Silk spool processing method, device, apparatus, and storage medium

Abstract

The present disclosure provides a silk spool processing method, device, equipment and storage medium. The method comprises: in the case of determining a target silk box to be transferred to a temporary storage, selecting N candidate storage positions from a plurality of storage positions of the temporary storage; the target silk box contains a plurality of silk spools to be cooled; N is a positive integer greater than or equal to 1; obtaining the actual temperature of each candidate storage position in the N candidate storage positions; based on the actual temperature of each candidate storage position, selecting a target storage position from the N candidate storage positions, and temporarily storing the target silk box in the target storage position.

Description

Technical Field

[0001] This disclosure relates to the field of data processing technology, and in particular to a method, apparatus, equipment, and storage medium for processing silk spindles. Background Technology

[0002] Cooling is a crucial step in the production of yarn spindles. Typically, batches of spindles are transported to a designated cooling area (such as the workshop floor) for natural cooling. However, this method lacks proper planning for the distribution of cooling space and can easily negatively impact the quality of the spindles, resulting in low cooling efficiency. Summary of the Invention

[0003] This disclosure provides a method, apparatus, device, and storage medium for processing filament spindles to solve or alleviate one or more technical problems in the prior art.

[0004] In a first aspect, this disclosure provides a method for processing silk spindles, including:

[0005] Given a target yarn box to be transferred to a temporary storage warehouse, N candidate storage locations are selected from multiple storage locations in the temporary storage warehouse; the target yarn box contains multiple yarn spindles to be cooled; N is a positive integer greater than or equal to 1.

[0006] Obtain the actual temperature of each candidate storage bit among the N candidate storage bits;

[0007] Based on the actual temperature of each candidate storage location, a target storage location is selected from the N candidate storage locations, and the target filament box is temporarily stored in the target storage location.

[0008] Secondly, this disclosure provides a spindle processing apparatus, comprising:

[0009] The first processing unit is used to select N candidate storage locations from multiple storage locations in the temporary storage warehouse when a target yarn box to be transferred to the temporary storage warehouse is determined; the target yarn box contains multiple yarn spindles to be cooled; and N is a positive integer greater than or equal to 1.

[0010] A temperature acquisition unit is used to acquire the actual temperature of each candidate storage bit among the N candidate storage bits;

[0011] The second processing unit is used to select a target storage location from the N candidate storage locations based on the actual temperature of each candidate storage location, and temporarily store the target filament box in the target storage location.

[0012] Thirdly, an electronic device is provided, comprising:

[0013] At least one processor; and

[0014] The memory is communicatively connected to the at least one processor; wherein,

[0015] The memory stores instructions that can be executed by the at least one processor to enable the at least one processor to perform any of the methods described in the present disclosure.

[0016] Fourthly, a non-transitory computer-readable storage medium is provided storing computer instructions, wherein the computer instructions are used to cause the computer to perform any of the methods according to embodiments of the present disclosure.

[0017] Fifthly, a computer program product is provided, including a computer program that, when executed by a processor, implements any of the methods according to embodiments of the present disclosure.

[0018] In this way, the present invention can automatically and intelligently select a suitable storage location (i.e., target storage location) from the N candidate storage locations based on the actual temperature of each candidate storage location, and then temporarily store the target yarn box in the target storage location for cooling. In this way, the target yarn box can be effectively cooled, and compared with the natural cooling in the prior art, the quality of the yarn spindle can be ensured not to be affected, while improving the cooling efficiency of the yarn spindle.

[0019] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this disclosure, nor is it intended to limit the scope of this disclosure. Other features of this disclosure will become readily apparent from the following description. Attached Figure Description

[0020] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the various drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments provided according to this disclosure and should not be construed as limiting the scope of this disclosure.

[0021] Figure 1 This is an illustrative flow diagram of a silk spindle processing method according to an embodiment of this application. Figure 1 ;

[0022] Figure 2 This is an illustrative flow diagram of a silk spindle processing method according to an embodiment of this application. Figure 2 ;

[0023] Figure 3 This is a schematic diagram of a scene of a silk spindle falling into a drum according to an embodiment of this application;

[0024] Figure 4 This is an illustrative flow diagram of a silk spindle processing method according to an embodiment of this application. Figure 3 ;

[0025] Figure 5 This is a schematic diagram of the structure of a silk spindle processing apparatus according to an embodiment of this application;

[0026] Figure 6 This is a block diagram of an electronic device used to implement the spindle processing method of the embodiments of this disclosure. Detailed Implementation

[0027] The present disclosure will now be described in further detail with reference to the accompanying drawings. The same reference numerals in the drawings denote elements that have the same or similar functions. Although various aspects of embodiments are shown in the drawings, they are not necessarily drawn to scale unless specifically indicated otherwise.

[0028] Furthermore, to better illustrate this disclosure, numerous specific details are set forth in the following detailed description. Those skilled in the art will understand that this disclosure can be practiced without certain specific details. In some instances, methods, means, components, and circuits well known to those skilled in the art have not been described in detail in order to highlight the main points of this disclosure.

[0029] This disclosure provides a method for processing silk spindles that can automatically generate a reasonable plan for the cooling of silk spindles, thereby improving the cooling efficiency of the silk spindles.

[0030] Specifically, Figure 1 This is an illustrative flow diagram of a silk spindle processing method according to an embodiment of this application. Figure 1 This method can be optionally applied to electronic devices, such as personal computers, servers, server clusters, and other electronic devices.

[0031] Furthermore, the method includes at least a portion of the following: For example... Figure 1 As shown, it includes:

[0032] Step S101: If the target silk box to be transferred to the temporary storage is determined, N candidate storage locations are selected from the multiple storage locations of the temporary storage.

[0033] Here, the target wire box contains multiple wire spindles to be cooled; N is a positive integer greater than or equal to 1.

[0034] It should be noted that this disclosure does not impose any special restrictions on the target silk boxes to be transferred to the temporary storage warehouse. For example, the silk carts to be transferred to the temporary storage warehouse can also be used. As long as the carrier can hold multiple silk spindles to be cooled, this disclosure applies.

[0035] Step S102: Obtain the actual temperature of each candidate storage bit among the N candidate storage bits.

[0036] Step S103: Based on the actual temperature of each candidate storage location, select the target storage location from the N candidate storage locations and temporarily store the target filament box in the target storage location.

[0037] In this way, the present invention can automatically and intelligently select a suitable storage location (i.e., target storage location) from the N candidate storage locations based on the actual temperature of each candidate storage location, and then temporarily store the target yarn box in the target storage location for cooling. In this way, the target yarn box can be effectively cooled, and compared with the natural cooling in the prior art, the quality of the yarn spindle can be ensured not to be affected, while improving the cooling efficiency of the yarn spindle.

[0038] Furthermore, since the present invention can provide suitable storage locations for the temporary storage of the target silk box, the present invention makes more reasonable use of each storage location in the temporary storage library, improves the utilization rate of each storage location in the temporary storage library, and makes the cooling process for the silk spindle more automated and intelligent, thereby improving the management efficiency of the cooling process.

[0039] Furthermore, in a specific example, N candidate storage locations can be obtained in the following manner; specifically, that is, in the case of determining the target silk box to be transferred to the temporary storage warehouse as described above, N candidate storage locations are selected from the multiple storage locations of the temporary storage warehouse (for example, step S101 described above), which specifically includes:

[0040] Step S101-1: If the target silk box to be transferred to the temporary storage is determined, M storage bits that are in an idle state are determined from the multiple storage bits of the temporary storage.

[0041] Step S101-2: If the number of storage bits M is greater than the first threshold, select N candidate storage bits from the M storage bits that are in an idle state, where M is a positive integer greater than or equal to N; or, if the number of storage bits M is less than or equal to the first threshold, use the M storage bits that are in an idle state as the N candidate storage bits.

[0042] In other words, in one example, when a target silk box to be transferred to the temporary storage is determined, firstly, M storage locations that are in an idle state are determined from the multiple storage locations in the temporary storage; secondly, it is determined whether the number of storage locations M that are in an idle state is greater than a first threshold (for example, the first threshold is 1); if so, filtering is performed to select N candidate storage locations from the M storage locations; otherwise, no filtering is required, and the M storage locations are directly used as N candidate storage locations.

[0043] In this way, the present invention can select N candidate storage locations from the M storage locations that are in an idle state, which can be used to cool the target wire box. This lays the foundation for subsequently determining the target storage location suitable for cooling the target wire box.

[0044] Figure 2 This is an illustrative flow diagram of a silk spindle processing method according to an embodiment of this application. Figure 2 This method can be optionally applied to electronic devices, such as personal computers, servers, and server clusters. It is understood that the above... Figure 1 The methods shown can also be applied to this example, and the related content will not be elaborated further in this example.

[0045] Furthermore, the method includes at least a portion of the following: For example... Figure 2 As shown, it includes:

[0046] Step S201: If the target silk box to be transferred to the temporary storage is determined, M storage positions that are in an idle state are determined from the multiple storage positions of the temporary storage.

[0047] Step S202: Determine whether the number of storage bits M is greater than the first threshold. If yes, proceed to step S203; otherwise, proceed to step S206.

[0048] Step S203: If the number of storage bits M is greater than the first threshold, obtain the drop-off characteristic information of the target yarn box. Then proceed to step S204.

[0049] Here, the drop-off characteristic information of the target yarn box is at least obtained based on the drop-off time of the yarn spindle in the target yarn box.

[0050] It should be noted that the time of the yarn bobbin falling into the target yarn box specifically refers to the moment corresponding to the last yarn bobbin falling from the winding machine into the target yarn box (or target yarn cart) among the multiple yarn bobbins to be cooled in the target yarn box (or target yarn cart); for example, as Figure 3 As shown, the winding machine sequentially drops five spindles onto the drum. For example, if the winding machine drops spindle 1 onto the drum at time t1, the time for dropping spindle 1 onto the drum is t1. If the winding machine drops spindle 2 onto the drum at time t2, the time for dropping spindle 2 onto the drum is t2, and so on. If the winding machine drops the last spindle (i.e., spindle 5) onto the drum at time t5, the time for dropping spindle 5 onto the drum is t5. At this time, the latest time for dropping the spindles placed in the target yarn box is t5.

[0051] Step S204: Based on the drop-off characteristic information of the target yarn box, obtain the latest drop-off time of the target yarn box. Then proceed to step S205.

[0052] Step S205: Based on the idle time of each of the M storage bits in an idle state and the latest time of the target yarn box falling onto the drum, select N candidate storage bits from the M storage bits in an idle state. Proceed to step S207.

[0053] Here, M is a positive integer greater than or equal to N.

[0054] Further, in a specific example, N candidate storage bits can be selected in the following manner; specifically, based on the idle time of each of the M storage bits in an idle state and the latest time of the target yarn box falling onto the drum, as described above, N candidate storage bits are selected from the M storage bits in an idle state (for example, step S205 described above), which specifically includes:

[0055] Step S205-1: Obtain environmental characteristic information.

[0056] Here, the environmental characteristics information may specifically be seasonal characteristics, such as summer; or it may specifically be climatic characteristics, etc., and this disclosure does not limit it in this way.

[0057] Step S205-2: Determine the time difference between the idle time of each of the M storage bits in an idle state and the latest time of the target wire box falling onto the drum.

[0058] Here, the execution order of steps S205-1 and S205-2 can also be that step S205-2 is executed first and then step S205-1. This disclosure does not limit the execution order of steps S205-1 and S205-2.

[0059] Step S205-3: Based on the environmental feature information and the time difference corresponding to each storage bit in the M storage bits, select N candidate storage bits that can perform cooling treatment on the spindle of the target silk box under the environment represented by the environmental feature information.

[0060] In a specific example, the present invention can also determine a preset time difference condition corresponding to the environmental characteristic information based on the environmental characteristic information, and select storage bits from M storage bits whose time differences satisfy the preset time difference condition corresponding to the environmental characteristic information (such as storage bits with longer time differences) as candidate storage bits, so as to obtain N candidate storage bits. In this way, the selection method of storage bits can be adaptively adjusted according to the environmental characteristic information, ensuring efficient cooling while avoiding excessively rapid cooling, and further ensuring the quality of the spindles in the target silk box.

[0061] For example, firstly, environmental characteristic information is obtained. For instance, if the obtained seasonal characteristic is summer, the preset time difference condition corresponding to summer is determined to be a time difference greater than a preset time difference threshold -1. Secondly, the time difference between the idle time of each of the M storage positions and the latest time of the target yarn box being dropped into the drum is determined. Finally, storage positions from the M storage positions with a time difference greater than the preset time difference threshold -1 are selected as candidate storage positions to obtain N candidate storage positions. In this way, selecting storage positions with larger time differences is beneficial for effectively cooling the target yarn box in a summer environment.

[0062] Alternatively, for example, if the obtained seasonal characteristic is winter, the preset time difference condition corresponding to winter is determined to be that the time difference is less than a preset time difference threshold -2; secondly, the time difference between the idle time of each of the M storage positions and the latest time of the target yarn box being dropped into the bobbin is determined; finally, storage positions that have a time difference greater than the preset time difference threshold -2 and less than the preset time difference threshold -1 with the latest time of the target yarn box are selected from the M storage positions as candidate storage positions, so as to obtain N candidate storage positions. In this way, selecting storage positions with smaller time differences helps to avoid rapid cooling, thereby preventing the quality of the yarn spindle from being affected.

[0063] Here, in the above example, the preset time difference threshold-1 is greater than the preset time difference threshold-2, or the preset time difference threshold-1 can also be equal to the preset time difference threshold-2. This disclosed solution does not impose any specific restrictions on this.

[0064] In this way, the present invention can select, from the M idle storage locations, a suitable storage location for cooling the target yarn box under the environmental characteristics indicated by the environmental characteristics information, thereby ensuring the quality of the yarn spindle in the target yarn box during the cooling process and making the cooling process of the yarn spindle more automated, thereby improving the cooling efficiency of the yarn spindle.

[0065] Step S206: If the number of storage bits M is less than or equal to the first threshold, select the M storage bits that are in an idle state as the N candidate storage bits. Proceed to step S207.

[0066] Step S207: Obtain the actual temperature of each candidate storage bit among the N candidate storage bits.

[0067] Step S208: Based on the actual temperature of each candidate storage location, select the target storage location from the N candidate storage locations and temporarily store the target filament box in the target storage location.

[0068] In this way, the present solution can select N candidate storage locations from M idle storage locations based on the drop characteristics of the target yarn box, and then select the target storage location from the N candidate storage locations based on the actual temperature of each candidate storage location. In this way, a suitable storage location for temporary storage of the target yarn box can be quickly selected for more effective cooling treatment. At the same time, the selection of storage locations in the temporary storage warehouse is more reasonable and more automated, thereby improving the quality and cooling efficiency of the yarn spindle in the cooling process.

[0069] Figure 4 This is an illustrative flow diagram of a silk spindle processing method according to an embodiment of this application. Figure 3 This method can be optionally applied to electronic devices, such as personal computers, servers, and server clusters. It is understood that the above... Figure 1 and Figure 2 The methods shown can also be applied to this example, and the related content will not be elaborated further in this example.

[0070] Furthermore, the method includes at least a portion of the following: For example... Figure 4 As shown, it includes:

[0071] Step S401: If the target silk box to be transferred to the temporary storage is determined, N candidate storage locations are selected from the multiple storage locations of the temporary storage.

[0072] Here, the target wire box contains multiple wire spindles to be cooled; N is a positive integer greater than or equal to 1.

[0073] Step S402: Obtain the actual temperature of each candidate storage bit among the N candidate storage bits.

[0074] Step S403: Obtain the target temperature of the target wire box.

[0075] Here, the execution order of steps S402 and S403 can also be that step S403 is executed first and then step S402. This disclosure does not limit the execution order of steps S402 and S403.

[0076] Furthermore, in a specific example, the target temperature of the target filament box can be obtained in the following way, thus laying the foundation for quickly selecting a suitable target storage location based on the target temperature of the target filament box; specifically including:

[0077] Method 1: That is, obtaining the target temperature of the target wire box as described above (for example, step S403 mentioned above), specifically includes:

[0078] Step S403-1-1: Obtain the temperature of the environment where the target wire box is located, as collected by the sensor.

[0079] Step S403-1-2: Based on the temperature of the environment where the target yarn box is located, obtain the target temperature of the target yarn box, for example, directly use the temperature of the environment where the target yarn box is located as the target temperature of the target yarn box.

[0080] Method 2: That is, obtaining the target temperature of the target wire box as described above (for example, step S403 mentioned above), specifically includes:

[0081] Step S403-2-1: Obtain the dropper feature information of the target yarn box.

[0082] Here, the drop-off characteristic information of the target yarn box is at least obtained based on the drop-off time of the yarn spindle in the target yarn box.

[0083] For an explanation of the timing of the silk spindle falling onto the drum, please refer to the example above; it will not be repeated here.

[0084] Step S403-2-2: Based on the dropper characteristics of the target yarn box, estimate the target temperature of the target yarn box.

[0085] For example, in one instance, the temperature of each spindle in the target yarn box can be obtained based on the drop-off time of each spindle contained in the drop-off feature information of the target yarn box, and the mapping relationship between the drop-off time of the spindle and the temperature of the spindle. Then, based on the temperature of each spindle, the target temperature of the target yarn box can be obtained.

[0086] Step S404: Determine whether there is at least one candidate storage bit among the N candidate storage bits whose temperature difference with the target temperature of the target wire box is within a preset temperature difference range. If yes, proceed to step S405; otherwise, proceed to step S406.

[0087] Step S405: If it is determined that there is at least one candidate storage location among the N candidate storage locations whose temperature difference with the target temperature of the target yarn box is within a preset temperature difference range, determine the target storage location from the at least one candidate storage location whose temperature difference with the target temperature of the target yarn box is within the preset temperature difference range, and temporarily store the target yarn box in the target storage location.

[0088] Step S406: If it is determined that there is no candidate storage location among the N candidate storage locations whose temperature difference with the target temperature of the target wire box is within a preset temperature difference range, then select the target storage location from the N candidate storage locations. Proceed to step S407.

[0089] Step S407: Based on the difference between the actual temperature of the selected target storage location and the target temperature of the target filament box, generate a control command and proceed to step S408.

[0090] Here, the control command is used to activate the preheating component to preheat the target storage location and reacquire the actual temperature of the target storage location after a preset time period; or, the control command is used to activate the heat recovery component to recover the heat energy of the target storage location and reacquire the actual temperature of the target storage location after a preset time period.

[0091] For example, if it is determined that there is no candidate storage location among the N candidate storage locations whose temperature difference with the target temperature of the target yarn box is within a preset temperature difference range, any storage location is selected from the N candidate storage locations as the target storage location. In this case, in one example, if the temperature difference between the actual temperature of the selected target storage location and the target temperature of the target yarn box is greater than or equal to the maximum value within the preset temperature difference range, a control command to start the preheating component is generated to preheat the target storage location so that the temperature difference between the new actual temperature of the target storage location and the target temperature of the target yarn box is within the preset temperature difference range.

[0092] Alternatively, in another example, if the temperature difference between the actual temperature of the selected target and the target temperature of the target filament box is less than the minimum value within a preset temperature difference range, a control command to start the heat recovery component is generated to recover heat energy and improve energy efficiency. At the same time, while recovering heat energy, cooling is achieved so that the temperature difference between the new actual temperature of the target storage location and the target temperature of the target filament box can be within the preset temperature difference range.

[0093] Step S408: After the preset time has been reached, and after determining that the temperature difference between the new actual temperature of the target storage location and the target temperature of the target yarn box is within the preset temperature difference range, the target yarn box is temporarily stored in the target storage location.

[0094] In this way, the present invention can determine the storage location that can reasonably cool the target wire box based on the target temperature of the target wire box and the actual temperature of the candidate storage location. This allows for more effective cooling of the target wire box, avoids rapid cooling of the wire spindles in the target wire box, and thus ensures the quality of the wire spindles in the target wire box. In addition, the present invention can quickly select a suitable storage location according to the actual situation of the target wire box, making the use of storage locations more reasonable and automated, thereby improving the processing efficiency in the cooling process.

[0095] Furthermore, for storage locations with excessively high temperatures, effective heat recovery can be performed to supply other storage locations or process equipment (such as process air conditioners) that require preheating, thereby greatly reducing the energy consumption cost of the workshop.

[0096] This disclosure also provides a spindle processing device, such as... Figure 5As shown, it includes:

[0097] The first processing unit 501 is used to select N candidate storage locations from multiple storage locations in the temporary storage warehouse when a target yarn box to be transferred to the temporary storage warehouse is determined; the target yarn box contains multiple yarn spindles to be cooled; and N is a positive integer greater than or equal to 1.

[0098] Temperature acquisition unit 502 is used to acquire the actual temperature of each candidate storage bit among the N candidate storage bits;

[0099] The second processing unit 503 is used to select a target storage location from the N candidate storage locations based on the actual temperature of each candidate storage location, and temporarily store the target filament box in the target storage location.

[0100] In a specific example of the disclosed solution, the first processing unit is specifically used for:

[0101] If the target silk box to be transferred to the temporary storage is determined, M storage locations that are in an idle state are determined from the multiple storage locations of the temporary storage.

[0102] If the number of storage bits M is greater than the first threshold, N candidate storage bits are selected from the M storage bits that are in an idle state, where M is a positive integer greater than or equal to N; or, if the number of storage bits M is less than or equal to the first threshold, the M storage bits that are in an idle state are used as the N candidate storage bits.

[0103] In a specific example of the scheme disclosed herein, the first processing unit is specifically used for

[0104] Obtain the doffing characteristic information of the target yarn box, wherein the doffing characteristic information of the target yarn box is at least based on the doffing time of the yarn spindle in the target yarn box;

[0105] Based on the drop-off characteristic information of the target yarn box, the latest drop-off time of the target yarn box is obtained;

[0106] Based on the idle time of each of the M storage bits in an idle state and the latest time of the target yarn box falling into the drum, N candidate storage bits are selected from the M storage bits in an idle state.

[0107] In a specific example of the disclosed solution, the first processing unit is specifically used for:

[0108] Obtain environmental characteristic information;

[0109] Determine the time difference between the idle time of each of the M storage bits in an idle state and the latest time of the target yarn box falling onto the drum;

[0110] Based on environmental feature information and the time difference between each of the M storage bits, N candidate storage bits are selected that can cool the spindles of the target silk box under the environment represented by the environmental feature information.

[0111] In a specific example of the disclosed solution, the second processing unit is specifically used for:

[0112] Obtain the target temperature of the target wire box;

[0113] If it is determined that there is at least one candidate storage location among the N candidate storage locations whose temperature difference with the target temperature of the target yarn box is within a preset temperature difference range, then the target storage location is determined from the at least one candidate storage location whose temperature difference with the target temperature of the target yarn box is within the preset temperature difference range, and the target yarn box is temporarily stored in the target storage location.

[0114] In a specific example of the disclosed solution, the second processing unit is further configured to:

[0115] If it is determined that there is no candidate storage location among the N candidate storage locations whose temperature difference with the target temperature of the target wire box is within a preset temperature difference range, then the target storage location is selected from the N candidate storage locations.

[0116] Based on the difference between the actual temperature of the selected target storage location and the target temperature of the target filament box, a control command is generated. The control command is used to activate the preheating component to preheat the target storage location and reacquire the actual temperature of the target storage location after a preset time period. Alternatively, the control command is used to activate the heat recovery component to recover the heat energy of the target storage location and reacquire the actual temperature of the target storage location after a preset time period.

[0117] In a specific example of the disclosed solution, the second processing unit is specifically used for:

[0118] The temperature of the environment where the target yarn box is located is acquired by the sensor, and the target temperature of the target yarn box is obtained based on the temperature of the environment where the target yarn box is located;

[0119] Alternatively, the doffing characteristic information of the target yarn box can be obtained, wherein the doffing characteristic information of the target yarn box is at least based on the doffing time of the yarn spindle in the target yarn box; based on the doffing characteristic information of the target yarn box, the target temperature of the target yarn box can be estimated.

[0120] For a description of the specific functions and examples of each unit of the apparatus in this disclosure embodiment, please refer to the relevant descriptions of the corresponding steps in the above method embodiments, which will not be repeated here.

[0121] The acquisition, storage, and application of user personal information involved in the technical solution disclosed herein comply with the provisions of relevant laws and regulations and do not violate public order and good morals.

[0122] Figure 6 This is a structural block diagram of an electronic device according to an embodiment of the present disclosure. Figure 6 As shown, the electronic device includes a memory 610 and a processor 620. The memory 610 stores a computer program that can run on the processor 620. There can be one or more memories 610 and processors 620. The memory 610 can store one or more computer programs, which, when executed by the electronic device, cause the electronic device to perform the methods provided in the above-described method embodiments. The electronic device may also include a communication interface 630 for communicating with external devices and performing data exchange and transmission.

[0123] If the memory 610, processor 620, and communication interface 630 are implemented independently, they can be interconnected via a bus to communicate with each other. This bus can be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, or an Extended Industry Standard Architecture (EISA) bus, etc. This bus can be divided into address bus, data bus, control bus, etc. For ease of representation, Figure 6 The bus is represented by a single thick line, but this does not mean that there is only one bus or one type of bus.

[0124] Optionally, in a specific implementation, if the memory 610, processor 620, and communication interface 630 are integrated on a single chip, then the memory 610, processor 620, and communication interface 630 can communicate with each other through an internal interface.

[0125] It should be understood that the aforementioned processor can be a Central Processing Unit (CPU), or other general-purpose processors, Digital Signal Processors (DSPs), Application Specific Integrated Circuits (ASICs), Field-Programmable Gate Arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. General-purpose processors can be microprocessors or any conventional processor. It is worth noting that the processor can be a processor supporting Advanced Reduced Instruction Set Machines (ARM) architecture.

[0126] Further, optionally, the aforementioned memory may include read-only memory and random access memory, and may also include non-volatile random access memory. The memory may be volatile or non-volatile, or may include both. Non-volatile memory may include read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), or flash memory. Volatile memory may include random access memory (RAM), which serves as an external cache. Many forms of RAM are available by way of example, but not limitation. Examples include Static Random Access Memory (SRAM), Dynamic Random Access Memory (DRAM), Synchronous DRAM (SDRAM), Double Data Rate Synchronous DRAM (DDR SDRAM), Enhanced Synchronous DRAM (ESDRAM), Synchlink DRAM (SLDRAM), and Direct RAMBUS RAM (DR RAM).

[0127] In the above embodiments, implementation can be achieved, in whole or in part, through software, hardware, firmware, or any combination thereof. When implemented in software, it can be implemented, in whole or in part, as a computer program product. The computer program product includes one or more computer instructions. When the computer instructions are loaded and executed on a computer, all or part of the processes or functions described in the embodiments of this disclosure are generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another via wired (e.g., coaxial cable, fiber optic, Digital Subscriber Line, DSL) or wireless (e.g., infrared, Bluetooth, microwave, etc.) means. The computer-readable storage medium can be any available medium accessible to a computer, or a data storage device such as a server or data center that integrates one or more available media. The available media can be magnetic media (e.g., floppy disks, hard disks, magnetic tapes), optical media (e.g., Digital Versatile Discs (DVDs)), or semiconductor media (e.g., Solid State Disks (SSDs)). It is worth noting that the computer-readable storage media mentioned in this disclosure can be non-volatile storage media; in other words, it can be non-transient storage media.

[0128] Those skilled in the art will understand that all or part of the steps of the above embodiments can be implemented by hardware or by a program instructing related hardware. The program can be stored in a computer-readable storage medium, such as a read-only memory, a disk, or an optical disk.

[0129] In the description of the embodiments of this disclosure, references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this disclosure. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of those different embodiments or examples.

[0130] In the description of the embodiments disclosed herein, unless otherwise stated, " / " means "or". For example, A / B can mean A or B. The "and / or" in this document is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone.

[0131] In the description of embodiments of this disclosure, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this disclosure, unless otherwise stated, "a plurality of" means two or more.

[0132] The above description is merely an exemplary embodiment of this disclosure and is not intended to limit this disclosure. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the protection scope of this disclosure.

Claims

1. A method for processing silk spindles, comprising: Once the target silk box to be transferred to the temporary storage warehouse is determined, N candidate storage locations are selected from the multiple storage locations of the temporary storage warehouse; The target wire box contains multiple wire spindles to be cooled; N is a positive integer greater than or equal to 1. Obtain the actual temperature of each candidate storage bit among the N candidate storage bits; Based on the actual temperature of each candidate storage location, a target storage location is selected from the N candidate storage locations, and the target filament box is temporarily stored in the target storage location.

2. The method according to claim 1, wherein, When a target silk box to be transferred to the temporary storage warehouse is determined, N candidate storage locations are selected from multiple storage locations in the temporary storage warehouse, including: If the target silk box to be transferred to the temporary storage is determined, M storage locations that are in an idle state are determined from the multiple storage locations of the temporary storage. If the number of storage bits M is greater than the first threshold, N candidate storage bits are selected from the M storage bits that are in an idle state, where M is a positive integer greater than or equal to N; or, if the number of storage bits M is less than or equal to the first threshold, the M storage bits that are in an idle state are used as the N candidate storage bits.

3. The method according to claim 2, wherein, The step of selecting N candidate storage bits from M idle storage bits includes: Obtain the doffing characteristic information of the target yarn box, wherein the doffing characteristic information of the target yarn box is at least based on the doffing time of the yarn spindle in the target yarn box; Based on the drop-off characteristic information of the target yarn box, the latest drop-off time of the target yarn box is obtained; Based on the idle time of each of the M storage bits in an idle state and the latest time of the target yarn box falling into the drum, N candidate storage bits are selected from the M storage bits in an idle state.

4. The method according to claim 3, wherein, Based on the idle time of each of the M storage bits in an idle state and the latest time of the target yarn box falling onto the drum, N candidate storage bits are selected from the M storage bits in an idle state, including: Obtain environmental characteristic information; Determine the time difference between the idle time of each of the M storage bits in an idle state and the latest time of the target yarn box falling onto the drum; Based on environmental feature information and the time difference between each of the M storage bits, N candidate storage bits are selected that can cool the spindles of the target silk box under the environment represented by the environmental feature information.

5. The method according to any one of claims 1-4, wherein, The step of selecting a target storage location from the N candidate storage locations based on the actual temperature of each candidate storage location, and temporarily storing the target filament box in the target storage location, includes: Obtain the target temperature of the target wire box; If it is determined that there is at least one candidate storage location among the N candidate storage locations whose temperature difference with the target temperature of the target yarn box is within a preset temperature difference range, the target storage location is determined from the at least one candidate storage location whose temperature difference with the target temperature of the target yarn box is within the preset temperature difference range, and the target yarn box is temporarily stored in the target storage location.

6. The method according to claim 5, further comprising: If it is determined that there is no candidate storage location among the N candidate storage locations whose temperature difference with the target temperature of the target wire box is within a preset temperature difference range, then the target storage location is selected from the N candidate storage locations. Based on the difference between the actual temperature of the selected target storage location and the target temperature of the target filament box, a control command is generated; wherein, the control command is used to activate the preheating component to preheat the target storage location, and to reacquire the actual temperature of the target storage location after a preset time period; or, the control command is used to activate the heat recovery component to recover the heat energy of the target storage location, and to reacquire the actual temperature of the target storage location after a preset time period.

7. The method according to claim 5, wherein, The process of obtaining the target temperature of the target wire box includes: The temperature of the environment where the target yarn box is located is acquired by the sensor, and the target temperature of the target yarn box is obtained based on the temperature of the environment where the target yarn box is located; Alternatively, the doffing characteristic information of the target yarn box can be obtained, wherein the doffing characteristic information of the target yarn box is at least based on the doffing time of the yarn spindle in the target yarn box; based on the doffing characteristic information of the target yarn box, the target temperature of the target yarn box can be estimated.

8. A spindle processing apparatus, comprising: The first processing unit is used to select N candidate storage locations from multiple storage locations in the temporary storage warehouse when the target silk box to be transferred to the temporary storage warehouse is determined. The target wire box contains multiple wire spindles to be cooled; N is a positive integer greater than or equal to 1. A temperature acquisition unit is used to acquire the actual temperature of each candidate storage bit among the N candidate storage bits; The second processing unit is used to select a target storage location from the N candidate storage locations based on the actual temperature of each candidate storage location, and temporarily store the target filament box in the target storage location.

9. The apparatus according to claim 8, wherein, The first processing unit is specifically used for: If the target silk box to be transferred to the temporary storage is determined, M storage locations that are in an idle state are determined from the multiple storage locations of the temporary storage. If the number of storage bits M is greater than the first threshold, N candidate storage bits are selected from the M storage bits that are in an idle state, where M is a positive integer greater than or equal to N; Alternatively, if the number of storage bits M is less than or equal to the first threshold, the M storage bits that are in an idle state are selected as the N candidate storage bits.

10. The apparatus according to claim 9, wherein, The first processing unit is specifically used for: Obtain the doffing characteristic information of the target yarn box, wherein the doffing characteristic information of the target yarn box is at least based on the doffing time of the yarn spindle in the target yarn box; Based on the drop-off characteristic information of the target yarn box, the latest drop-off time of the target yarn box is obtained; Based on the idle time of each of the M storage bits in an idle state and the latest time of the target yarn box falling into the drum, N candidate storage bits are selected from the M storage bits in an idle state.

11. The apparatus according to claim 10, wherein, The first processing unit is specifically used for: Obtain environmental characteristic information; Determine the time difference between the idle time of each of the M storage bits in an idle state and the latest time of the target yarn box falling onto the drum; Based on environmental feature information and the time difference between each of the M storage bits, N candidate storage bits are selected that can cool the spindles of the target silk box under the environment represented by the environmental feature information.

12. The apparatus according to any one of claims 8-11, wherein, The second processing unit is specifically used for: Obtain the target temperature of the target wire box; If it is determined that there is at least one candidate storage location among the N candidate storage locations whose temperature difference with the target temperature of the target yarn box is within a preset temperature difference range, the target storage location is determined from the at least one candidate storage location whose temperature difference with the target temperature of the target yarn box is within the preset temperature difference range, and the target yarn box is temporarily stored in the target storage location.

13. The apparatus according to claim 12, wherein, The second processing unit is further configured to: If it is determined that there is no candidate storage location among the N candidate storage locations whose temperature difference with the target temperature of the target wire box is within a preset temperature difference range, then the target storage location is selected from the N candidate storage locations. Based on the difference between the actual temperature of the selected target storage location and the target temperature of the target filament box, a control command is generated; wherein, the control command is used to activate the preheating component to preheat the target storage location, and to reacquire the actual temperature of the target storage location after a preset time period; or, the control command is used to activate the heat recovery component to recover the heat energy of the target storage location, and to reacquire the actual temperature of the target storage location after a preset time period.

14. The apparatus according to claim 12, wherein, The second processing unit is specifically used for: The temperature of the environment where the target yarn box is located is acquired by the sensor, and the target temperature of the target yarn box is obtained based on the temperature of the environment where the target yarn box is located; Alternatively, the doffing characteristic information of the target yarn box can be obtained, wherein the doffing characteristic information of the target yarn box is at least based on the doffing time of the yarn spindle in the target yarn box; based on the doffing characteristic information of the target yarn box, the target temperature of the target yarn box can be estimated.

15. An electronic device comprising: At least one processor; as well as A memory communicatively connected to the at least one processor; wherein, The memory stores instructions that can be executed by the at least one processor to enable the at least one processor to perform the method of any one of claims 1-7.

16. A non-transitory computer-readable storage medium storing computer instructions, wherein, The computer instructions are used to cause the computer to perform the method according to any one of claims 1-7.

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