A kind of semiconductor laser beam shaping debugging device based on optical fiber compression
Patent Information
- Application Number
- CN202410560616.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-08
- Publication Date
- 2026-10-30
- Estimated Expiration
- 2044-05-08
AI Technical Summary
然而现有的光束整形装置需要利用多根光纤,物料成本较高
[0014]本发明技术方案通过简单的结构设计实现了一根光纤多段利用,大大降低了物料成本;本发明技术方案通过设置固定块和压片实现对半导体激光器的限位和固定,可确保每次安装半导体激光器后,光束位置基本一致;本发明的技术方案通过转接夹与连接杆的活动连接,增大了垂直方向上光纤的调节距离,同时配合光纤叉固定夹和光纤叉在水平方向的滑动连接,增大了水平方向上光纤的调节距离。
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Figure CN118352879B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of laser manufacturing technology, and more specifically to a semiconductor laser beam shaping and adjustment device based on fiber compression. Background Technology
[0002] Blue semiconductor lasers are highly stable and have high electro-optical efficiency, and are widely used in laser processing (such as copper and gold), medical applications, underwater communication, laser pumping, and other fields.
[0003] Blue semiconductor lasers output wavelengths in the 400nm–500nm range. There are three methods to obtain blue semiconductor lasers: one is a laser diode (LD) that directly emits blue light; another is a blue light source obtained by frequency doubling of an LD; and the third is a blue laser obtained by LD-pumping through nonlinear optical methods. Blue semiconductor lasers generally use GaN-based semiconductor materials to directly obtain blue laser light. Recent developments in blue semiconductor lasers have enabled the optical output power per emitter to reach up to 5.5W. By combining spatial beam combining, polarization beam combining, fiber beam combining, and fiber bundling, high-power blue semiconductor lasers can be obtained by increasing the output power.
[0004] As the power of blue semiconductor lasers increases, their output beam quality and spot parameters directly determine their application process and effect. Therefore, beam shaping of blue semiconductor lasers is crucial. However, existing beam shaping devices require the use of multiple optical fibers, resulting in high material costs. Summary of the Invention
[0005] Therefore, the technical problem to be solved by the present invention is to overcome the defects in the prior art, thereby providing a semiconductor laser beam shaping and adjustment device based on fiber compression.
[0006] A semiconductor laser beam shaping and adjustment device based on fiber compression includes: a semiconductor laser fixing assembly and an fiber fixing and adjustment assembly. The semiconductor laser mounting assembly includes a semiconductor laser, a mounting base, and a power supply connector; The mounting base has a through hole in the horizontal direction. The power supply connector extends into the interior of the mounting base from one end of the through hole. The other end of the through hole is provided with a laser mounting groove. The semiconductor laser is connected to the laser mounting groove, and the electrode pins of the semiconductor laser are connected to the power supply connector. The fiber optic fixing and debugging assembly includes an adapter clip, a connecting rod, a fiber optic fixing clip, a locking device, and a fiber optic fork. The adapter clip and the connecting rod are movably connected and fixed by a fixing component. The end of the connecting rod away from the adapter clip is fixedly connected to the optical fiber fixing clip. The optical fiber fixing clip is slidably connected to the optical fiber fork and locked by a locking device. Multiple optical fiber fixing teeth are evenly distributed below the optical fiber fork.
[0007] Furthermore, the fiber optic fork is provided with a sliding groove in the lateral direction, and a waist-shaped hole is provided at the corresponding position of the sliding groove. The fiber optic fixing clamp is provided with a guide boss that cooperates with the sliding groove, and a threaded hole is provided on the guide boss. The locking device passes through the waist-shaped hole and is threadedly connected to the threaded hole on the guide boss to fix and lock the fiber optic fork.
[0008] Furthermore, the device also includes a fixing block; The semiconductor laser is provided with a limiting protrusion, and the fixing block is provided with a limiting groove that matches the limiting protrusion. The fixing block is installed in the fixing block mounting groove below the fixed through hole.
[0009] Furthermore, the device also includes pressure; The through hole of the fixing base is provided with a pressure plate placement groove above the corresponding position of the power supply connector, and the pressure plate is placed in the pressure plate placement groove to press the power supply connector.
[0010] Furthermore, a limiting boss is provided in the laser mounting groove, and the limiting boss is connected to the edge of the semiconductor laser.
[0011] Furthermore, the adapter clip is provided with a movable opening, which is movably connected to the connecting rod and fixed by a fixing component.
[0012] Furthermore, the end of the connecting rod away from the adapter clip is provided with a fixing protrusion, and the end of the fiber optic fixing clip connected to the connecting rod is provided with a fixing groove.
[0013] Furthermore, the fixing protrusion is provided with an external thread, the fixing groove is provided with an internal thread, and the connecting rod is threadedly connected to the optical fiber fixing clamp.
[0014] The technical solution of this invention achieves multi-segment utilization of a single optical fiber through a simple structural design, greatly reducing material costs. The technical solution of this invention uses a fixing block and pressure plate to limit and fix the semiconductor laser, ensuring that the beam position is basically consistent after each installation of the semiconductor laser. The technical solution of this invention increases the vertical adjustment distance of the optical fiber through the movable connection of the adapter clip and the connecting rod, while simultaneously increasing the horizontal adjustment distance of the optical fiber through the sliding connection of the fiber fork fixing clip and the fiber fork. Attached Figure Description
[0015] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0016] Figure 1 This is a schematic diagram of the device of the present invention; Figure 2 for Figure 1 Exploded view; Explanation of reference numerals in the attached figures: 1-Adapter clip; 2-Fixing assembly; 3-Connecting rod; 4-Fiber optic clamp; 5-Locking device; 6-Fiber optic fork; 7-Semiconductor laser; 8-First screw; 9-Fixing block; 10-Tablet press; 11-Fixing base; 12-Power supply connector; 13 - Second screw; 14 - Third screw; 15 - Optical fiber. Detailed Implementation
[0017] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0018] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0019] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.
[0020] Furthermore, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.
[0021] Please see Figure 1 and Figure 2A semiconductor laser beam shaping and adjustment device based on fiber compression includes: a semiconductor laser fixing component and an fiber fixing and adjustment component; The semiconductor laser fixing assembly is used to fix the decapped TO packaged blue semiconductor laser, and specifically includes semiconductor laser 7, fixing base 11 and power supply connector 12. The mounting base 11 has a through hole arranged horizontally. The power supply connector 12 extends into the interior of the mounting base 11 from one end of the through hole. The other end of the through hole is provided with a laser mounting groove. The semiconductor laser 7 is connected to the laser mounting groove, and the electrode pins of the semiconductor laser 7 are connected to the power supply connector 12. The positive and negative terminals of the power supply connector 12 plug correspond to the positive and negative terminals of the semiconductor laser 7. After the switch is closed, the semiconductor laser 7 can emit light and work. The fiber fixing and debugging assembly is used to bond the coated fiber 15 and can adjust the position of the fiber 15 to compress the spot of the fast axis beam of the semiconductor laser. Specifically, it includes an adapter clip 1, a connecting rod 3, a fiber fixing clip 4, a locking device 5, and a fiber fork 6. The adapter clip 1 and the connecting rod 3 are movably connected and fixed by the fixing component 2. The end of the connecting rod 3 away from the adapter clip 1 is fixedly connected to the optical fiber fixing clip 4. The optical fiber fixing clip 4 is slidably connected to the optical fiber fork 6 and locked by the locking device 5. Multiple optical fiber fixing teeth are evenly distributed below the optical fiber fork 6. The multiple optical fiber fixing teeth fix the optical fiber 15. In order to reduce material loss, the distance between two adjacent optical fiber fixing teeth below the optical fiber fork 6 is shortened as much as possible.
[0022] Fiber 15 can be selected with a core diameter of 105μm, a cladding diameter of 125μm, or other specifications, depending on the parameters of the semiconductor laser 7 and the desired beam divergence angle. To achieve high transmittance, fiber 15 requires an antireflection coating with a center wavelength consistent with that of the semiconductor laser 7. During coating, multiple fibers are loaded into a fixture and coated on both sides. In application, fiber 15 is bonded to the fiber fixing teeth of the fiber fork 6. After the position of fiber 15 is determined, both sides are fixed with UV adhesive. After UV curing, fiber 15 is cut with a fiber cleaver.
[0023] The semiconductor laser fixing assembly is mounted on an optical platform or other stable location, which facilitates installation and adjustment; the fiber fixing and debugging assembly is installed on a precision six-dimensional adjustment frame to achieve precise adjustment of the fiber 15 position; the 7-axis compressed beam pattern of the semiconductor laser can be observed with the help of a distant wall or optical camera, and the beam divergence angle after beam compression can be calculated.
[0024] The fiber optic fork 6 is provided with a sliding groove in the horizontal direction, and a waist-shaped hole is provided at the corresponding position of the sliding groove. The fiber optic fixing clamp 4 is provided with a guide boss that cooperates with the sliding groove, and a threaded hole is provided on the guide boss. The locking device 5 passes through the waist-shaped hole and is threadedly connected to the threaded hole on the guide boss to fix and lock the fiber optic fork 6. Through the precise cooperation between the sliding groove and the guide boss, the fiber optic fork 6 can slide horizontally along the fiber optic fixing clamp 4, which increases the adjustment distance of the fiber optic 7 in the horizontal direction. When the fiber optic fork 6 slides to the appropriate position, it is locked and fixed by the locking device 5.
[0025] The device also includes a fixing block 9; the semiconductor laser 7 is provided with a limiting protrusion, and the fixing block 9 is provided with a limiting groove that matches the limiting protrusion. The fixing block 9 is installed in the fixing block mounting groove below the through hole of the fixing seat 11. Finally, the fixing block 9 is fixed in the fixing seat 11 by the first screw 8 to ensure that the semiconductor laser 7 is installed firmly.
[0026] The device also includes a pressure plate 10; the through hole of the fixing base 11 is provided with a pressure plate placement groove above the corresponding position of the power supply connector 12, the pressure plate 10 is placed in the pressure plate placement groove to press the power supply connector 12, and finally fixed and locked by the second screw 13 and the third screw 14, and will not be disassembled afterward.
[0027] The laser mounting groove is provided with a limiting boss, which is connected to the edge of the semiconductor laser 7 to ensure that the beam position is basically consistent after each installation of the semiconductor laser 7.
[0028] The adapter clip 1 has a movable opening, which is movably connected to the connecting rod 3. The connecting rod 3 can move up and down, thereby increasing the adjustment distance of the optical fiber in the vertical direction. After the position of the optical fiber is determined, it is locked and fixed using the fixing component 2. The adapter clip 1 can be fixed on a precision six-dimensional adjustment frame to achieve precise adjustment of the position of the optical fiber 15.
[0029] The end of the connecting rod 3 away from the connecting rod 3 is provided with a fixing protrusion, and the end of the fiber optic clamp 4 connected to the connecting rod 3 is provided with a fixing groove. The fixing protrusion is provided with an external thread, and the fixing groove is provided with an internal thread. The connecting rod 3 and the fiber optic clamp 4 are threadedly connected. The threaded connection can achieve a stable connection between the connecting rods 3 and the connecting rod 4, and is convenient for disassembly and installation.
[0030] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.
Claims
1. A semiconductor laser beam shaping and adjustment device based on fiber compression, characterized in that, include: Semiconductor laser fixing components and fiber optic fixing and debugging components; The semiconductor laser fixing assembly includes a semiconductor laser (7), a fixing base (11), and a power supply connector (12). The fixed base (11) is provided with a through hole in the horizontal direction. The power supply connector (12) extends into the interior of the fixed base (11) from one end of the through hole. The other end of the through hole is provided with a laser mounting groove. The semiconductor laser (7) is connected to the laser mounting groove, and the electrode pins of the semiconductor laser (7) are connected to the power supply connector (12). The fiber optic fixing and debugging assembly includes an adapter clip (1), a connecting rod (3), a fiber optic fixing clip (4), a locking device (5), and a fiber optic fork (6). The adapter (1) and the connecting rod (3) are movably connected and fixed by the fixing component (2). The end of the connecting rod (3) away from the adapter (1) is fixedly connected to the optical fiber fixing clip (4). The optical fiber fixing clip (4) is slidably connected to the optical fiber fork (6) and locked by the locking device (5). Multiple optical fiber fixing teeth are evenly distributed below the optical fiber fork (6). The fiber optic fork (6) is provided with a sliding groove in the transverse direction. A waist-shaped hole is also provided at the corresponding position of the sliding groove. The fiber optic fixing clamp (4) is provided with a guide boss that is connected to the sliding groove. A threaded hole is provided on the guide boss. The locking device (5) passes through the waist-shaped hole and is threadedly connected to the threaded hole on the guide boss to fix and lock the fiber optic fork (6). The device also includes a fixing block (9). The semiconductor laser (7) is provided with a limiting protrusion, and the fixing block (9) is provided with a limiting groove that matches the limiting protrusion. The fixing block (9) is installed in the fixing block mounting groove below the through hole of the fixing seat (11). The device also includes a tablet press (10). The through hole of the fixed base (11) is provided with a pressure plate placement groove above the corresponding position of the power supply connector (12), and the pressure plate (10) is placed in the pressure plate placement groove to press the power supply connector (12). The laser mounting groove is provided with a limiting boss, which is connected to the edge of the semiconductor laser (7).
2. The semiconductor laser beam shaping and adjustment device based on fiber compression according to claim 1, characterized in that, The adapter (1) is provided with a movable opening, which is movably connected to the connecting rod (3) and fixed by the fixing component (2).
3. The semiconductor laser beam shaping and adjustment device based on fiber compression according to claim 1, characterized in that, The end of the connecting rod (3) away from the adapter (1) is provided with a fixing protrusion, and the end of the fiber optic fixing clip (4) connected to the connecting rod (3) is provided with a fixing groove.
4. The semiconductor laser beam shaping and adjustment device based on fiber compression according to claim 3, characterized in that, The fixed protrusion is provided with an external thread, and the fixed groove is provided with an internal thread. The connecting rod (3) is threadedly connected to the optical fiber fixing clamp (4).
Citation Information
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