An apparatus for fabricating ultrathin silicon carbide single crystal substrates

Abstract

This invention discloses a fabrication device for ultrathin silicon carbide single crystal substrates, belonging to the technical field of fabrication equipment. It includes a main body structure, with a cutting component fixedly connected to the top of the inner wall of the main body structure and a clamping mechanism fixedly connected to the inner surface wall of the main body structure. In use, through the interaction of the main body structure, the cutting component, and the clamping mechanism, the device utilizes diamond-coated steel wire to slice the single crystal silicon rod. During the slicing process, as the steel wire rapidly winds up, driven by two energized drive motors A, and using multiple components as transmission media, two sets of hollow columns and linkage tubes (and their fixed components) are rotated, thus completing the transmission of the steel wire's rotation. This winding and rotating state of the steel wire allows for the cutting of the single crystal silicon rod, effectively reducing scratches on the outer surface of the single crystal substrate and improving yield and product quality.

Description

Technical Field

[0001] This invention relates to the field of fabrication equipment technology, specifically to a fabrication equipment for ultrathin silicon carbide single crystal substrates. Background Technology

[0002] Ultrathin silicon carbide single crystal substrates are a type of crystalline material belonging to wide-bandgap semiconductor materials. They possess advantages such as high voltage resistance, high temperature resistance, high frequency, and low loss. They are fundamental materials for fabricating high-power power electronic devices and microwave radio frequency devices, and therefore have broad application prospects in fields such as solid-state lighting, defense, aviation, aerospace, power electronics, communications, oil exploration, optical storage, and displays. In addition, the processing of ultrathin silicon carbide single crystal substrates is also very important, mainly including slicing, thinning, and polishing. Among them, slicing, as the first step in the processing, determines the level of subsequent thinning and polishing. Therefore, controlling surface crack damage of the wafer is of great significance for promoting the development of silicon carbide device manufacturing technology.

[0003] In the prior art, such as Chinese Patent No. CN114147550A, a tool polishing and cleaning device is provided. The tool polishing and cleaning device includes a tool holder, a grinding seat, and a fan. The tool holder is located on the upper side of the grinding seat and cooperates with the grinding seat. The fan is located on one side of the grinding seat and cooperates with the grinding seat. The tool holder includes a clamping head and a rotating seat. The rotating seat is located inside the grinding seat and rotatably cooperates with the grinding seat. The clamping head is located on the upper side of the rotating seat and is fixedly connected to the rotating seat. The improved structure of the tool polishing and cleaning device, by adding a clamping head, uses the clamping head to hold the tool to be polished and cleaned, thereby effectively improving the safety of the tool polishing process and preventing injury to the user.

[0004] While the aforementioned equipment can improve safety during the polishing process of cutting tools, existing equipment slices monocrystalline silicon rods by using steel wires with diamond particles attached to their outer walls. These diamond particles rub against the outer wall of the monocrystalline silicon rod to complete the slicing process. Since the tiny diamond particles attached to the outer wall of the steel wire are irregularly shaped and unevenly distributed, they can easily cause small and long scratches on the outer wall of the monocrystalline substrate during the cutting process. If these scratches are not treated, they can easily affect the quality of the final product. Summary of the Invention

[0005] The purpose of this invention is to provide an apparatus for preparing ultrathin silicon carbide single crystal substrates, in order to solve the problem mentioned in the background that traditional processing methods easily lead to fine and long scratches on the outer wall of the single crystal substrate, which can easily affect the quality of the final product.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a fabrication apparatus for an ultrathin silicon carbide single crystal substrate, comprising a main body structure, wherein a cutting component is fixedly connected to the top of the inner wall of the main body structure, and a clamping mechanism is fixedly connected to the inner surface wall of the main body structure; The cutting assembly includes two support frames. A drive frame is fixedly connected to the top of each support frame near its left edge. Each drive frame has a pre-set drive groove I. The inner surface of each drive groove I is fitted with a bearing A. A drive rod I is fixedly inserted between the inner surface of each bearing A. A gear A is fixedly fitted onto the outer surface of each drive rod I. A drive groove II is pre-set near the bottom of each drive frame. A drive rod II is movably inserted into the inner surface of each drive groove II. A gear B is fixedly fitted onto the outer surface of each drive rod II. A drive motor A is fixedly connected to one side of the outer surface of each drive rod II. A motor frame is fixedly fitted onto the outer surface of each drive motor A. Gears C are meshed between the outer surfaces of each gear A. The outer surfaces of each gear B mesh with the inner surface of each gear C. Hollow columns are fixedly inserted into the inner surface of each gear C.

[0007] Preferably, a set of outer plates is fixedly connected to the outer walls of the two hollow columns. The interior of the two sets of outer plates is pre-set with movable grooves. Movable rods are movably inserted into the inner walls of the two sets of movable grooves. Clamping wheels are fixedly sleeved on the outer walls of the two sets of movable rods.

[0008] Preferably, one of the two sets of clamping rollers has a pressing outer disc fixedly installed on its outer wall, the other of the two sets of clamping rollers has a wire groove on its outer wall, and the outer walls of the two sets of pressing outer discs rotate inside the wire groove. The top of the two sets of movable rods is fixedly connected to a drive motor B, the outer walls of the two sets of drive motors B are fixedly fitted with a fixing frame, and the bottom of the two sets of fixing frames is fixedly connected to one side of the outer wall of the outer plate.

[0009] Preferably, a set of connecting plates is fixedly connected to the outer walls of the two hollow columns, a linkage pipe is fixedly connected between the outer walls of the two sets of connecting plates, a set of bearings B is fixedly sleeved on the outer walls of the two linkage pipes, a mounting bracket is fixedly sleeved between the outer walls of the two sets of bearings B, and the bottom of the two mounting brackets is fixedly connected to the top of the support frame.

[0010] Preferably, each of the two linkage tubes has a set of drive grooves three inside, and drive rods three are movably inserted into the inner surface of each of the two sets of drive grooves three. A wire winding wheel is fixedly sleeved on the outer surface of each of the two sets of drive rods three. A set of drive motors C is fixedly connected to the outer surface of each of the two sets of drive motors C. A motor mounting frame is fixedly sleeved on the outer surface of each of the two sets of motor mounting frames, and one side of the outer wall of each set of motor mounting frames is fixedly connected to the outer surface of the linkage tube. A limit plate is fixedly connected to the inner surface of the two linkage tubes.

[0011] Preferably, the clamping mechanism includes two fixed frames, each of the two fixed frames having a set of movable slots inside, each of the inner walls of the two sets of movable slots having a slider movably embedded therein, each of the two sets of sliders having a linkage column fixedly connected between one side of the outer wall of the two sets of sliders, each of the two linkage columns having a linkage plate fixedly connected to one side of the outer wall of the two linkage plates, and each of the two linkage plates having an electric telescopic rod fixedly connected to its top.

[0012] Preferably, a set of movable frames is fixedly connected to one side of the outer wall of each of the two linkage columns. The interior of each set of movable frames is pre-set with a sliding groove. The inner surface of each set of sliding grooves is slidably embedded with a slide bar. A telescopic plate is fixedly connected between the outer surface of each set of slide bars. A cylinder is fixedly connected to one side of the outer wall of each of the two linkage columns, and the telescopic ends of the two cylinders are fixedly connected to one side of the outer wall of the telescopic plate.

[0013] Preferably, a clamping ring is fixedly connected to one side of the outer wall of each of the two telescopic plates, and an anti-slip pad is fixedly connected to the inner surface of each of the two clamping rings.

[0014] Preferably, the main body includes a support box, the top of which is fixedly connected to an anti-slip cover, and the bottom of which is fixedly inserted with a set of anti-slip pads.

[0015] Preferably, the bottoms of both support frames are fixedly connected to the top of the support box, and the outer walls of both fixing frames are fixedly inserted into the inside of the anti-slip cover.

[0016] Compared with the prior art, the beneficial effects of the present invention are: In use, this invention utilizes diamond-coated steel wire to slice single-crystal silicon rods through the interaction of the main body, cutting components, and clamping mechanism. During the slicing process, as the steel wire is rapidly wound up, two drive motors A, with multiple components serving as transmission media, can drive two sets of hollow columns and linkage tubes (and their fixed components) to rotate, thereby completing the transmission of the steel wire's rotation. The steel wire, in a winding and rotating state, completes the cutting of the single-crystal silicon rod, effectively reducing scratches on the outer wall of the single-crystal substrate and improving yield and product quality.

[0017] In use, through the interaction of the main body, cutting components, and clamping mechanism, this device can limit the movement of the steel wire during rapid wire take-up and take-down using two sets of clamping wheels, reducing the shaking of the steel wire during movement and improving the accuracy of subsequent cutting.

[0018] In use, the present invention achieves the rotation of the steel wire through the interaction of the main body, the cutting component, and the clamping mechanism. This is accomplished by the mutual transmission between multiple sets of gears. The gears are arranged in a triangular support configuration, and both gears A and B are equipped with limiting baffles to effectively limit gear C, thereby preventing slippage and improving the stability of the equipment during transmission. Attached Figure Description

[0019] Figure 1 This is a three-dimensional view of the main structure in the fabrication equipment for an ultrathin silicon carbide single crystal substrate according to the present invention; Figure 2 This is a three-dimensional view of the main structure in the fabrication equipment for an ultrathin silicon carbide single crystal substrate according to the present invention; Figure 3 This is a side view of the cutting component in the fabrication equipment for an ultrathin silicon carbide single crystal substrate according to the present invention. Figure 4 This is a perspective view of the cutting component in the fabrication equipment for an ultrathin silicon carbide single crystal substrate according to the present invention. Figure 5 This is a three-dimensional sectional view of the cutting component in the fabrication equipment for an ultrathin silicon carbide single crystal substrate according to the present invention. Figure 6 This is a three-dimensional sectional view of the left side of the cutting component in the fabrication equipment for an ultrathin silicon carbide single crystal substrate according to the present invention. Figure 7 This is a three-dimensional sectional view of the rear part of the cutting component in the fabrication equipment for an ultrathin silicon carbide single crystal substrate according to the present invention. Figure 8 This is a perspective view of the clamping mechanism in the fabrication equipment for an ultrathin silicon carbide single crystal substrate according to the present invention.

[0020] In the diagram: 1. Main structure; 101. Support box; 102. Anti-slip cover; 103. Anti-slip mat; 2. Cutting assembly; 201. Support frame; 202. Drive frame; 203. Drive slot one; 204. Drive rod one; 205. Gear A; 206. Drive slot two; 207. Drive rod two; 208. Gear B; 209. Drive motor A; 210. Motor frame; 211. Gear C; 212. Hollow column; 213. Outer plate; 214. Movable slot; 215. Movable rod; 216. Clamping wheel; 217. Extrusion outer disc; 218. Wire groove; 219. Drive motor B; 220. Fixed Frame; 221. Connecting plate; 222. Linkage pipe; 223. Bearing B; 224. Mounting frame; 225. Drive slot three; 226. Drive rod three; 227. Wire winding wheel; 228. Drive motor C; 229. Motor mounting frame; 230. Limiting plate; 231. Bearing A; 3. Clamping mechanism; 301. Fixed frame; 302. Moving slot; 303. Slider; 304. Linkage column; 305. Linkage plate; 306. Electric telescopic rod; 307. Moving frame; 308. Sliding slot; 309. Sliding bar; 310. Telescopic plate; 311. Cylinder; 312. Clamping ring; 313. Anti-slip pad. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] Please see Figures 1-8 As shown, the present invention provides a fabrication apparatus for an ultrathin silicon carbide single crystal substrate, including a main body 1, a cutting component 2 fixedly connected to the top of the inner wall of the main body 1, and a clamping mechanism 3 fixedly connected to the inner surface wall of the main body 1. The cutting assembly 2 includes two support frames 201. A drive frame 202 is fixedly connected to the top of each support frame 201 near its left edge. Each drive frame 202 has a set of drive grooves 203 pre-set inside. Bearings A231 are mounted on the inner walls of both drive grooves 203. Drive rods 204 are fixedly inserted between the inner walls of the two sets of bearings A231. Gears A205 are fixedly fitted onto the outer walls of both sets of drive rods 204. A second drive groove 206 is pre-set inside each drive frame 202 near its bottom. Drive rods are movably inserted into the inner walls of both drive grooves 206. Two drive rods 207 are each fitted with gears B208 on their outer walls. A drive motor A209 is fixedly connected to one side of the outer wall of each drive rod 207. A motor frame 210 is fixedly fitted to the outer wall of each drive motor A209. Gears C211 mesh between the outer surfaces of two sets of gears A205. The outer walls of both gears B208 mesh with the inner walls of gears C211. Hollow columns 212 are fixedly inserted into the inner walls of both gears C211. Two sets of bearings A231 are movably inserted into the drive groove 203. The two sets of bearings A231 and the drive frame 202 are kept in a fixed state, while the two gears A205 can clamp gear C211 in the middle, thus maintaining the meshing connection between the three. Subsequently, the drive rod 207 at its bottom is fixedly inserted into the drive groove 206, and the gear B208, which is fixed to the drive rod 207, can be installed inside the drive frame 202 and keep rotating. Gear B208 can also be meshed with gear C211, so that the two gears A205 and one gear B208 can form a triangular support meshing point for gear C211. In this design, both gears A205 and B208 are equipped with limit baffles to effectively prevent slippage. The output end of the drive motor A209 is fixedly connected to one side of the outer wall of the drive rod 207. When the drive motor A209 is energized, its output end can drive the drive rod 207 and the fixed gear B208 to rotate. During the rotation, this power can be transmitted to the gear C211, thereby driving the gear C211 and the fixed object to rotate. This rotation meets the subsequent usage requirements.

[0023] according to Figures 4-7As shown: A set of external plates 213 are fixedly connected to the outer walls of the two hollow columns 212. The interior of each set of external plates 213 has a pre-set movable groove 214. Movable rods 215 are movably inserted into the inner walls of each set of movable grooves 214. Clamping wheels 216 are fixedly sleeved on the outer walls of each set of movable rods 215. First, the outer walls of the hollow columns 212 are fixedly connected to the two sets of external plates 213, with one set of external plates 213 being fixed laterally and the other being fixed longitudinally. The movable grooves 214 are pre-set inside the two sets of external plates 213, which can keep the movable rods 215 rotating inside them. The movable rods 215 are fixedly connected to the clamping wheels 216 and can drive the two sets of clamping wheels 216 to rotate in opposite directions inside them.

[0024] according to Figure 6 As shown: One of the two sets of clamping rollers 216 has a pressing outer disc 217 fixedly mounted on its outer wall. The outer wall of the other set of clamping rollers 216 has a groove 218. The outer walls of both pressing outer discs 217 rotate inside the groove 218. The tops of both sets of movable rods 215 are fixedly connected to drive motors B219. The outer walls of both sets of drive motors B219 are fixedly fitted with fixing frames 220. The bottoms of both sets of fixing frames 220 are fixedly connected to one side of the outer wall of the outer plate 213. The moving gear C211 can drive the hollow column 212 to rotate. During the rotation of the hollow column 212, a drive motor B219 is fixedly connected to the top of each movable rod 215. The drive motor B219 can be fixed to the top of the outer plate 213 by the fixing bracket 220. When the drive motor B219 is energized, it can maintain the two sets of clamping wire wheels 216 to rotate outward, thereby conveying the steel wire clamped between the two sets of wire grooves 218 and the extrusion outer plate 217 forward.

[0025] according to Figure 7 As shown: A set of connecting plates 221 are fixedly connected to the outer walls of the two hollow columns 212. A linkage pipe 222 is fixedly connected between the outer walls of the two sets of connecting plates 221. A set of bearings B223 is fixedly sleeved on the outer walls of the two sets of bearings B223. A mounting bracket 224 is fixedly sleeved between the outer walls of the two sets of bearings B223. The bottom of the two mounting brackets 224 is fixedly connected to the top of the support frame 201. Under the action of the two sets of connecting plates 221, the hollow columns 212 and the linkage pipes 222 (and the components fixed to the linkage pipes 222) can be kept to rotate in the same frequency and direction. With the cooperation of the set of bearings B223, a support point is provided for this rotation.

[0026] according to Figure 7As shown: Each of the two linkage pipes 222 has a pre-set set of drive grooves 225 inside. Drive rods 226 are movably inserted into the inner walls of both drive grooves 225. Wire winding wheels 227 are fixedly fitted onto the outer walls of both drive rods 226. A drive motor C228 is fixedly connected to the outer walls of both drive rods 226. Motor mounting frames 229 are fixedly fitted onto the outer walls of both motors C228. One side of the outer wall of each motor mounting frame 229 is fixedly connected to the outer wall of the linkage pipe 222. The inner walls of the two linkage pipes 222 are fixedly connected to each other. Under the action of external force, the position plate 230 can keep the linkage tube 222 rotating inside the two bearings B223. When the linkage tube 222 rotates, under the drive of the two drive motors C228, the drive rod 226 can rotate inside the drive groove 225, thereby driving the wire winding wheel 227 fixed to the outer wall of the drive rod 226 to rotate. When the wire winding wheel 227 rotates, it can complete the winding or unwinding of the external wire. During the winding and unwinding of the wire, it can better complete the cutting and slicing of the single crystal silicon rod.

[0027] according to Figure 8 As shown: The clamping mechanism 3 includes two fixed frames 301. Each fixed frame 301 has a set of movable grooves 302 pre-set inside. The inner surface of each set of movable grooves 302 is movably embedded with a slider 303. A linkage column 304 is fixedly connected between the outer walls of the two sets of sliders 303. A linkage plate 305 is fixedly connected to the outer wall of each of the two linkage columns 304. An electric telescopic rod 306 is fixedly connected to the top of each of the two linkage plates 305. First, under the action of the two electric telescopic rods 306, the telescopic property of the electric telescopic rods 306 can push the linkage plate 305 fixed to its telescopic end to move up and down. The outer wall of the linkage plate 305 is fixedly connected to the linkage column 304. With the slider 303 slidingly embedded in the movable groove 302, the telescopic movement of the electric telescopic rod 306 drives the components fixed to the two linkage columns 304 to move up and down.

[0028] according to Figure 8As shown: A set of movable frames 307 is fixedly connected to one side of the outer wall of each of the two linkage columns 304. The interior of each set of movable frames 307 is pre-set with a sliding groove 308. The inner surface of each set of sliding grooves 308 is slidably embedded with a slide bar 309. A telescopic plate 310 is fixedly connected between the outer surface of each set of slide bars 309. A cylinder 311 is fixedly connected to one side of the outer wall of each of the two linkage columns 304. The telescopic ends of the two cylinders 311 are fixedly connected to one side of the outer wall of the telescopic plate 310. First, with the slide bar 309 slidingly embedded in the sliding groove 308, the telescopic plate 310 can be driven to move embedded in the movable frame 307. This movement is achieved by the cooperation of the two cylinders 311. When the two cylinders 311 are in operation, they generate a push-pull movement state (when one cylinder 311 is pushing, the other is pulling).

[0029] according to Figure 8 As shown: Clamping rings 312 are fixedly connected to one side of the outer wall of the two telescopic plates 310. Anti-slip pads 313 are fixedly connected to the inner surface of the two clamping rings 312. After the two clamping rings 312 come into contact with the outer surface of the monocrystalline silicon rod, the pressure sensors set on the inner surface of the two clamping rings 312 can detect the data of this compression. When a certain value is reached, the stable state is maintained. Then, under the pushing and pulling movement of the two cylinders 311, the monocrystalline silicon rod can be driven to move laterally inside the equipment. After contacting the steel wire during the slow movement, the slicing process of the monocrystalline silicon rod is completed.

[0030] according to Figure 2 As shown: The main body 1 includes a support box 101. An anti-slip cover 102 is fixedly connected to the top of the support box 101. A set of anti-slip pads 103 are fixedly inserted into the bottom of the support box 101. The set of anti-slip pads 103 at the bottom is in contact with the ground. Under this contact, the friction between the anti-slip pads 103 and the ground can be increased, thereby maintaining the stability of the equipment in operation.

[0031] according to Figures 2-8 As shown: the bottom of both support frames 201 are fixedly connected to the top of the support box 101, and the outer walls of both fixed frames 301 are fixedly inserted into the inside of the anti-slip cover 102. With the interconnection of the above components, the connection between the main body mechanism 1, the cutting component 2 and the clamping mechanism 3 can be effectively realized, so as to better complete the slicing of single crystal silicon rods.

[0032] The working principle of the entire mechanism is as follows: Firstly, during use, steel wires (with diamond particles attached to their outer surface) are wound between the outer surfaces of two wire winding wheels 227. The wires are clamped inside the two sets of clamping wheels 216, keeping them confined within the extrusion outer disc 217 and the wire groove 218. At this time, the wires can also pass through the central channels of the two limiting discs 230. In operation, the two cylinders 311 move towards each other, using their front clamping rings 312 to clamp the monocrystalline silicon rod. The internal anti-slip pads 313 contact the outer surface of the monocrystalline silicon rod, increasing friction and maintaining the clamping state. For stability, pressure sensors installed on the inner walls of the two clamping rings 312 can detect the data of this compression and maintain a stable state when a certain value is reached. Subsequently, under the pushing and pulling movement of the two cylinders 311, the monocrystalline silicon rod can be driven to move slowly back and forth laterally inside the equipment. At the bottom, a motor controller controls the two sets of drive motors A209, B219, and C228. When the two wire winding wheels 227 are driven by the two sets of drive motors C228, they maintain rotation in the same direction, thereby completing the winding and unwinding of the wire and maintaining the rapid longitudinal movement of the wire. During the movement of the wire, the two drive motors... When motor A209 is energized and maintains rotation in the same direction, it can drive the drive rod 207 and the gear B208 fixed to the outer wall to rotate. During the rotation, gear B208 can mesh with gear C211. During this transmission, two gears A205 can support and mesh with gear B208 on both sides, providing good stability for the rotation of gear C211 and its fixed components. With the connection of two sets of connecting plates 221, the two hollow columns 212 (and their fixed components) and the two linkage tubes 222 (and their fixed components) rotate at the same frequency. During the rotation of the hollow column 212, each Each movable rod 215 has a drive motor B219 fixedly connected to its top. The drive motor B219 can be fixed to the top of the outer plate 213 by the fixing bracket 220. When the drive motor B219 is powered on, it can keep the two sets of clamping wire wheels 216 rotating outwards, thereby conveying the steel wire clamped between the two sets of wire grooves 218 and the extrusion outer plate 217 forward (it can also limit the movement of the steel wire to prevent the steel wire from shaking). The rotation of the two sets of drive motors B219 is kept at the same frequency as the rotation of drive motor C228. This method can maintain its own rotation while the steel wire moves forward quickly, improving the integrity of the cutting.

[0033] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An apparatus for preparing an ultrathin silicon carbide single crystal substrate, characterized in that: It includes a main body (1), a cutting component (2) is fixedly connected to the top of the inner wall of the main body (1), and a clamping mechanism (3) is fixedly connected to the inner surface wall of the main body (1). The cutting assembly (2) includes two support frames (201). A drive frame (202) is fixedly connected to the top of each support frame (201) near its left edge. Each drive frame (202) has a pre-set drive groove (203). The inner walls of both drive grooves (203) are fitted with bearings A (231). Drive rods (204) are fixedly inserted between the inner walls of the two bearings A (231). Gears A (205) are fixedly fitted onto the outer walls of both drive rods (204). A second drive groove (206) is pre-set near the bottom of each drive frame (202). The inner walls of both drive grooves (206) are movably inserted... A drive rod two (207) is provided, and gears B (208) are fixedly sleeved on the outer walls of both drive rod two (207). A drive motor A (209) is fixedly connected to one side of the outer wall of both drive rod two (207). A motor frame (210) is fixedly sleeved on the outer wall of both drive motors A (209). Gears C (211) are meshed between the outer surfaces of two sets of gears A (205), and the outer walls of both gears B (208) are meshed with the inner walls of gears C (211). Hollow columns (212) are fixedly inserted into the inner walls of both gears C (211). A set of outer plates (213) is fixedly connected to the outer walls of both hollow columns (212). The outer plates (213) of each set are pre-set with movable slots (214). Movable rods (215) are movably inserted into the inner walls of the two sets of movable slots (214). The outer walls of the two sets of movable rods (215) are fixedly fitted with clamping wheels (216). One of the clamping wheels (216) has a pressing outer disc (217) fixedly installed on its outer wall. The outer wall of the other clamping wheel (216) has a wire groove (218). The outer walls of the two pressing outer discs (217) rotate inside the wire groove (218). The tops of the two sets of movable rods (215) are fixedly connected to drive motors B (219). The outer walls of the two sets of drive motors B (219) are fixedly connected to the tops of the two sets of movable rods (215). A fixed frame (220) is fixedly fitted, and the bottom of both sets of fixed frames (220) is fixedly connected to one side of the outer wall of the outer plate (213). A set of connecting plates (221) is fixedly connected to the outer walls of the two hollow columns (212). A linkage pipe (222) is fixedly connected between the outer walls of the two sets of connecting plates (221). A set of bearings B (223) is fixedly fitted on the outer walls of the two sets of bearings B (223). A mounting frame (224) is fixedly fitted between the outer walls of the two sets of bearings B (223). The bottom of the two mounting frames (224) is fixedly connected to the top of the support frame (201). A set of drive grooves (225) is preset inside the two linkage pipes (222).Both sets of drive grooves 3 (225) have drive rods 3 (226) movably inserted into their inner walls. Both sets of drive rods 3 (226) have wire winding wheels 227 fixedly fitted onto their outer walls. Both sets of drive rods 3 (226) have a set of drive motors C (228) fixedly connected to their outer walls. Both sets of drive motors C (228) have motor mounting frames 229 fixedly fitted onto their outer walls. One side of the outer wall of each set of motor mounting frames 229 is fixedly connected to the outer wall of a linkage pipe (222). The inner walls of both linkage pipes (222) are fixedly connected to limit plates 230.

2. The fabrication equipment for an ultrathin silicon carbide single crystal substrate according to claim 1, characterized in that: The clamping mechanism (3) includes two fixed frames (301). Each of the two fixed frames (301) has a set of movable slots (302) inside. The inner surface of each of the two sets of movable slots (302) is movably fitted with sliders (303). A linkage column (304) is fixedly connected between the outer walls of the two sets of sliders (303). A linkage plate (305) is fixedly connected to the outer wall of each of the two linkage columns (304). An electric telescopic rod (306) is fixedly connected to the top of each of the two linkage plates (305).

3. The fabrication equipment for an ultrathin silicon carbide single crystal substrate according to claim 2, characterized in that: A set of movable frames (307) is fixedly connected to one side of the outer wall of each of the two linkage columns (304). The interior of each set of movable frames (307) is pre-set with a sliding groove (308). The inner surface of each set of sliding grooves (308) is slidably embedded with a slide bar (309). A telescopic plate (310) is fixedly connected between the outer surface of each set of slide bars (309). A cylinder (311) is fixedly connected to one side of the outer wall of each of the two linkage columns (304), and the telescopic ends of the two cylinders (311) are fixedly connected to one side of the outer wall of the telescopic plate (310).

4. The fabrication equipment for an ultrathin silicon carbide single crystal substrate according to claim 3, characterized in that: Each of the two telescopic plates (310) has a clamping ring (312) fixedly connected to one side of its outer wall, and each of the two clamping rings (312) has an anti-slip pad (313) fixedly connected to its inner surface.

5. The fabrication equipment for an ultrathin silicon carbide single crystal substrate according to claim 4, characterized in that: The main body (1) includes a support box (101), the top of which is fixedly connected to an anti-slip cover (102), and the bottom of which is fixedly inserted with a set of anti-slip pads (103).

6. The fabrication equipment for an ultrathin silicon carbide single crystal substrate according to claim 5, characterized in that: The bottom of both support frames (201) is fixedly connected to the top of the support box (101), and the outer walls of both fixing frames (301) are fixedly inserted into the inside of the anti-slip cover (102).

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