Ultrafast laser processing system and method for composite flexible matrix materials

Abstract

The application discloses a kind of for composite flexible matrix material ultrafast laser processing system and method, for composite flexible matrix material ultrafast laser processing system includes: processing platform, processing platform is suitable for installing sample to be processed on, and sample to be processed includes flexible matrix material layer and functional material layer;Processing module, processing module includes ultrafast laser, quarter-wave plate, shutter, light field shaping phase plate, electric variable magnification beam expander, neutral density attenuator, two-dimensional scanning galvanometer and focusing lens, coaxial imaging device is equipped in two-dimensional scanning galvanometer, light field shaping phase plate is suitable for increasing focal depth and reducing spot area, and processing module can be switched between functional layer processing state and matrix layer processing state.According to the embodiment of the application for composite flexible matrix material ultrafast laser processing system can process different material layers separately, with high processing quality, high processing precision, good flexibility, strong applicability and the like.

Description

Technical Field

[0001] This invention relates to the field of laser processing technology, and more specifically, to an ultrafast laser processing system and method for composite flexible substrate materials. Background Technology

[0002] Composite flexible matrix materials are composed of two or more different types of materials to achieve various properties and functions, including a flexible matrix material layer and a functional material layer. Composite flexible matrix materials are mainly used in the automotive industry, flexible electronics, and biomedicine, and high-precision processing technology is fundamental to ensuring their application. With the diversification of application scenarios, traditional processes such as waterjet cutting and ultrasonic cutting cannot meet production demands.

[0003] The processing of composite flexible matrix materials using carbon dioxide lasers in related technologies has the following problems: the heat-affected zone of carbon dioxide lasers is large, and the surrounding materials are prone to structural changes and performance degradation during processing; the focal depth and focal spot diameter of the Gaussian beam are mutually restrictive, resulting in poor processing flexibility and applicability; the processing quality is affected by the laser polarization effect, making it difficult to guarantee processing quality; since composite flexible matrix materials are composed of multi-layer structures with different components, different materials absorb lasers differently, and using long-pulse lasers at the same energy level cannot guarantee the processing quality of multi-layer materials, for example, the surface layer may have good processing quality, but the surrounding material of the underlying layer may be severely carbonized. Summary of the Invention

[0004] This invention aims to at least solve one of the technical problems existing in the prior art. To this end, this invention proposes an ultrafast laser processing system for composite flexible matrix materials. This ultrafast laser processing system for composite flexible matrix materials can process different material layers individually and has advantages such as high processing quality, high processing accuracy, good flexibility, and strong applicability.

[0005] This invention also proposes an ultrafast laser processing method for composite flexible matrix materials.

[0006] To achieve the above objectives, according to an embodiment of the first aspect of the present invention, an ultrafast laser processing system for composite flexible matrix materials is provided. The ultrafast laser processing system for composite flexible matrix materials includes: a processing platform adapted to mount a sample to be processed, the sample comprising a flexible matrix material layer and a functional material layer located above the flexible matrix material layer; and a processing module comprising an ultrafast laser, a quarter-wave plate, a shutter, a field-shaping phase plate, an electrically operated variable-magnification beam expander, a neutral density attenuator, a two-dimensional scanning galvanometer, and a focusing lens. The laser emitted by the ultrafast laser is adapted to sequentially pass through the quarter-wave plate, shutter, field-shaping phase plate, electrically operated variable-magnification beam expander, neutral density attenuator, two-dimensional scanning galvanometer, and focusing lens to irradiate the sample to be processed on the processing platform. The output wavelength, repetition frequency, and pulse width of the ultrafast laser are adjustable. The two-dimensional scanning galvanometer is equipped with a mechanism suitable for acquiring data coaxial with the laser emitted from the two-dimensional scanning galvanometer. A coaxial imaging device for images, wherein the light field shaping phase plate is adapted to increase the focal depth of the passing laser and reduce the spot area that the passing laser can form; the processing module can switch between a functional layer processing state and a substrate layer processing state; the processing module is adapted to process the functional material layer in the functional layer processing state and to process the flexible substrate material layer in the substrate layer processing state; the laser emitted by the processing module in the functional layer processing state has a wavelength of 515 nm or 343 nm, a repetition frequency of 1 MHz, a pulse width of 500 femtoseconds to 10 picoseconds, a scanning speed of 10-1000 mm / s, and a laser energy flux of 0.2-5 joules per square centimeter; the laser emitted by the processing module in the substrate layer processing state has a wavelength of 1030 nm, a repetition frequency of 10 kHz to 1 MHz, a pulse width of 100-500 femtoseconds, a scanning speed of 1-100 mm / s, and a laser energy flux of 0.64-20 joules per square centimeter.

[0007] The ultrafast laser processing system for composite flexible matrix materials according to embodiments of the present invention can process different material layers individually, and has the advantages of high processing quality, high processing precision, good flexibility, and strong applicability.

[0008] In addition, the ultrafast laser processing system for composite flexible matrix materials according to the above embodiments of the present invention may also have the following additional technical features:

[0009] According to one embodiment of the present invention, the optical field shaping phase plate is configured such that the focal depth of the laser emitted from the optical field shaping phase plate reaches 10 cm and the diameter of the light spot formed by the laser emitted from the optical field shaping phase plate is 500 micrometers to 1 millimeter.

[0010] According to one embodiment of the present invention, the sample to be processed is adapted to be mounted on the processing platform by means of a positioning element.

[0011] According to one embodiment of the present invention, the processing platform is provided with a positioning hole, and the positioning element is detachably fitted into the positioning hole.

[0012] According to one embodiment of the present invention, the positioning element is provided with an identifiable mark, and the coaxial imaging device is adapted to identify the identifiable mark.

[0013] According to one embodiment of the present invention, there are three positioning elements.

[0014] According to one embodiment of the present invention, the positioning element is a bolt.

[0015] According to one embodiment of the present invention, the functional material layer is a knitted fabric or leather material layer, and the flexible matrix material layer is a polymer material layer.

[0016] According to one embodiment of the present invention, the ultrafast laser processing system for composite flexible matrix materials further includes a reflector located between the shutter and the light field shaping phase plate.

[0017] According to an embodiment of a second aspect of the present invention, an ultrafast laser processing method for composite flexible matrix materials is provided, employing the ultrafast laser processing system for composite flexible matrix materials described in an embodiment of a first aspect of the present invention, comprising the following steps:

[0018] The sample to be processed is mounted on the processing platform, and the coaxial imaging device is used to position the sample to be processed.

[0019] The processing module processes the functional material layer in the state of the functional layer processing;

[0020] The processing module processes the flexible substrate material layer in the state of the substrate layer processing.

[0021] The ultrafast laser processing method for composite flexible matrix materials according to embodiments of the present invention, by utilizing the ultrafast laser processing system for composite flexible matrix materials described in the first aspect of the present invention, can process different material layers individually, and has the advantages of high processing quality, high processing accuracy, good flexibility, and strong applicability.

[0022] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0023] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0024] Figure 1 This is a schematic diagram of an ultrafast laser processing system for composite flexible matrix materials according to an embodiment of the present invention.

[0025] Figure 2 This is a schematic diagram of the processing procedure of an ultrafast laser processing system for composite flexible matrix materials according to an embodiment of the present invention.

[0026] Figure 3 This is a schematic diagram of the processing procedure of an ultrafast laser processing system for composite flexible matrix materials according to an embodiment of the present invention.

[0027] Figure 4 This is a schematic diagram of the processing procedure of an ultrafast laser processing system for composite flexible matrix materials according to an embodiment of the present invention.

[0028] Figure 5 This is a flowchart of an ultrafast laser processing method for composite flexible matrix materials according to an embodiment of the present invention.

[0029] Figure reference numerals: 1. Ultrafast laser processing system for composite flexible matrix materials; 2. Processing platform; 3. Ultrafast laser; 4. Quarter-wave plate; 5. Shutter; 6. Light field shaping phase plate; 7. Motorized zoom beam expander; 8. Neutral density attenuator; 9. Two-dimensional scanning galvanometer; 10. Focusing lens; 11. Laser; 2. Sample to be processed; 3. Functional material layer; 4. Flexible matrix material layer. Detailed Implementation

[0030] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0031] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, features defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0032] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0033] An ultrafast laser processing system 1 for composite flexible matrix materials according to an embodiment of the present invention is described below with reference to the accompanying drawings.

[0034] like Figures 1-5 As shown, the ultrafast laser processing system 1 for composite flexible matrix materials according to an embodiment of the present invention includes a processing platform 10 and a processing module.

[0035] The processing platform 10 is suitable for mounting the sample to be processed 2, which includes a flexible substrate material layer 4 and a functional material layer 3 located above the flexible substrate material layer 4 (the vertical direction is shown by the arrow in the figure).

[0036] The processing module includes an ultrafast laser 20, a quarter-wave plate 30, a shutter 40, a light field shaping phase plate 50, a motorized zoom beam expander 60, a neutral density attenuator 70, a two-dimensional scanning galvanometer 80, and a focusing lens 90. The laser emitted by the ultrafast laser 20 is suitable for irradiating the sample 2 to be processed on the processing platform 10 by sequentially passing through the quarter-wave plate 30, shutter 40, light field shaping phase plate 50, motorized zoom beam expander 60, neutral density attenuator 70, two-dimensional scanning galvanometer 80, and focusing lens 90. It should be understood here that "ultrafast laser 20" refers to a laser with a pulse intensity in the picosecond and femtosecond range.

[0037] The output wavelength, repetition rate, and pulse width of the ultrafast laser 20 are adjustable.

[0038] The two-dimensional scanning galvanometer 80 is equipped with a coaxial imaging device suitable for acquiring images that are coaxial with the laser emitted from the two-dimensional scanning galvanometer 80.

[0039] The light field shaping phase plate 50 is suitable for increasing the focal depth of the passing laser and reducing the spot area that the passing laser can form.

[0040] The processing module can switch between a functional layer processing state and a substrate layer processing state. The processing module is suitable for processing the functional material layer 3 in the functional layer processing state and for processing the flexible substrate material layer 4 in the substrate layer processing state.

[0041] When the processing module is in the processing state of the functional layer, the laser 110 emitted has a wavelength of 515 nanometers or 343 nanometers, a repetition frequency of 1 MHz, a pulse width of 500 femtoseconds to 10 picoseconds, a scanning speed of 10 to 1000 millimeters per second, and a laser energy flux of 0.2 to 5 joules per square centimeter.

[0042] The laser 110 emitted by the processing module during the processing of the substrate layer has a wavelength of 1030 nanometers, a repetition frequency of 10 kHz to 1 MHz, a pulse width of 100 to 500 femtoseconds, a scanning speed of 1 to 100 millimeters per second, and a laser energy flux of 0.64 to 20 joules per square centimeter.

[0043] Specifically, the linearly polarized laser emitted by the ultrafast laser 20 is converted into circularly polarized light by a quarter-wave plate 30, the focal depth is extended and the spot size is reduced by a phase plate 50, the beam is expanded by an electric zoom beam expander 60, the laser energy flux is attenuated by a neutral density attenuator 70, the exit position is adjusted by a two-dimensional scanning galvanometer 80, and finally the laser is focused by a focusing lens 90 and emitted to illuminate the sample 2 to be processed on the processing platform 10.

[0044] By adjusting the pulse wavelength, repetition rate, and pulse width of the ultrafast laser 20, the pulse wavelength, repetition rate, and pulse width of the emitted laser 110 are adjusted. The emission timing of the laser is controlled by the shutter 40, and the energy flux of the emitted laser 110 is controlled by adjusting the current of the ultrafast laser 20 and the neutral density attenuator 70. This allows the processing module to switch between the processing state of the functional layer and the processing state of the substrate layer. The laser 110 is moved and processed on the surface of the sample 2 by controlling the motorized zoom beam expander 60 and the two-dimensional scanning galvanometer 80.

[0045] The ultrafast laser processing system 1 for composite flexible matrix materials according to an embodiment of the present invention, by employing an ultrafast laser 20, has a smaller heat-affected zone and higher processing precision compared to the carbon dioxide laser processing method in related technologies. It can avoid problems such as changes in the structure and performance reduction of surrounding materials during processing, and ensure improved processing quality and processing precision when processing multilayer materials.

[0046] Furthermore, by setting a quarter-wave plate 30 and a light field shaping phase plate 50, the linearly polarized laser beam can be converted into a circularly polarized beam through the cooperation of the quarter-wave plate 30 and the light field shaping phase plate 50, thereby reducing the spot size and extending the focal depth. This alleviates the problem of mutual constraint between focal depth and spot size in related technologies, as well as the problem of processing quality being affected by laser polarization, and improves the processing quality, processing flexibility and applicability of the ultrafast laser processing system 1 used for composite flexible matrix materials.

[0047] Furthermore, by enabling the processing module to have a functional layer processing state and a substrate layer processing state, the laser 110 emitted by the processing module can have different states, so that it is suitable for processing different material layers in different states. This allows the processing module to process one of the functional material layer 3 and the flexible substrate material layer 4 separately, avoiding the problem that the upper material has good processing quality but the lower material is severely carbonized when processing multiple layers of different materials at the same time, so as to ensure processing quality.

[0048] Furthermore, by limiting the wavelength, repetition frequency, pulse width, scanning speed, and energy flux of the laser emitted by the processing module under different states, it is possible to further facilitate the individual processing of different material layers of the composite flexible matrix material, avoiding problems such as the laser being unable to remove materials or causing material carbonization, and further ensuring processing quality.

[0049] Therefore, the ultrafast laser processing system 1 for composite flexible matrix materials according to the present invention can process different material layers individually, and has the advantages of high processing quality, high processing accuracy, good flexibility and strong applicability.

[0050] The following description, with reference to the accompanying drawings, describes an ultrafast laser processing system 1 for composite flexible matrix materials according to a specific embodiment of the present invention.

[0051] In some specific embodiments of the present invention, such as Figures 1-5 As shown, the ultrafast laser processing system 1 for composite flexible matrix materials according to an embodiment of the present invention includes a processing platform 10 and a processing module.

[0052] Optionally, the light field shaping phase plate 50 is configured such that the focal depth of the laser emitted from the light field shaping phase plate 50 reaches 10 cm and the diameter of the laser spot formed by the laser emitted from the light field shaping phase plate 50 is 500 micrometers to 1 millimeter. This allows the light field shaping phase plate 50 to sufficiently extend the focal depth and reduce the laser spot size, further facilitating processing flexibility.

[0053] Specifically, the sample 2 to be processed is suitable for being mounted on the processing platform 10 by means of a positioning element. This facilitates the positioning of the sample 2 and prevents it from moving arbitrarily.

[0054] More specifically, the processing platform 10 is provided with positioning holes, and the positioning component can be detachably fitted into the positioning holes. This facilitates the installation and removal of the positioning component and the replacement of the sample 2 to be processed.

[0055] Advantageously, the positioning element is provided with an identifiable mark, and the coaxial imaging device is adapted to identify the identifiable mark. This allows the positioning element and the coaxial imaging device to be used to position the sample 2 to be processed, facilitating the determination of the laser processing location.

[0056] More advantageously, there are three positioning elements. This allows the position of the sample 2 to be processed to be determined using three positioning elements, facilitating the determination of the laser processing position.

[0057] Furthermore, the positioning element is a bolt. This facilitates the assembly and disassembly of the positioning element.

[0058] In some embodiments, the functional material layer 3 is a knitted fabric or leather material layer, and the flexible matrix material layer 4 is a polymer material layer. This allows the functional material layer 3 and the flexible matrix material layer 4 to have a large difference in spectral absorption capacity, facilitating separate processing.

[0059] Figure 1 An ultrafast laser processing system 1 for composite flexible matrix materials is shown according to some examples of the present invention. For example... Figure 1 As shown, the ultrafast laser processing system 1 for composite flexible substrate materials also includes a reflector 100, which is located between the shutter 40 and the optical field shaping phase plate 50. This improves the flexibility of the arrangement of various components in the optical path, reduces the space occupied by the ultrafast laser processing system 1 for composite flexible substrate materials, and improves space utilization.

[0060] The following describes an ultrafast laser processing method for composite flexible matrix materials according to an embodiment of the present invention. The ultrafast laser processing system 1 for composite flexible matrix materials according to the above embodiment of the present invention includes the following steps:

[0061] The sample to be processed is mounted on the processing platform, and the coaxial imaging device is used to position the sample to be processed.

[0062] The processing module processes the functional material layer in the state of the functional layer processing;

[0063] The processing module processes the flexible substrate material layer in the state of the substrate layer processing.

[0064] Specifically, the repetition frequency of the laser emitted by the processing module can be adjusted according to the laser's moving speed during processing. Since the laser's moving speed cannot be guaranteed to be completely uniform during processing—for example, at the start, stop, and bends in the processing path—the laser's moving speed will change. By adjusting the laser repetition frequency, the number of pulses deposited along the processing path is ensured to be uniform, thereby guaranteeing processing consistency.

[0065] The ultrafast laser processing method for composite flexible matrix materials according to the embodiments of the present invention, by utilizing the ultrafast laser processing system 1 for composite flexible matrix materials according to the above embodiments of the present invention, can process different material layers individually, and has the advantages of high processing quality, high processing accuracy, good flexibility, and strong applicability.

[0066] The following is for reference. Figures 1-5 The processing procedure of an ultrafast laser processing system 1 for composite flexible matrix materials according to some examples of the present invention is described.

[0067] The three-dimensional model of the sample 2 to be processed is input into the control system of the electric variable magnification beam expander 60 and the two-dimensional scanning galvanometer 80;

[0068] The sample 2 to be processed is fixed onto the processing platform 10 through the three positioning holes using the three positioning elements;

[0069] By controlling the two-dimensional scanning galvanometer 80, the laser processing point is aligned with the three positioning points of the three-dimensional model of the sample 2 to be processed, and compared with the identifiable marks on the three positioning parts seen in the coaxial imaging device. The position of the three-dimensional model is adjusted so that the three positioning points completely coincide with the identifiable marks on the three positioning parts.

[0070] First, the functional material layer 3 is cut: the processing module switches to the functional layer processing state, and the ultrafast laser pulse sequence emitted by the ultrafast laser 20 passes sequentially through a quarter-wave plate 30, a shutter 40, a reflector 100, a light field shaping phase plate 50, a motorized zoom beam expander 60, a neutral density attenuator 70, a two-dimensional scanning galvanometer 80, and a focusing lens 90 before being focused onto the surface of the functional material layer 3, such as... Figure 2As shown. The laser focus is controlled by an electrically operated variable-magnification beam expander 60 and a two-dimensional scanning galvanometer 80 to scan the area to be cut on the surface of the functional material layer 3 at a speed of 10-1000 mm / s, thus achieving the cutting of the functional material layer 3. The flexible substrate material layer 4 does not absorb the laser in this state and therefore does not undergo any processing effect. Figure 3 As shown, the ultrafast laser 20 emits laser pulses with a wavelength of 515 nm or 343 nm, a repetition frequency of 1 MHz, and a pulse width of 500 femtoseconds to 10 picoseconds. The laser emitted by the ultrafast laser 20 is linearly polarized light, which is converted into circularly polarized light by a quarter-wave plate 30. The focal spot is controlled to have a long focal depth and a small spot size by a phase plate 50. By adjusting the control current of the ultrafast laser 20 and the neutral density attenuator 70, the laser energy flux is made to be 0.2-5 joules per square centimeter. During the processing, at the start, stop, and turning points of the processing path, the repetition frequency of the laser emitted by the ultrafast laser 20 is controlled to ensure that the number of deposited pulses is the same, further ensuring the consistency of the processing.

[0071] Next, the flexible substrate material layer 4 is cut: After the functional material layer 3 is cut, the laser focus is controlled by the motorized variable magnification beam expander 60 and the two-dimensional scanning galvanometer 80 to scan the area to be cut on the surface of the flexible substrate material layer 4 at a speed of 1-100 mm / s, thereby achieving the cutting of the flexible substrate material layer 4. Figure 4 As shown; depending on the different flexible substrate material layer 4, the ultrafast laser 20 used has a pulse wavelength of 1030 nm, a repetition frequency of 10 kHz to 1 MHz, and a pulse width of 100 femtoseconds to 500 femtoseconds. By adjusting the neutral density attenuator 70, the laser energy flux is made to be 0.64-20 joules per square centimeter. During the processing, at the start, stop, and turning points of the processing path, the repetition frequency of the laser emitted by the ultrafast laser 20 is controlled to ensure that the number of deposited pulses is the same, further ensuring processing consistency.

[0072] For example, a composite structure of knitted fabric and polyvinyl chloride (PVC) material designed using ultrafast laser processing can cut only the knitted fabric without damaging the PVC substrate.

[0073] Cutting only knitted fabrics: The ultrafast laser 20 has a pulse wavelength of 515 nanometers, a repetition rate of 1 MHz, a pulse width of 1 picosecond, and a laser energy flux of 2 joules per square centimeter. The scanning speed is 100 millimeters per second.

[0074] A composite flexible matrix material consisting of elk hide and a polypropylene substrate was completely cut through using an ultrafast laser.

[0075] Cutting elk hide: The ultrafast laser 20 has a pulse wavelength of 515 nm, a repetition rate of 1 MHz, a pulse width of 500 femtoseconds, and a laser energy flux of 5 joules per square centimeter. The scanning speed is 500 millimeters per second.

[0076] Polypropylene substrate cutting: After the elk hide 13 is cut, the laser focus is controlled to scan the area to be cut on the surface of the polypropylene substrate material layer at a speed of 100 mm / s. The ultrafast laser 20 has a pulse wavelength of 1030 nm, a repetition frequency of 100 kHz, a pulse width of 100 femtoseconds, and a laser energy flux of 5 joules per square centimeter.

[0077] Other configurations and operations of the ultrafast laser processing system 1 for composite flexible matrix materials according to embodiments of the present invention are known to those skilled in the art and will not be described in detail here.

[0078] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0079] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. An ultrafast laser processing system for composite flexible matrix materials, characterized in that, include: A processing platform, the processing platform being adapted to mount a sample to be processed, the sample to be processed comprising a flexible substrate material layer and a functional material layer located above the flexible substrate material layer; The processing module includes an ultrafast laser, a quarter-wave plate, a shutter, a phase-shaping optical field plate, a motorized zoom beam expander, a neutral density attenuator, a two-dimensional scanning galvanometer, and a focusing lens. The ultrafast laser emits light that is adapted to sequentially pass through the quarter-wave plate, shutter, phase-shaping optical field plate, phase-shaping optical field plate, phase-shaping optical field expander, neutral density attenuator, two-dimensional scanning galvanometer, and focusing lens to illuminate the sample to be processed on the processing platform. The output wavelength, repetition frequency, and pulse width of the ultrafast laser are adjustable. The two-dimensional scanning galvanometer contains a coaxial imaging device adapted to acquire an image coaxial with the laser emitted from the two-dimensional scanning galvanometer. The phase-shaping optical field plate is adapted to increase the depth of focus of the passing laser and decrease the spot area formed by the passing laser. The processing module operates in a functional layer processing state and... The processing module can switch between substrate layer processing states. In the functional layer processing state, the processing module is suitable for processing the functional material layer, and in the substrate layer processing state, the processing module is suitable for processing the flexible substrate material layer. When the processing module is in the functional layer processing state, the laser emitted by the processing module has a wavelength of 515 nm or 343 nm, a repetition frequency of 1 MHz, a pulse width of 500 femtoseconds to 10 picoseconds, a scanning speed of 10 to 1000 mm / s, and a laser energy flux of 0.2 to 5 joules per square centimeter. When the processing module is in the substrate layer processing state, the laser emitted by the processing module has a wavelength of 1030 nm, a repetition frequency of 10 kHz to 1 MHz, a pulse width of 100 to 500 femtoseconds, a scanning speed of 1 to 100 mm / s, and a laser energy flux of 0.64 to 20 joules per square centimeter.

2. The ultrafast laser processing system for composite flexible matrix materials according to claim 1, characterized in that, The optical field shaping phase plate is configured such that the focal depth of the laser emitted from the optical field shaping phase plate reaches 10 cm and the diameter of the light spot formed by the laser emitted from the optical field shaping phase plate is 500 micrometers to 1 millimeter.

3. The ultrafast laser processing system for composite flexible matrix materials according to claim 1, characterized in that, The sample to be processed is adapted to be mounted on the processing platform by means of a positioning element.

4. The ultrafast laser processing system for composite flexible matrix materials according to claim 3, characterized in that, The processing platform is provided with positioning holes, and the positioning component can be detachably fitted into the positioning holes.

5. The ultrafast laser processing system for composite flexible matrix materials according to claim 3, characterized in that, The positioning element is provided with an identifiable mark, and the coaxial imaging device is adapted to identify the identifiable mark.

6. The ultrafast laser processing system for composite flexible matrix materials according to claim 3, characterized in that, There are three positioning components.

7. The ultrafast laser processing system for composite flexible matrix materials according to claim 3, characterized in that, The positioning element is a bolt.

8. The ultrafast laser processing system for composite flexible matrix materials according to claim 1, characterized in that, The functional material layer is a knitted fabric or leather material layer, and the flexible matrix material layer is a polymer material layer.

9. The ultrafast laser processing system for composite flexible matrix materials according to claim 1, characterized in that, It also includes a reflector located between the shutter and the light field shaping phase plate.

10. A method for ultrafast laser processing of composite flexible matrix materials, characterized in that, The ultrafast laser processing system for composite flexible matrix materials according to any one of claims 1-9 includes the following steps: The sample to be processed is mounted on the processing platform using a positioning component, and the coaxial imaging device is used to position the sample to be processed. The processing module processes the functional material layer in the state of the functional layer processing; The processing module processes the flexible substrate material layer in the state of the substrate layer processing.

Images