Polishing processing method and device, computer device and storage medium

Abstract

The application relates to a polishing processing method and device, computer equipment, a storage medium and a computer program product. The method comprises the following steps: acquiring position information of a workpiece surface defect point and size information of a candidate polishing head; determining an expected polishing area containing the defect point in the workpiece surface based on the size information and the position information; determining the expected polishing area; determining a first normal vector corresponding to the defect point and a second normal vector of each of a plurality of polishing points in the expected polishing area except the defect point; statistically processing the direction similarity of the first normal vector and each of the second normal vectors; and determining the equivalent curvature of the expected polishing area. By using the above method, a target polishing head suitable for the defect point can be automatically determined without manual participation, and the polishing processing work efficiency is improved.

Description

Technical Field

[0001] This application relates to the field of automatic polishing technology, and in particular to a polishing process method, apparatus, computer equipment, storage medium and computer program product. Background Technology

[0002] During the processing or use of a workpiece, defects such as scratches and pits may be formed on the workpiece surface. Therefore, it is usually necessary to grind and polish the workpiece surface to eliminate surface defects.

[0003] Traditional grinding methods rely on operators' experience to select grinding heads for workpiece surfaces, often requiring them to switch between heads to find the right one for the surface. Therefore, this traditional method results in reduced grinding efficiency. Summary of the Invention

[0004] Therefore, it is necessary to provide a grinding method, apparatus, computer equipment, computer-readable storage medium, and computer program product that can improve the efficiency of grinding processes in response to the above-mentioned technical problems.

[0005] Firstly, this application provides a polishing method. The method includes:

[0006] The process involves: acquiring the location information of defects on the workpiece surface and the size information of candidate grinding heads; determining a target grinding area containing the defects on the workpiece surface based on the size information and the location information; determining a first normal vector corresponding to the defect in the target grinding area and a second normal vector for each of the multiple grinding points in the target grinding area other than the defect; statistically analyzing the directional similarity between the first normal vector and each of the second normal vectors to determine the equivalent curvature of the target grinding area; and determining the candidate grinding head as the target grinding head for grinding the defects if the equivalent curvature matches the size information.

[0007] In one embodiment, the size information includes the size of the grinding head; determining the expected grinding area containing the defect point on the workpiece surface based on the size information and the position information includes: determining the projection area of ​​the candidate grinding head on the workpiece surface according to the size of the grinding head; the projection area contains the defect point; and superimposing a grinding offset parameter on the projection area to obtain the expected grinding area containing the defect point.

[0008] In one embodiment, both the first normal vector and the second normal vector are unit vectors; the step of statistically analyzing the directional similarity between the first normal vector and each of the second normal vectors to determine the equivalent curvature of the expected polishing region includes: for each second normal vector, performing a dot product operation between the second normal vector and the first normal vector to determine the directional similarity between the second normal vector and the first normal vector; and determining the statistical value of each directional similarity as the equivalent curvature of the expected polishing region.

[0009] In one embodiment, the method further includes: obtaining a curvature threshold configured for the size information; if the curvature threshold is greater than or equal to the equivalent curvature, determining that the equivalent curvature matches the size information; if the curvature threshold is less than the equivalent curvature, determining that the equivalent curvature does not match the size information.

[0010] In one embodiment, obtaining the size information of a candidate grinding head includes: determining a candidate grinding head from a plurality of alternative grinding heads, and obtaining the size information of the candidate grinding head; the size information includes the grinding head area; the method further includes: if the equivalent curvature does not match the size information, selecting a new candidate grinding head from the remaining plurality of alternative grinding heads; the grinding head area of ​​the new candidate grinding head is smaller than that of the candidate grinding head; returning to the step of determining the expected grinding area containing the defect point on the workpiece surface based on the size information and the position information, until the target grinding head for the defect point is determined.

[0011] In one embodiment, the method further includes: determining the desired grinding posture of the target grinding head based on the first normal vector; in the desired grinding posture, the axis of the target grinding head coincides with the first normal vector; and controlling the target grinding head to grind the desired grinding area according to the desired grinding posture.

[0012] Secondly, this application also provides a polishing processing apparatus. The apparatus includes:

[0013] The system includes an information acquisition module for acquiring the location information of defects on the workpiece surface and the size information of candidate grinding heads; a region determination module for determining a target grinding region containing the defects on the workpiece surface based on the size information and the location information; a vector determination module for determining a first normal vector corresponding to the defect in the target grinding region and a second normal vector for each of the multiple grinding points in the target grinding region other than the defect; a vector statistics module for statistically analyzing the directional similarity between the first normal vector and each of the second normal vectors to determine the equivalent curvature of the target grinding region; and a grinding head determination module for determining the candidate grinding head as the target grinding head for grinding the defects if the equivalent curvature matches the size information.

[0014] Thirdly, this application also provides a computer device. The computer device includes a memory and a processor, the memory storing a computer program, and the processor executing the computer program to perform the following steps:

[0015] The process involves: acquiring the location information of defects on the workpiece surface and the size information of candidate grinding heads; determining a target grinding area containing the defects on the workpiece surface based on the size information and the location information; determining a first normal vector corresponding to the defect in the target grinding area and a second normal vector for each of the multiple grinding points in the target grinding area other than the defect; statistically analyzing the directional similarity between the first normal vector and each of the second normal vectors to determine the equivalent curvature of the target grinding area; and determining the candidate grinding head as the target grinding head for grinding the defects if the equivalent curvature matches the size information.

[0016] Fourthly, this application also provides a computer-readable storage medium. The computer-readable storage medium stores a computer program thereon, which, when executed by a processor, performs the following steps:

[0017] The process involves: acquiring the location information of defects on the workpiece surface and the size information of candidate grinding heads; determining a target grinding area containing the defects on the workpiece surface based on the size information and the location information; determining a first normal vector corresponding to the defect in the target grinding area and a second normal vector for each of the multiple grinding points in the target grinding area other than the defect; statistically analyzing the directional similarity between the first normal vector and each of the second normal vectors to determine the equivalent curvature of the target grinding area; and determining the candidate grinding head as the target grinding head for grinding the defects if the equivalent curvature matches the size information.

[0018] Fifthly, this application also provides a computer program product. The computer program product includes a computer program that, when executed by a processor, performs the following steps:

[0019] The process involves: acquiring the location information of defects on the workpiece surface and the size information of candidate grinding heads; determining a target grinding area containing the defects on the workpiece surface based on the size information and the location information; determining a first normal vector corresponding to the defect in the target grinding area and a second normal vector for each of the multiple grinding points in the target grinding area other than the defect; statistically analyzing the directional similarity between the first normal vector and each of the second normal vectors to determine the equivalent curvature of the target grinding area; and determining the candidate grinding head as the target grinding head for grinding the defects if the equivalent curvature matches the size information.

[0020] The aforementioned grinding process method, apparatus, computer equipment, storage medium, and computer program product acquire the location information of defects on the workpiece surface and the dimensional information of candidate grinding heads. Based on the dimensional and location information, a target grinding area containing the defects is determined on the workpiece surface. The target grinding area is then determined, along with a first normal vector corresponding to the defect in the target grinding area and second normal vectors for each of the multiple grinding points (excluding the defect) within the target grinding area. The directional similarity between the first and second normal vectors is statistically analyzed to determine the equivalent curvature of the target grinding area. If the equivalent curvature matches the dimensional information, it indicates that the candidate grinding head can meet the grinding requirements of the target grinding area, and the candidate grinding head is determined as the target grinding head for grinding the defects. Using this method, the target grinding head suitable for the defects can be automatically determined without manual intervention, thus improving the efficiency of the grinding process. Attached Figure Description

[0021] Figure 1 This is an application environment diagram of the polishing process in one embodiment;

[0022] Figure 2 This is a schematic flowchart of a polishing process in one embodiment;

[0023] Figure 3 This is a schematic diagram of a system for measuring defect points in one embodiment;

[0024] Figure 4 This is a schematic diagram of the grinding process on the surface of a workpiece in one embodiment;

[0025] Figure 5 This is a flowchart illustrating the curvature algorithm used in one embodiment to automatically polish defects on a glossy surface.

[0026] Figure 6This is a structural block diagram of the polishing apparatus in one embodiment;

[0027] Figure 7 This is an internal structural diagram of a computer device in one embodiment. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0029] The inspection terminal 102 communicates with the polishing terminal 104. The data processed by the inspection terminal 102 can be obtained from the data storage system or in real time.

[0030] The detection terminal 102 acquires the location information of the defect points on the workpiece surface and the size information of the candidate grinding head. Based on the size and location information, the detection terminal 102 determines the expected grinding area containing the defect points on the workpiece surface. The detection terminal 102 determines the first normal vector corresponding to the defect point in the expected grinding area and the second normal vectors of each of the multiple grinding points in the expected grinding area other than the defect point. The detection terminal 102 performs statistical analysis on the directional similarity between the first normal vector and each of the second normal vectors to determine the equivalent curvature of the expected grinding area. If the equivalent curvature matches the size information successfully, the detection terminal 102 determines the candidate grinding head as the target grinding head for grinding the defect points. The grinding terminal 104 controls the target grinding head to grind the overdue grinding area where the defect points are located.

[0031] The detection terminal 102 can be, but is not limited to, various personal computers, laptops, smartphones, tablets, IoT devices, and portable wearable devices. IoT devices can include smart speakers, smart TVs, smart air conditioners, and smart in-vehicle devices. Portable wearable devices can include smartwatches, smart bracelets, and head-mounted devices. The polishing terminal 104 is a robot controller with computing capabilities, such as a controller for a smart robot.

[0032] In one embodiment, such as Figure 2 As shown, a polishing method is provided, which is applied to... Figure 1 Taking the detection terminal in the middle as an example, the explanation includes:

[0033] S202, obtain the location information of the defects on the workpiece surface and the size information of the candidate grinding heads.

[0034] The workpiece can be any piece that needs to be polished. The surface type of the workpiece is generally a high-gloss finish. A high-gloss finish usually refers to a workpiece surface that has been specially treated or polished, resulting in a smooth, bright, and highly reflective surface. This type of surface can usually reflect light very well, giving a mirror-like visual effect.

[0035] The defects on the workpiece surface can be points corresponding to scratches, pits, and other defects. The location information of the defects can be the spatial coordinates of the defects in a spatial coordinate system.

[0036] To remove scratches, dents, and other surface defects from the glossy surface and restore its original shine and appearance, further polishing can be performed on the glossy surface.

[0037] Before polishing the high-gloss surface, a simulation method can be used to select a suitable candidate polishing head as the target polishing head from multiple candidate polishing heads, and then polish the workpiece surface (high-gloss surface) according to the target polishing head.

[0038] A grinding head is a component used to grind various points (including defects) on the surface of a workpiece. The grinding head is generally the end component of a grinding device. After a candidate grinding head meets certain conditions, it can be used to grind defects on the workpiece surface. Specifically, the dimensional information of the candidate grinding head and the location information of the defects on the workpiece surface can be comprehensively analyzed. The comprehensive analysis result characterizes whether the candidate grinding head is suitable for grinding the defects on the workpiece surface.

[0039] Specifically, before selecting from multiple candidate grinding heads, the phase deflection number can be used to detect defects on the high-gloss surface to obtain defect information, and then a suitable candidate grinding head can be selected based on the high-gloss surface defect information.

[0040] The defect information includes the defect location and size. For example, a deflection camera and a display screen are used to detect points on a bright surface. The screen displays sine or binary fringes. When a defect appears on the surface being tested, the fringe pattern captured by the camera is deformed. The three-dimensional coordinates of the defect can be detected and obtained through algorithms such as deep learning.

[0041] Furthermore, the mapping relationship between points on the display screen and points on the camera imaging plane can be determined by the stripes, the angle bisectors of the incident and reflected rays can be solved, and the incident point can be obtained, that is, the defect point corresponds to the normal vector of the surface to be measured.

[0042] There are multiple candidate grinding heads, and the size information of each candidate grinding head is different. For example, some candidate grinding heads are round, some are elliptical, some have a larger diameter, and some have a smaller diameter.

[0043] Specifically, by simulating the dimensional information of each candidate grinding head, it can be determined whether the edge of each candidate grinding head will collide with the workpiece surface. The candidate grinding head that does not collide is selected as the target grinding head, and then the target grinding head is controlled to grind the workpiece surface.

[0044] S204, based on dimensional and positional information, determines the expected grinding area containing defect points on the workpiece surface.

[0045] For example, the size information indicates the size of the candidate grinding head.

[0046] The expected grinding area is the area on the workpiece surface that will be ground.

[0047] Specifically, a candidate grinding head image containing the size information of the candidate grinding head can be projected onto the workpiece surface to obtain the expected grinding area. The size information corresponding to the expected grinding area can match the size information of the candidate grinding head. For example, the candidate grinding head image can be orthographically projected onto the workpiece surface to obtain the expected grinding area image, and the area corresponding to the expected grinding area image is the expected grinding area.

[0048] Alternatively, the candidate grinding head image can be projected onto the workpiece surface with the defect point as the projection center to obtain the expected grinding area, and the center of the expected grinding area is the defect point.

[0049] Specifically, multiple candidate grinding areas can be determined on the workpiece surface based on dimensional information. The dimensional information of the candidate grinding areas can match the dimensional information of the grinding head. Among these multiple candidate grinding areas, the candidate grinding area containing defect points is selected as the expected grinding area.

[0050] S206, determine the first normal vector of the defect point corresponding to the expected grinding area, and the second normal vector of each of the multiple grinding points in the expected grinding area other than the defect point;

[0051] This involves obtaining a workpiece surface image beforehand, performing analytical processing on the workpiece surface image, and obtaining the normal vector of each point in the workpiece surface image.

[0052] Specifically, refer to Figure 3 The schematic diagram of the system for measuring defect points shown includes: a display screen and a camera. The camera (deflection camera) emits deflected light onto the workpiece surface, which is then reflected onto the display screen. The display screen shows sine or binary fringes. When the camera captures a distorted image of the fringes, it indicates a defect on the workpiece surface. The three-dimensional coordinates of the defect can be detected and obtained using algorithms such as deep learning.

[0053] Furthermore, the mapping relationship between points on the display screen and points on the camera imaging plane can be determined by the stripes, the angle bisectors of the incident and reflected rays can be solved, and the incident point can be obtained. That is, the defect point corresponds to the normal vector of the workpiece surface, that is, the defect point corresponds to the first normal vector of the expected grinding area.

[0054] Using the same method, the second normal vectors of multiple grinding points in the expected grinding area, excluding defect points, can be obtained.

[0055] S208, Statistical analysis is performed on the directional similarity between the first normal vector and each of the second normal vectors to determine the equivalent curvature of the expected polishing area.

[0056] For a second normal vector, the directional similarity between the first and second normal vectors characterizes the similarity between the vector directions of the first and second normal vectors.

[0057] Specifically, the directional similarity between the first and second normal vectors can be obtained based on the trigonometric function value of the angle between them. Taking the cosine of the trigonometric function value of the angle between the first and second normal vectors as an example, and for ease of calculation, both the first and second normal vectors can be considered as unit vectors.

[0058] If the cosine of the first and second normal vectors is 1, it means that the first and second normal vectors coincide in the spatial coordinate system. If the cosine of the first and second normal vectors is 0, it means that the angle between the first and second normal vectors is 90 degrees.

[0059] Similarly, trigonometric function values ​​can also be sine values. In this case, the directional similarity between the first normal vector and the second normal vector can be the function value of the sine function formed by the first normal vector and the second normal vector.

[0060] Understandably, the greater the directional similarity, the closer the first and second normal vectors are to coinciding; conversely, the smaller the directional similarity, the closer the first and second normal vectors are to being opposite. It should be noted that the workpiece surface is generally a high-gloss surface. The angle between the first and second normal vectors on the workpiece surface can be less than 90 degrees, less than 30 degrees, or even smaller. In this case, the directional similarity between the first and second normal vectors is correlated with the angle between them.

[0061] Furthermore, the directional similarity between the first normal vector and each of the second normal vectors can be statistically analyzed to obtain statistical values ​​reflecting the angles formed by the second normal vectors around the first normal vector and the first normal vector, that is, the curvature of the region around the first normal vector.

[0062] Specifically, the equivalent curvature of the expected polishing area can be obtained by solving the vector operation results between the first normal vector and each of the second normal vectors, and then averaging the vector operation results.

[0063] S210, under the condition that the equivalent curvature and dimensional information are matched, the candidate grinding head is determined as the target grinding head for grinding defects.

[0064] The equivalent curvature represents the degree of curvature of the region surrounding a defect point on the workpiece surface. A larger equivalent curvature results in a smaller equivalent radius of curvature for the region surrounding the defect point, and thus a greater degree of curvature. Conversely, a smaller equivalent curvature results in a less curvature for the region surrounding the defect point.

[0065] Among them, the size information reflects the specifications of the grinding head, and the matching between the equivalent curvature and the size information reflects whether the grinding head is suitable for the area around the defect point.

[0066] Specifically, if the equivalent curvature matches the dimensional information, it means that the grinding head is suitable for the area around the defect point; if the equivalent curvature does not match the dimensional information, it means that the grinding head is not suitable for the area around the defect point.

[0067] One reason it may not be suitable is that the grinding head is too large, and the edge of the grinding head is prone to colliding with the workpiece surface. (See figure)

[0068] If the equivalent curvature matches the dimensional information, the candidate grinding head is selected as the target grinding head for grinding defects. If the equivalent curvature does not match the dimensional information, the grinding head can be replaced.

[0069] Specifically, a grinding head can be selected from multiple candidate grinding heads, and the process returns to step S204 until the equivalent curvature corresponding to a certain grinding head is matched with the size information corresponding to a certain grinding head, and that grinding head is determined as the target grinding head for grinding defects.

[0070] It should be noted that if the equivalent curvature and size information of multiple candidate grinding heads do not match, the candidate grinding head with the smallest size will be selected as the target grinding head for grinding defects.

[0071] In the above-described grinding method, the location information of defects on the workpiece surface and the size information of candidate grinding heads are obtained. Based on the size and location information, a target grinding area containing the defects is determined on the workpiece surface. The target grinding area is then determined, along with a first normal vector corresponding to the defect in the target grinding area and second normal vectors for each of the multiple grinding points (excluding the defect) within the target grinding area. The directional similarity between the first and second normal vectors is statistically analyzed to determine the equivalent curvature of the target grinding area. If the equivalent curvature matches the size information, it indicates that the candidate grinding head can meet the grinding requirements of the target grinding area, and the candidate grinding head is then selected as the target grinding head for grinding the defects. Using this method, the target grinding head suitable for the defects can be automatically determined without manual intervention, thus improving the efficiency of the grinding process.

[0072] In one embodiment, the size information includes the size of the grinding head. Based on the size information and the position information, determining the expected grinding area containing the defect points on the workpiece surface includes: determining the projection area of ​​the candidate grinding head on the workpiece surface according to the size of the grinding head, the projection area containing the defect points; and superimposing grinding offset parameters on the projection area to obtain the expected grinding area containing the defect points.

[0073] The dimensional information includes the grinding head size. The grinding head size represents the area of ​​the grinding surface on the grinding head. The larger the area of ​​the grinding surface, the more easily the edge of the grinding surface can collide and interfere with the workpiece surface, causing damage to the workpiece surface.

[0074] Once the grinding head size is obtained, the projection area of ​​the candidate grinding head can be determined on the workpiece surface based on the size of the grinding head.

[0075] Specifically, the grinding image from the grinding head can be projected onto the surface of the workpiece, and the area containing the resulting projected image is the projection area. It should be noted that when projecting the grinding image from the grinding head onto the workpiece surface, it is necessary to ensure that the defect points are within both the projected image and the projection area.

[0076] For example, the area coordinates corresponding to the defect point can be used as the projection center to project the grinding image of the grinding head onto the workpiece surface, thus obtaining a projection area centered on the defect point.

[0077] The projection area represents the area that the grinding head may come into contact with during the grinding process. In order to avoid interference between the projection area and the edge of the grinding head, and to protect the projection area on the workpiece surface from damage, grinding offset parameters can be superimposed on the projection area to obtain the expected grinding area containing the defect points.

[0078] Among them, the grinding offset parameter can characterize the magnification factor of the projected area, and the grinding offset parameter can also characterize the area of ​​the magnified projected area. For example, taking the projected area as a circle with a diameter of φ and the grinding offset parameter as ε, which characterizes the increase in diameter, the grinding offset parameter (a ring with a thickness of ε) is superimposed on the projected area (a circle with a diameter of φ) to obtain the expected grinding area (a circle with a diameter of φ+ε) containing the defect points.

[0079] In this embodiment, by determining the accurate projection area of ​​the candidate grinding head on the workpiece surface according to the grinding head size, the projection area includes defect points. Grinding offset parameters are superimposed on the projection area to obtain the expected grinding area containing defect points. This results in the area that the grinding head may contact during the grinding process, which facilitates further calculation of the equivalent curvature of the candidate grinding head based on the expected grinding area.

[0080] In one embodiment, both the first normal vector and the second normal vector are unit vectors; the equivalent curvature of the expected polishing area is determined by statistically analyzing the directional similarity between the first normal vector and each of the second normal vectors, including: for each second normal vector, performing a dot product operation between the second normal vector and the first normal vector to determine the directional similarity between the second normal vector and the first normal vector, and determining the statistical value of each directional similarity as the equivalent curvature of the expected polishing area.

[0081] The correspondence between the first normal vector and each of the second normal vectors is one-to-many, that is, each first normal vector is multiplied by each of the second normal vectors.

[0082] Specifically, to facilitate the dot product operation, both the first normal vector and the second normal vector can be considered as unit vectors. The dot product operation is then performed on the first normal vector and the second normal vector to obtain the directional similarity between the first normal vector and the second normal vector.

[0083] Here, the dot product of the first and second normal vectors (directional similarity) represents the cosine value of the angle between the two normal vectors. Specifically, the dot product of the first and second normal vectors is expressed as: , Denotes the first normal vector. Let i represent the second normal vector, i = 2, 3, ..., k.

[0084] Specifically, the directional similarity between the second normal vector and the first normal vector is... After calculating cos(θ), the similarity in each direction is averaged. The averaging method is as follows:

[0085]

[0086] in, The value represents the equivalent curvature of the area to be polished, and k represents the number of second normal vectors, which is k-1.

[0087] The equivalent curvature of the expected grinding area characterizes the degree of curvature of the region surrounding the defect point on the workpiece surface. A larger equivalent curvature results in a smaller equivalent radius of curvature around the defect point, and thus a greater degree of curvature in the region. Conversely, a smaller equivalent curvature results in a less curvature in the region surrounding the defect point.

[0088] In this embodiment, for each second normal vector, the dot product operation is performed on the second normal vector and the first normal vector to determine the accurate directional similarity between the second normal vector and the first normal vector. Then, based on the statistical value of the accurate directional similarity, the equivalent curvature of the expected grinding area is determined, and the curvature of the area around the defect point on the workpiece surface is obtained. This facilitates subsequent matching based on the equivalent curvature and helps to improve the efficiency of the grinding process.

[0089] In one embodiment, the polishing process further includes: obtaining a curvature threshold configured for the size information; if the curvature threshold is greater than or equal to the equivalent curvature, then determining that the equivalent curvature matches the size information; if the curvature threshold is less than the equivalent curvature, then determining that the equivalent curvature does not match the size information.

[0090] The curvature threshold characterizes the critical equivalent curvature at which a candidate grinding head will likely cause damage to the workpiece surface. A larger curvature threshold indicates a lower probability of damage to the workpiece surface due to impact from the grinding head edge; conversely, a smaller curvature threshold indicates a higher probability of damage. It should be noted that the curvature threshold can be a threshold set manually according to certain rules.

[0091] If the curvature threshold is greater than or equal to the equivalent curvature, it means that the degree of curvature of the workpiece surface represented by the equivalent curvature is within a reasonable range, and it can be considered that there is no risk of collision between the workpiece surface and the edge of the grinding head. Conversely, if the curvature threshold is less than the equivalent curvature, it means that the degree of curvature of the workpiece surface represented by the equivalent curvature is not within a reasonable range, and it can be considered that there is a risk of collision between the workpiece surface and the edge of the grinding head.

[0092] Furthermore, if the equivalent curvature is determined to match the dimensional information, the candidate grinding head corresponding to the dimensional information can be identified as the target grinding head for grinding defects.

[0093] If it is determined that the equivalent curvature does not match the dimensional information, multiple alternative grinding heads can be analyzed until the dimensional information of the alternative grinding head matches the equivalent curvature of the alternative grinding head. Then, the alternative grinding head is determined as the target grinding head for grinding defects.

[0094] Based on this, if the size information of all candidate grinding heads does not match the equivalent curvature of the candidate grinding head, then the grinding head with the smallest size is selected from all grinding heads (including candidate grinding heads and multiple alternative grinding heads) and determined as the target grinding head for grinding defects.

[0095] In this embodiment, by obtaining the curvature threshold configured for the size information, if the curvature threshold is greater than or equal to the equivalent curvature, it is determined that the equivalent curvature matches the size information; if the curvature threshold is less than the equivalent curvature, it is determined that the equivalent curvature does not match the size information. This allows for the rapid screening of candidate grinding heads, providing a basis for the subsequent rapid determination of the target grinding head.

[0096] In one embodiment, obtaining the size information of a candidate grinding head includes: determining a candidate grinding head from a plurality of alternative grinding heads and obtaining the size information of the candidate grinding head, the size information including the grinding head area; the method further includes: selecting a new candidate grinding head from the remaining plurality of alternative grinding heads if the equivalent curvature does not match the size information; if the grinding head area of ​​the new candidate grinding head is smaller than that of the candidate grinding head, returning to the step of determining the expected grinding area containing the defect point on the workpiece surface based on the size information and position information, until the target grinding head for the defect point is determined.

[0097] The process involves first obtaining multiple alternative grinding heads and their respective size information, and then selecting a candidate grinding head from among these alternatives.

[0098] Specifically, the selection of candidate grinding heads from multiple alternative grinding heads can be done randomly, or by first sorting the candidate grinding heads by their respective dimensions and grinding head area, and then selecting from the descending order of the candidate grinding heads sequentially. This method prioritizes selecting candidate grinding heads with larger grinding head areas, rather than always selecting those with smaller grinding head areas, thus avoiding excessive wear on smaller grinding head areas and extending the replacement cycle of each candidate grinding head.

[0099] If the equivalent curvature does not match the size information, it means that the grinding head area of ​​the current candidate grinding head does not meet the safety requirements for grinding the workpiece surface. Generally, the grinding head area is too large. If you insist on selecting this grinding head as the target grinding head for grinding defect points, it is easy to cause the target grinding head to collide and interfere with the workpiece surface.

[0100] A reasonable approach is to select a new candidate grinding head from the remaining multiple alternative grinding heads, with the grinding head area of ​​the new candidate grinding head being smaller than that of the original candidate grinding head.

[0101] Specifically, after selecting a new candidate grinding head, the process returns to the step of determining the expected grinding area containing defect points on the workpiece surface based on the size and position information, thereby obtaining the matching status between the new equivalent curvature and the new size information. If there is no match, another new candidate grinding head is selected, and the process continues to return to the step of determining the expected grinding area containing defect points on the workpiece surface based on the size and position information, until the equivalent curvature corresponding to a certain candidate grinding head successfully matches the size information. At this point, the grinding head can be determined as the target grinding head for grinding defect points.

[0102] It should be noted that if the target grinding head is still not determined after going through multiple candidate grinding heads, then the candidate grinding head with the smallest grinding head area can be selected from among the candidate grinding heads and determined as the target grinding head for grinding the defect points.

[0103] In this embodiment, a candidate grinding head is determined from multiple alternative grinding heads, and the size information of the candidate grinding head is obtained. If the equivalent curvature does not match the size information, a new candidate grinding head is selected from the remaining multiple alternative grinding heads. The grinding head area of ​​the new candidate grinding head is smaller than that of the candidate grinding head. The process returns to the step of determining the expected grinding area containing the defect point on the workpiece surface based on the size information and position information, until the target grinding head for the defect point is determined. By traversing multiple alternative grinding heads, the target grinding head can be obtained quickly and accurately, which helps to improve the work efficiency of the entire subsequent grinding process.

[0104] In one embodiment, the grinding process further includes: determining the desired grinding posture of the target grinding head based on the first normal vector; under the desired grinding posture, the axis of the target grinding head coincides with the first normal vector, and controlling the target grinding head to grind the expected grinding area according to the desired grinding posture.

[0105] Among them, the desired grinding posture of the target grinding head refers to the posture maintained by the target grinding head during the grinding process of the desired grinding area.

[0106] Specifically, such as Figure 4 The diagram shows the position of the grinding device and the workpiece surface. The grinding device includes a target grinding head and other connecting components. The workpiece surface is concave upwards, and the defect point is on the workpiece surface. The axis of the target grinding head coincides with the first normal vector of the defect point. It can be understood that when the axis of the target grinding head coincides with the first normal vector of the defect point, the target grinding head is controlled to grind the expected grinding area according to the desired grinding posture.

[0107] There are various processes for controlling the target grinding head to perform grinding on the expected grinding area. Depending on the actual grinding needs, the target grinding head can be controlled to perform grinding actions under the target grinding process on the expected grinding area. No specific limitations are made here.

[0108] It should be noted that the edge of the target grinding head does not actually collide with the workpiece surface during the actual grinding process; this is merely an exaggerated depiction. Figure 4 It can also be explained that if the curvature around the defect point is large, the equivalent radius of curvature is small, and the equivalent curvature is large, the edge of the target grinding head is more likely to collide and interfere with the workpiece surface. Conversely, if the curvature around the defect point is small, the equivalent radius of curvature is large, and the equivalent curvature is small, the edge of the target grinding head will not collide and interfere with the workpiece surface.

[0109] In this embodiment, the desired grinding posture of the target grinding head is determined based on the first normal vector. Under the desired grinding posture, the axis of the target grinding head coincides with the first normal vector. According to the desired grinding posture, the target grinding head is controlled to grind the expected grinding area. Under the premise of ensuring that the target grinding head does not collide or interfere with the workpiece surface, the target grinding head is controlled to grind the expected grinding area according to the desired grinding posture, which improves the grinding accuracy of the workpiece surface and avoids under-grinding and mis-grinding.

[0110] In one embodiment, such as Figure 5 The curvature algorithm shown is used to assist in the automatic polishing of defects on high-gloss surfaces. The algorithm is applied to a polishing terminal for illustration. The curvature algorithm for assisting in the automatic polishing of defects on high-gloss surfaces includes:

[0111] The first part, identifying the target grinding head section, includes:

[0112] S502, obtain the location information of the defect points on the workpiece surface, determine the candidate grinding head from multiple alternative grinding heads, and obtain the size information of the candidate grinding head.

[0113] S504, according to the size of the grinding head, determine the projection area of ​​the candidate grinding head on the workpiece surface.

[0114] The projected area includes defect points. The dimensional information includes the dimensions of the grinding head.

[0115] S506, by superimposing grinding offset parameters on the projected area, the expected grinding area containing defect points is obtained.

[0116] The expected polishing area containing the defect points can be the defect neighborhood of the defect points, and each point in the defect neighborhood is a polishing point.

[0117] S508, determine the first normal vector of the defect point corresponding to the expected polishing area, and the second normal vector of each of the multiple polishing points in the expected polishing area other than the defect point.

[0118] Both the first and second normal vectors are unit vectors.

[0119] S510, for each second normal vector, perform a dot product operation on the second normal vector and the first normal vector to determine the directional similarity between the second normal vector and the first normal vector.

[0120] S512 determines the statistical values ​​of similarity in each direction as the equivalent curvature of the expected polishing area.

[0121] S514, obtain the curvature threshold configured for the size information.

[0122] S516, determine whether the curvature threshold is greater than or equal to the equivalent curvature. If yes, execute S518; otherwise, execute S520.

[0123] S518, determine the equivalent curvature and size information to match, identify the candidate grinding head as the target grinding head for grinding defects, and execute S524.

[0124] S520, it was determined that the equivalent curvature did not match the dimensional information.

[0125] S522, Select a new candidate grinding head from the remaining multiple alternative grinding heads, and return to S504.

[0126] Among them, the grinding head area of ​​the new candidate grinding head is smaller than that of the candidate grinding head.

[0127] The dimensions include the area of ​​the grinding head.

[0128] By identifying the target grinding head, it is possible to quickly and accurately determine whether a particular grinding head can be used for grinding the surface of a workpiece.

[0129] The second part, the grinding section based on the target grinding head, includes:

[0130] S524, determine the desired grinding posture of the target grinding head based on the first normal vector.

[0131] In the desired grinding posture, the axis of the target grinding head coincides with the first normal vector.

[0132] S526, according to the desired grinding posture, control the target grinding head to grind the expected grinding area.

[0133] In this embodiment, the location information of defects on the workpiece surface and the size information of candidate grinding heads are obtained. Based on the size and location information, a target grinding area containing the defects is determined on the workpiece surface. The target grinding area is then determined, along with a first normal vector corresponding to the defect and second normal vectors for each of the multiple grinding points (excluding the defect) within the target grinding area. The directional similarity between the first and second normal vectors is statistically analyzed to determine the equivalent curvature of the target grinding area. If the equivalent curvature matches the size information, it indicates that the candidate grinding head can meet the grinding requirements of the target grinding area, and the candidate grinding head is selected as the target grinding head for grinding the defects. Using this method, the target grinding head suitable for the defects can be automatically determined without manual intervention, which helps improve the efficiency of the grinding process.

[0134] It should be understood that although the steps in the flowcharts of the embodiments described above are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the embodiments described above may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the steps or stages of other steps.

[0135] Based on the same inventive concept, this application also provides a grinding apparatus for implementing the grinding method described above. The solution provided by this apparatus is similar to the solution described in the above method; therefore, the specific limitations in one or more of the grinding apparatus embodiments provided below can be found in the limitations of the grinding method described above, and will not be repeated here.

[0136] In one embodiment, such as Figure 6 As shown, a grinding processing device is provided, including: an information acquisition module 602, an area determination module 604, a vector determination module 606, a vector statistics module 608, and a grinding head determination module 610, wherein:

[0137] The information acquisition module 602 is used to acquire the location information of the defect points on the workpiece surface and the size information of the candidate grinding head;

[0138] The region determination module 604 is used to determine the expected grinding region containing defect points on the surface of the workpiece based on size information and position information.

[0139] The vector determination module 606 is used to determine the first normal vector of the defect point corresponding to the expected grinding area, and the second normal vector of each of the multiple grinding points in the expected grinding area other than the defect point.

[0140] The vector statistics module 608 is used to statistically analyze the directional similarity between the first normal vector and each of the second normal vectors to determine the equivalent curvature of the expected polishing area.

[0141] The grinding head determination module 610 is used to determine the candidate grinding head as the target grinding head for grinding defects, provided that the equivalent curvature and dimensional information are matched.

[0142] In one embodiment, the size information includes the size of the grinding head; the region determination module 604 is further configured to determine the projection area of ​​the candidate grinding head on the workpiece surface according to the size of the grinding head; the projection area contains defect points; and grinding offset parameters are superimposed on the projection area to obtain the expected grinding area containing defect points.

[0143] In one embodiment, both the first normal vector and the second normal vector are unit vectors; the vector statistics module 608 is further configured to perform a dot product operation on the second normal vector and the first normal vector for each second normal vector to determine the directional similarity between the second normal vector and the first normal vector; and to determine the statistical value of each directional similarity as the equivalent curvature of the expected polishing area.

[0144] In one embodiment, the polishing device further includes: a curvature determination module, used to obtain a curvature threshold configured for the size information; if the curvature threshold is greater than or equal to the equivalent curvature, then it is determined that the equivalent curvature matches the size information; if the curvature threshold is less than the equivalent curvature, then it is determined that the equivalent curvature does not match the size information.

[0145] In one embodiment, the information acquisition module 602 is further configured to determine a candidate grinding head from a plurality of alternative grinding heads and acquire the size information of the candidate grinding head. The grinding processing apparatus further includes: a circulation module, configured to select a new candidate grinding head from the remaining plurality of alternative grinding heads when the equivalent curvature and size information do not match; the grinding head area of ​​the new candidate grinding head is smaller than that of the candidate grinding head; and return to the step of determining the expected grinding area containing the defect point on the workpiece surface based on the size information and position information, until the target grinding head for the defect point is determined.

[0146] In one embodiment, the polishing apparatus further includes: a polishing module, configured to determine the desired polishing posture of the target polishing head based on a first normal vector; in the desired polishing posture, the axis of the target polishing head coincides with the first normal vector; and control the target polishing head to polish the desired polishing area according to the desired polishing posture.

[0147] Each module in the aforementioned polishing device can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in or independent of the processor in a computer device, or stored in the memory of a computer device as software, so that the processor can call and execute the corresponding operations of each module.

[0148] In one embodiment, a computer device is provided, which may be a server, and its internal structure diagram may be as follows: Figure 7 As shown, this computer device includes a processor, memory, input / output (I / O) interfaces, and a communication interface. The processor, memory, and I / O interfaces are connected via a system bus, and the communication interface is also connected to the system bus via the I / O interfaces. The processor provides computational and control capabilities. The memory includes non-volatile storage media and internal memory. The non-volatile storage media stores the operating system, computer programs, and a database. The internal memory provides the environment for the operation of the operating system and computer programs stored in the non-volatile storage media. The database stores location and size information. The I / O interfaces are used for exchanging information between the processor and external devices. The communication interface is used for communicating with external terminals via a network connection. When executed by the processor, the computer program implements a polishing process.

[0149] Those skilled in the art will understand that Figure 7 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the computer device to which the present application is applied. Specific computer devices may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0150] In one embodiment, a computer device is provided, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the steps of the above-described method embodiments.

[0151] In one embodiment, a computer-readable storage medium is provided having a computer program stored thereon, which, when executed by a processor, implements the steps of the above-described method embodiments.

[0152] In one embodiment, a computer program product is provided, including a computer program that, when executed by a processor, implements the steps of the above-described method embodiments.

[0153] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, stored data, displayed data, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties. Furthermore, the acquisition, storage, processing, and transmission of the data all comply with relevant laws and regulations.

[0154] Those skilled in the art will understand that all or part of the processes in the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium. When executed, the computer program can include the processes of the embodiments described above. Any references to memory, databases, or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM). The databases involved in the embodiments provided in this application may include at least one type of relational database and non-relational database. Non-relational databases may include, but are not limited to, blockchain-based distributed databases. The processors involved in the embodiments provided in this application may be general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic devices, quantum computing-based data processing logic devices, etc., and are not limited to these.

[0155] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0156] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A polishing method, characterized in that, The method includes: Obtain the location information of defects on the workpiece surface, as well as the size information of candidate grinding heads; Based on the size information and the position information, a target grinding area containing the defect point is determined on the surface of the workpiece. The first normal vector corresponding to the defect point in the expected polishing area is determined, and the second normal vectors of each of the multiple polishing points in the expected polishing area other than the defect point are determined; both the first normal vector and the second normal vector are unit vectors. For each second normal vector, perform a dot product operation between the second normal vector and the first normal vector to determine the directional similarity between the second normal vector and the first normal vector; The statistical values ​​of the similarity in each direction are determined as the equivalent curvature of the expected polishing area; Obtain the curvature threshold configured for the size information; If the curvature threshold is greater than or equal to the equivalent curvature, then the equivalent curvature is determined to match the size information; If the equivalent curvature matches the dimensional information, the candidate grinding head is determined as the target grinding head for grinding the defect point.

2. The method according to claim 1, characterized in that, The dimensional information includes the size of the grinding head; The step of determining the expected grinding area containing the defect point on the workpiece surface based on the size information and the position information includes: According to the size of the grinding head, the projection area of ​​the candidate grinding head is determined on the surface of the workpiece; the projection area includes the defect point. By superimposing the grinding offset parameters on the projected area, the expected grinding area containing the defect points is obtained.

3. The method according to claim 1, characterized in that, The method further includes: If the curvature threshold is less than the equivalent curvature, then it is determined that the equivalent curvature does not match the size information.

4. The method according to any one of claims 1 to 3, characterized in that, Obtain the dimensional information of the candidate grinding heads, including: Candidate grinding heads are selected from multiple alternative grinding heads, and the size information of the candidate grinding heads is obtained; The dimensional information includes the area of ​​the grinding head; the method further includes: If the equivalent curvature does not match the size information, a new candidate grinding head is selected from the remaining multiple alternative grinding heads; the grinding head area of ​​the new candidate grinding head is smaller than that of the original candidate grinding head. Return to the step of determining the expected grinding area containing the defect point on the workpiece surface based on the size information and the position information, until the target grinding head of the defect point is determined.

5. The method according to claim 1, characterized in that, The method further includes: The desired grinding posture of the target grinding head is determined based on the first normal vector; in the desired grinding posture, the axis of the target grinding head coincides with the first normal vector; According to the desired grinding posture, the target grinding head is controlled to grind the desired grinding area.

6. A polishing processing apparatus, characterized in that, The device includes: The information acquisition module is used to acquire the location information of defects on the workpiece surface and the size information of candidate grinding heads; The region determination module is used to determine, based on the size information and the position information, a planned grinding region containing the defect point on the surface of the workpiece; The vector determination module is used to determine the first normal vector of the defect point corresponding to the expected polishing area, and the second normal vector of each of the multiple polishing points in the expected polishing area other than the defect point; both the first normal vector and the second normal vector are unit vectors; The vector statistics module is used to perform a dot product operation on the second normal vector and the first normal vector for each second normal vector to determine the directional similarity between the second normal vector and the first normal vector; and to determine the statistical value of each directional similarity as the equivalent curvature of the expected polishing area. The curvature determination module is used to obtain a curvature threshold configured for the size information. If the curvature threshold is greater than or equal to the equivalent curvature, it is determined that the equivalent curvature matches the size information. A grinding head determination module is used to determine the candidate grinding head as the target grinding head for grinding the defect point when the equivalent curvature matches the size information.

7. The apparatus according to claim 6, characterized in that, The dimensional information includes the size of the grinding head; The region determination module is specifically used to: determine the projection area of ​​the candidate grinding head on the workpiece surface according to the grinding head size; the projection area includes the defect point; and superimpose grinding offset parameters on the projection area to obtain the expected grinding area including the defect point.

8. A computer device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that, When the processor executes the computer program, it implements the steps of the method according to any one of claims 1 to 5.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 5.

10. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 5.

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