A circuit contact welding device for filter production

CN118287801BActive Publication Date: 2026-10-30GUIZHOU MUGONG GUIXIN MICROELECTRONICS CO LTD
View PDF 2 Cites 0 Cited by

Patent Information

Application Number
CN202410417275.9
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-04-09
Publication Date
2026-10-30
Estimated Expiration
2044-04-09

AI Technical Summary

Technical Problem

需要将若干元件焊接在线路板上来组成滤波器,由于元件数量多,进而需要焊接的引脚数量多,人工焊接不仅速度慢,而且长时间工作,也会导致工人出现视觉疲劳,导致焊接效果不能达到标准

Benefits of technology

[0014]1、将插满元件的线路板放置在载架上,载架对线路板上端面进行施压并对线路板进行反转,使露出元件引脚的一面位于上方,方便焊接机械手对线路接点进行焊接,使元件焊接在线路板上。

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN118287801B_ABST
    Figure CN118287801B_ABST
Patent Text Reader

Abstract

The application discloses a circuit contact welding device for filter production and relates to the welding technical field.The welding device comprises a machine table, a carrier is installed on the machine table, one module mechanism is installed on each side of the carrier, a mechanical hand is installed on each module mechanism, one mechanical hand is a welding mechanical hand, the other mechanical hand is a pressing mechanical hand, a wire feeding mechanism and a welding gun are installed on the welding mechanical hand, a material cylinder is installed on the pressing mechanical hand, a circuit board with inserted elements is placed on the carrier, the carrier exerts pressure on the upper end face of the circuit board and reverses the circuit board, so that the side with exposed element pins is located on the upper side, the welding mechanical hand is facilitated to weld the circuit contact, the elements are welded on the circuit board, the pressing mechanical hand takes off the welded circuit board from the carrier, or when a chip needs to be welded on the circuit board, the pressing mechanical hand presses the chip, so that the chip position deviation phenomenon is prevented in the welding process.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This invention relates to the field of welding technology, specifically to a welding device for line contacts used in filter production. Background Technology

[0002] A filter is a filtering circuit composed of components such as capacitors, inductors, and resistors, along with a circuit board. It is one of the essential key components in an radio frequency (RF) system. Filters are used for frequency selection, allowing desired frequency signals to pass while reflecting unwanted interference frequency signals. To assemble a filter, several components need to be soldered onto a circuit board. Due to the large number of components, there are many pins to solder. Manual soldering is not only slow but also causes visual fatigue for workers after prolonged work, resulting in substandard soldering quality.

[0003] When soldering components onto a circuit board, the components need to be installed on the circuit board first, then the components are pressed down and the circuit board is flipped over for soldering. Due to the different sizes of the components, larger components will obstruct the pressing of smaller components. Therefore, large and small components cannot be installed at the same time. Furthermore, due to the different sizes of the components and the reasons for the component installation and soldering methods, the components can only be installed and soldered one by one, resulting in low soldering efficiency of the entire filter. Summary of the Invention

[0004] The purpose of this invention is to provide a circuit contact welding device for filter production, so as to solve the problems mentioned in the background art.

[0005] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a circuit contact welding device for filter production, comprising a wire feeding mechanism, a welding torch, a module mechanism, a welding robot, and a pressing robot. The wire feeding mechanism and the welding torch are mounted on the welding robot, and the welding robot and the pressing robot are mounted on the module mechanism. The device includes a machine base, on which a housing is mounted, and a carrier is mounted on the machine base. The module mechanism is mounted on both sides of the carrier. A material cylinder is mounted on the pressing robot. The welding robot and the pressing robot are located on both sides of the carrier, and the circuit board carrying components and chips is placed on the carrier. The circuit board filled with components is placed on a carrier. The carrier applies pressure to the upper surface of the circuit board and flips the circuit board so that the side with exposed component leads is facing upwards. This makes it easier for the soldering robot to solder the circuit connections (i.e., the positions of the pin sockets and pins, and the positions of the chip leads and solder points), thus soldering the components onto the circuit board. The pressing robot then uses a barrel to remove the soldered circuit board from the carrier. Alternatively, when it is necessary to solder a chip onto the circuit board, the pressing robot uses a barrel to press the chip to prevent the chip from shifting during the soldering process.

[0006] The carrier includes a first side plate and a second side plate, with a material rack slidably mounted between the first and second side plates. Both the first and second side plates are equipped with multi-stroke cylinders, which are connected to one end of the material rack. The first and second side plates provide support for the material rack and the multi-stroke cylinders. The multi-stroke cylinders move the material rack, extending it into the machine housing to facilitate loading the circuit boards by external personnel. Afterward, the multi-stroke cylinders bring the material rack carrying the circuit boards back into the machine housing, where a welding robot and a pressing robot work together to weld the circuit connections on the circuit boards.

[0007] Both side plates 1 and 2 have grooves on their opposite sides. The multi-stroke cylinder is installed in the grooves. Both side plates 1 and 2 have slides connecting to the grooves at their upper ends. One end of the multi-stroke cylinder is fitted with a slider. The upper end of the slider is connected to a connecting plate via a bracket located within the slide. One end of the connecting plate is fitted with a connecting block. The connecting block is connected to a transition plate via a connecting rod. One end of the transition plate is connected to one end of the material rack. The side plates 1 and 2 have symmetrical sliding grooves on their adjacent end faces. Pins are installed on both sides of the other end of the material rack, and the pins are located within the sliding grooves.

[0008] The adapter plate is rotatably connected to the material rack and the connecting rod, respectively. The bracket is rotatably connected to the connecting plate. The center line of the connection between the bracket and the connecting plate is lower than the center line of the connecting rod, and the end of the adapter plate rotatably connected to the connecting rod is higher than the end of the adapter plate rotatably connected to the material rack. Side plate one and side plate two support the connecting plate. When a circuit board needs to be placed, the multi-stroke cylinder pushes the connecting plate to move through the slider, so that the connecting plate pulls the material rack to move through the connecting block and the adapter plate. This also causes the pin to slide in the slide groove, moving the material rack out of the machine housing. After the circuit board is placed on the material rack, the multi-stroke cylinder pulls the slider back to reset the material rack, so that the pin abuts against the end of the slide groove. At this time, all the pins of the components are facing down. The welding robot and the pressing robot cooperate to weld the chip onto the circuit board. The pressing robot uses the material cylinder to press the chip to prevent the chip from shifting position. After the chip soldering is completed, the multi-stroke cylinder retracts the output rod again, and the slider drives the connecting plate to move again via the bracket. Since the pin is already at the end of the chute and cannot move further, and since the pin is lower than the height of the connecting rod, when the connecting plate drives the connecting block to continue moving, supported by the pin, the connecting plate will pull the material rack to rotate around the center line of the pin. As the multi-stroke cylinder continuously retracts the output rod, the connecting plate continuously slides on side plate one and side plate two, eventually causing the material rack to rotate 180°. After the material rack 6 has rotated and passed 90°, the pin can slide to the other end of the chute, allowing the material rack to rotate quickly. When the material rack needs to be flipped back, first use the connecting plate to push the material rack in the other direction of the slide, so that the pin abuts against the other end of the slide. Then, the output rod of the multi-stroke cylinder continues to extend. Since the height of the connecting rod centerline is higher than the height of the centerline of the connection between the bracket and the connecting plate, when the output rod continues to extend, the end of the connecting plate with the connecting block tilts up and drives the material rack to rotate around the centerline of the pin. When the material rack flips and crosses 90°, the pin slides to the other end of the slide again, so that the material rack can flip quickly. When the material rack flips back 180° and needs to be fed again, the multi-stroke cylinder continues to extend the output rod, so that the connecting plate drives the material rack to move out of the machine housing for feeding again.

[0009] The material rack has a "C" shaped structure with "C" shaped material grooves and symmetrically arranged slots. A rotating shaft and a micro air pump are rotatably mounted inside the rack. A micro motor is rotatably connected to one end of the rotating shaft, which winds up a pressure plate. The pressure plate includes a cover plate composed of several short plates rotatably connected and an airbag mounted on the cover plate. The airbag is connected to the micro air pump via a pipe. One end of the cover plate is located in the slot. When the circuit board is placed in the material groove and needs to be flipped, the micro motor (not shown in the figure) drives the rotating shaft to rotate, pushing the cover plate into the slot. Once the cover plate completely fills the slot, the micro air pump (not shown in the figure) injects air into the airbag, causing it to inflate and compress all components on the circuit board, thus stabilizing the components on the circuit board. When the soldered circuit board needs to be removed from the rack, the miniature air pump reverses the air intake to restore the air chamber, and the miniature motor drives the rotating shaft to rotate, causing the rotating shaft to retract the pressure plate, thus allowing the circuit board to be removed from the tray.

[0010] The material cylinder is mounted on the end effector of the pressing robot via a support rod. A conical shell is installed at one end of the material cylinder, and an opening is provided at one end of the conical shell. A negative pressure pump is installed inside the material cylinder, and the negative pressure pump is connected to the internal space of the shell through a pipe. The negative pressure pump draws air from inside the shell, creating a negative pressure inside the shell, which then uses this negative pressure to adsorb the chip and press it down.

[0011] The material cylinder has four mounting slots. The cylinder shell is composed of four carrier plates, one end of which is fitted with a connecting plate. The connecting plate is rotatably mounted in the mounting slot. A suction nozzle is mounted on the end of the carrier plate away from the connecting plate. An adjusting cylinder is rotatably mounted inside the material cylinder at the position corresponding to the mounting slot. An adjusting groove is provided on the mounting slot. The output rod of the adjusting cylinder passes through the adjusting groove and is rotatably connected to the carrier plate. The negative pressure pump is connected to the suction nozzle pipe through an air pipe. A pipe groove is provided on the mounting slot, and one end of the air pipe passes through the pipe groove. The adjusting cylinder is rotatably mounted inside the material cylinder. When the output rod of the adjusting cylinder extends, it pushes the carrier plate outward, causing the carrier plate to rotate around the connection point between the connecting plate and the mounting slot. This causes the four carrier plates to rotate outward, opening the cylinder shell and exposing the suction nozzle, facilitating the suction nozzle to adsorb the circuit board. The negative pressure pump draws in external air through the air pipe and the suction nozzle, causing the suction nozzle to adsorb the circuit board under negative pressure. This allows the downward-pressing robot to use the suction nozzle to perform negative pressure adsorption and unloading of the circuit board.

[0012] An air plate is slidably installed inside the material cylinder. An end plate is installed at one end of the material cylinder connecting support rod. The negative pressure pump is installed on the end plate. A support spring is installed between the end plate and the air plate. The negative pressure pump is connected to the space inside the air plate through a hose. A sleeve is installed at the middle of the two end faces of the air plate. A pin is installed at the center of the sleeve. One end of the air pipe is fixed in the pipe groove and connected to the suction pipe through a hose. The air pipe passes through the air plate and is slidably connected to the air plate. The other ends of the four air pipes are connected to an air chamber. Multiple pipes are installed at the center of the air chamber. One end of the multiple pipes is slidably installed in the sleeve. A negative pressure hole is provided at the middle of the end of the material cylinder away from the end plate. A single pipe is installed inside the negative pressure hole. One end of the single pipe is slidably installed in the sleeve. A ball core is slidably installed inside the single pipe and multiple pipes through a sealing spring. The pin is directly opposite the ball core of the one-way valve. The air plate is in contact with the regulating cylinder. The sealing spring makes the ball core press against the pipe wall of the single pipe and multiple pipes. When the regulating cylinder is not working (the four carrier plates are in contact with each other and the cylinder shell is closed), the support spring makes the air plate contact the surface of the regulating cylinder. At this time, the ejector pin in the sleeve pushes the ball core in the single tube open, compressing the sealing spring in the single tube. The space between the single tube and the air plate is connected, allowing the negative pressure pump to draw air from the single tube through the air plate. This causes the cylinder shell to be under negative pressure through the open chip formed by the carrier plates. When the regulating cylinder is working, it pushes the carrier plate outward through the output rod. When the carrier plate rotates around the connecting plate, the connection point between the output rod and the carrier plate rises, causing the regulating cylinder to rotate passively. This rotation of the regulating cylinder causes the air plate to slide in the cylinder, increasing the connection surface between the sleeve and the multi-tube. This causes the ejector pin in the sleeve to push the ball core in the multi-tube open, while the ball core in the single tube is reset under the support of the sealing spring and seals the single tube again. After the ball core in the multi-tube is pushed open, the air chamber is connected to the space in the air plate, allowing the negative pressure pump to connect to the suction nozzle through the air pipe. By adjusting the cylinder, carrier plate, and air plate, the air path is automatically switched when the shell expands and closes, eliminating the need for a switching mechanism required for air path cutting.

[0013] Compared with the prior art, the beneficial effects achieved by the present invention are:

[0014] 1. Place the circuit board filled with components on the carrier. The carrier applies pressure to the upper surface of the circuit board and flips the circuit board so that the side with exposed component leads is facing up, which makes it easier for the welding robot to weld the circuit connection points and weld the components onto the circuit board.

[0015] 2. Four carrier plates form an open cylindrical shell. When negative pressure adsorption and pressing of the chip are required, the four carrier plates close together. With the regulating cylinder inactive, the air plate connects to the single tube. The negative pressure pump draws air from the single tube through the air plate, allowing the cylindrical shell to adsorb the chip under negative pressure. When unloading the soldered circuit board, the regulating cylinder activates, unfolding the four carrier plates and exposing the suction nozzle. The operation of the regulating cylinder moves the air plate, automatically switching it to the multi-tube connection and disconnecting it from the single tube, thus connecting the suction nozzle to the negative pressure pump. Through the configuration of the regulating cylinder, carrier plates, and air plate, automatic air path switching during the opening and closing of the cylindrical shell is achieved, eliminating the need for a switching mechanism required for air path cutting. The material cylinder not only allows for chip pressing and positioning but also enables circuit board unloading.

[0016] 3. When the circuit board needs to be flipped, the micro motor drives the rotating shaft to rotate, pushing the cover plate into the slot. Once the cover plate completely fills the slot, the micro air pump fills the air chamber with air. As the air chamber expands, it compresses all the components on the circuit board, keeping them stable. The pressure plate allows for the installation of existing components on the circuit board in one go. By filling the pressure plate with air, it compresses all the components, eliminating the need for repeated component installation and circuit board rotation. Attached Figure Description

[0017] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used together with the embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings:

[0018] Figure 1 This is a three-dimensional view of the overall structure of the present invention;

[0019] Figure 2 This is a perspective view showing the positional relationship between the welding robot, the pressing robot, and the carrier of the present invention;

[0020] Figure 3 This is a perspective view of the carrier frame of the present invention;

[0021] Figure 4 This is an exploded view of the carrier frame of the present invention;

[0022] Figure 5 This is a perspective view of the material rack of the present invention;

[0023] Figure 6 This is a left half-sectional view of the material rack of the present invention;

[0024] Figure 7 This is a perspective view of the material cylinder of the present invention mounted on the pressing robot arm;

[0025] Figure 8 This is a perspective view of the feed cylinder of the present invention;

[0026] Figure 9 This is a partial exploded view of the material cylinder of the present invention;

[0027] Figure 10 This is an exploded view of the inside of the barrel of the present invention;

[0028] Figure 11 This is a schematic diagram showing the positions of the ejector pin and the ball core of the present invention.

[0029] In the diagram: 1. Machine base; 2. Machine housing; 3. Carrier frame; 31. Side plate one; 32. Side plate two; 33. Multi-stroke cylinder; 34. Slider; 35. Connecting block; 36. Adapter plate; 37. Pin shaft; 4. Welding robot; 5. Pressing robot; 6. Material rack; 61. Material trough; 62. Slot; 63. Pressure plate; 7. Material cylinder; 71. Carrier plate; 72. Suction nozzle; 73. Mounting slot; 74. Adjustment slot; 75. Negative pressure pump; 76. Air pipe; 77. Adjustment cylinder; 78. Single pipe; 79. Air plate; 80. Multi-pipe; 81. Ejector pin. Detailed Implementation

[0030] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0031] Please see Figures 1-11 The present invention provides a technical solution: a circuit contact welding device for filter production, including a wire feeding mechanism, a welding torch, a module mechanism, a welding robot 4 and a pressing robot 5. The wire feeding mechanism and the welding torch are mounted on the welding robot 4, and the welding robot 4 and the pressing robot 5 are mounted on the module mechanism. The device includes a machine base 1, a housing 2 is mounted on the machine base 1, a carrier frame 3 is mounted on the machine base 1, the module mechanism is mounted on both sides of the carrier frame 3, and a material cylinder 7 is mounted on the pressing robot 5. The welding robot 4 and the pressing robot 5 are located on both sides of the carrier frame 3, and place the circuit board carrying components and chips on the carrier frame 3. The circuit board filled with components is placed on the carrier 3. The carrier 3 applies pressure to the upper surface of the circuit board and flips the circuit board so that the side with exposed component leads is facing up, which facilitates the soldering robot 4 to solder the circuit contacts and solder the components onto the circuit board. The pressing robot 5 uses the material cylinder 7 to remove the soldered circuit board from the carrier. Alternatively, when it is necessary to solder a chip onto the circuit board, the pressing robot 5 uses the material cylinder 7 to press the chip to prevent the chip from shifting during the soldering process.

[0032] The carrier 3 includes a first side plate 31 and a second side plate 32. A material rack 6 is slidably installed between the first side plate 31 and the second side plate 32. Grooves are provided on the opposite sides of the first side plate 31 and the second side plate 32. A multi-stroke cylinder 33 is installed in the groove. A slide rail connecting the groove is provided on the upper end of the first side plate 31 and the second side plate 32. A slider 34 is installed on one end of the multi-stroke cylinder 33. A connecting plate is connected to the upper end of the slider 34 through a bracket. The bracket is located in the slide rail. A connecting block 35 is installed on one end of the connecting plate. A transition plate 36 is connected to the connecting block 35 through a connecting rod. One end of the transition plate 36 is connected to one end of the material rack 6. Slide grooves are symmetrically provided on the opposite end faces of the first side plate 31 and the second side plate 32. Pins 37 are installed on both sides of the other end of the material rack 6. The pins 37 are located in the slide groove.

[0033] The adapter plate 36 is rotatably connected to the material rack 6 and the connecting rod, and the bracket is rotatably connected to the connecting plate. The center line of the rotatable connection between the bracket and the connecting plate is lower than the center line of the connecting rod, and the end of the adapter plate 36 rotatably connected to the connecting rod is higher than the end of the adapter plate 36 rotatably connected to the material rack 6.

[0034] The material rack 6 has a "C" shaped structure. The material rack 6 is equipped with a "C" shaped material groove 61 and symmetrical slots 62. A rotating shaft and a micro air pump are rotatably installed inside the material rack 6. A micro motor is rotatably connected to one end of the rotating shaft. A pressure plate 63 is wound on the rotating shaft. The pressure plate 63 includes a cover plate composed of several short plates rotatably connected and an air bladder installed on the cover plate. The air bladder is connected to the micro air pump pipe. One end of the cover plate is located in the slot 62.

[0035] The material cylinder 7 is installed at the end of the pressing robot 5 via a support rod. A conical shell is installed at one end of the material cylinder 7. A negative pressure pump 75 is installed inside the material cylinder 7. Four mounting slots 73 are provided on the material cylinder 7. The shell is composed of four carrier plates 71. A connecting plate is installed at one end of the carrier plate 71. The connecting plate is rotatably installed in the mounting slot 73. A suction nozzle 72 is installed at the end of the carrier plate 71 away from the connecting plate. The ends of the four carrier plates 71 with suction nozzles 72 cooperate with each other to form an opening. An adjusting cylinder 77 is rotatably installed inside the material cylinder 7 at the position corresponding to the mounting slot 73. An adjusting groove 74 is opened on the mounting slot 73. The output rod of the adjusting cylinder 77 passes through the adjusting groove 74 and is rotatably connected to the carrier plate 71. A pipe groove is provided on the mounting slot 73. The pipe groove is located on one side of the adjusting groove 74.

[0036] An air plate 79 is slidably installed inside the material cylinder 7. An end plate is installed at one end of the material cylinder 7 connecting to the support rod. A negative pressure pump 75 is installed on the end plate. A support spring is installed between the end plate and the air plate 79. The negative pressure pump 75 is connected to the space inside the air plate 79 through a hose. A sleeve is installed at the middle of both end faces of the air plate 79. A pin 81 is installed at the center of the sleeve. One end of an air pipe 76 is fixed in a pipe groove. The air pipe 76 is connected to the suction nozzle 72 through a hose. The air pipe 76 passes through the air plate 79 and is slidably connected to the air plate 79. There are four air pipes. The other end of 76 is connected to an air chamber. A multi-tube 80 is installed at the center of the air chamber. One end of the multi-tube 80 is slidably installed inside the sleeve. A negative pressure hole is provided in the middle of the end of the material cylinder 7 away from the end plate. A single tube 78 is installed inside the negative pressure hole. One end of the single tube 78 is slidably installed inside the sleeve. A ball core is slidably installed inside both the single tube 78 and the multi-tube 80 through a sealing spring. The ejector pin 81 is directly opposite the ball core of the one-way valve. The air plate 79 is in contact with the regulating cylinder 77. The sealing spring causes the ball core to press against the tube wall of the single tube 78 and the multi-tube 80.

[0037] Working principle of the invention:

[0038] When a circuit board needs to be placed, the multi-stroke cylinder 33 pushes the connecting plate to move through the slider 34, so that the connecting plate pulls the material rack 6 to move through the connecting block 35 and the adapter plate 36, and also makes the pin 37 slide in the slide groove, so that the material rack 6 is moved out of the housing 2 and the circuit board is placed in the material groove 61. After the circuit board is placed on the material rack 6, the multi-stroke cylinder 33 pulls the slider 34 back to reset the material rack 6, so that the pin 37 abuts against the end of one end of the slide groove, at which time all the pins of the component are facing down.

[0039] The pressing robot 5 moves the material cylinder 7 above the chip. At this time, the adjusting cylinder 77 is not working. The support spring makes the air plate 79 contact the surface of the adjusting cylinder 77. The ejector pin 81 in the sleeve pushes the ball core in the single tube 78 open, compressing the sealing spring in the single tube 78. The space in the single tube 78 and the air plate 79 is connected, so that the negative pressure pump 75 draws air from the single tube 78 through the air plate 79. Then, the cylinder shell is subjected to negative pressure through the open chip formed by the carrier plate 71. The negative pressure pump 75 draws air from the inside of the cylinder shell, creating negative pressure in the cylinder shell. The cylinder shell then uses negative pressure to adsorb the chip and presses the chip through the cylinder shell.

[0040] The welding robot 4 welds the chip pins using a welding gun and wire feeding mechanism. The welding robot 4 and the pressing robot 5 work together to weld the chip onto the circuit board. The pressing robot 5 uses the material cylinder 7 to press the chip to prevent the chip from shifting position.

[0041] After the chip is soldered, when the circuit board needs to be flipped, the micro motor drives the rotating shaft to rotate. The rotation of the rotating shaft pushes the cover plate into the slot 62. When the cover plate completely fills the slot 62, the micro air pump pumps air into the air bag, causing the air bag to expand and squeeze the components on the circuit board, so that the components stay stably on the circuit board.

[0042] The multi-stroke cylinder 33 retracts the output rod again, and the slider 34 drives the connecting plate to move again via the bracket. Since the pin 37 is already at the end of the chute and cannot move further, and since the pin 37 is lower than the height of the connecting rod, when the connecting plate drives the connecting block 35 to continue moving, supported by the pin 37, the connecting plate will pull the material rack 6 to rotate around the center line of the pin 37. As the multi-stroke cylinder 33 continuously retracts the output rod, the connecting plate continues to slide on the side plate 1 31 and the side plate 2 32, eventually causing the material rack 6 to rotate 180°. After the material rack 6 has rotated and passed 90°, the pin 37 can slide to the other end of the chute, allowing the material rack 6 to rotate quickly.

[0043] At this time, the module mechanism drives the pressing robot 5 to move to other positions, and the welding robot 4 welds the pins and pin sockets of the component through the welding gun and wire feeding mechanism.

[0044] After welding is completed, when the material rack 6 needs to be flipped back, first use the connecting plate to push the material rack 6 in the other direction of the slide, so that the pin 37 abuts against the other end of the slide. Then the output rod of the multi-stroke cylinder 33 continues to extend. Since the height of the connecting rod centerline is higher than the height of the centerline of the connection between the bracket and the connecting plate, when the output rod continues to extend, one end of the connecting plate mounting the connecting block 35 tilts up and drives the material rack 6 to rotate around the centerline of the pin 37. When the material rack 6 flips and crosses 90°, the pin 37 slides to the other end of the slide again, so that the material rack 6 can flip quickly and flip back 180°.

[0045] When the circuit board after welding needs to be removed from the material rack 6, the micro air pump reverses to extract the air from the air bag, so that the air bag is restored. The micro motor drives the rotating shaft to rotate, so that the rotating shaft retracts the pressure plate 63, thus making it easier for the circuit board to be taken out from the material trough 61.

[0046] The module mechanism moves the pressing robot 5 above the circuit board, and the adjusting cylinder 77 operates. The adjusting cylinder 77 pushes the carrier plate 71 outward through the output rod. When the carrier plate 71 rotates around the connecting plate, it causes the four carrier plates 71 to rotate outward, opening the cylinder shell and exposing the suction nozzle 72, which facilitates the suction nozzle 72 to adsorb the circuit board. The extension of the output rod causes the connection point between the output rod and the carrier plate 71 to rise, causing the adjusting cylinder 77 to rotate passively. In turn, the rotation of the adjusting cylinder 77 causes the air plate 79 to slide in the material cylinder 7. The movement increases the number of connection surfaces between the sleeve and the multi-tube 80, causing the ejector pin 81 in the sleeve to push open the ball core in the multi-tube 80. Meanwhile, the ball core in the single tube 78, supported by the sealing spring, resets and re-seals the single tube 78. After the ball core of the multi-tube 80 is pushed open, the air chamber connects to the space in the air plate 79, allowing the negative pressure pump 75 to connect to the suction nozzle 72 via the air pipe 76. The negative pressure pump 75 draws in external air through the air pipe 76 and the suction nozzle 72, causing the suction nozzle 72 to adhere to the circuit board under negative pressure. This allows the downward-pressing robotic arm 5 to perform negative pressure suction and material handling on the circuit board through the suction nozzle 72.

[0047] After the soldered circuit board is removed, the multi-stroke cylinder 33 continues to extend its output rod, causing the connecting plate to move the material rack 6 out of the machine housing 2 for reloading.

[0048] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0049] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A line contact welding device for filter production, comprising a wire feeding mechanism, a welding torch, a module mechanism, a welding robot (4), and a pressing robot (5), wherein the wire feeding mechanism and the welding torch are mounted on the welding robot (4), and the welding robot (4) and the pressing robot (5) are mounted on the module mechanism, characterized in that: Includes a machine base (1), on which a housing (2) is installed, and a carrier frame (3) is installed on the machine base (1). The module mechanism is installed on both sides of the carrier frame (3). A material cylinder (7) is installed on the pressing robot (5). The welding robot (4) and the pressing robot (5) are located on both sides of the carrier frame (3). The carrier (3) includes a side plate one (31) and a side plate two (32). A material rack (6) is slidably installed between the side plate one (31) and the side plate two (32). A multi-stroke cylinder (33) is installed on both the side plate one (31) and the side plate two (32). The multi-stroke cylinder (33) is connected to one end of the material rack (6). The material rack (6) has a "C" shaped structure. The material rack (6) is provided with a "C" shaped material groove (61). The material rack (6) is symmetrically provided with slots (62). The material rack (6) is rotatably installed with a rotating shaft and a micro air pump. One end of the rotating shaft is rotatably connected to a micro motor. The rotating shaft is wound with a pressure plate (63). The pressure plate (63) includes a cover plate composed of several short plates rotatably connected and an air bladder installed on the cover plate. The air bladder is connected to the micro air pump pipe. One end of the cover plate is located in the slot (62). A conical shell is installed at one end of the material cylinder (7), and an opening is provided at one end of the conical shell. A negative pressure pump (75) is installed inside the material cylinder (7), and the negative pressure pump (75) is connected to the internal space of the shell through a pipe. The material cylinder (7) is provided with four mounting slots (73). The cylinder shell is composed of four carrier plates (71). A connecting plate is installed at one end of the carrier plate (71). The connecting plate is rotatably installed in the mounting slot (73). A suction nozzle (72) is installed at the end of the carrier plate (71) away from the connecting plate. An adjusting cylinder (77) is rotatably installed inside the material cylinder (7) at the position corresponding to the mounting slot (73). An adjusting slot (74) is opened on the mounting slot (73). The output rod of the adjusting cylinder (77) passes through the adjusting slot (74) and is rotatably connected to the carrier plate (71). The negative pressure pump (75) is connected to the suction nozzle (72) through an air pipe (76). A pipe groove is provided on the mounting slot (73). One end of the air pipe (76) passes through the pipe groove. An air plate (79) is slidably installed inside the material cylinder (7). An end plate is installed at one end of the material cylinder (7) connecting to the support rod. The negative pressure pump (75) is installed on the end plate. A support spring is installed between the end plate and the air plate (79). The negative pressure pump (75) is connected to the space inside the air plate (79) through a hose. A sleeve is installed at the middle of the upper and lower end faces of the air plate (79). A pin (81) is installed at the center of the sleeve. One end of the air pipe (76) is fixed in the pipe groove and connected to the suction nozzle (72) through a hose. The air pipe (76) passes through the air plate (79) and is slidably connected to the air plate (79). Four air pipes (76) is connected to an air chamber at the other end. Multiple tubes (80) are installed at the center of the air chamber. One end of the multiple tubes (80) is slidably installed in the sleeve. A negative pressure hole is provided at the middle of the end of the material cylinder (7) away from the end plate. A single tube (78) is installed inside the negative pressure hole. One end of the single tube (78) is slidably installed in the sleeve. A ball core is slidably installed inside both the single tube (78) and the multiple tubes (80) through a sealing spring. The ejector pin (81) is directly opposite the ball core. The air plate (79) is in contact with the regulating cylinder (77). The sealing spring causes the ball core to press against the tube wall of the single tube (78) and the multiple tubes (80).

2. The circuit contact welding device for filter production according to claim 1, characterized in that: The side plates 1 (31) and 2 (32) are provided with grooves on the opposite sides. The multi-stroke cylinder (33) is installed in the groove. The upper ends of the side plates 1 (31) and 2 (32) are provided with slides that connect to the grooves. A slider (34) is installed at one end of the multi-stroke cylinder (33). The upper end of the slider (34) is connected to a connecting plate through a bracket. The bracket is located in the slide. A connecting block (35) is installed at one end of the connecting plate. The connecting block (35) is connected to a transition plate (36) through a connecting rod. One end of the transition plate (36) is connected to one end of the material rack (6). Slide grooves are symmetrically provided on the side surfaces of the side plates 1 (31) and 2 (32) that are close to each other. Pins (37) are installed on both sides of the other end of the material rack (6). The pins (37) are located in the slide grooves.

3. The circuit contact welding device for filter production according to claim 2, characterized in that: The adapter plate (36) is rotatably connected to the material rack (6) and the connecting rod respectively. The bracket is rotatably connected to the connecting plate. The center line of the bracket and the connecting plate is lower than the center line of the connecting rod. The end of the adapter plate (36) rotatably connected to the connecting rod is higher than the end of the adapter plate (36) rotatably connected to the material rack (6).

4. The circuit contact welding device for filter production according to claim 1, characterized in that: The material cylinder (7) is mounted on the end of the pressing robot (5) via a support rod.

Citation Information

Patent Citations

  • Automated mechanical arm capable of performing clamping steadily

    CN107598962A

  • Power filter printed plate assembly welding device

    CN111761161A