Marking device for semiconductor packages

Abstract

This invention discloses a marking device for semiconductor packaging. Each of the first, second, and third frames has an electromagnetic slide rail mounted on two opposing inner walls. The electromagnetic slide rails on the same inner wall of the first, second, and third frames are connected. A motor is mounted on a support plate opposite to the second frame, and a first gear is connected to the output shaft of this motor. A turntable is rotatably mounted on the support plate. A circular groove is provided on the support plate, and several steel balls are rotatably arranged circumferentially within this groove. The turntable is embedded in this groove and rotatably connected to the support plate through the steel balls. A nozzle is provided on a baffle plate, and a dust collection chamber is located below the third frame, which is connected to the nozzle through a first air duct. This invention provides a marking device for semiconductor packaging with smoother flipping action and better positioning accuracy during the flipping process, thereby ensuring the quality and accuracy of double-sided marking.

Description

[0001] This application is a divisional application. The original application was filed on November 27, 2019, with the application number 201911180523.8 and the invention title: Semiconductor Device Packaging Apparatus. Technical Field

[0002] This invention relates to the field of semiconductor device packaging, specifically to a marking device for semiconductor packaging. Background Technology

[0003] Semiconductor devices are electronic devices whose conductivity lies between that of a good conductor and an insulator. They utilize the special electrical properties of semiconductor materials to perform specific functions. They can be used to generate, control, receive, transform, and amplify signals and perform energy conversion. The semiconductor materials of semiconductor devices are silicon, germanium, or gallium arsenide, and they can be used as rectifiers, oscillators, light emitters, amplifiers, photometers, and other equipment.

[0004] In the current semiconductor device packaging process, marking can only be done one side at a time. After marking one side of the semiconductor device, it still needs to be manually flipped over, which is cumbersome. In addition, during the current semiconductor device deburring process, plastic debris is not collected in a centralized manner, resulting in debris flying everywhere. This not only poses a health hazard to workers, but also makes subsequent cleaning difficult. Summary of the Invention

[0005] The purpose of this invention is to provide a marking device for semiconductor packaging, in order to solve the problems that existing semiconductor device packaging marking cannot perform double-sided marking and that existing semiconductor device deburring does not collect debris.

[0006] To achieve the above objectives, the technical solution adopted by the present invention is: a marking device for semiconductor packaging, comprising a support plate, a first frame, a second frame, a third frame, a marking device, and a grinding mechanism, wherein the first frame, the second frame, and the third frame are sequentially connected and disposed on the same side of the support plate, the marking device is disposed above the second frame, and the grinding mechanism is installed above the third frame.

[0007] An electromagnetic slide rail is installed on each of the two opposite inner walls of the first frame, the second frame, and the third frame. The electromagnetic slide rails on the same side inner wall of the first frame, the second frame, and the third frame are connected. A moving block is connected between the opposite electromagnetic slide rails.

[0008] A motor is mounted on the support plate on the side opposite to the second frame. A first gear is connected to the output shaft of the motor. A turntable is rotatably mounted on the support plate. A second gear is mounted on the surface of the turntable on the side opposite to the second frame. The second gear meshes with the first gear. At least two connecting blocks are mounted on the other surface of the turntable. These connecting blocks are all fixedly connected to the second frame.

[0009] The support plate is provided with an annular groove, and several steel balls are rotatably arranged in the groove along the circumference. The turntable is embedded in the groove and is rotatably connected to the support plate through the steel balls.

[0010] The grinding mechanism includes a top plate and a grinding head movably installed below the top plate. One side of the top plate is fixedly connected to a support plate, and a baffle is provided on the other side of the top plate. The baffle is installed on the third frame.

[0011] A nozzle is provided on the baffle. A dust collection chamber is provided below the third frame. The dust collection chamber is connected to the nozzle through a first air duct. A negative pressure fan is provided inside the dust collection chamber. A first filter and a second filter are provided on both sides of the negative pressure fan. The first filter is located on the side of the negative pressure fan closer to the first air duct. The mesh diameter of the first filter is smaller than that of the second filter. A dust collection plate is provided below the third frame. A through hole is provided on the dust collection plate. The through hole is connected to the dust collection chamber through a second air duct.

[0012] The number of steel balls is 18, and these 18 steel balls are evenly spaced along the circumference. Several sliders corresponding to the electromagnetic slide rail are provided on both side surfaces of the moving block, and several through slots are provided on the moving block.

[0013] The following are further improvements to the above technical solution:

[0014] 1. In the above scheme, the first frame and the third frame are connected to support columns below.

[0015] 2. In the above scheme, the slider is slidably connected to the electromagnetic slide rail.

[0016] 3. In the above scheme, the through slot is engaged with the semiconductor device.

[0017] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art:

[0018] 1. The present invention provides a marking device for semiconductor packaging, which enables the rotation of a second frame, thereby allowing the rotating block within the second frame to be flipped. This automatically achieves double-sided marking of semiconductor devices mounted within the rotating block without manual intervention, avoiding errors caused by manual flipping that affect marking accuracy, saving manpower and operating time, and improving work efficiency. Furthermore, a circular groove is provided on the support plate, within which several steel balls are rotatably arranged circumferentially. The turntable is embedded in this groove and rotatably connected to the support plate through the steel balls. Based on the flippability of the second frame, this reduces resistance during the flipping process, making the flipping action of the second frame smoother and improving the accuracy of the stopping position during the flipping process, thus ensuring the quality and accuracy of double-sided marking.

[0019] 2. The marking device for semiconductor packaging of the present invention realizes the grinding of semiconductor devices moved to the third frame, enriches the connotation of the device, improves the automation of semiconductor device processing, and can also avoid the flying of debris generated during the grinding process. In addition, a nozzle is opened on the baffle, and a dust collection chamber is arranged below the third frame. The dust collection chamber is connected to the nozzle through a first air duct. A negative pressure fan is arranged in the dust collection chamber. Through the negative pressure fan and the dust collection chamber, the debris generated during the grinding process can be absorbed into the dust collection chamber, avoiding the air pollution caused by debris and affecting the health of the workers. At the same time, it can also avoid the difficulty of cleaning by cleaning personnel later.

[0020] 3. The marking device for semiconductor packaging of the present invention has a first filter and a second filter respectively installed on both sides of the negative pressure fan. The first filter is located on the side of the negative pressure fan closer to the first air duct. By setting up the two filters, it is possible to prevent debris in the dust collection chamber from entering the fan and clogging it, thus preventing the fan from malfunctioning. At the same time, it is possible to ensure the circulation with the outside air, thereby ensuring that the negative pressure fan can work continuously and stably, and thus ensuring high-efficiency absorption of grinding debris. Furthermore, a dust collection plate is set below the third frame. This dust collection plate has a through hole, which is connected to the dust collection chamber through a second air duct. The dust collection plate and the second air duct are set on the basis of the first air duct, which can further absorb the debris that was missed by the first air duct. This ensures the comprehensive absorption of debris generated during the grinding process and avoids the debris causing air pollution that affects the health of the staff and the difficulty of subsequent cleaning. Attached Figure Description

[0021] Appendix Figure 1 This is a schematic diagram of the marking device for semiconductor packaging according to the present invention;

[0022] Appendix Figure 2 This is a schematic diagram of the motor connection structure of the marking device for semiconductor packaging according to the present invention;

[0023] Appendix Figure 3 This is a cross-sectional view of the support plate of the marking device for semiconductor packaging according to the present invention;

[0024] Appendix Figure 4 This is a cross-sectional view of the dust collection chamber of the marking device for semiconductor packaging according to the present invention;

[0025] Appendix Figure 5 This is a schematic diagram of the dust collection chamber connection structure of the marking device for semiconductor packaging according to the present invention;

[0026] Appendix Figure 6 This is a partial structural diagram of the marking device for semiconductor packaging according to the present invention.

[0027] In the attached diagrams: 1. Support plate; 2. First frame; 3. Second frame; 4. Third frame; 5. Electromagnetic slide rail; 6. Moving block; 7. Marker; 8. Motor; 9. First gear; 10. Turntable; 11. Second gear; 12. Connecting block; 13. Steel ball; 14. Grinding mechanism; 141. Top plate; 15. Dust collection chamber; 16. First air duct; 17. Air nozzle; 18. Second air duct; 19. Dust collection plate; 20. Through hole; 22. First filter screen; 23. Negative pressure fan; 24. Second filter screen; 25. Slide groove; 26. Baffle. Detailed Implementation

[0028] The present patent can be further understood through the specific embodiments given below, but they are not intended to limit the present patent.

[0029] Example: A marking device for semiconductor packaging includes a support plate 1, a first frame 2, a second frame 3, a third frame 4, a marking device 7, and a polishing mechanism 14. The first frame 2, the second frame 3, and the third frame 4 are sequentially connected and disposed on the same side of the support plate 1. The marking device 7 is disposed above the second frame 3, and the polishing mechanism 14 is mounted above the third frame 4.

[0030] An electromagnetic slide rail 5 is installed on each of the two inner walls opposite to the first frame 2, the second frame 3, and the third frame 4. The electromagnetic slide rails 5 on the same inner wall of the first frame 2, the second frame 3, and the third frame 4 are connected. A moving block 6 is connected between the electromagnetic slide rails 5 that are opposite to each other. This moving block 6 can slide along the electromagnetic slide rail 5 between the first frame 2, the second frame 3, and the third frame 4.

[0031] A motor 8 is mounted on the support plate 1 on the side opposite to the second frame 3. A first gear 9 is connected to the output shaft of the motor 8. A turntable 10 is rotatably mounted on the support plate 1. A second gear 11 is mounted on the surface of the turntable 10 on the side opposite to the second frame 3. The second gear 11 meshes with the first gear 9. At least two connecting blocks 12 are mounted on the other surface of the turntable 10. The connecting blocks 12 are fixedly connected to the second frame 3 and drive the second frame 3 to rotate.

[0032] The support plate 1 is provided with an annular groove 25, and a number of steel balls 13 are rotatably arranged in the groove 25 along the circumference. The turntable 10 is embedded in the groove 25 and is rotatably connected to the support plate 1 through the steel balls 13.

[0033] The grinding mechanism 14 includes a top plate 141 and a grinding head movably installed below the top plate 141. One side of the top plate 141 is fixedly connected to the support plate 1, and a baffle 26 is provided on the other side of the top plate 141. The baffle 26 is installed on the third frame 4.

[0034] A nozzle 17 is provided on the baffle 26. A dust collection chamber 15 is provided below the third frame 4. The dust collection chamber 15 is connected to the nozzle 17 through a first air duct 16. A negative pressure fan 23 is provided inside the dust collection chamber 15. A first filter 22 and a second filter 24 are respectively provided on both sides of the negative pressure fan 23. The first filter 22 is located on the side of the negative pressure fan 23 closer to the first air duct 16. The mesh diameter of the first filter 22 is smaller than that of the second filter 24. A dust collection plate 19 is provided below the third frame 4. A through hole 20 is provided on the dust collection plate 19. The through hole 20 is connected to the dust collection chamber 15 through a second air duct 18.

[0035] The second frame 3 and the third frame 4 are both rectangular frames formed by connecting four beams end to end; the first frame 2 and the third frame 4 are connected to support columns below; the dust collection plate 19 is installed on the support column below the third frame 4.

[0036] The number of steel balls 13 is 18, and these 18 steel balls 13 are evenly spaced along the circumference; several sliders corresponding to the electromagnetic slide rail 5 are provided on both side surfaces of the moving block 6, and these sliders are slidably connected to the electromagnetic slide rail 5; several through slots are provided on the moving block 6, and these through slots are engaged with semiconductor devices.

[0037] Working Principle: During use, an external power source is required to provide power for the device to operate normally. The semiconductor device is placed inside the cavity of the moving block 6, ensuring it engages securely and won't easily fall off. Then, the electromagnetic slide rail 5 is activated. Under the action of the electromagnetic slide rail 5, the moving block 6 slides within the first frame 2, second frame 3, and third frame 4. When the moving block 6 moves from the first frame 2 into the second frame 3, the marking device 7 marks one side of the semiconductor. After all marking is completed, the motor 8 is activated. The rotation of the motor 8 drives the first gear 9 to rotate, which in turn drives the meshing second gear 11 to rotate. The rotation of the second gear 11 drives the turntable 10 within the support plate 1. The part rotates, and the rotation process is smoother under the action of the slide 25 and the steel ball 13. The rotation of the turntable 10 can drive the second frame 3, which is fixedly connected to it, to rotate, thereby causing the second frame 3 to flip. The flipped second frame 3 flips out the other side of the semiconductor, so that the marking device 7 can mark the other side of the semiconductor, so that both sides of the semiconductor are marked. The process is simple. After the marking is completed, the moving block 6 continues to move forward. When it moves into the interior of the third frame 4, it is first polished by the polishing mechanism 14. Some of the debris generated by polishing will enter the interior of the dust collection chamber 15 through the nozzle 17 and the first air duct 16 under the action of the negative pressure fan 23. Some of the debris will fall into the interior of the dust collection plate 19 and be transported to the interior of the dust collection chamber 15 by the second air duct 18.

[0038] When using the aforementioned marking device for semiconductor packaging, the second frame is rotated, allowing the movable block within the second frame to be flipped. This automatically marks both sides of the semiconductor device mounted within the movable block without manual intervention. This avoids errors caused by manual flipping that could affect marking accuracy, saves manpower and operating time, and improves work efficiency. Furthermore, the flippable second frame reduces resistance during the flipping process, resulting in smoother flipping and better positioning accuracy during the flipping process, thus ensuring the quality and accuracy of double-sided marking.

[0039] In addition, it enables the polishing of semiconductor devices moved to the third frame, enriching the device's capabilities, improving the automation of semiconductor device processing, and preventing debris from splashing during the polishing process. Furthermore, the negative pressure fan and dust collection chamber can absorb the debris generated during the polishing process into the dust collection chamber, preventing the debris from causing air pollution that could affect the health of the staff, and also avoiding the difficulty of cleaning by the cleaning staff later.

[0040] Furthermore, the use of two filters not only prevents debris from entering the dust collection chamber and clogging the fan, thus preventing fan malfunction, but also ensures airflow with the outside air, guaranteeing the continuous and stable operation of the negative pressure fan and ensuring efficient absorption of grinding debris. In addition, the dust collection plate and the second air duct, built on top of the first air duct, can further absorb any debris missed by the first air duct, ensuring comprehensive absorption of debris generated during the grinding process and preventing air pollution from debris that could affect the health of workers and make subsequent cleaning difficult.

[0041] The above embodiments are only for illustrating the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the content of the present invention and implement it accordingly. They should not be construed as limiting the scope of protection of the present invention. All equivalent changes or modifications made in accordance with the spirit and essence of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A marking apparatus for semiconductor packages, characterized by: It includes a support plate (1), a first frame (2), a second frame (3), a third frame (4), a marking device (7), and a grinding mechanism (14). The first frame (2), the second frame (3), and the third frame (4) are sequentially connected and arranged on the same side of the support plate (1). The marking device (7) is arranged above the second frame (3), and the grinding mechanism (14) is installed above the third frame (4). An electromagnetic slide rail (5) is installed on each of the two inner walls opposite to the first frame (2), the second frame (3), and the third frame (4). The electromagnetic slide rails (5) on the same inner wall of the first frame (2), the second frame (3), and the third frame (4) are connected, and a moving block (6) is connected between the electromagnetic slide rails (5) that are arranged opposite to each other. A motor (8) is mounted on the side of the support plate (1) opposite to the second frame (3). A first gear (9) is connected to the output shaft of the motor (8). A turntable (10) is rotatably mounted on the support plate (1). A second gear (11) is mounted on the surface of the turntable (10) opposite to the second frame (3). The second gear (11) meshes with the first gear (9). At least two connecting blocks (12) are mounted on the other surface of the turntable (10). The connecting blocks (12) are all fixedly connected to the second frame (3). The support plate (1) is provided with an annular groove (25), and several steel balls (13) are rotatably arranged along the inner circumference of the groove (25). The turntable (10) is embedded in the groove (25) and is rotatably connected to the support plate (1) through the steel balls (13). The grinding mechanism (14) includes a top plate (141) and a grinding head movably installed below the top plate (141). One side of the top plate (141) is fixedly connected to the support plate (1), and a baffle (26) is provided on the other side of the top plate (141). The baffle (26) is installed on the third frame (4). A nozzle (17) is provided on the baffle (26). A dust collection chamber (15) is provided below the third frame (4). The dust collection chamber (15) is connected to the nozzle (17) through a first air duct (16). A negative pressure fan (23) is provided inside the dust collection chamber (15). A first filter screen (22) and a second filter screen (24) are provided on both sides of the negative pressure fan (23). The first filter screen (22) is located on the side of the negative pressure fan (23) close to the first air duct (16). The mesh diameter of the first filter screen (22) is smaller than that of the second filter screen (24). A dust collection plate (19) is provided below the third frame (4). A through hole (20) is provided on the dust collection plate (19). The through hole (20) is connected to the dust collection chamber (15) through a second air duct (18). The number of steel balls (13) is 18. These 18 steel balls (13) are arranged at equal intervals along the circumference. Several sliders corresponding to the electromagnetic slide rail (5) are provided on both side surfaces of the moving block (6). Several through slots are provided on the moving block (6).

2. The marking apparatus for semiconductor packaging according to claim 1, characterized in that: The slider is slidably connected to the electromagnetic slide rail (5).

3. The marking apparatus for semiconductor packaging according to claim 1, characterized in that: Support columns are connected below the first frame (2) and the third frame (4).

4. The marking apparatus for semiconductor packaging according to claim 1, characterized in that: The through slot is engaged with the semiconductor device.

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