Horizontal hot filament CVD apparatus electrode plate and horizontal hot filament CVD apparatus

Abstract

The application relates to the field of coating technology and discloses a horizontal hot-wire CVD equipment electrode plate and a horizontal hot-wire CVD equipment. The electrode plate comprises multiple process units which are horizontally and side by side connected, the process unit comprises a unit main body frame, a heating wire mounting plate is arranged above the inner cavity of the unit main body frame, a connecting hole is arranged on the bottom surface of the heating wire mounting plate, and a plurality of heating wires are correspondingly inserted into the connecting hole in a straight line; a plurality of gas holes for supplying gas to the heating wires are arranged on the front and back sides of the heating wire mounting plate in the direction perpendicular to the axis of the heating wire; a magnetic member is further arranged on the inner wall of the unit main body frame below the heating wire mounting plate, and the magnetic member applies a surrounding magnetic field to the space below the heating wire. The application realizes horizontal deposition, improves the uniformity of coating, shortens the heating wire, overcomes the defects of the existing long heating wire, such as serious deformation and short service life, and realizes horizontal continuous dynamic deposition.

Description

Technical Field

[0001] This invention relates to the field of coating technology, and more specifically, to an electrode plate for a horizontal hot-wire CVD equipment and a horizontal hot-wire CVD equipment. Background Technology

[0002] Hot-wire CVD equipment, also known as catalytic chemical vapor deposition equipment or HoFCVD equipment, refers to integrated circuit thin film deposition equipment based on the principle of hot-wire CVD technology. The principle of hot-wire CVD technology involves the catalytic decomposition of gas molecules such as SiH4 (silane) and H2 (hydrogen) on a metal wire (tungsten or tantalum wire) heated to 2200℃, generating various "uncharged" active groups. These active groups then adhere to the substrate surface and undergo reactions such as adhesion, migration, and chemical bonding to form a thin film.

[0003] Currently available hot-filament CVD equipment, due to inherent limitations of the hot filament itself, mostly employs vertical vacuum equipment to heat and decompose process gases to form thin films. To avoid deformation of the hot filament during heating, which could affect film uniformity, the hot filament is vertically suspended within the vacuum chamber, and the substrate is also vertically passed through the process chamber to deposit the thin film. However, this design still presents the following problems: 1. The vertical design of the hot filament also affects film uniformity; 2. Excessively long hot filaments suffer from severe deformation and short lifespan.

[0004] Therefore, it is necessary to improve the electrode plates of existing hot-filament CVD equipment to overcome the above-mentioned technical problems. Summary of the Invention

[0005] In view of this, the present invention proposes an electrode plate for a horizontal hot-wire CVD device and a horizontal hot-wire CVD device, the specific technical solution of which is as follows:

[0006] A horizontal hot-wire CVD equipment electrode plate is horizontally arranged above the interior of a vacuum chamber, with a substrate to be coated placed horizontally below the electrode plate. The electrode plate includes multiple horizontally connected process units. Each process unit includes a unit main frame, and a heating wire mounting plate is installed above the inner cavity of the unit main frame. Multiple connection holes are arranged in a straight line on the bottom surface of the heating wire mounting plate. Several heating wires are inserted into the connection holes in a straight line and connected in series via internal wiring of the heating wire mounting plate. The heating wires are powered by a hot-wire power supply device located outside the process unit. The heating wire mounting plate has multiple air holes on its front and rear sides perpendicular to the heating wire axis for supplying gas to the heating wires. These air holes are connected to a process gas supply device located outside the process unit via internal air passages in the heating wire mounting plate. A magnetic component is also installed on the inner wall of the unit main frame below the heating wire mounting plate, applying a surrounding magnetic field to the space below the heating wires.

[0007] Preferably, a radiant plate is also installed on the heating wire mounting plate located above the heating wire.

[0008] Preferably, the hot wire power supply device and the process gas supply device located outside the process unit are arranged in parallel and uniformly side by side; and, depending on the power of the external power supply, the hot wire power supply device is designed to support N units.

[0009] Preferably, the internal gas path of the heating wire mounting plate is designed as multiple sets of one-to-two branches, and the flow rate of each gas path branch is uniformly controlled by using a gas flow controller.

[0010] Preferably, the spacing between two adjacent heating wires in the same process unit is set to be evenly distributed according to the temperature uniformity inside the unit.

[0011] Preferably, the connection hole is a quick-connect hole, and the heating wire is evenly suspended below the heating wire mounting plate in a quick-connect manner.

[0012] Preferably, the distance between the heating wire and the substrate to be coated is calculated based on the mean free path of ions.

[0013] Preferably, the heating wires on two adjacent process units are arranged in an alternating pattern.

[0014] A horizontal hot-wire CVD apparatus includes a vacuum chamber. An electrode plate of the horizontal hot-wire CVD apparatus described above is horizontally arranged above the interior of the vacuum chamber. A transmission device is provided below the vacuum chamber. A substrate to be coated is horizontally placed on the transmission device and located in a slit formed between the electrode plate of the horizontal hot-wire CVD apparatus and the transmission device.

[0015] Preferably, a heating device for controlling the temperature of the entire vacuum chamber is also installed below the transmission device.

[0016] Compared with the prior art, the horizontal hot-wire CVD equipment electrode plate and horizontal hot-wire CVD equipment of the present invention have the following beneficial effects:

[0017] 1. In this invention, both the electrode plate and the substrate to be coated in the hot filament CVD equipment are placed horizontally, achieving horizontal deposition and ensuring uniform gas distribution in the reaction chamber, thereby improving the uniformity of the coating.

[0018] 2. This invention changes the design concept by combining the heating wire with the electrode plate. By shortening the length of the heating wire in the process unit, multiple short heating wires are connected in series with the internal wiring of the heating wire mounting plate to form a complete heating wire, thus overcoming the defects of existing long heating wires that have severe deformation and short life.

[0019] 3. The heating wire in this invention is connected to the heating wire mounting plate via a quick-connect method, which is simple and convenient to operate.

[0020] 4. In this invention, a surrounding magnetic field is installed under the heating wire in each process unit. The ions pyrolyzed by the heating wire are affected by the surrounding magnetic field, making the ion clusters more uniform and promoting secondary collisions, resulting in more complete ionization.

[0021] 5. The electrode plate of the horizontal hot filament CVD equipment of the present invention adopts a modular design. The substrate to be coated passes through the slit between the bottom of each process unit and the top of the transmission device, which can further realize horizontal continuous dynamic deposition and improve the equipment utilization rate. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0023] Figure 1 This is a bottom view of the electrode plate of a horizontal hot-wire CVD equipment.

[0024] Figure 2 This is a schematic diagram of the gas supply section in the electrode plate of a horizontal hot-wire CVD equipment.

[0025] Figure 3 This is a schematic diagram of the installation of the heating wire and the heating wire mounting plate in the electrode plate of a horizontal hot-wire CVD equipment.

[0026] Figure 4 This is a schematic diagram of the internal structure of the vacuum chamber of a horizontal hot-wire CVD equipment.

[0027] In the diagram: 1-Process unit, 2-Unit main frame, 3-Heating wire mounting plate, 4-Heating wire, 5-Air hole, 6-Magnetic component, 7-Radiation plate, 8-Quick insertion hole, 9-Transmission device, 10-Slit, 11-Heating device. Detailed Implementation

[0028] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0029] In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0030] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0031] Example 1:

[0032] This embodiment provides an electrode plate for a horizontal hot filament CVD device. The electrode plate is horizontally arranged above the interior of the vacuum chamber, and the substrate to be coated is placed horizontally below the electrode plate, thereby achieving horizontal deposition, ensuring uniform gas distribution in the reaction chamber, and thus improving the uniformity of the coating.

[0033] like Figure 1 As shown, the electrode plate in this embodiment includes multiple process units 1 connected horizontally side by side (specifically four process units in this embodiment). When the substrate to be coated is conveyed for coating, it will pass through each process unit 1 in sequence.

[0034] Specifically, each process unit 1 includes a main frame 2. A heating wire mounting plate 3 is installed above the inner cavity of the main frame 2. Multiple connection holes are arranged in a straight line on the bottom surface of the heating wire mounting plate 3. Several heating wires 4 are inserted into the connection holes in a straight line and connected in series by means of the internal wiring of the heating wire mounting plate 3. The heating wires 4 are powered by a heating wire power supply device located outside the process unit 1.

[0035] More specifically, such as Figure 3 As shown, the connection hole is a quick-connect hole 8, and the heating wire 4 is evenly suspended below the heating wire mounting plate 3 in a quick-connect manner.

[0036] In this invention, the heating wire mounting plate 3 uses an internal power supply connection, and the heating wire 4 is inserted into the external quick-connect hole 8 to form a series connection. Then, an external power supply is used to heat the heating wire 4. Figure 1 As shown at point A, depending on the power of the external power supply, the hot wire power supply device can be designed as a structure that supports N units.

[0037] The heating wire mounting plate 3 has several air holes 5 on its front and rear sides perpendicular to the heating wire axis for supplying air to the heating wire 4. The air holes 5 are connected to the process gas supply device located outside the process unit 1 through the internal air passage of the heating wire mounting plate.

[0038] In this embodiment, the hot wire power supply device and the process gas supply device located outside the process unit 1 are arranged in parallel and uniformly side by side.

[0039] At the same time, such as Figure 2 As shown, the internal gas path design of the heating wire mounting plate 3 is a multi-group, one-to-two configuration. In order to achieve uniform gas supply, each gas path branch is controlled by a gas flow controller (MFC) to achieve uniform flow control.

[0040] A magnetic component 6 is also installed on the inner wall of the unit main frame located below the heating wire mounting plate 3. The magnetic component 6 applies a surrounding magnetic field to the space below the heating wire 4. The ions pyrolyzed by the heating wire 4 are affected by the surrounding magnetic field, making the ion clusters more uniform and promoting secondary collisions, resulting in more complete ionization.

[0041] In a further specific embodiment, a radiation plate 7 is also installed on the heating wire mounting plate 3 located above the heating wire 4. The radiation plate 7 radiates the heat generated by the heating wire 4 downwards to ensure temperature uniformity.

[0042] In this embodiment, the spacing between two adjacent heating wires on the same process unit 1 is set to be evenly distributed according to the temperature uniformity inside the unit, that is, a whole heating wire 4 is evenly divided into several quick-connect heating filaments through the heating wire mounting plate 3, so as to evenly distribute the temperature.

[0043] In this embodiment, the distance between the heating wire 4 and the substrate to be coated is calculated based on the mean free path of ions.

[0044] In a further specific embodiment, in order to further improve the uniformity of the coating, the heating wires 4 on two adjacent process units 1 are arranged in an alternating manner.

[0045] Example 2:

[0046] This embodiment provides a horizontal hot-wire CVD apparatus, including a vacuum chamber, such as... Figure 4 As shown, the horizontal hot filament CVD equipment electrode plate described in Embodiment 1 is arranged horizontally above the interior of the vacuum chamber, and a transmission device 9 is provided below the vacuum chamber. The substrate to be coated is placed horizontally on the transmission device 9 and located in the slit 10 formed between the horizontal hot filament CVD equipment electrode plate and the transmission device 9.

[0047] Meanwhile, a heating device 11 for controlling the temperature of the entire vacuum chamber is also installed below the transmission device 9, for example, to control the temperature of the vacuum chamber to be stably maintained at 500°C.

[0048] The electrode plate of the horizontal hot-wire CVD equipment of this invention adopts a modular design. The substrate to be coated passes through the slit 10 between the bottom of each process unit 1 and the top of the transmission device 9, which further enables horizontal continuous dynamic deposition and improves equipment uptime. This invention can also realize single-stage continuous deposition or multi-stage continuous deposition according to process requirements.

[0049] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For the apparatus disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the description is relatively simple; relevant parts can be referred to the method section.

[0050] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An electrode plate for a horizontal hot-wire CVD device, characterized in that, The electrode plate is horizontally arranged above the interior of the vacuum chamber, and the substrate to be coated is placed horizontally below the electrode plate. The electrode plate includes multiple process units connected horizontally side by side. Each process unit includes a unit main frame. A heating wire mounting plate is installed above the inner cavity of the unit main frame. Multiple connection holes are opened on the bottom surface of the heating wire mounting plate in a straight line. Several heating wires are inserted into the connection holes in a straight line and connected in series by the internal wiring of the heating wire mounting plate. The heating wires are powered by a heating wire power supply device located outside the process unit. The heating wire mounting plate has several air holes on its front and rear sides perpendicular to the heating wire axis for supplying gas to the heating wires. The air holes are connected to the process gas supply device located outside the process unit through the internal air passage of the heating wire mounting plate. A magnetic component is also installed on the inner wall of the unit main frame located below the heating wire mounting plate. The magnetic component applies a surrounding magnetic field to the space below the heating wires. The connection hole is a quick-connect hole, and the heating wire is evenly suspended below the heating wire mounting plate in a quick-connect manner; the heating wires on two adjacent process units are arranged alternately.

2. The electrode plate of a horizontal hot-wire CVD equipment according to claim 1, characterized in that, A radiant plate is also installed on the heating wire mounting plate located above the heating wire.

3. The electrode plate of a horizontal hot-wire CVD equipment according to claim 1, characterized in that, The hot wire power supply device and the process gas supply device, which are located outside the process unit, are arranged in a uniform parallel arrangement; and, depending on the power of the external power supply, the hot wire power supply device is designed to support N units.

4. The electrode plate of a horizontal hot-wire CVD equipment according to claim 1 or 3, characterized in that, The internal gas path of the heating wire mounting plate is designed in a multi-group, one-to-two configuration, and the flow rate of each gas path branch is uniformly controlled by a gas flow controller.

5. The electrode plate of a horizontal hot-wire CVD equipment according to claim 1, characterized in that, The spacing between two adjacent heating wires in the same process unit is set to be evenly distributed according to the temperature uniformity inside the unit.

6. The electrode plate of a horizontal hot-wire CVD equipment according to claim 1, characterized in that, The distance between the heating wire and the substrate to be coated is calculated based on the mean free path of ions.

7. A horizontal hot-wire CVD device, characterized in that, The device includes a vacuum chamber, above which an electrode plate of any one of claims 1-6 is horizontally arranged, and below the vacuum chamber is a transmission device. The substrate to be coated is horizontally placed on the transmission device and located in the slit formed between the electrode plate of the horizontal hot filament CVD device and the transmission device.

8. A horizontal hot-wire CVD apparatus according to claim 7, characterized in that, A heating device for controlling the temperature of the entire vacuum chamber is also installed below the transmission device.

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