双面研磨装置
By inserting a resin hollow plug into the through hole of the upper platform of the double-sided grinding device and setting a window material, high-precision wafer thickness measurement was achieved, solving the problems of easy damage and contamination of the window material and improving production efficiency.
CN118338987BActive Publication Date: 2026-07-17SHIN ETSU HANDOTAI CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SHIN ETSU HANDOTAI CO LTD
- Filing Date
- 2022-12-02
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
In existing double-sided grinding equipment, window materials are easily damaged and contaminated, resulting in insufficient thickness measurement accuracy. Furthermore, cleaning consumes manpower and time, affecting production efficiency.
Method used
A resin hollow plug is inserted into the through hole of the upper platform, and a window material is set on its upper surface. The wafer thickness is measured in real time using optical methods to avoid contact between the window material and the paste. The hollow plug is easy to disassemble and clean.
Benefits of technology
It improves the accuracy of thickness measurement, eliminates concerns about metal impurities, scratches and particles, and reduces production losses.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN118338987B_ABST
Abstract
本发明是一种双面研磨装置，其是具有上平台及下平台的晶圆的双面研磨装置，其特征在于，在所述上平台中，在旋转中心与周缘之间设置有多个平台贯通孔，且在所述上平台的与所述下平台对置的研磨面上设置有研磨布，在所述研磨布中，在与所述多个平台贯通孔对应的位置设置有孔，该孔具有所述平台贯通孔的直径以上的大小的直径，在所述上平台的所述贯通孔的每一个中插入有树脂制的中空塞，该中空塞的上表面设置有窗材并且在所述研磨面侧即下表面没有窗材，且该中空塞具有塞贯通孔，在所述上平台的上部还具备晶圆厚度测量机构，该晶圆厚度测量机构能够通过所述塞贯通孔而在研磨中以光学方式实时测量所述晶圆的厚度。由此，能够提供一种双面研磨装置，其能够表现出优异的厚度测量精度，且消除金属杂质、伤痕及颗粒的担忧。
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