Semiconductor dicing blade composite function press plate

Abstract

The application provides a semiconductor dicing blade composite function pressing plate, which comprises a first pressing plate and a second pressing plate, the first pressing plate and the second pressing plate are arranged in an overlapping mode and are used for clamping and fixing the dicing blade, a water supply port is arranged on the side of the first pressing plate and / or the second pressing plate which is away from the dicing blade, a water collecting area is formed on the side of the first pressing plate and the second pressing plate which faces each other, the water collecting area is annular around the central axis of the dicing blade body, and the inner ring side of the water collecting area is communicated with the water supply port at least at one position; the edge of the side of the first pressing plate and the second pressing plate which faces each other is provided with a water passing groove in an annular distribution, one end of the water passing groove is connected with the working area of the edge of the dicing blade, and the water passing groove is communicated with the water collecting area. The cooling water is made to flow out from the water passing groove by centrifugal force, the cooling water directly and massively enters the cutting gap from the inner side of the airflow barrier of the dicing blade to realize sufficient cooling, and the cutting debris is beneficially taken away; in addition, the problem of axial impact of the cooling water on the working area of the dicing blade is solved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor dicing blade technology, and more specifically to a semiconductor dicing blade composite functional pressure plate. Background Technology

[0002] Semiconductor dicing blades are generally made of metal, ceramic, resin or composite material as a binder, bonded with diamond, and are used to process different types of semiconductor materials.

[0003] The dicing blade rotates at high speed during cutting, generating significant cutting heat and a large amount of dust in the cutting zone. This dust further intensifies friction, generating substantial frictional heat, necessitating sufficient cooling water flow. Effective cooling not only protects the blade and workpiece from burning during the cutting process but also reduces the occurrence of electric shocks and arcing. Furthermore, it lowers the load, minimizes edge chipping, and improves cutting efficiency and quality.

[0004] Traditional cooling methods involve spraying water onto the surface of the dicing cutter, with controllable nozzle direction, position, and flow rate. Semiconductor dicing cutters use finer diamond particles, resulting in a very small exposed diamond height on the end face. The thickness of the kerf and the dicing cutter are similar, narrowing the channel for cooling water to enter the kerf and limiting the amount of cooling water reaching the kerf. When the dicing cutter rotates at high speed, most of the cooling water entering the kerf contacts the cutter outside the kerf and then enters under its influence. However, the high-speed rotation of the dicing cutter surface creates an airflow barrier, causing some cooling water to be prematurely atomized and unable to effectively reach the cutting zone for adequate cooling. Therefore, the cooling effect of the water in the kerf is negligible. Excessive spray pressure can even impact the dicing cutter, causing wobbling, widening the kerf, generating more debris, leading to workpiece chipping, cutter wear, and increased frictional heat causing the cutter to overheat. These are technical problems that the field has long sought to solve but has yet to resolve. Summary of the Invention

[0005] The technical problem to be solved by this invention is: how to achieve sufficient cooling of the semiconductor dicing blade during operation when the dicing kerf is narrow, while avoiding the influence of airflow barriers on the surface of the dicing blade.

[0006] The technical solution of the present invention to solve the above-mentioned technical problems is as follows: This invention provides a semiconductor dicing blade composite functional pressure plate, including a first pressure plate and a second pressure plate. The first and second pressure plates are arranged in an overlapping manner and used to clamp and fix the dicing blade. A water supply port is provided on the side of the first and / or second pressure plates away from the dicing blade. A water collection area is formed on the side of the first and second pressure plates facing each other. The water collection area is annular around the central axis of the dicing blade body, and at least one part on the inner ring side of the water collection area is connected to the water supply port. Water channels are distributed along the annular edge of the side of the first and second pressure plates facing each other. One end of the water channel is connected to the working area of ​​the edge of the dicing blade, and the water channel is connected to the water collection area.

[0007] The beneficial effects of this invention are: This invention utilizes centrifugal force to direct cooling water from the water channel, enabling a large volume of cooling water to directly enter the cutting kerf from inside the airflow barrier of the dicing blade for thorough cooling and effectively removing cutting debris. This effectively protects the blade from damage and the workpiece material from burning, reduces the occurrence of electric shock and arcing, lowers the load, minimizes edge chipping, and improves cutting efficiency and quality. Furthermore, this invention avoids the problem of axial impact of cooling water on the dicing blade's working area, preventing issues such as kerf widening, blade wear, and workpiece edge chipping caused by blade wobble.

[0008] Based on the above technical solution, the present invention can be further improved as follows.

[0009] Furthermore, the water supply outlet is annular and coaxially arranged with the water collection area. The outer diameter of the water supply outlet is smaller than the inner diameter of the water collection area, and the inner ring side of the water collection area is connected to the water supply outlet through multiple channels.

[0010] This scheme allows the supplied cooling water to directly enter the water collection area under the action of centrifugal force, preventing backflow and improving water supply efficiency.

[0011] Furthermore, impeller blades are distributed on the inner ring side of the water collection area, and a channel is formed between each two adjacent impeller blades to connect with the water supply port.

[0012] Using this design, the impeller blades can promote the radial acceleration of cooling water along the water collection area and into the water collection area, which helps the cooling water to accelerate from the water collection area into the water channel and finally be discharged.

[0013] Furthermore, the first pressure plate has a hub in the middle, and the outer ring side of the hub has an annular convex structure in the middle, which is fixedly connected to the first pressure plate.

[0014] This design facilitates mounting the wheel hub onto the cutting machine's shaft.

[0015] Furthermore, both the first and second pressure plates are provided with water inlets on the side opposite to the dicing blade, and the water inlets are arranged on both axial sides of the convex structure.

[0016] With this design, water can be supplied through either the first pressure plate or the second pressure plate during operation, making it convenient to operate. The outward-protruding structure prevents cooling water from escaping directly from the other water supply port.

[0017] Furthermore, the convex structure has a semi-elliptical arc shape in cross-section along the hub axis, and the water collection area is arranged around the convex structure.

[0018] This design allows the supplied cooling water to directly enter the water collection area under the action of centrifugal force. The elliptical arc shape has low resistance, which is conducive to the centrifugal force pressurizing the cooling water and improving the water supply efficiency of the water channel.

[0019] Furthermore, the water collection area is connected to the water supply outlet at any four positions along the semi-elliptical arc of the outward convex structure.

[0020] This scheme improves the efficiency of water supply during rotation.

[0021] Furthermore, the first pressure plate and the second pressure plate are respectively provided with windproof water curtain channels distributed circumferentially. The windproof water curtain channels are connected to the water collection area. From the radial perspective of the dicing blade, the water channel is located between the outer ring edge of the dicing blade and the windproof water curtain channel.

[0022] This solution reduces the impact of external airflow on the cooling water in the water tank and on the surface of the dicing blade's working area, preventing premature atomization of the cooling water and improving the cooling effect.

[0023] Furthermore, the water outlet of the windbreak water curtain channel is annular.

[0024] Furthermore, the outlet end of the water channel is annular. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the working state of the present invention.

[0026] Figure 2 for Figure 1 Enlarged detailed view of part A.

[0027] Figure 3 This is a schematic diagram of the end face structure of the present invention.

[0028] Figure 4 for Figure 3 BB-direction sectional view.

[0029] Figure 5 for Figure 4 Enlarged detailed view of section C.

[0030] Figure 6 This is a schematic diagram of the structure of the first pressure plate.

[0031] In the accompanying drawings, the technical features represented by each reference numeral are as follows: 1-First pressure plate; 2-Second pressure plate; 3-Scibbing blade; 4-Water inlet; 5-Water collection area; 6-Water channel; 7-Hub; 8-Outward protruding structure; 9-Windproof water curtain channel; 10-Impeller blade. Detailed Implementation

[0032] The principles and features of the present invention are described below. The examples given are only for explaining the present invention and are not intended to limit the scope of the present invention.

[0033] Example 1, as Figure 1-5 As shown: This invention provides a semiconductor dicing blade composite functional pressure plate, including a first pressure plate 1 and a second pressure plate 2. The first pressure plate 1 and the second pressure plate 2 are arranged in an overlapping manner and are used to clamp and fix the dicing blade 3. A water inlet 4 is provided on the side of the first pressure plate 1 and / or the second pressure plate 2 away from the dicing blade 3. A water collection area 5 is formed on the side of the first pressure plate 1 and the second pressure plate 2 facing each other. The water collection area 5 is annular around the central axis of the dicing blade 3 body, and at least one part of the inner ring side of the water collection area 5 is connected to the water inlet 4. Water channels 6 are distributed along the annular edge of the side of the first pressure plate 1 and the second pressure plate 2 facing each other. One end of the water channel 6 is connected to the working area of ​​the edge of the dicing blade 3, and the water channel 6 is connected to the water collection area 5.

[0034] Note: The dicing blade 3 is the semiconductor dicing blade described in the subject matter. The water collection area 5 can be formed by machining corresponding grooves on at least one of the first pressure plate 1 and the second pressure plate 2, with the first pressure plate 1 and the second pressure plate 2 overlapping to form the water collection area 5. In addition, although it is known from the teachings of this patent that a water channel 6 can be opened on the dicing blade 3, this patent is an improvement on the pressure plates (first pressure plate 1 and second pressure plate 2). For ease of understanding, this description temporarily ignores or does not limit the solution of opening a water channel on the dicing blade 3.

[0035] Principle: In use, the dicing blade 3 is clamped between the first pressure plate 1 and the second pressure plate 2, which are mounted on the drive shaft of the cutting machine to drive the dicing blade 3 to rotate and cut semiconductor materials. During cutting, cooling water is supplied from the water inlet 4 on the side of the first pressure plate 1 and the second pressure plate 2 away from the dicing blade 3. Under the action of centrifugal force, the cooling water fills the water collection area 5 and flows out of the pressure plate area from the water channel 6. Under the action of centrifugal force, it flows radially along the surface of the dicing blade 3, directly inside the airflow barrier of the dicing blade 3, thus eliminating the problem of premature atomization. Furthermore, under the action of centrifugal force, the cooling water can quickly and directly enter the cutting kerf in large quantities, achieving sufficient cooling of the working area of ​​the dicing blade 3, while also helping to remove a large amount of cutting debris, further reducing cutting heat and wear.

[0036] In summary, this invention utilizes centrifugal force to allow cooling water to flow out from the water channel 6, enabling a large volume of cooling water to directly enter the cutting kerf from the inside of the airflow barrier of the dicing blade 3 for thorough cooling. This also facilitates the removal of cutting debris. It effectively protects the blade from damage and the workpiece material from burning, reduces the occurrence of electric shock and arcing, lowers the load, minimizes edge chipping, and improves cutting efficiency and quality. Furthermore, this invention avoids the problem of axial impact of cooling water on the working area of ​​the dicing blade 3, preventing issues such as kerf widening, blade wear, and workpiece edge chipping caused by blade wobble.

[0037] Example 2: Based on Embodiment 1, the water supply port 4 is annular and coaxially arranged with the water collection area 5. The outer diameter of the water supply port 4 is smaller than the inner diameter of the water collection area 5. The inner ring side of the water collection area 5 is connected to the water supply port 4 through multiple channels.

[0038] This scheme allows the supplied cooling water to directly enter the water collection area 5 under the action of centrifugal force, preventing backflow and improving water supply efficiency.

[0039] Preferably, impeller blades 10 are distributed on the inner ring side of the water collection area 5, and a channel is formed between each two adjacent impeller blades 10 to communicate with the water supply port 4.

[0040] Using this scheme, the impeller blades 10 can promote the radial acceleration of cooling water along the water collection area 5 and into the water collection area 5, which helps the cooling water to accelerate from the water collection area 5 into the water channel 6 and finally be discharged.

[0041] Example 3, as Figure 4-6 As shown: Based on any of the optional solutions in Embodiment 1 to 2, the first pressure plate 1 is provided with a hub 7 in the middle, and the outer ring side of the hub 7 is provided with an annular convex structure 8, which is fixedly connected to the first pressure plate 1.

[0042] This design facilitates mounting the wheel hub 7 onto the cutting machine's shaft.

[0043] Preferably, the first pressure plate 1 and the second pressure plate 2 are each provided with a water inlet 4 on the side opposite to the dicing blade 3, and the water inlet 4 are arranged on both sides of the axial direction of the outward convex structure 8.

[0044] With this design, water can be supplied through either the first pressure plate 1 or the second pressure plate 2 during operation, making it convenient to operate. The outward protruding structure 8 prevents cooling water from escaping directly from the other water supply port 4.

[0045] Preferably, the convex structure 8 has a semi-elliptical arc shape in cross section along the axial direction of the hub 7, and the water collection area 5 is arranged around the convex structure 8.

[0046] With this design, the water inlet 4 is connected to the water collection area 5 along the semi-elliptical arc of the outward-convex structure 8, which facilitates the direct entry of the supplied cooling water into the water collection area 5 under the action of centrifugal force. The elliptical arc has low resistance, which is conducive to the centrifugal force pressurizing the cooling water and improving the water supply efficiency of the water passage 6.

[0047] Preferably, the water collection area 5 is connected to the water supply port 4 at any four positions along the semi-elliptical arc of the outward convex structure 8.

[0048] This scheme improves the efficiency of water supply during rotation. "Orientation" in any four directions refers to the four directions spaced 90° apart along the circumference of the catchment area 5, without specifying a particular geographical location.

[0049] Example 4: Based on any of the optional solutions in the above embodiments, the first pressure plate 1 and the second pressure plate 2 are respectively distributed with windproof water curtain channels 9 along the circumference. The windproof water curtain channels 9 are connected to the water collection area 5. From the radial perspective of the dicing blade 3, the water channel 6 is located between the outer ring edge of the dicing blade 3 and the windproof water curtain channel 9.

[0050] This solution reduces the impact of external airflow on the cooling water in the water tank 6 and on the working area surface of the dicing blade 3, preventing premature atomization of the cooling water and improving the cooling effect.

[0051] Preferably, the water outlet of the windbreak water curtain channel 9 is annular.

[0052] Preferably, the outlet end of the water channel 6 is annular.

[0053] Example 5: Based on any of the optional solutions in the above embodiments, the windproof water curtain channel 9 and the water channel 6 distributed circumferentially on the first pressure plate 1 and the second pressure plate 2 can be set as unobstructed annular outlet ends.

[0054] This approach increases the flow rate and velocity of the cooling water, resulting in higher cooling water efficiency.

[0055] In the description of this invention, it should be understood that if descriptive terms indicating orientation, direction, or positional relationship appear, such as "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," etc., the orientation or positional relationship indicated in this specification is based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of understanding this invention and simplifying the description, and does not indicate or imply that the part, element, or whole referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this invention.

[0056] Furthermore, if sequential descriptive terms such as "first," "second," etc., appear, their purpose in this specification is for ease of understanding or simplification. For example, to distinguish multiple technical features of the same type or function, which must be mentioned separately, this specification may use prefixes or suffixes to differentiate them. Therefore, they should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. In the description of this invention, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0057] In this invention, when descriptive terms describing structural relationships are used, such as "installation," "connection," "joining," and "fixation," they should be interpreted broadly unless otherwise explicitly specified and limited. For example, "installation," "connection," and "joining" can refer to a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can refer to the internal communication of two components or the interaction between two components. "Fixation" can refer to integral fixation or detachable fixation using fasteners; it can be direct fixation or fixation through an intermediate medium. For those skilled in the art, the specific meaning of the above descriptive terms in this invention can be understood based on the specific circumstances, the context, and the coherence of the preceding and following text.

[0058] In this invention, if descriptive terms containing subordinate or connecting meanings appear, such as "above" or "below" the second feature, they should not be interpreted restrictively unless otherwise explicitly specified and limited. For example, "above" or "below" can mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. For those skilled in the art, the specific meaning of the above descriptive terms in this invention can be understood based on the specific circumstances, the context, and the coherence of the preceding and following text.

[0059] Furthermore, "above," "on top of," and "above" the first feature in relation to the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "under," and "below" the first feature in relation to the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0060] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. The illustrative expressions of the above terms in this specification do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments, examples, and features described in this specification, and such combinations or integrations should all fall within the scope of the present invention.

[0061] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of information available through public channels and in conjunction with the technical teachings given in this application.

Claims

1. A semiconductor dicing blade composite functional pressure plate, characterized in that: The device includes a first pressure plate (1) and a second pressure plate (2). The first pressure plate (1) and the second pressure plate (2) are arranged in an overlapping manner and are used to clamp and fix the dicing blade (3). The first pressure plate (1) and / or the second pressure plate (2) are provided with a water inlet (4) on the side away from the dicing blade (3). A water collection area (5) is formed on the side facing the first pressure plate (1) and the second pressure plate (2). The water collection area (5) is annular around the central axis of the dicing blade (3) body, and at least one part of the inner ring side of the water collection area (5) is connected to the water inlet (4). Water channels (6) are distributed along the annular edge on the side facing the first pressure plate (1) and the second pressure plate (2). One end of the water channel (6) is connected to the working area of ​​the edge of the dicing blade (3), and the water channel (6) is connected to the water collection area (5). The first pressure plate (1) and the second pressure plate (2) are also respectively distributed with windproof water curtain channels (9) along the circumference. The windproof water curtain channels (9) are connected to the water collection area (5). From the radial perspective of the dicing blade (3), the water channel (6) is located between the outer ring edge of the dicing blade (3) and the windproof water curtain channel (9).

2. The semiconductor dicing blade composite functional pressure plate according to claim 1, characterized in that: The water supply port (4) is ring-shaped and arranged coaxially with the water collection area (5). The outer diameter of the water supply port (4) is smaller than the inner diameter of the water collection area (5). The inner ring side of the water collection area (5) is connected to the water supply port (4) through multiple channels.

3. The semiconductor dicing blade composite functional pressure plate according to claim 2, characterized in that: Impeller blades (10) are distributed on the inner ring side of the water collection area (5), and a channel is formed between each two adjacent impeller blades (10) to connect with the water supply port (4).

4. The semiconductor dicing blade composite functional pressure plate according to any one of claims 1-3, characterized in that: The first pressure plate (1) has a hub (7) in the middle, and the outer ring side of the hub (7) has an annular convex structure (8) in the middle, which is fixedly connected to the first pressure plate (1).

5. The semiconductor dicing blade composite functional pressure plate according to claim 4, characterized in that: The first pressure plate (1) and the second pressure plate (2) are each provided with a water inlet (4) on the side away from the dicing blade (3), and the water inlet (4) is arranged on both sides of the axial direction of the convex structure (8).

6. The semiconductor dicing blade composite functional pressure plate according to claim 5, characterized in that: The convex structure (8) has a semi-elliptical arc shape along the axial section of the hub (7), and the water collection area (5) is arranged around the convex structure (8).

7. The semiconductor dicing blade composite functional pressure plate according to claim 6, characterized in that: The water collection area (5) is connected to the water supply port (4) in any four directions along the semi-elliptical arc of the outward convex structure (8) on any four sides of the inner ring side.

8. The semiconductor dicing blade composite functional pressure plate according to claim 1, characterized in that: The outlet end of the windproof water curtain channel (9) is annular.

9. The semiconductor dicing blade composite functional pressure plate according to claim 1, characterized in that: The outlet end of the water passage (6) is annular.

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