece 100. The processing space inside the processing unit 50 is connected to the internal space of the chamber 10, for example, through gaps between the multiple upper heat spreaders 52. Therefore, if the pressure inside the chamber 10 is reduced, the pressure inside the processing space of the processing unit 50 is also reduced.

[0131] Here, as described above, the multiple heaters 33 are rod-shaped and arranged at predetermined intervals. Therefore, if the workpiece 100 is directly heated using the multiple rod-shaped heaters 33, the temperature distribution within the surface of the heated workpiece 100 will deviate.

[0132] If the temperature distribution within the surface of workpiece 100 deviates, the quality of the formed organic film may decrease. For example, bubbles may form in areas with higher temperatures, or the composition of the organic film may change.

[0133] If an upper heat spreader 52 and a lower heat spreader 53 are provided, heat emitted from the multiple heaters 33 is incident on the upper heat spreader 52 and the lower heat spreader 53. The heat incident on the upper heat spreader 52 and the lower heat spreader 53 propagates along the surface direction inside these heat spreaders and is simultaneously radiated toward the workpiece 100. Therefore, deviations in the in-plane temperature distribution of the workpiece 100 can be suppressed, thereby improving the quality of the formed organic film.

[0134] The upper heat spreader 52 and the lower heat spreader 53 are preferably made of materials with high thermal conductivity. These materials may include, for example, aluminum, copper, stainless steel, etc. In addition, when using materials that are easily oxidized, such as aluminum or copper, a layer containing a material that is not easily oxidized may be provided on the surface.

[0135] A portion of the heat emitted from the upper heat spreader 52 and the lower heat spreader 53 is directed toward the processing space. Therefore, the processing unit 50 is provided with a side heat spreader 54 and a side heat spreader 55. The heat incident on the side heat spreaders 54 and 55 is propagated along the planar direction through the side heat spreaders 54 and 55, and a portion of this heat is dissipated toward the workpiece 100. Therefore, the heating efficiency of the workpiece 100 can be improved.

[0136] The materials of the side heat spreaders 54 and 55 can be the same as those of the upper heat spreader 52 and the lower heat spreader 53 described above.

[0137] In addition, Figure 2 The example provided illustrates a case where multiple upper heat spreaders 52 and multiple lower heat spreaders 53 are provided, but at least one of the upper heat spreaders 52 and the lower heat spreaders 53 may also be a single plate-shaped component.

[0138] As explained above, the workpiece 100, supported within the processing space of the processing unit 50, is heated via the upper heat spreader 52, the lower heat spreader 53, and the side heat spreaders 54 and 55. Here, vapors containing sublimes generated during the heating of the solution tend to adhere to objects with temperatures lower than the workpiece 100 being heated. In this case, since the upper heat spreader 52, the lower heat spreader 53, and the side heat spreaders 54 and 55 are heated, the adhesion of sublimes to these heat spreaders can be suppressed. Furthermore, the generated sublimes are discharged to the outside of the processing unit 50 through gaps between the upper heat spreaders 52, and are discharged outside the chamber 10 along with the descending airflow described above. Therefore, the adhesion of generated sublimes to the workpiece 100 can be suppressed.

[0139] Furthermore, the processing unit 50 is detachably mounted inside the chamber 10. Therefore, if sublimation adheres to the components of the processing unit 50, the adhered material can be removed from outside the chamber 10. This improves maintainability.

[0140] In addition, the processing unit 50 can be fabricated separately in advance. Therefore, for example, while cleaning the processing unit 50 with attached substances, the workpiece 100 can be processed using other processing units 50.

[0141] Multiple support sections 56 are provided inside the processing unit 50. These support sections 56 support the workpiece 100 within the space surrounded by the upper heat spreader 52, the lower heat spreader 53, the side heat spreader 54, and the side heat spreader 55—that is, the processing space where the workpiece 100 is heated. The multiple support sections 56 support the workpiece 100 in an arrangement facing the upper heat spreader 52 and the lower heat spreader 53.

[0142] Multiple support parts 56 can be configured as rod-shaped bodies.

[0143] One end of the plurality of support portions 56 (the end on the workpiece 100 side) can be shaped as a hemispherical shape or the like. If one end of the plurality of support portions 56 is hemispherical, damage to the lower surface of the workpiece 100 can be suppressed. In addition, the contact area between the lower surface of the workpiece 100 and the plurality of support portions 56 can be reduced, thereby reducing the heat transferred from the workpiece 100 to the plurality of support portions 56.

[0144] The other end of the multiple support parts 56 (the end opposite to the workpiece 100 side) can be fixed to the frame 51, the part where the lower heat spreader 53 is installed, etc.

[0145] Multiple support parts 56 are formed, for example, from stainless steel.

[0146] The number, configuration, and spacing of the multiple support parts 56 can be appropriately changed according to the size or rigidity (flexibility) of the workpiece 100.

[0147] At least one temperature sensor 57 is provided inside the processing unit 50. The temperature sensor 57 detects the temperature of the workpiece 100 in the space surrounded by the upper heat spreader 52, the lower heat spreader 53, the side heat spreader 54 and the side heat spreader 55, that is, the processing space where the workpiece 100 is heated.

[0148] Here, the central region of workpiece 100 is less prone to heat dissipation compared to its peripheral region. Therefore, the temperature in the central region of workpiece 100 is more likely to be higher than the temperature in the peripheral region. In this case, if multiple temperature sensors 57 are provided, the in-plane temperature distribution of workpiece 100 can be determined.

[0149] For example, such as Figure 2 As shown, a temperature sensor 57 (an example of a first temperature sensor) can be provided to detect the temperature of the central region of the workpiece 100 facing the panel 61 (an example of a first region). A temperature sensor 57 (an example of a second temperature sensor) can also be provided to detect the temperature of the peripheral region of the workpiece 100 (an example of a second region). However, the configuration and number of temperature sensors 57 are not limited to the example and can be appropriately changed according to the size of the workpiece 100 or the heating temperature.

[0150] For example, the temperature sensor 57 indirectly measures the temperature of the workpiece 100 in the space near the lower surface of the workpiece 100. In this case, if the workpiece 100 deflects or otherwise causes a deviation in the distance between the workpiece 100 and the temperature sensor 57, the error in the measured value will increase. In this case, the deflection of the portion of the workpiece 100 supported by the support portion 56 is small, so if the temperature sensor 57 is placed near the support portion 56, the error in the measured value can be reduced. Therefore, the temperature sensor 57 is preferably placed near the support portion 56.

[0151] In addition, non-contact temperature sensors such as infrared sensors can be used to directly detect the temperature of the workpiece 100.

[0152] If the temperature sensor 57 does not come into contact with the workpiece 100, it will not cause damage to the workpiece 100. In addition, since the impact caused by repeatedly picking up and putting down the workpiece 100 will not be applied to the temperature sensor 57, damage to the temperature sensor 57 can be suppressed.

[0153] Temperature sensor 57 may be, for example, a thermocouple, a temperature-sensing resistor, a thermistor, an infrared sensor, etc. However, temperature sensor 57 is not limited to the example.

[0154] Temperature sensor 57 is electrically connected to wiring 57a. For example... Figure 2 As shown, the end of wiring 57a is located outside the processing unit 50. A connector 57b is electrically connected to the end of wiring 57a. In the chamber 10, for example, a wiring 14 electrically connected to the controller 70 is provided. A connector 14a is provided at the end of wiring 14. Connector 14a and connector 57b are electrically and mechanically detachable. When the processing unit 50 is moved into the chamber 10, connector 57b is connected to connector 14a. When the processing unit 50 is moved out of the chamber 10, connector 57b is detached from connector 14a. In this way, the processing unit 50, including the temperature sensor 57, can be detachably installed inside the chamber 10.

[0155] Alternatively, temperature sensor 57 can be omitted. The temperature of workpiece 100 during the heating process can be known in advance. For example, the temperature of workpiece 100 during the heating process can be determined by heating a workpiece equipped with multiple temperature sensors, or by simulation.

[0156] However, if a temperature sensor 57 is installed, the temperature of the workpiece 100 in the heating process can be accurately and in real time determined.

[0157] A retaining part 58 is provided on the side of the frame 51 that intersects with the side where the side heat spreader 54 is provided. A pair of retaining parts 58 are provided. The retaining parts 58 protrude outward from the side of the frame 51 and extend between each other on the side where the side heat spreader 54 is provided.

[0158] like Figure 1 As shown, inside the chamber 10, a pair of bridge portions 15 are provided for each processing unit 50. The holding portion 58 of the processing unit 50, which is moved into the chamber 10, is mounted on the bridge portion 15. The processing unit 50 is detachably held inside the chamber 10 by the pair of holding portions 58 and the pair of bridge portions 15.

[0159] Here, as described above, if an upper heat spreader 52 and a lower heat spreader 53 are provided, the deviation in the in-plane temperature of the workpiece 100 can be suppressed. However, since the outer side of the processing section 50 (the outer side of the workpiece 100) has the inner wall of the chamber 10, the peripheral area of ​​the workpiece 100 is more prone to heat dissipation to the outside compared to the central area of ​​the workpiece 100. Therefore, if only the upper heat spreader 52 and the lower heat spreader 53 are provided, it is difficult to further homogenize the in-plane temperature of the workpiece 100.

[0160] Therefore, the heat treatment apparatus 1 of this embodiment is provided with a temperature control unit 60. When multiple processing units 50 are provided, a temperature control unit 60 can be provided for each of the multiple processing units 50. Alternatively, at least one temperature control unit 60 can be provided for each processing unit 50.

[0161] The temperature control unit 60 reduces the deviation of the in-plane temperature of the workpiece 100 by lowering the temperature of a specified area of ​​the workpiece 100.

[0162] like Figure 1 and Figure 3 As shown, the temperature control unit 60 includes, for example, a panel 61, a nozzle 62, a valve 63, a flow rate adjustment unit 64, and a gas source 65.

[0163] Panel 61 may be provided on the inner wall of processing unit 50 or chamber 10, for example, using spacers or brackets. Panel 61 is plate-shaped and faces the upper surface of processing unit 50 (upper heat spreader 52). Panel 61 is provided, for example, substantially parallel to the upper surface of processing unit 50. The planar dimension of panel 61 may be smaller than the planar dimension of the upper surface of processing unit 50.

[0164] Panel 61 is positioned opposite the area of ​​the workpiece 100 where the temperature drops. As mentioned above, the temperature in the central region of the workpiece 100 tends to be higher than that in the peripheral region. Therefore, generally, panel 61 is positioned opposite the central region of the workpiece 100.

[0165] A temperature control gas (described later) is supplied to the gap between the panel 61 and the upper surface of the processing unit 50. Therefore, the panel 61 is provided to suppress the diffusion of the supplied temperature control gas into the interior of the chamber 10. The temperature control gas can be held to some extent between the panel 61 and the upper surface of the processing unit 50. Therefore, the planar dimensions and shape of the panel 61 can, for example, be set to be the same as the planar dimensions and shape of the area where the temperature of the workpiece 100 drops. However, the planar dimensions and shape of the panel 61 can be appropriately changed according to the size of the workpiece 100 or the temperature, etc. The planar dimensions and shape of the panel 61 can be appropriately determined through experiments or simulations.

[0166] The material of panel 61 can be set to be the same as that of the upper heat spreader 52.

[0167] Nozzle 62 supplies temperature-controlled gas into the gap between panel 61 and the upper surface of processing section 50. Nozzle 62 may be fixed to panel 61, for example. At least one nozzle 62 may be provided. For example, one nozzle 62 may be provided in the center of panel 61, or multiple nozzles may be provided in various locations on panel 61. The number or arrangement of nozzles 62 may be appropriately varied depending on factors such as the size of the temperature drop area of ​​workpiece 100. The number or arrangement of nozzles 62 may be appropriately determined through experiments or simulations.

[0168] Valve 63 is connected to nozzle 62. Valve 63 is located outside chamber 10 and between nozzle 62 and gas source 65. Valve 63 switches the start and stop of the supply of temperature control gas.

[0169] Furthermore, valve 63 is preferably configured to gradually increase the supply of temperature control gas when valve 63 is opened. For example, valve 63 can be configured as a so-called slow-start valve or slow-open valve. If the supply of temperature control gas gradually increases when valve 63 is opened, the temperature of the processing section 50 can be suppressed, and thus the rapid temperature change of the workpiece 100 can be suppressed. Therefore, deviations in the quality of the organic film formed in the surface of the workpiece 100 can be suppressed.

[0170] The flow regulating unit 64 is connected to the valve 63. The flow regulating unit 64 is located outside the chamber 10, between the valve 63 and the gas source 65. The flow regulating unit 64 controls the supply amount of temperature-controlled gas. The flow regulating unit 64 can be, for example, a mass flow controller. The flow regulating unit 64 may also have the function of the valve 63 described above. If the flow regulating unit 64 has the function of the valve 63, the valve 63 can be omitted.

[0171] A gas source 65 is located outside the chamber 10. The gas source 65 supplies temperature control gas to the nozzle 62 via a valve 63 and a flow regulating unit 64. The gas source 65 can be, for example, a high-pressure gas cylinder, factory piping, etc. The temperature control gas can be a gas that does not readily react with the heated workpiece 100. Examples of temperature control gases include nitrogen, carbon dioxide (CO2), and rare gases. Rare gases can be, for example, argon or helium. The temperature of the temperature control gas can be, for example, below room temperature (e.g., 25°C). The temperature control gas can be the same as or different from the cooling gas described above.

[0172] As described above, the processing unit 50 is detachably mounted inside the chamber 10. Therefore, when the panel 61 and nozzle 62 are mounted on the processing unit 50, a connector 66 can be provided between the nozzle 62 and the valve 63. The connector 66 connects and disconnects the piping on the nozzle 62 side from the piping on the valve 63 side. With the connector 66 provided, it becomes easier to move the processing unit 50, which is equipped with the panel 61 and nozzle 62, into and out of the chamber 10.

[0173] Next, the function and effect of the temperature control unit 60 will be further explained.

[0174] Figure 4 This is a diagram used to illustrate the heating process of workpiece 100.

[0175] like Figure 4 As shown, the workpiece 100, which is moved into the interior of the chamber 10, is heated to a predetermined temperature through a heating process (1), a heat treatment process (2), and a heating process (3). In the heat treatment process (2), the temperature of the workpiece 100 is maintained for a predetermined period of time, thereby forming an organic film, for example, on a substrate. Subsequently, after a cooling process to cool the workpiece 100, the heat-treated workpiece 100 is moved out of the chamber 10.

[0176] Figure 5 It is a chart used to illustrate the temperature of the central region of workpiece 100 and the temperature of the peripheral region of workpiece 100.

[0177] As mentioned above, the peripheral region of workpiece 100 dissipates heat more easily to the outside than the central region of workpiece 100. Therefore, as Figure 5 As shown, the temperature of the central region of workpiece 100 tends to be higher than the temperature of the peripheral region. In this case, the higher the temperature of workpiece 100, the greater the temperature difference between the central and peripheral regions. For example, compared to the temperature difference T1 between the central and peripheral regions in heat treatment step (1), the temperature difference T2 between the central and peripheral regions in heat treatment step (2) becomes larger. In heat treatment step (2), for example, an organic film is formed on the substrate. Therefore, if the temperature difference T2 between the central and peripheral regions becomes larger, there is a risk that the quality of the organic film formed in the surface of workpiece 100 will deviate.

[0178] Since the heat treatment apparatus 1 of this embodiment is provided with a temperature control unit 60, the temperature difference between the central region and the peripheral region can be reduced by supplying a temperature control gas to a position facing the central region of the workpiece 100. Therefore, deviations in the quality of the organic film formed in the surface of the workpiece 100 can be suppressed.

[0179] Furthermore, although it is described that the temperature control gas is supplied to a position opposite to the central region of the workpiece 100, it is sufficient to supply the temperature control gas to a position opposite to the region of the workpiece 100 with a high temperature.

[0180] When a temperature sensor 57 is provided, the controller 70 can control the valve 63 and the flow adjustment unit 64 based on the signal from the temperature sensor 57, thereby controlling the timing and amount of supply of temperature control gas.

[0181] For example, the controller 70 controls the valve 63 based on the temperature of the central region of the workpiece 100 facing the panel 61 and the temperature of the peripheral region of the workpiece 100. Moreover, when the temperature of the central region is higher than the temperature of the peripheral region, the controller 70 controls the valve 63 to supply temperature control gas from the nozzle 62 between the panel 61 and the processing unit 50.

[0182] Furthermore, the controller 70 adjusts the supply of temperature control gas, controlled by the flow adjustment unit 64, based on the temperature difference between the central region and the peripheral region. For example, it increases the supply of temperature control gas when the temperature difference is large and decreases the supply of temperature control gas when the temperature difference is small.

[0183] In the absence of temperature sensor 57, controller 70 can control valve 63 and flow adjustment unit 64 based on pre-determined control conditions, thereby controlling the timing and amount of temperature control gas supply. As described above, the control conditions without temperature sensor 57 can be determined, for example, by heating a workpiece equipped with multiple temperature sensors and determining the temperature of the workpiece 100 during the heating process, or by simulating the temperature of the workpiece 100 during the heating process.

[0184] For example, the controller 70 can store a control program that includes a predetermined heating timing for the first heating unit 31 and the second heating unit 32 to heat, a predetermined supply timing for the temperature control gas supplied by the valve 63, and a predetermined supply amount of the temperature control gas controlled by the flow adjustment unit 64. Furthermore, the controller 70 can process the workpiece 100 supported inside the processing unit 50 based on the stored control program.

[0185] Figure 6 This is a schematic plan view illustrating a temperature control unit 60a in another embodiment.

[0186] like Figure 6 As shown, the temperature control unit 60a includes, for example, a panel 61, multiple nozzles 62, multiple valves 63, multiple flow adjustment units 64, and a gas source 65.

[0187] That is, the temperature control unit 60a is provided with multiple sets of nozzles 62, valves 63, and flow adjustment units 64. Figure 6 In the case of the temperature control unit 60a shown in the example, three sets of nozzles 62, valves 63 and flow adjustment units 64 are provided.

[0188] For example, when the planar dimensions of workpiece 100 are large, temperature differences may sometimes occur in the central region of workpiece 100. For instance, the temperature near the center of the central region of workpiece 100 may sometimes be higher than the temperature at the periphery of the central region of workpiece 100.

[0189] In this case, if multiple sets of nozzles 62, valves 63 and flow adjustment units 64 are provided, the number of areas for temperature control can be increased, thereby further suppressing deviations in the temperature distribution within the surface of the workpiece 100.

[0190] Figure 7 This is a schematic cross-sectional view illustrating the temperature control unit 60b in another embodiment.

[0191] like Figure 7 As shown, the temperature control unit 60b includes, for example, a panel 61a, a nozzle 62, a valve 63, a flow adjustment unit 64, and a gas source 65.

[0192] Panel 61a may be the same as the panel 61 described above. However, since the nozzle 62 is not provided on panel 61a, holes for the nozzle 62 to be inserted are not provided.

[0193] The nozzle 62 may be provided, for example, on the frame 51 of the processing unit 50. The nozzle 62 supplies temperature-controlled gas into the gap between the panel 61a and the upper surface of the processing unit 50. The number or arrangement of the nozzles 62 may be the same as that of the temperature control unit 60 described above.

[0194] Even if the nozzle 62 is provided on the processing section 50 side, temperature control gas can be supplied to the gap between the panel 61a and the upper surface of the processing section 50, so that the effect of the temperature control section 60 described above can be enjoyed.

[0195] Figure 8 This is a schematic cross-sectional view illustrating the temperature control unit 60c of another embodiment.

[0196] like Figure 8 As shown, the temperature control unit 60c includes, for example, a panel 61, a nozzle 62, a valve 63, a flow adjustment unit 64, and a gas source 65.

[0197] In the case of the temperature control unit 60 described above, the panel 61 and the nozzle 62 are provided on the upper surface side of the processing unit 50. That is, the temperature control unit 60 controls the temperature of the workpiece 100 from the surface side of the workpiece 100. In contrast, in the case of the temperature control unit 60c, the panel 61 and the nozzle 62 are provided on the lower surface side of the processing unit 50. That is, the temperature control unit 60c controls the temperature of the workpiece 100 from the back side of the workpiece 100.

[0198] Nozzle 62 supplies temperature control gas into the gap between panel 61 and the lower surface (lower heat spreader 53) of processing unit 50. The number or arrangement of nozzles 62 can be the same as that of temperature control unit 60 described above.

[0199] Even if the panel 61 and nozzle 62 are provided on the lower surface of the processing unit 50, the effects of the temperature control unit 60 described above can still be enjoyed.

[0200] Alternatively, the panel 61 and the nozzle 62 may be disposed on the upper and lower surface sides of the processing unit 50.

[0201] That is, the panel 61 and the nozzle 62 may be disposed on at least one of the first heating part 31 side and the second heating part 32 side outside the processing part 50.

[0202] Figure 9 This is a schematic cross-sectional view illustrating the temperature control unit 60d in another embodiment.

[0203] Figure 10 yes Figure 9 A schematic plan view of the BB line direction of the temperature control unit 60d.

[0204] like Figure 9 and Figure 10 As shown, the temperature control unit 60d includes, for example, a panel 61a, a nozzle 62a, a valve 63, a flow adjustment unit 64, and a gas source 65.

[0205] The nozzle 62a is cylindrical and extends between the panel 61a and the upper surface of the processing unit 50. For example, the nozzle 62a extends along the long side of the processing unit 50. In a top view, the centerline of the nozzle 62a may overlap with the centerline of the processing unit 50. In a top view, multiple nozzle outlets may be provided on both sides of the nozzle 62a in the direction intersecting the centerline. Figure 10 As shown, temperature control gas supplied to nozzle 62a is supplied from multiple nozzles to the gap between panel 61a and the upper surface of processing unit 50.

[0206] If temperature control gas is supplied from multiple nozzles, it can be supplied over a wide range, thus making it easy, for example, to control the temperature of a workpiece 100 with a large planar dimension.

[0207] The embodiments have been illustrated above. However, the present invention is not limited to these descriptions.

[0208] Any implementation methods that can be derived by making appropriate design changes to the above-described embodiments, as long as they possess the features of the present invention, are included within the scope of the present invention.

[0209] For example, the shape, size, configuration, etc. of the heat treatment apparatus 1 are not limited to the example and can be appropriately changed.

[0210] Furthermore, the elements included in the above-described embodiments can be combined as much as possible, and any embodiments obtained by combining these elements that include the features of the present invention are included within the scope of the present invention.

Claims

1. A heat treatment apparatus, characterized in that, include: Chamber; At least one pair of bridge portions are disposed inside the chamber; A first heating section is disposed above the at least one pair of bridge sections and has at least one first heater; A second heating section is disposed below the at least one pair of bridge sections and has at least one second heater, and faces the first heating section; The processing unit is box-shaped and has a space inside to support the workpiece, and is detachably supported between the first heating unit and the second heating unit by the at least one pair of bridges. Temperature control unit; as well as Controller The processing unit has a frame, which forms the skeleton structure of the processing unit. On a pair of opposing sides of the processing unit, there are respectively a holding part mounted on the at least one pair of bridge portions. The retaining part protrudes outward from the side of the frame. The processing unit is provided with at least one of the temperature control units. The temperature control unit includes a panel, nozzles, valves, a flow adjustment unit, and a gas source. The panel is disposed on at least one of the first heating section side and the second heating section side outside the processing unit. The nozzle supplies temperature-controlled gas between the panel and the processing unit. The valve is connected to the nozzle. The controller controls the first heating unit, the second heating unit, and the valve. When the workpiece is heated in the first heating section and the second heating section, the controller controls the valve to supply the temperature control gas from the nozzle.

2. The heat treatment apparatus according to claim 1, wherein, The at least one pair of bridge portions are provided in multiple ways in the vertical direction inside the chamber; The processing unit is provided in multiple ways in the vertical direction inside the chamber; The holding portion of the processing unit is held by each of the at least one pair of bridge portions; The first heating section and the second heating section are provided corresponding to each of the at least one pair of bridge sections.

3. The heat treatment apparatus according to claim 2, wherein, The first heating section or the second heating section between the processing sections can be used concurrently.

4. The heat treatment apparatus according to claim 1 or 2, wherein, The processing unit has: The upper heat spreader is disposed on the frame; A lower heat spreader is disposed on the frame; as well as A pair of side heat spreaders are disposed between the upper heat spreader and the lower heat spreader, and are disposed on each of the opposing sides of the frame.

5. The heat treatment apparatus according to claim 4, wherein, At least one of the upper heat spreader and the lower heat spreader is composed of a heat spreader as a single plate-shaped component.

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