Refrigerator

Abstract

The application discloses a refrigerator, comprising: a drying chamber, the drying chamber comprising a drying area and a heating water collecting area separated by a partition; a fan arranged at an air outlet, used to provide air power to suck air in the drying area into the heating water collecting area and send the air into the drying area through an air inlet; a semiconductor refrigeration device arranged in the heating water collecting area and located at the air outlet side of the fan, having a heat dissipation end and a condensation end arranged oppositely, the heat dissipation end being located at the side of the semiconductor refrigeration device facing the fan, and the condensation end being located at the side away from the fan; the heat dissipation end can heat the air sucked into the heating water collecting area by the fan, and the condensation end can condense the air in the heating water collecting area. Therefore, the heat dissipation end can heat the air at the water level in the heating water collecting area, the heated air is introduced into the drying area for drying, and the drying effect can be improved. Moreover, the air in the heating water collecting area is condensed by the condensation end and then introduced into the drying area, and the drying effect can also be improved.

Description

Technical Field

[0001] This application relates to the field of household appliances, and in particular to a refrigerator. Background Technology

[0002] Refrigerators use air for cooling. When hot air flows through a low-temperature evaporator, water vapor in the air condenses on the evaporator, causing the air temperature and humidity to decrease. When this low-temperature, low-humidity air is introduced into the compartment, a low-temperature, low-humidity environment is created to store items.

[0003] Existing refrigerators use the above principle to divide dry storage areas, but their ability to dry items is limited, and they are currently only used to store dry foods. Summary of the Invention

[0004] This application provides a refrigerator that can improve the drying effect on items to be dried.

[0005] Specifically, the refrigerator includes: a cabinet, which is constructed as the outer shell of the refrigerator; a storage compartment, formed within the cabinet; a drying compartment, disposed within the storage compartment and isolated from the storage compartment outside the drying compartment, the drying compartment including a separated drying area and a heating water collection area, the drying area having an air outlet and an air inlet communicating with the heating water collection area; a fan, disposed at the air outlet, the fan being used to provide airflow to draw air from the drying area into the heating water collection area through the air outlet and to send air from the heating water collection area into the drying area through the air inlet; a thermoelectric cooling device, disposed within the heating water collection area and located on the air outlet side of the fan; the thermoelectric cooling device has a heat dissipation end and a condensation end arranged opposite to each other, the heat dissipation end being located on the side of the thermoelectric cooling device facing the fan, and the condensation end being located on the side of the thermoelectric cooling device away from the fan; wherein, the heat dissipation end is capable of heating the air drawn into the heating water collection area by the fan, and the condensation end is capable of condensing the moisture in the air in the heating water collection area.

[0006] In some specific embodiments, the semiconductor cooling device includes a semiconductor cooling chip, a first heat conduction element, and a second heat conduction element. The first heat conduction element is disposed in contact with one side of the semiconductor cooling chip to form a heat dissipation end, and the second heat conduction element is disposed in contact with the other side of the semiconductor cooling chip to form a condensation end.

[0007] In some specific embodiments, the first heat conduction element includes a first conductive plate and a plurality of second conductive plates. The first conductive plate is disposed in contact with one side of the thermoelectric cooler. The plurality of second conductive plates are disposed at intervals on the side of the first conductive plate away from the thermoelectric cooler. A guide groove with an opening facing the air outlet side of the fan is formed between two second conductive plates. The airflow discharged by the fan is guided into the guide groove and discharged from both ends of the guide groove.

[0008] In some specific embodiments, the refrigerator also includes a heat insulation component, with a hollowed-out area in the middle of the heat insulation component. A semiconductor cooling chip is disposed in the hollowed-out area, and a first heat conduction component and a second heat conduction component are respectively disposed on both sides of the heat insulation component. The heat insulation component is used to achieve heat insulation between the first heat conduction component and the second heat conduction component.

[0009] In some specific embodiments, a drying air duct is provided in the drying zone, which is connected to the air outlet. The drying air duct extends away from the heating water collection zone, and the air in the heating water collection zone enters and exits into the drying zone through the drying air duct.

[0010] In some specific embodiments, the drying zone and the heating water collection zone are arranged in a horizontal direction, the drying air duct is set on the side wall of the drying zone, and the air duct wall opposite to the side wall of the drying zone is provided with an air outlet.

[0011] In some specific embodiments, the refrigerator includes multiple drying racks, which are spaced apart along the height of the drying area; there are multiple drying air ducts, with one drying rack corresponding to one drying air duct, so that the airflow from the air outlet of the drying air duct flows to the item to be dried on the corresponding drying rack.

[0012] In some specific embodiments, there are multiple drying air ducts, which are arranged on opposite side walls of the drying zone in the horizontal direction. The airflow from the fan is directed into the drying air ducts on the opposite side walls.

[0013] In some specific embodiments, there are multiple air outlets, which are arranged at intervals along the extension direction of the drying air duct, and the area of ​​the multiple air outlets first increases and then decreases along the direction away from the fan.

[0014] In some specific embodiments, the refrigerator also includes a water-receiving funnel and a water-collecting box. The water-receiving funnel is located below the condenser end, and its opening is located directly below the condenser end to collect the condensate generated by the condenser end. The water-collecting box is located below the water-receiving funnel and is used to collect the condensate collected by the water-receiving funnel.

[0015] This application has at least the following beneficial effects: Based on the refrigerator provided by this application, the drying chamber includes a separated drying zone and a heating water collection zone. The drying zone is provided with an air outlet and an air inlet communicating with the heating water collection zone. A fan is provided at the air outlet to provide airflow, drawing air from the drying zone into the heating water collection zone through the air outlet and sending air from the heating water collection zone into the drying zone through the air inlet. A semiconductor refrigeration device is provided in the heating water collection zone and on the air outlet side of the fan. The semiconductor refrigeration device has a heat dissipation end and a condensation end arranged opposite to each other. The heat dissipation end is located on the side of the semiconductor refrigeration device facing the fan, and the condensation end is located on the side of the semiconductor refrigeration device away from the fan. The heat dissipation end can heat the air drawn into the heating water collection zone by the fan, and the condensation end can condense the moisture in the air in the heating water collection zone. Therefore, the heat dissipation end can heat the water-filled air in the heating water collection zone, and the heated air is introduced into the drying zone for drying, which can improve the drying effect. Furthermore, heating the air in the water collection area and condensing it through the condenser end before introducing it into the drying area can also improve the drying effect. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the structure of an embodiment of the refrigerator provided in this application.

[0018] Figure 2 Figure 1 A schematic diagram of the refrigerator from another perspective.

[0019] Figure 3 yes Figure 2 The refrigerator in the picture is a cross-sectional view along section line AA.

[0020] Figure 4 yes Figure 1 A schematic diagram of the drying compartment assembly of a refrigerator.

[0021] Figure 5 yes Figure 4 The diagram shows the structure of the drying chamber assembly from another perspective.

[0022] Figure 6 yes Figure 5 The diagram shows the structure of the drying chamber assembly along section line BB.

[0023] Figure 7 yes Figure 4The exploded view of the structure shown.

[0024] Figure 8 yes Figure 7 A schematic diagram of the main frame in the structure shown.

[0025] Figure 9 yes Figure 8 A structural diagram of the main framework from another perspective.

[0026] Figure 10 yes Figure 9 An enlarged structural diagram of region A of the structure shown.

[0027] Figure 11 It is a structural schematic diagram including a fan and a semiconductor cooling component.

[0028] Figure 12 yes Figure 11 The diagram shows a breakdown of the structure.

[0029] Figure 13 yes Figure 4 The diagram shows the structure from another perspective.

[0030] Figure 14 yes Figure 13 The structure shown is a cross-sectional view along section line CC.

[0031] Explanation of reference numerals in the attached drawings: 10. Refrigerator; 11. Cabinet; 111. Storage compartment; 12. Drying chamber assembly; 121. Drying chamber; 1211. Drying area; 1212. Heating and water collection area; 122. Partition; 123. Main frame; 124. Cover plate; 125. Drying drawer; 1251. Supporting side panel; 1252. Drying rack; 1253. Pull-out plate; 13. Fan; 14. Semiconductor cooling component; 141. Heat dissipation end; 142. Condensation end; 143. Semiconductor cooling chip; 144. First heat conduction component; 1441. First heat conduction plate; 1442. Second heat conduction plate; 145. Second heat conduction component; 15. Insulation component; 151. Perforated area; 161. Fan cover; 162. Fixing bracket; 17. Drying air duct; 171. Air outlet; 18. Water collection funnel; 19. Water collection box; 191. Guide pipe. Detailed Implementation

[0032] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be particularly noted that the following embodiments are for illustrative purposes only and do not limit the scope of the application. Similarly, the following embodiments are only some, not all, embodiments of the present application, and all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of the present application.

[0033] The terms “first,” “second,” “third,” “fourth,” etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a particular order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of the application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms “comprising” and “having,” and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0034] This application provides a refrigerator 10, Figure 1 This is a schematic diagram of the structure of an embodiment of the refrigerator 10 provided in this application. Figure 2 Figure 1 A structural schematic diagram of the refrigerator 10 from another perspective. Figure 3 yes Figure 2 A cross-sectional view of refrigerator 10 along section line AA.

[0035] Combination Figures 1-3 The refrigerator 10 includes a cabinet 11, which is constructed as the outer shell of the air-cooled refrigerator 10. Of course, other structures can be further provided on the outside of the cabinet 11 to achieve better sealing and protection.

[0036] The hollow body 11 forms a storage compartment 111, which constitutes the low-temperature storage space of the air-cooled refrigerator 10 and is used to store items. In order to ensure the airtightness of the storage compartment 111 and facilitate the placement and removal of items, a door (not shown) is movably provided on one side of the body 11. The door is used to seal the storage compartment 111, and the user can open and close the door to retrieve or place items.

[0037] In some specific embodiments, the storage compartment 111 is divided into a higher-temperature refrigeration zone and a lower-temperature freezing zone. The refrigeration zone and the freezing zone can be arranged sequentially at intervals along the height of the cabinet 11 and separated by components such as partitions. Figure 1 In the structure shown, the freezing zone is located above the refrigeration zone. Of course, in other embodiments, the arrangement of the refrigeration zone and the freezing zone is not limited to this.

[0038] A drying chamber 121 is provided inside the storage room 111. The drying chamber 121 is isolated from the storage room 111 outside the drying chamber 121. The drying chamber 121 can be located in the cold storage area at the bottom of the storage room 111. The drying chamber 121 is used to dry the items to be dried and can store the dried items.

[0039] Combination Figure 3 The drying chamber 121 includes a separate drying area 1211 and a heating water collection area 1212. The drying area 1211 is provided with an air outlet (not shown) and an air inlet (not shown) that communicate with the heating water collection area 1212. When the drying area 1211 and the heating water collection area 1212 are separated, they are only connected by the air outlet and the air inlet, making them relatively independent.

[0040] In some specific embodiments, the drying zone 1211 and the heating water collection zone 1212 can be arranged in a horizontal direction. In this case, the drying zone 1211 can be located at the front of the box 11, and the heating water collection zone 1212 can be located at the rear of the box 11.

[0041] Figure 4 yes Figure 1 A schematic diagram of the structure of the drying compartment assembly 12 of the refrigerator 10. Figure 5 yes Figure 4 The diagram shows the structure of the drying chamber assembly 12 from another perspective. Figure 6 yes Figure 5 The diagram shows the structure of the drying chamber assembly 12 along section line BB.

[0042] Combination Figure 4 as well as Figure 5 In some specific embodiments, the refrigerator 10 may include a drying chamber assembly 12 separately. The outer wall of the drying chamber assembly 12 is in contact with or spaced from the inner wall of the cabinet 11. In this case, the drying chamber assembly 12 is hollow to form a drying chamber 121, and the wall of the drying chamber 121 is the inner wall of the drying chamber assembly 12. Of course, in other embodiments, some structures may be enclosed together with the cabinet to form the drying chamber 121, without specific limitations.

[0043] Combination Figure 6 The refrigerator 10 includes a fan 13, which is located at the air outlet. The fan 13 provides airflow to draw air from the drying zone 1211 into the heating water collection zone 1212 through the air outlet, and then sends air from the heating water collection zone 1212 into the drying zone 1211 through the air inlet. At this time, the fan 13 acts as a guide, accelerating the air in the drying zone 1211 and forming an accelerated airflow that is directed into the heating water collection zone 1212. The accelerated airflow from the heating water collection zone 1212 is then directed into the drying zone 1211, thereby drying the items to be dried in the drying zone 1211.

[0044] Specifically, the drying zone 1211 and the heating and water collection zone 1212 can be separated by a partition 122, and the air outlet and air inlet can be provided on the partition 122. In combination with the above, the air outlet can be located in the middle of the partition 122, and the air inlet can be located at the edge of the partition 122.

[0045] When the fan 13 is installed at the air outlet, the outer peripheral wall of the fan 13 is fitted to the inner wall of the air outlet, and the suction side of the fan 13 faces the drying zone 1211 to absorb the air in the drying zone 1211, and the air outlet side of the fan 13 faces the heating water collection zone 1212 to introduce the absorbed air into the drying water collection zone 1212.

[0046] Continue to combine Figure 6 The refrigerator 10 also includes a semiconductor cooling element 14, which is disposed within the heating water collection area 1212 and on the air outlet side of the fan 13. The semiconductor cooling element 14 can be disposed directly opposite the air outlet side of the fan 13, so that the airflow from the fan 13 can be directly blown onto the semiconductor cooling element 14.

[0047] Specifically, the thermoelectric cooler 14 has a heat dissipation end 141 and a condensation end 142 arranged opposite to each other. The heat dissipation end 141 is located on the side of the thermoelectric cooler 14 facing the fan 13, and the condensation end 142 is located on the side of the thermoelectric cooler 14 away from the fan 13. The heat dissipation end 141 has a higher temperature, enabling it to heat the air drawn into the heating water collection area 1212 by the fan 13, while the air in the heating water collection area 1212 also dissipates heat from the heat dissipation end 141. The condensation end 142 has a lower temperature, enabling it to condense moisture in the air in the heating water collection area 1212.

[0048] It should be understood that the semiconductor cooling device 14 includes a thermocouple made of two different semiconductor materials connected in series. Utilizing the Peltier effect of semiconductor materials, when direct current passes through the thermocouple made of two different semiconductor materials connected in series, heat can be absorbed and released at the two ends of the thermocouple, respectively forming the condensation end 142 and the heat dissipation end 141 of the semiconductor cooling device 14.

[0049] In summary, the drying chamber 121 is not connected to other parts of the storage chamber 111, but the drying zone 1211 and the heating water collection zone 1212 within the drying chamber 121 are connected via air inlets and outlets. After the fan 13 draws air from the drying zone 1211 into the heating water collection zone 1212, the semiconductor cooling device 14 heats the air in the heating water collection zone 1212 and condenses the moisture in the air. Therefore, the temperature of the air in the heating water collection zone 1212 increases and the humidity decreases. Furthermore, the air in the heating water collection zone 1212 is drawn into the drying zone 1211, and the air in the drying zone 1211 is then drawn back into the heating water collection zone 1212. This cycle continues, causing the air temperature to rise and the humidity to decrease throughout the drying chamber 121. At this point, the high-temperature, low-humidity air in the drying zone 1211 effectively dries the items to be dried.

[0050] In some specific embodiments, the refrigerator 10 may be a frost-free refrigerator, in which case the refrigerator 10 may also include an evaporator compartment (not shown) and an evaporator (not shown), the evaporator compartment being formed inside the cabinet 11, the evaporator being disposed inside the evaporator compartment, and the evaporator being configured to generate cold air inside the evaporator compartment.

[0051] Specifically, the evaporator compartment is a sealed cavity, combined with Figure 1 The evaporator compartment is located at the rear of the housing 11 and has an opening 1111 communicating with the storage compartment 111. The opening 1111 is located above the drying chamber assembly 12. Of course, in other embodiments, the evaporator compartment may be located on the side of the housing, or simultaneously on the side and rear, without specific limitations.

[0052] It should be understood that the evaporator has a low surface temperature when it is working. When air comes into contact with the surface of the evaporator, it is cooled down, thus forming cold air inside the evaporator compartment. The cold air inside the evaporator compartment can be introduced into the storage compartment 111 to provide a refrigerated environment for the storage compartment 111.

[0053] In some embodiments, a cooling air duct can be formed inside the housing 11. The cooling air duct is configured as a pipe for the flow of cold air. The cooling air duct connects the evaporator compartment and the opening 1111, and can transport the cold air in the evaporator compartment into the storage room 111 to achieve cooling in the storage room 111.

[0054] Based on the above, the refrigeration duct 142 connects the evaporator compartment and the refrigerated area of ​​the storage compartment 111. At this time, the cold air in the evaporator compartment is introduced into the refrigeration area through the refrigeration duct to provide a low-temperature environment for the refrigeration area.

[0055] Figure 7 yes Figure 4 An exploded view of the structure shown. Figure 8 yes Figure 7A schematic diagram of the main frame 122 in the structure shown.

[0056] Combination Figure 7 as well as Figure 8 The drying chamber assembly 12 includes a main frame 123 and a cover plate 124. The main frame 123 constitutes the main body of the drying chamber assembly 12. The main frame 123 is hollow and has an opening at the top. The cover plate 124 covers the opening at the top of the main frame 123.

[0057] The drying chamber assembly 12 also includes a drying drawer 125, which includes a supporting side plate 1251 and a drying rack 1252. The supporting side plate 1251 is disposed on both sides of the drying rack 1252. Both the drying rack 1252 and the supporting side plate 1251 are disposed within the main frame 122. The supporting side plate 1241 is used to support the drying rack 1252 against the inner wall of the main frame 122. The drying chamber assembly 12 also includes a pull plate 1253, which is disposed at one end of the supporting side plate 1251 and is used to pull the drying rack 1252 through the supporting side plate 1251.

[0058] It should be understood that an opening is formed at one end of the main frame 123, and when the drying drawer 125 is in the working position, the pull plate 1251 covers the opening at one end of the main frame 123. Therefore, when the drying drawer 125 is in the working position, the inner cavity of the drying chamber assembly 12 can be sealed by the cover plate 124 and the pull plate 1251, thereby forming the drying chamber 121. When the drying drawer 125 is not in the working position, that is, when the drying drawer 125 is pulled out, items can be placed or removed from the drying rack 1252.

[0059] Figure 9 yes Figure 8 A structural diagram of the main frame 123 from another perspective. Figure 10 yes Figure 9 An enlarged structural diagram of region A of the structure shown.

[0060] Combination Figures 8-10 In addition to the above, the partition 122 is set on the main frame 123, thereby dividing the drying chamber 121 into a drying area 1211 and a heating water collection area 1212. The fan 13 is set on the partition 122, and the semiconductor cooling component 14 is set on the side of the fan 13 away from the partition 122, that is, on the air outlet side of the fan 13.

[0061] Figure 11 This is a schematic diagram of a structure including a fan 13 and a semiconductor cooling component 14. Figure 12 yes Figure 11 The diagram shows a structural breakdown of the structure shown.

[0062] Combination Figure 11 as well as Figure 12In some specific embodiments, the semiconductor cooling device 14 includes a semiconductor cooling chip 143, a first heat conduction element 144, and a second heat conduction element 145. The first heat conduction element 144 is disposed in contact with one side of the semiconductor cooling chip 141 to form a heat dissipation end 141, and the second heat conduction element 145 is disposed in contact with the other side of the semiconductor cooling chip 143 to form a condensation end 142.

[0063] Specifically, when the thermoelectric cooler 143 is turned on, one side heats up and the other side absorbs heat. The first heat-conducting element 144 is in contact with the heat-conducting side, and the second heat-conducting element 145 is in contact with the heat-absorbing side. Both the first heat-conducting element 144 and the second heat-conducting element 145 are structural components with good thermal conductivity, allowing the thermoelectric cooler 143 to conduct heat to the first heat-conducting element 144 through its heat-conducting side, resulting in a higher temperature for the first heat-conducting element 144, thus forming a heat dissipation end 141. The thermoelectric cooler 143 absorbs heat from the second heat-conducting element 145 through its heat-absorbing side, resulting in a lower temperature for the second heat-conducting element 145, thus forming a condensation end 142.

[0064] Combination Figure 12 In some specific embodiments, the first heat conduction element 144 includes a first conduction plate 1441 and a plurality of second conduction plates 1442. The first conduction plate 1441 is disposed in contact with one side of the semiconductor cooling chip 143, and the plurality of second conduction plates 1442 are disposed at intervals on the side of the first conduction plate 1441 away from the semiconductor cooling chip 143.

[0065] Specifically, the first side of the first conductive plate 1441 is in contact with one side of the semiconductor cooling chip 143, and the second conductive plate 1442 is disposed on the second side of the first conductive plate 1441. The first side and the second side are two opposite sides of the first conductive plate 1441.

[0066] Among them, a guide channel with an opening facing the air outlet side of the fan 13 is formed between the two second guide plates 1442. The airflow exported by the fan 13 is introduced into the guide channel and exported from both ends of the guide channel.

[0067] The second conductive plate 1442 can be vertically arranged on the first side of the first conductive plate 1441, and there are multiple second conductive plates 1442. The multiple second conductive plates 1442 can be arranged in parallel, and a guide groove is formed between two adjacent second conductive plates 1442. At this time, multiple guide grooves are formed between the second conductive plates.

[0068] It should be understood that the first heat conduction plate 1441 and the second heat conduction plate 1442 have strong thermal conductivity. The first heat conduction plate 1441 directly conducts heat from the hot end of the semiconductor cooling chip 143 and transfers the heat to the second heat conduction plate 1442. At this time, when airflow is discharged from the outlet side of the fan 13, the airflow enters the guide channel, and the sidewall of the guide channel makes full contact with the air to achieve heat exchange and heat the air. Therefore, by setting the guide channel, the heating effect of the first heat conduction plate 144 on the airflow discharged by the fan can be enhanced.

[0069] The structure of the second heat conduction element 145 can be the same as that of the first heat conduction element 144. That is, the second heat conduction element 145 also has a guide groove, but the guide groove of the second heat conduction element 145 does not guide the air. Instead, it allows the second heat conduction element 145 to fully contact the air in the heating water collection area 1212 for condensation.

[0070] Continue to combine Figure 12 In some specific embodiments, the refrigerator 10 further includes a heat insulation component 15, with a hollowed-out area 151 formed in the middle of the heat insulation component 15. A semiconductor cooling chip 143 is disposed in the hollowed-out area 151. A first heat conduction component 144 and a second heat conduction component 145 are respectively disposed on both sides of the heat insulation component 15. The heat insulation component 15 is used to achieve heat insulation between the first heat conduction component 144 and the second heat conduction component 145.

[0071] Specifically, the shape and size of the hollowed-out area 151 in the middle of the heat insulation component 15 can be the same as the shape and size of the semiconductor cooling component 143, so that the semiconductor cooling component 143 can be completely fitted into the hollowed-out area 151. At this time, the first heat conduction component 144 and the second heat conduction component 145 are located on both sides of the heat insulation component 15, so that the first heat conduction component 144 and the second heat conduction component do not have any directly opposite parts in the direction perpendicular to the plane of the heat insulation component 15, thereby achieving a good heat insulation effect between the first heat conduction component 144 and the second heat conduction component 145.

[0072] It should be understood that the heat insulation component 15 has a good heat insulation effect. By setting the heat insulation component 15, the heat exchange between the first heat conduction component 144 and the second heat conduction component 145 can be reduced, so as to ensure that the first heat conduction component 144 has a higher temperature and the second heat conduction component 145 has a lower temperature.

[0073] Combination Figures 10-12In some embodiments, the fan 13 is disposed inside a fan cover 161, which is fixed to a partition 122, thereby securing the fan 13. A thermoelectric cooler 14 is fixed to a mounting bracket 162, one end of which is fixed to the partition 122, thus securing the thermoelectric cooler 14 relative to the fan 13. In conjunction with the above, the mounting bracket 162 has mounting holes (not shown), and a heat insulation element 15 can be disposed at these mounting holes, thereby securing the thermoelectric cooler 14.

[0074] Figure 13 yes Figure 4 A schematic diagram of the structure shown in the image from another perspective. Figure 14 yes Figure 13 The structure shown is a cross-sectional view along section line CC.

[0075] Combination Figure 13 as well as Figure 14 In some specific embodiments, a drying air duct 17 is provided in the drying zone 1211. The drying air duct 17 is connected to the air outlet. The drying air duct 17 extends in a direction away from the heating water collection zone 1212. Air in the heating water collection zone 1212 enters through the drying air duct 17 and is then discharged into the drying zone 1211.

[0076] Specifically, the end of the drying duct 17 is connected to the air outlet, thereby connecting it to the heating water collection area 1212. The drying duct 17 is strip-shaped, and its length direction can be the same as that of the drying area 1211. By setting up the drying duct 17, air in the heating water collection area 1212 can be introduced to a specific location, thereby enabling targeted drying of the items to be dried in a specific area of ​​the drying area 1211.

[0077] Specifically, the drying zone 1211 and the heating water collection zone 1212 are arranged in a horizontal direction, and the drying air duct 17 is set on the side wall of the drying zone 1211.

[0078] It should be understood that this horizontal direction is perpendicular to the height direction when the refrigerator 10 is normally placed. In this case, the horizontal direction can be the front and back direction of the refrigerator 10. In this arrangement, the drying zone 1211 is located at the front of the storage compartment 111 of the refrigerator 10, and the heating water collection zone 1212 is located at the rear of the storage compartment 111.

[0079] Furthermore, since the drying duct 17 is located on the side wall of the drying area 1211 rather than on the top wall of the drying area 1211, the height of the drying area 1211 can be reduced to meet the requirement of low height of the drying area 1211 in specific application scenarios.

[0080] Combination Figure 8 as well as Figure 9An air outlet 171 is provided on the duct wall opposite to the side wall of the drying zone 1211. There can be multiple air outlets 171, and multiple air outlets 171 can be arranged at intervals along the length extension direction of the drying duct 17, so that the drying duct 17 can introduce airflow into the drying zone 1211 more comprehensively through the air outlets 171.

[0081] Combination Figures 7-9 In some specific embodiments, multiple drying racks 1252 are spaced apart along the height direction of the drying area 1211. That is, multiple drying drawers 125 are present, and these drawers are spaced apart along the height direction of the drying area. It should be understood that... Figure 7 The example only shows two drying drawers 125, but in other embodiments, it is not limited to this.

[0082] At this time, there are multiple drying air ducts 17, with one drying air duct 17 corresponding to one drying rack 1252, so that the airflow from the air outlet of the drying air duct 17 flows to the object to be dried on the corresponding drying rack 1252. The drying air ducts 17 are also spaced apart along the height direction of the drying area 1211, and are positioned above the drying rack 1252, so that the airflow can directly blow onto the object to be dried on the drying rack 1252. Through this arrangement, the object to be dried on each drying rack 1252 is directly dried by the airflow from the drying air duct 17, ensuring a uniform and efficient drying effect.

[0083] To ensure a more efficient drying effect, so that the material to be dried is dried quickly, combined with Figure 14 : In some specific embodiments, multiple drying ducts 17 can be disposed on opposite side walls of the drying zone 1211 in the horizontal direction, and the airflow discharged by the fan 13 is respectively directed into the drying ducts 17 on opposite side walls.

[0084] Further integration Figures 9-12 as well as Figure 14 The guide grooves of the first heat conduction element 144 guide the airflow to both sides of the heating water collection area 1212, and then into the drying air duct 17 set on the side wall of the drying area 1211. By guiding the airflow through the oppositely arranged drying air duct 17, the object to be dried on the same drying rack 1252 can be dried by guiding airflow in two directions, thereby ensuring efficient drying.

[0085] To ensure uniform drying of the items to be dried on each drying rack 1252, in some specific embodiments: Multiple air outlets 171 are arranged at intervals along the extension direction of the drying air duct 17, and the area of ​​the multiple air outlets 171 first increases and then decreases along the direction away from the fan 13.

[0086] Specifically, the drying duct 17 can be divided into a first air supply zone, a second air supply zone, and a third air supply zone along the direction away from the fan 13. The area of ​​the air outlet 171 in the first air supply zone is smaller than that in the second air supply zone, and the area of ​​the air outlet 171 in the second air supply zone is larger than that in the third air supply zone. It should be understood that the airflow gradually decreases along the direction away from the fan 13 in the drying duct 17. Through this arrangement, the airflow at the corresponding drying racks 1252 in the first and second air supply zones is similar, while the third air supply zone, which is farther from the fan 13, does not require a large airflow, thus ensuring uniform airflow and full utilization.

[0087] Combination Figures 9-12 In some specific embodiments, the refrigerator 10 also includes a water-receiving funnel 18 and a water-collecting box 19. The water-receiving funnel is located below the condenser end 142, and the opening of the water-receiving funnel 18 is located directly below the condenser end 142 to collect the condensed water generated by the condenser end 142. The water-collecting box 19 is located below the water-receiving funnel 18 and is used to collect the condensed water collected by the water-receiving funnel 18.

[0088] Specifically, in conjunction with the above, the opening of the water receiving funnel 18 is directly opposite the second heat conduction element 145, and the extension direction of the guide groove of the second heat conduction element 145 can be vertical, so that the condensate formed on the second heat conduction element 145 flows directly into the water receiving funnel 18 through the guide groove.

[0089] The water collection box 19 is also provided with a guide pipe 191 that communicates with its inner cavity. The guide pipe 191 can drain the condensate in the water collection box 19 to the outside of the refrigerator 10, so as to avoid manually pouring out the water in the water collection box 19.

[0090] The above are merely embodiments of this application and do not limit the scope of this patent application. Any equivalent structural or procedural changes made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of this application.

Claims

1. A refrigerator, characterized in that, include: The box is constructed to form the outer shell of the refrigerator; A storage compartment is formed within the box; A drying chamber is located inside the storage room and is isolated from the storage room outside the drying room. The drying chamber includes a drying area and a heating and water collection area separated by a partition. The drying area is located at the front of the box body, and the heating and water collection area is located at the rear of the box body. The drying area is provided with an air outlet and an air inlet that communicate with the heating and water collection area. The air outlet is located in the middle of the partition, and the air inlet is located at the edge of the partition. A fan is installed at the air outlet. The fan is used to provide airflow to draw air from the drying zone into the heating water collection zone through the air outlet, and to send air from the heating water collection zone into the drying zone through the air inlet. A semiconductor cooling device is disposed within the heating water collection area and on the air outlet side of the fan; the semiconductor cooling device has a heat dissipation end and a condensation end arranged opposite to each other, the heat dissipation end is located on the side of the semiconductor cooling device facing the fan, and the condensation end is located on the side of the semiconductor cooling device away from the fan. The heat dissipation end can heat the air drawn into the heating water collection area by the fan, and the condensation end can condense the moisture in the air in the heating water collection area. The drying zone is provided with a drying air duct, which is located on the left and right side walls of the drying zone and extends in the front-back direction; the drying air duct is connected to the air inlet; an air outlet is provided on the air duct wall opposite to the side wall of the drying zone; the air in the heating water collection zone is led out into the drying zone through the drying air duct and the air outlet.

2. The refrigerator according to claim 1, characterized in that, The semiconductor cooling device includes a semiconductor cooling chip, a first heat conduction element, and a second heat conduction element. The first heat conduction element is disposed in contact with one side of the semiconductor cooling chip to form the heat dissipation end, and the second heat conduction element is disposed in contact with the other side of the semiconductor cooling chip to form the condensation end.

3. The refrigerator according to claim 2, characterized in that, The first heat conduction component includes a first conductive plate and a plurality of second conductive plates. The first conductive plate is in contact with one side of the thermoelectric cooler. The plurality of second conductive plates are spaced apart on the side of the first conductive plate away from the thermoelectric cooler. A guide groove with an opening facing the air outlet side of the fan is formed between two second conductive plates. The airflow discharged by the fan is guided into the guide groove and discharged from both ends of the guide groove.

4. The refrigerator according to claim 2, characterized in that, The refrigerator also includes a heat insulation component, which has a hollowed-out area in the middle. The semiconductor cooling chip is disposed in the hollowed-out area. The first heat conduction component and the second heat conduction component are respectively disposed on both sides of the heat insulation component. The heat insulation component is used to achieve heat insulation between the first heat conduction component and the second heat conduction component.

5. The refrigerator according to claim 1, characterized in that, The refrigerator includes multiple drying racks, which are spaced apart along the height direction of the drying area. There are multiple drying air ducts, and each drying air duct corresponds to one drying rack, so that the airflow blown out of the air outlet of the drying air duct flows to the object to be dried on the corresponding drying rack.

6. The refrigerator according to claim 1, characterized in that, The number of drying air ducts is multiple, and the multiple drying air ducts are arranged on opposite side walls of the drying area in the horizontal direction. The airflow discharged by the fan is respectively guided into the drying air ducts on the opposite side walls.

7. The refrigerator according to claim 1, characterized in that, The number of air outlets is multiple, and the multiple air outlets are arranged at intervals along the extension direction of the drying air duct, and the area of ​​the multiple air outlets first increases and then decreases along the direction away from the fan.

8. The refrigerator according to claim 1, characterized in that, The refrigerator also includes a water-receiving funnel and a water collection box. The water-receiving funnel is located below the condenser end, and the opening of the water-receiving funnel is located directly below the condenser end to collect the condensate generated by the condenser end. The water collection box is located below the water-receiving funnel and is used to collect the condensate collected by the water-receiving funnel.

Images